CN106024733A - Large-power heat pipe radiator - Google Patents
Large-power heat pipe radiator Download PDFInfo
- Publication number
- CN106024733A CN106024733A CN201510874261.0A CN201510874261A CN106024733A CN 106024733 A CN106024733 A CN 106024733A CN 201510874261 A CN201510874261 A CN 201510874261A CN 106024733 A CN106024733 A CN 106024733A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- radiator
- fin
- conducting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a large-power heat pipe radiator. The to-be-solved problems are that the heat generated by a conventional IGBT is larger and cannot be dissipated timely, and the use effect of the IGBT is affected. The technical scheme of the invention is that the interior of a heat conduction substrate of the radiator body is provided with a plurality of heat pipes; the heat pipes are made of closed seamless pipe materials; one side of the heat conduction substrate is provided with a device installation surface, and the other side of the heat conduction substrate is provided with a fin. The radiator is advantageous in that the radiator is simple in structure, reduces the resistance, and effectively improves the heat dissipation effect of the IGBT.
Description
Technical field
The invention belongs to heat sink technology field, fin surface temperature can be made to improve particularly to a kind of and then increase the large power heat pipe radiator of radiating effect.
Background technology
In module class semiconductor heat-dissipating device, due to the volume using requirement to limit such devices that it is special, such as: IGBT.
The shortcoming of powerful igbt (IGBT) is that its heat power consumption is more much larger than triode thyristor, when switching frequency is higher, its power consumption is greatly increased especially, therefore greatly constrains the performance of IGBT usefulness as the radiator affecting service life and device is exerted oneself.
Existing module class device radiator generally uses one side fin structure to dispel the heat, and the fin area of dissipation which results in radiator is limited thus have impact on radiating effect.
In order to be effectively increased the heat dissipation capacity to IGBT within the unit interval, can be realized by the method reducing heat radiator thermal resistance value, owing to existing structure is one side radiator structure, it significantly limit effective area of dissipation of radiator, and owing to its thermal resistance value is relatively big, therefore its heat-sinking capability is limited bigger.
Therefore, in the case of heat sink material is constant, how to adjust heat spreader structures increasing its radiating effect is the application problem to be solved.
Summary of the invention
It is an object of the invention to provide a kind of large power heat pipe radiator that can make the raising of fin surface temperature and then increase radiating effect.
The object of the present invention is achieved like this, and it includes: radiator body, it is characterized in that: if being provided with dry heat pipe in the heat-conducting substrate of radiator body, described heat pipe is made up of seamless tubular goods that closing；The side of heat-conducting substrate is provided with device installed surface, and opposite side is provided with fin.
One end of heat-conducting substrate is provided with heat conduction extension, is provided with heat pipe in described heat conduction extension, and its both sides are provided with fin.
Heat pipe in heat-conducting substrate communicates with the heat pipe in heat conduction extension.
Described heat pipe is copper heat pipe.
Described heat pipe is arranged on the axial location of heat-conducting substrate, and is parallel to each other with fin direction.
Heat pipe in heat-conducting substrate slightly towards in the wing root of fin.
The invention have the advantage that simple in construction, reduce the thermal resistance value of radiator, be effectively increased the radiating effect of IGBT.
Accompanying drawing explanation
Fig. 1 is the structural representation sketch of the present invention；
Fig. 2 is the A-A sectional view of Fig. 1.
The present invention is described in further detail by example below in conjunction with accompanying drawing, but the following example example therein that is only the present invention, not representing the right protection scope that the present invention is limited, the scope of the present invention is as the criterion with claims.
Detailed description of the invention
Example
1
If being provided with dry heat pipe 5 in the heat-conducting substrate of radiator body 1, described heat pipe is made up of seamless pipe that closing；The side of heat-conducting substrate is provided with equipment installed surface 3, and opposite side is provided with fin 2.
One end of heat-conducting substrate is provided with heat conduction extension 4, is provided with heat pipe in described heat conduction extension, and its both sides are provided with fin.
Described heat pipe is copper heat pipe.
Described heat pipe is arranged on the axial location of heat-conducting substrate, and is parallel to each other with fin direction.
Heat pipe in heat-conducting substrate slightly towards in the wing root of fin.
Owing to the surrounding of IGBT in a state of use there will be harmonic wave, ensure the normal work of IGBT in order to absorb harmonic wave, need to arrange capacitor.Which limits can only extending of radiator in side.
Claims (5)
1. a large power heat pipe radiator, it includes: radiator body, it is characterized in that: if being provided with dry heat pipe in the heat-conducting substrate of radiator body, described heat pipe is made up of seamless tubular goods that closing；The side of heat-conducting substrate is provided with device installed surface, and opposite side is provided with fin；One end of heat-conducting substrate is provided with heat conduction extension, is provided with heat pipe in described heat conduction extension, and its both sides are provided with fin.
Large power heat pipe radiator the most according to claim 1, is characterized in that: the heat pipe in heat-conducting substrate communicates with the heat pipe in heat conduction extension.
Large power heat pipe radiator the most according to claim 1, is characterized in that: described heat pipe is copper heat pipe.
Large power heat pipe radiator the most according to claim 1, is characterized in that: described heat pipe is arranged on the axial location of heat-conducting substrate, and is parallel to each other with fin direction.
Large power heat pipe radiator the most according to claim 1, is characterized in that: heat pipe in heat-conducting substrate slightly towards in the wing root of fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874261.0A CN106024733A (en) | 2015-12-03 | 2015-12-03 | Large-power heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874261.0A CN106024733A (en) | 2015-12-03 | 2015-12-03 | Large-power heat pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106024733A true CN106024733A (en) | 2016-10-12 |
Family
ID=57082551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510874261.0A Pending CN106024733A (en) | 2015-12-03 | 2015-12-03 | Large-power heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106024733A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2410740Y (en) * | 2000-03-23 | 2000-12-13 | 郭度厚 | Integral power unit |
| CN201259193Y (en) * | 2008-09-04 | 2009-06-17 | 李镭 | Heat radiator of high power LED street lamp |
| CN201259190Y (en) * | 2008-04-22 | 2009-06-17 | 曾一鸣 | High-power LED illuminating apparatus module |
| CN201363701Y (en) * | 2009-02-26 | 2009-12-16 | 薛文艳 | Heat radiation structure used for LED lamp with large power |
| CN201681813U (en) * | 2010-02-25 | 2010-12-22 | 郭培囵 | Profile-type superconductive radiator |
| US20150062819A1 (en) * | 2013-08-29 | 2015-03-05 | Eaton Corporation | Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat |
| CN205174294U (en) * | 2015-12-03 | 2016-04-20 | 王洪波 | High -power heat pipe cooling ware |
-
2015
- 2015-12-03 CN CN201510874261.0A patent/CN106024733A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2410740Y (en) * | 2000-03-23 | 2000-12-13 | 郭度厚 | Integral power unit |
| CN201259190Y (en) * | 2008-04-22 | 2009-06-17 | 曾一鸣 | High-power LED illuminating apparatus module |
| CN201259193Y (en) * | 2008-09-04 | 2009-06-17 | 李镭 | Heat radiator of high power LED street lamp |
| CN201363701Y (en) * | 2009-02-26 | 2009-12-16 | 薛文艳 | Heat radiation structure used for LED lamp with large power |
| CN201681813U (en) * | 2010-02-25 | 2010-12-22 | 郭培囵 | Profile-type superconductive radiator |
| US20150062819A1 (en) * | 2013-08-29 | 2015-03-05 | Eaton Corporation | Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat |
| CN205174294U (en) * | 2015-12-03 | 2016-04-20 | 王洪波 | High -power heat pipe cooling ware |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |
|
| RJ01 | Rejection of invention patent application after publication |