CN207947281U - A kind of good diode of heat dissipation - Google Patents
A kind of good diode of heat dissipation Download PDFInfo
- Publication number
- CN207947281U CN207947281U CN201721927480.1U CN201721927480U CN207947281U CN 207947281 U CN207947281 U CN 207947281U CN 201721927480 U CN201721927480 U CN 201721927480U CN 207947281 U CN207947281 U CN 207947281U
- Authority
- CN
- China
- Prior art keywords
- shell
- sink strip
- heat sink
- aluminum
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
A kind of good diode of heat dissipation, including shell, shell is cylindrical, enclosure is equipped with chip, there are two pins for chip electrical connection, two pins extend in the opposite direction, and part exposes to the end of shell, the circumference of shell is equipped with several mounting grooves, mounting groove is arranged along the axial direction of shell, is fixedly installed aluminum heat sink strip in each mounting groove, each aluminum heat sink strip is equipped with several copper heat conduction items, copper heat conduction item is arranged along the length direction of aluminum heat sink strip, and copper heat conduction item is to shell internal stretch.The setting of aluminum heat sink strip and copper heat conduction item so that the heat inside diode quickly dissipates outward, to keep the temperature inside diode relatively low.
Description
Technical field
The utility model is related to diode fields, and in particular to a kind of good diode of heat dissipation.
Background technology
The shell of diode in the prior art is closed shell, and at work, the heat inside diode is difficult to soon
Speed scatters away, and causes diode internal temperature higher, influences the service life of diode.
Invention content
In view of the deficiencies of the prior art, the purpose of this utility model is to provide a kind of good diode of heat dissipation, inside
Heat being capable of rapid dispersion.
In order to solve the above-mentioned technical problem, technical solution used by the utility model is：
A kind of good diode of heat dissipation, including shell, shell is cylindrical, and enclosure is equipped with chip, and chip is electrically connected
It connects there are two pin, two pins extend in the opposite direction, and part exposes to the end of shell, if the circumference of shell is equipped with
Dry mounting groove, mounting groove are arranged along the axial direction of shell, and aluminum heat sink strip is fixedly installed in each mounting groove, and each aluminum dissipates
Hot item is equipped with several copper heat conduction items, and copper heat conduction item is arranged along the length direction of aluminum heat sink strip, copper heat conduction item to
Enclosure extends.
Specifically, mounting groove is uniformly distributed along the circumferential direction of the periphery of shell.
Specifically, the radial dimension of aluminum heat sink strip is a, 0.2mm≤a≤0.3mm.
Specifically, the outer surface of aluminum heat sink strip is flushed with the periphery of shell.
The beneficial effects of the utility model are：
Diode work be, in the middle part of chip (not shown) generate heat, due to being fixedly installed in each mounting groove
There is an aluminum heat sink strip, each aluminum heat sink strip is equipped with five copper heat conduction items, and copper heat conduction item is to shell internal stretch.Copper has
There are preferable heat conductivility, copper heat conduction item that can conduct the heat of enclosure to aluminum heat sink strip.Aluminum heat sink strip
Part exposes to shell, and aluminium has good heat dissipation performance, and heat is contributed to dissipate.Aluminum heat sink strip and copper heat conduction item
Setting so that the heat inside diode quickly dissipates outward, to keep the temperature inside diode relatively low.
Description of the drawings
Fig. 1 is the external structure view of the diode of the utility model；
Fig. 2 is by the Section View obtained by A-A section cut in Fig. 1, wherein chip is not shown.
Reference numeral is in figure：
1. shell, 2. pins, 3. aluminum heat sink strips,
4. copper heat conduction item, 5. mounting grooves.
Specific implementation mode
The utility model is further described With reference to embodiment.
See that Fig. 1, a kind of good diode of heat dissipation, including shell 1, shell 1 are cylindrical.Shell 1 is internally provided with chip
(not shown), shell 1 are encapsulated in outside chip.There are two pin 2, two pins 2 extend in the opposite direction for chip electrical connection, and
Part exposes to the end of shell 1.The circumference of shell 1 is equipped with four mounting grooves 5, axial direction setting of the mounting groove 5 along shell 1.Knot
Fig. 1, Fig. 2 are closed, aluminum heat sink strip 3 is fixedly installed in each mounting groove 5.Each aluminum heat sink strip 3 is equipped with five and copper leads
Hot item 4, copper heat conduction item 4 are arranged along the length direction of aluminum heat sink strip 3, and copper heat conduction item 4 is to 1 internal stretch of shell.Two
Grade pipe work be, in the middle part of chip (not shown) generate heat, due to being fixedly installed aluminum heat sink strip in each mounting groove 5
3, each aluminum heat sink strip 3 is equipped with five copper heat conduction items 4, and copper heat conduction item 4 is to 1 internal stretch of shell.Copper has preferable
Heat conductivility, copper heat conduction item 4 can conduct the heat inside shell 1 to aluminum heat sink strip 3.3 innings of aluminum heat sink strip
Portion exposes to shell 1, and aluminium has good heat dissipation performance, and heat is contributed to dissipate.Aluminum heat sink strip 3 and copper heat conduction item 4
Setting so that the heat inside diode quickly dissipates outward, to keep the temperature inside diode relatively low.
Specifically, mounting groove 5 is uniformly distributed along the circumferential direction of the periphery of shell 1.
Specifically, the radial dimension of aluminum heat sink strip 3 is a, a=0.25mm so that mounting groove 5 and aluminum heat sink strip 3
Quantity can need in response to practical heat dissipation and increase to eight or more, to improve integral heat sink efficiency.
Specifically, the outer surface of aluminum heat sink strip 3 is flushed with the periphery of shell 1 so that the surface of shell 1 keeps flat
It is sliding so that the diode of the utility model is easily installed.
Wherein, the drawings are for illustrative purposes only and are merely schematic diagrams rather than pictorial diagram, should not be understood as to this
The limitation of patent；In order to better illustrate the utility model embodiment, the certain components of attached drawing have omission, zoom in or out,
The size of actual product is not represented；It will be understood by those skilled in the art that certain known features and its explanation may save in attached drawing
Slightly it will be understood by.
It above disclosure is merely preferred embodiments of the utility model, certainly cannot be new to limit this practicality with this
The interest field of type, therefore equivalent variations made according to the patent scope of the utility model still belong to the utility model and are covered
Range.
Claims (4)
1. a kind of good diode of heat dissipation, it is characterised in that：Including shell, shell is cylindrical, and enclosure is equipped with chip,
There are two pin, two pins extend in the opposite direction for chip electrical connection, and part exposes to the end of shell, the circle of shell
It is equipped with several mounting grooves week, mounting groove is arranged along the axial direction of shell, is fixedly installed aluminum heat sink strip in each mounting groove, often
A aluminum heat sink strip is equipped with several copper heat conduction items, and copper heat conduction item is arranged along the length direction of aluminum heat sink strip, copper
Heat conduction item is to shell internal stretch.
2. the good diode of heat dissipation according to claim 1, it is characterised in that：Week of the mounting groove along the periphery of shell
To being uniformly distributed.
3. the good diode of heat dissipation according to claim 1, it is characterised in that：The radial dimension of aluminum heat sink strip is a,
0.2mm≤a≤0.3mm。
4. the good diode of heat dissipation according to claim 1, it is characterised in that：The outer surface of aluminum heat sink strip with it is outer
The periphery of shell flushes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721927480.1U CN207947281U (en) | 2017-12-29 | 2017-12-29 | A kind of good diode of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721927480.1U CN207947281U (en) | 2017-12-29 | 2017-12-29 | A kind of good diode of heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207947281U true CN207947281U (en) | 2018-10-09 |
Family
ID=63701186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721927480.1U Expired - Fee Related CN207947281U (en) | 2017-12-29 | 2017-12-29 | A kind of good diode of heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207947281U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729260A (en) * | 2019-10-18 | 2020-01-24 | 长兴璟柏电子科技有限公司 | Metal packaging shell with heat dissipation function |
-
2017
- 2017-12-29 CN CN201721927480.1U patent/CN207947281U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729260A (en) * | 2019-10-18 | 2020-01-24 | 长兴璟柏电子科技有限公司 | Metal packaging shell with heat dissipation function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181009 Termination date: 20201229 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |