CN207752432U - A kind of structure improved radiator - Google Patents
A kind of structure improved radiator Download PDFInfo
- Publication number
- CN207752432U CN207752432U CN201721889878.0U CN201721889878U CN207752432U CN 207752432 U CN207752432 U CN 207752432U CN 201721889878 U CN201721889878 U CN 201721889878U CN 207752432 U CN207752432 U CN 207752432U
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- CN
- China
- Prior art keywords
- heat
- pipe
- heat sink
- structure improved
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model belongs to technical field of heat dissipation, more particularly to a kind of structure improved radiator, including heat sink, interval is installed in the positive several groups heat sink assembly of heat sink, it is installed in several heat conducting pipes of heat dissipation back, the accommodation space for installing chip is formed between two adjacent groups heat sink assembly, the heat conducting pipe includes longitudinal pipe corresponding with the position of accommodation space and transverse pipe corresponding with cooling fin, longitudinal pipe is connect with transverse pipe, in actual use, the installing chip in accommodation space, the back of heat sink corresponding with chip position is installed with heat conducting pipe, heat conducting pipe extends to the back side of the corresponding heat sink of heat sink assembly, so that the heat of chip is transmitted to heat sink assembly by heat conducting pipe, heat is dissipated eventually by cooling fin, the utility model is simple in structure, good heat dissipation effect and at low cost.
Description
Technical field
The utility model belongs to technical field of heat dissipation, and in particular to a kind of structure improved radiator.
Background technology
The fever of electronic component has become the bottleneck for restricting microelectric technique.With the development of technology, individual calculus
The power of machine CPU is higher and higher, and some has been over 100W.In view of the geometric dimension of CPU, the hair on CPU unit areas
Heat is very surprising.Therefore, the heat dissipation of CPU is also increasingly taken seriously.In general, setting radiator structure in electronic product as CPU
Heat dissipation is provided, radiator structure generally all includes fan, fastener, radiator (including bottom plate and fin), heat-conducting medium etc..
Since the power consumption of CPU is larger, often the volume of radiator is bigger than normal, in this way if radiator is made with copper, at
This will be very big, and if prepared with aluminium, and heat dissipation effect is again bad, therefore there is an urgent need for develop a kind of good heat dissipation effect and at low cost
New radiator.
Utility model content
In order to overcome shortcoming and defect existing in the prior art, the purpose of this utility model is to provide a kind of structures to change
Good radiator, the heat spreader structures are simple, good heat dissipation effect and production cost are low.
The purpose of this utility model is achieved through the following technical solutions：A kind of structure improved radiator, including heat sink,
Several heat conducting pipes that interval is installed in the positive several groups heat sink assembly of heat sink, is installed in heat dissipation back, two adjacent groups
The accommodation space for installing chip is formed between heat sink assembly, the heat conducting pipe includes corresponding with the position of accommodation space
Longitudinal pipe and transverse pipe corresponding with cooling fin, longitudinal pipe connect with transverse pipe.
Further, the heat conducting pipe is copper pipe.
Further, arc interconnecting piece is connected between the longitudinal pipe and transverse pipe.
Further, the longitudinal pipe, transverse pipe and arc interconnecting piece are integrally formed.
Further, the heat sink assembly includes several spaced cooling fins.
Further, the cooling fin is aluminium radiator fin.
Further, the back side of the heat sink offers and the matched groove of the heat conducting pipe, the heat conducting pipe dress
In groove.
Further, several installation through-holes are offered on the heat sink.
The beneficial effects of the utility model are：When the utility model is used, the installing chip in accommodation space, with chip
The back of the corresponding heat sink in position is installed with heat conducting pipe, and heat conducting pipe extends to the back of the body of the corresponding heat sink of heat sink assembly
Face so that the heat of chip is transmitted to heat sink assembly by heat conducting pipe, dissipates heat eventually by cooling fin, this practicality is new
Type is simple in structure, good heat dissipation effect and at low cost.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the utility model；
Fig. 2 is the dimensional structure diagram at another visual angle of the utility model.
Reference numeral is：
1- heat sinks；2- heat sink assemblies；3- heat conducting pipes；
4- accommodation spaces；5- installation through-holes；31- longitudinal pipes；
32- transverse pipes；33- arc interconnecting pieces.
Specific implementation mode
For the ease of the understanding of those skilled in the art, with reference to embodiment and attached drawing 1-2 to the utility model make into
The explanation of one step, the content that embodiment refers to not are the restriction to the utility model.
It please refers to attached drawing 1-2, a kind of structure improved radiator, including heat sink 1, interval and is installed in 1 front of heat sink
Several groups heat sink assembly 2, be installed in several heat conducting pipes 3 at 1 back side of heat sink, shape between two adjacent groups heat sink assembly 2
At the accommodation space 4 for installing chip, the heat conducting pipe 3 include longitudinal pipe corresponding with the position of accommodation space 4 31 with
And transverse pipe 32 corresponding with cooling fin, longitudinal pipe 31 are connect with transverse pipe 32.
When the utility model is used, the installing chip in accommodation space 4, the back of the body of heat sink corresponding with chip position 1
Portion is installed with heat conducting pipe 3, and heat conducting pipe 3 extends to the back side of 2 corresponding heat sink 1 of heat sink assembly so that the heat of chip is logical
It crosses heat conducting pipe 3 and is transmitted to heat sink assembly 2, dissipate heat eventually by cooling fin, the utility model is simple in structure, heat dissipation effect
Fruit is good and at low cost.
Further, the heat conducting pipe 3 is copper pipe.
The utility model is by using copper pipe as heat conducting pipe 3, and good heat conduction effect, can effectively extend chip uses the longevity
Life and the performance for improving chip.
Further, arc interconnecting piece 33 is connected between the longitudinal pipe 31 and transverse pipe.
For the utility model by being equipped with arc interconnecting piece 33 between longitudinal pipe 31 and transverse pipe, surface is round and smooth, when installation
Hand will not be hurt.
Further, the longitudinal pipe 31, transverse pipe 32 and arc interconnecting piece 33 are integrally formed.
The utility model prepares heat conducting pipe 3 by integral molding techniques, reduces production technology, effectively save production cost
And entirety connecting is good so that heat-conducting effect is more preferable.
Further, the heat sink assembly 2 includes several spaced cooling fins.
The utility model is formed logical by the way that heat sink assembly 2 is set as spaced cooling fin between abutting fins
Wind space so that heat dissipation effect is more preferable.
Further, the cooling fin is aluminium radiator fin.
The utility model, as aluminium radiator fin, good heat dissipation effect, and effectively reduces production cost by using aluminium flake.
Further, the back side of the heat sink 1 offers and 3 matched groove of the heat conducting pipe, the heat conducting pipe 3
It is installed in groove.
The utility model at the back side of heat sink 1 by opening up groove, and heat conducting pipe 3 is installed in groove so that heat conducting pipe 3
Apart from chip closer to faster, and integral heat sink plate 1 is more smooth for heat dissipation, is easy installation.
Further, several installation through-holes 5 are offered on the heat sink 1.
The utility model on heat sink 5 by opening up installation through-hole 5 so that the installation of radiator is more convenient.
Above-described embodiment is the preferable implementation of the utility model, and in addition to this, the utility model can be with other sides
Formula realizes that any obvious replacement is in the protection model of the utility model without departing from the concept of the premise utility
Within enclosing.
Claims (8)
1. a kind of structure improved radiator, it is characterised in that：It is installed in the positive several groups of heat sink including heat sink, interval
Heat sink assembly, several heat conducting pipes for being installed in heat dissipation back, form for installing core between two adjacent groups heat sink assembly
The accommodation space of piece, the heat conducting pipe include longitudinal pipe corresponding with the position of accommodation space and corresponding with cooling fin
Transverse pipe, longitudinal pipe are connect with transverse pipe.
2. a kind of structure improved radiator according to claim 1, it is characterised in that：The heat conducting pipe is copper pipe.
3. a kind of structure improved radiator according to claim 1, it is characterised in that：The longitudinal pipe and transverse pipe it
Between be connected with arc interconnecting piece.
4. a kind of structure improved radiator according to claim 3, it is characterised in that：The longitudinal pipe, transverse pipe with
Arc interconnecting piece is integrally formed.
5. a kind of structure improved radiator according to claim 1, it is characterised in that：If the heat sink assembly includes
Dry spaced cooling fin.
6. a kind of structure improved radiator according to claim 5, it is characterised in that：The cooling fin is aluminium flake.
7. a kind of structure improved radiator according to claim 1, it is characterised in that：The back side of the heat sink opens up
Have and is installed in groove with the matched groove of the heat conducting pipe, the heat conducting pipe.
8. a kind of structure improved radiator according to claim 1, it is characterised in that：If being offered on the heat sink
Dry installation through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721889878.0U CN207752432U (en) | 2017-12-27 | 2017-12-27 | A kind of structure improved radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721889878.0U CN207752432U (en) | 2017-12-27 | 2017-12-27 | A kind of structure improved radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207752432U true CN207752432U (en) | 2018-08-21 |
Family
ID=63149770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721889878.0U Active CN207752432U (en) | 2017-12-27 | 2017-12-27 | A kind of structure improved radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207752432U (en) |
-
2017
- 2017-12-27 CN CN201721889878.0U patent/CN207752432U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |