CN107037864B

CN107037864B - Computer network assembly control box heat dissipation mechanism

Info

Publication number: CN107037864B
Application number: CN201710462781.XA
Authority: CN
Inventors: 张莲莲
Original assignee: Yantai Zhixing Intellectual Property Consulting Service Co ltd
Current assignee: YANTAI ZHIXING INTELLECTUAL PROPERTY CONSULTING SERVICE Co.,Ltd.
Priority date: 2017-06-19
Filing date: 2017-06-19
Publication date: 2020-06-02
Anticipated expiration: 2037-06-19
Also published as: CN107037864A

Abstract

The invention discloses a heat dissipation mechanism of a control box of a computer network assembly, wherein a first fan cover is sleeved outside a first fan, a second fan cover is sleeved outside a second fan, the first fan rotates around a first rotating shaft, the second rotating shaft is obliquely arranged and forms an acute angle with the horizontal direction, the second fan cover rotates around a second rotating shaft, the first radiator is provided with a plurality of first fin groups which are arranged in parallel, the second radiator is provided with a plurality of second fin groups which are arranged in parallel, the first fin groups are parallel to the first rotating shaft, and the second fin groups are parallel to the second rotating shaft. The first fin group and the second fin group are both composed of fins, each fin comprises a fastener, the fasteners are arranged on one side of the fin, the fins are connected into the fin group through the fasteners, and the circuit board is arranged below the first radiator and the second radiator.

Description

Computer network assembly control box heat dissipation mechanism

Technical Field

The invention relates to a heat dissipation mechanism of a computer network assembly control box.

Background

Nowadays, computer CPU's arithmetic speed is faster and faster, and the heat of production is also more and more, if the unable discharge of heat, can influence CPU operation, can cause CPU's damage seriously, among the prior art, be provided with heat dissipation mechanism in the computer network assembly control box for get rid of the heat, but heat dissipation mechanism's radiating efficiency is low.

Disclosure of Invention

The invention aims to provide a heat dissipation mechanism for a computer network assembly control box, which can solve the problems in the prior art and improve the heat dissipation efficiency in the computer network assembly control box.

The invention is realized by the following technical scheme: a heat dissipation mechanism of a computer network assembly control box comprises a fan set, a fan cover set, a rotating shaft set and a heat sink set circuit board, wherein the fan set comprises a first fan and a second fan, the fan cover set comprises a first fan set and a second fan set, the rotating shaft set comprises a first rotating shaft set and a second rotating shaft set, the heat sink set comprises a first radiator and a second radiator, a certain gap is formed between the first fan and the second fan, the first fan is sleeved with a first fan cover outside, the second fan is sleeved with a second fan cover outside, a first rotating shaft is vertically arranged at the bottom of the first fan cover, the first fan is sleeved on the first rotating shaft and rotates around the first rotating shaft, a second rotating shaft is arranged at the bottom of the second fan cover, the second rotating shaft is arranged in an inclined mode, an acute angle is formed between the second rotating shaft and the horizontal direction, the second fan is sleeved on the second rotating shaft and rotates around the second rotating shaft, the first radiator and the second radiator are fixedly arranged below the first fan cover and the second fan cover, the first radiator is provided with a plurality of first fin groups which are arranged in parallel, the second radiator is provided with a plurality of second fin groups which are arranged in parallel, the first fin groups are parallel to the first rotating shaft, the second fin groups are parallel to the second rotating shaft, the first fin groups and the second fin groups are both composed of fins, each fin comprises a buckle piece, the buckle pieces are arranged on one sides of the fins, L-shaped buckles are hinged to the buckle pieces, clamp holes are formed in the buckle pieces and are connected into the fin groups in the clamp holes through the buckles, and the circuit board is arranged below the first radiator and the second radiator.

Further, the radiator includes the radiator cap, radiator and fin, the radiator is cylindrical, the inside of radiator is provided with the columniform cavity, it has cooling liquid to inject in the cavity, the diameter of cavity equals with the diameter of the sealing of radiator cap, the cover is equipped with the sealing washer on the sealing, the end cover of radiator cap contacts with the circuit board, the fixed fin that is provided with on the periphery wall of radiator, the fin spirals on the periphery wall of radiator, be provided with curved thin slice on the fin, be provided with curved slot on the internal perisporium of radiator.

Furthermore, the radiating fins and the thin sheets are formed by one-time stamping through a stamping grinding tool.

Furthermore, the groove meanders from the upper end of the inner wall of the heat radiation body to the lower end of the heat radiation body and corresponds to the heat radiation fins on the outer peripheral wall of the heat radiation body.

Furthermore, the radiator comprises a base plate, the forked pieces, the radiating fin group, a bottom plate and bending pieces, wherein the lower end face of the base plate is in contact with the circuit board, the upper end face of the base plate is connected with a pair of forked pieces, the forked pieces are vertically fixed on the upper end face of the base plate, inclined portions of the two forked pieces are arranged in a relatively inclined mode, the inclined directions are outward, the radiating fin group is arranged above the forked pieces and consists of a plurality of radiating fins separated from each other, the radiating fins of the same group are arranged in parallel, a plurality of grooves are formed in the radiating fins, the bottom plate is fixedly arranged on the upper end face of the radiating fin group, and the bending pieces are arranged on the upper end face.

Furthermore, the base part of the bending piece is arranged in parallel with the bottom plate, and the bending part of the bending piece is arranged in parallel with the bottom plate.

Further, the bending piece and the bottom plate may be connected by an adhesive.

Compared with the prior art, the invention has the following beneficial effects:

according to the invention, through the arrangement of the fan and the fin structures, the heat dissipation of the circuit board can be accelerated by the airflow generated by the fan, and through designing different structures for the heat dissipater, the heat dissipation of the heat dissipater is accelerated, and the heat dissipation efficiency in the control box of the computer network assembly is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural diagram of a fin of the present invention;

FIG. 3 is a schematic structural diagram according to a first embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a heat sink in accordance with an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a second embodiment of the present invention.

Wherein: 101-a first fan, 102-a second fan, 201-a first fan cover group, 202-a second fan cover group, 301-a first rotating shaft group, 302-a second rotating shaft group, 401-a first radiator, 402-a second radiator, 5-a circuit board, 6-a fin, 601-a hook, 602-a clamping hole, 701-a radiating cover, 702-a radiating body, 703-a radiating fin, 704-a cavity, 705-a sealing part, 706-a sealing ring, 707-a sheet, 801-a substrate, 802-a bifurcated sheet, 803-an inclined part, 804-a radiating fin group, 805-a radiating fin, 806-a groove, 807-a bottom plate, 808-a bent sheet and 809-a bent part.

Detailed Description

The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1, the present invention provides a heat dissipation mechanism for a control box of a computer network assembly, comprising a fan set, a fan cover set, a rotation shaft set, a heat sink set, and a circuit board, wherein the fan set comprises a first fan 101 and a second fan 102, the fan cover set comprises a first fan cover set 201 and a second fan cover set 202, the rotation shaft set comprises a first rotation shaft set 301 and a second rotation shaft set 302, the heat sink set comprises a first heat sink 401 and a second heat sink 402,

a certain gap is formed between the first fan 101 and the second fan 102, the first fan 201 is sleeved outside the first fan 101, the second fan 202 is sleeved outside the second fan 102, the first rotating shaft 301 is vertically arranged at the bottom of the first fan 201, the first fan 101 is sleeved on the first rotating shaft 301 and rotates around the first rotating shaft 301, the second rotating shaft 302 is arranged at the bottom of the second fan 202, the second rotating shaft 302 is obliquely arranged, an acute angle is formed between the second rotating shaft 302 and the horizontal direction, and the second fan 102 is sleeved on the second rotating shaft 302 and rotates around the second rotating shaft 302.

A first radiator 401 and a second radiator 402 are fixedly arranged below the first fan housing 201 and the second fan housing 202, the first radiator 401 has a plurality of first fin groups arranged in parallel, the second radiator 402 has a plurality of second fin groups arranged in parallel, the first fin groups are parallel to the first rotating shaft 301, and the second fin groups are parallel to the second rotating shaft 302. As shown in fig. 2, the first fin group and the second fin group are both composed of fins 6, each fin 6 includes a fastening member, the fastening member is disposed at one end of the fin 6, the fastening member is hinged to an L-shaped hook 601, the fastening member is provided with a fastening hole 602, and when the two fins 6 are connected to form the fin group, the two fins are fastened in the fastening hole 602 through the hook 601. When the direction of the rotating shaft and the direction of the fins are the same, the airflow flows along the direction of the fins, so that the heat of the circuit board can be taken away more quickly by the airflow.

The circuit board 5 is disposed below the first heat sink 401 and the second heat sink 402, and heat generated by the electronic components on the circuit board 5 is transferred to the first heat sink 401 and the second heat sink 402, and the heat dissipation is accelerated by the first fan 101 and the second fan 102.

The first embodiment is as follows:

as shown in fig. 3, the heat sink includes a heat sink cover 701, a heat sink 702, and a heat sink 703, where the heat sink 703 is cylindrical, and the surface area of the cylinder is large, so as to increase the contact area between the cooling liquid and the heat sink and improve the heat dissipation efficiency of the heat sink. A cylindrical cavity 704 is formed in the heat radiator 703, cooling liquid is injected into the cavity 704, the diameter of the cavity 704 is equal to that of a sealing portion 705 of the heat radiating cover 701, a sealing ring 706 is sleeved on the sealing portion 705 to prevent the cooling liquid in the cavity 704 from leaking, and the heat radiating cover 703 is connected with the cavity 704 and has good sealing performance. The end cap of the heat dissipation cover 703 is in contact with the circuit board 5, and heat generated by the circuit board 5 is transferred to the cavity of the heat dissipation body through the heat dissipation cover, absorbed by the cooling liquid in the cavity 704, and rapidly dispersed to the outer peripheral wall of the heat dissipation body 702.

The heat sink 703 is fixedly arranged on the outer peripheral wall of the heat sink 702, the heat sink 703 is wound around the outer peripheral wall of the heat sink 702, as shown in fig. 4, the heat sink 703 is provided with an arc-shaped sheet 707, and the heat sink 703 and the sheet 707 are both formed by one-step press forming with a press grinding tool, so that the heat dissipation effect of the heat sink 707 is increased.

Be provided with curved slot on the internal perisporium of heat dissipation body 702, the slot meanders to the lower extreme of heat dissipation body from the upper end of heat dissipation body inner wall, corresponds with fin 703 on the heat dissipation body 702 periphery wall, and the cooling liquid is in the inside area of contact increase of heat dissipation body, and then has improved heat transfer efficiency.

Example two:

as shown in fig. 5, the heat sink includes a substrate 801, a pair of bifurcating pieces 802, a heat sink group 804, and a bottom plate 807, wherein a lower end surface of the substrate 801 contacts with the circuit board 5, an upper end surface of the substrate 801 is connected with the pair of bifurcating pieces 802, the bifurcating pieces 802 are vertically fixed on the upper end surface of the substrate 801, and inclined portions 803 of the two bifurcating pieces 802 are arranged obliquely with respect to each other, and the inclined portions are outward in an inclined direction, which can enlarge a heat dissipating surface. A heat dissipation fin group 804 is arranged above the forked fins 802, the heat dissipation fin group 804 is composed of a plurality of heat dissipation fins 805 separated from each other, the same group of heat dissipation fins 805 are arranged in parallel, and a plurality of grooves 806 are arranged on the heat dissipation fins 805, so that the heat exchange area of the heat dissipation fins is effectively increased, and the heat dissipation is facilitated.

The upper end face of the heat dissipation fin group 804 is fixedly provided with a bottom plate 807, the upper end face of the bottom plate 807 is provided with a bending piece, the base of the bending piece 808 is arranged in parallel with the bottom plate 807, the bending piece 808 and the bottom plate 807 can be connected through an adhesive, the bending part 809 of the bending piece 808 is arranged in parallel with the bottom plate 807, and the bending piece 808 can efficiently transmit heat energy.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a computer network assembly control box heat dissipation mechanism which characterized in that: comprises a fan group, a fan cover group, a rotating shaft group, a radiator group circuit board, wherein the fan group comprises a first fan (101) and a second fan (102), the fan cover group comprises a first fan cover group (201) and a second fan cover group (202), the rotating shaft group comprises a first rotating shaft group (301) and a second rotating shaft group (302), the radiator group comprises a first radiator (401) and a second radiator (402), a gap with a certain distance is arranged between the first fan (101) and the second fan (102), the first fan cover (201) is sleeved outside the first fan (101), the second fan cover (202) is sleeved outside the second fan (102), the first rotating shaft (301) is vertically arranged at the bottom of the first fan cover (201), the first fan (101) is sleeved on the first rotating shaft (301) and rotates around the first rotating shaft (301), the second rotating shaft (302) is arranged at the bottom of the second fan cover (202), and the second rotating shaft (302) is obliquely arranged, the second rotating shaft (302) forms an acute angle with the horizontal direction, the second fan (102) is sleeved on the second rotating shaft (302) and rotates around the second rotating shaft (302), the lower parts of the first fan housing (201) and the second fan housing (202) are fixedly provided with a first radiator (401) and a second radiator (402), the first radiator (401) is provided with a plurality of first fin groups which are arranged in parallel, the second radiator (402) is provided with a plurality of second fin groups which are arranged in parallel, the first fin groups are parallel to the first rotating shaft (301), the second fin groups are parallel to the second rotating shaft (302), the first fin groups and the second fin groups are both composed of fins (6), each fin (6) comprises a clamping piece which is arranged on one side of the fin (6), an L-shaped clamping hook (601) is hinged and connected to the clamping piece, a clamping hole (602) is arranged on the clamping piece, and the clamping piece is clamped in the clamping hole (602) through the clamping hook (601) to form a fin group, the circuit board (5) is arranged below the first radiator (401) and the second radiator (402); the heat sink includes a heat-dissipating cover (701), the cooling structure comprises a heat radiator (702) and a heat radiating fin (703), wherein the heat radiator (703) is cylindrical, a cylindrical cavity (704) is arranged inside the heat radiator (703), cooling liquid is injected into the cavity (704), the diameter of the cavity (704) is equal to that of a sealing part (705) of a heat radiating cover (701), a sealing ring (706) is sleeved on the sealing part (705), an end cover of the heat radiating cover (703) is contacted with a circuit board (5), the heat radiating fin (703) is fixedly arranged on the outer peripheral wall of the heat radiator (702), the heat radiating fin (703) is wound on the outer peripheral wall of the heat radiator (702), an arc-shaped sheet (707) is arranged on the heat radiating fin (703), an arc-shaped groove is arranged on the inner peripheral wall of the heat radiator (702), and the groove is wound from the upper end of the inner wall of the heat radiator (702) to the lower;

the heat radiator comprises a base plate (801), bifurcated sheets (802), a radiating fin group (804), a bottom plate (807), bending sheets (808), wherein the lower end face of the base plate (801) is contacted with a circuit board (5), the upper end face of the base plate (801) is connected with a pair of bifurcated sheets (802), the bifurcated sheets (802) are vertically fixed on the upper end face of the base plate (801), inclined parts (803) of the two bifurcated sheets (802) are oppositely arranged in an inclined manner, the inclined direction is outward, the radiating fin group (804) is arranged above the bifurcated sheets (802), the radiating fin group (804) consists of a plurality of radiating fins (805) separated from each other, the same group of radiating fins (805) are arranged in parallel, a plurality of grooves (806) are arranged on the radiating fins (805), the upper end face of the radiating fin group (804) is fixedly provided with the bottom plate (807), the upper end face of the bottom plate (807) is provided with the bending sheets (808), the base parts of the bending sheets (, the bending part (809) of the bending piece (808) is arranged in parallel with the bottom plate (807).

2. The computer network assembly control box heat dissipation mechanism of claim 1, wherein: the heat sink (703) and the sheet (707) are press-molded at one time.

3. The computer network assembly control box heat dissipation mechanism of claim 1, wherein: the bending tabs (808) and the base plate (807) may be connected by an adhesive.