CN205174294U - High -power heat pipe cooling ware - Google Patents
High -power heat pipe cooling ware Download PDFInfo
- Publication number
- CN205174294U CN205174294U CN201520988139.1U CN201520988139U CN205174294U CN 205174294 U CN205174294 U CN 205174294U CN 201520988139 U CN201520988139 U CN 201520988139U CN 205174294 U CN205174294 U CN 205174294U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- radiator
- fin
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a result of use that high -power heat pipe cooling ware, the problem that solve is that the heat that produces of current IGBT is great, and timely effluvium, influences IGBT. The utility model provides a be provided with a plurality of heat pipes in the heat conduction base plate of radiator body, the heat pipe is made by the confined seamless pipe, one side of heat conduction base plate is provided with the equipment fixing face, and the opposite side is provided with the fin. The utility model has the advantages that: simple structure, the thermal resistance that reduces the radiator is worth, has effectively improved IGBT's radiating effect.
Description
Technical field
The utility model belongs to heat sink technology field, particularly a kind of large power heat pipe radiator that can make the raising of fin end portion temperature and then increase radiating effect.
Background technology
In module class semiconductor heat-dissipating device, because its special instructions for use limits the volume of such devices, such as: IGBT.
The shortcoming of powerful igbt (IGBT) is that its heat power consumption is more much larger than triode thyristor, when switching frequency is higher, its power consumption increases especially greatly, therefore as the performance affecting radiator that service life and device exert oneself and greatly constrain IGBT usefulness.
Existing module class device radiator uses one side fin structure to dispel the heat usually, and the fin area of dissipation which results in radiator is limited thus have impact on radiating effect.
In order to effectively increase the heat dissipation capacity to IGBT within the unit interval, can be realized by the method reducing heat radiator thermal resistance value, because existing structure is one side radiator structure, it significantly limit the efficiently radiates heat area of radiator, and due to its thermal resistance value comparatively large, therefore its heat-sinking capability is limited larger.
Therefore, when heat sink material is constant, how adjusting heat spreader structures, to increase its radiating effect be the application's problem to be solved.
Summary of the invention
The object of this invention is to provide a kind of large power heat pipe radiator that can make the raising of fin surface temperature and then increase radiating effect.
The object of the present invention is achieved like this, and it comprises: radiator body, it is characterized in that: be provided with some heat pipes in the heat-conducting substrate of radiator body, and described heat pipe is made up of seamless tubular goods that closing; The side of heat-conducting substrate is provided with device installed surface, and opposite side is provided with fin.
One end of heat-conducting substrate is provided with heat conduction extension, and be provided with heat pipe in described heat conduction extension, its both sides are provided with fin.
Heat pipe in heat-conducting substrate communicates with the heat pipe in heat conduction extension.
Described heat pipe is copper heat pipe.
Described heat pipe is arranged on the axial location of heat-conducting substrate, and is parallel to each other with fin direction.
Heat pipe is slightly close to the wing root of fin in heat-conducting substrate.
Advantage of the present invention is: structure is simple, reduces the thermal resistance value of radiator, effectively improves the radiating effect of IGBT.
Accompanying drawing explanation
Fig. 1 is structural representation sketch of the present utility model;
Fig. 2 is the A-A sectional view of Fig. 1.
The utility model is described in further detail by example below in conjunction with accompanying drawing; but following example is only the utility model example wherein; do not represent the rights protection scope that the utility model limits, rights protection scope of the present utility model is as the criterion with claims.
Detailed description of the invention
example 1
Be provided with some heat pipes 5 in the heat-conducting substrate 1 of radiator body, described heat pipe is made up of seamless pipe that closing; The side of heat-conducting substrate is provided with equipment installed surface 3, and opposite side is provided with fin 2.
One end of heat-conducting substrate is provided with heat conduction extension 4, and be provided with heat pipe in described heat conduction extension, its both sides are provided with fin.
Heat pipe in heat-conducting substrate communicates with the heat pipe in heat conduction extension.
Described heat pipe is copper pipe.
Described heat pipe is arranged on the axial location of heat-conducting substrate, and is parallel to each other with fin direction.
Heat pipe is slightly close to the wing root of fin in heat-conducting substrate.
Claims (1)
1. a large power heat pipe radiator, it comprises: radiator body, it is characterized in that: be provided with some heat pipes in the heat-conducting substrate of radiator body, and described heat pipe is made up of seamless pipe that closing; The side of heat-conducting substrate is provided with equipment installed surface, and opposite side is provided with fin; One end of heat-conducting substrate is provided with heat conduction extension, and be provided with heat pipe in described heat conduction extension, its both sides are provided with fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520988139.1U CN205174294U (en) | 2015-12-03 | 2015-12-03 | High -power heat pipe cooling ware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520988139.1U CN205174294U (en) | 2015-12-03 | 2015-12-03 | High -power heat pipe cooling ware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205174294U true CN205174294U (en) | 2016-04-20 |
Family
ID=55738283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520988139.1U Expired - Fee Related CN205174294U (en) | 2015-12-03 | 2015-12-03 | High -power heat pipe cooling ware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205174294U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024733A (en) * | 2015-12-03 | 2016-10-12 | 王洪波 | Large-power heat pipe radiator |
-
2015
- 2015-12-03 CN CN201520988139.1U patent/CN205174294U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024733A (en) * | 2015-12-03 | 2016-10-12 | 王洪波 | Large-power heat pipe radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |