CN207880542U

CN207880542U - Projecting Lamp

Info

Publication number: CN207880542U
Application number: CN201721617721.2U
Authority: CN
Inventors: 冉文方
Original assignee: Xian Cresun Innovation Technology Co Ltd
Current assignee: Xi'an weilaide Electronic Technology Co.,Ltd.
Priority date: 2017-11-28
Filing date: 2017-11-28
Publication date: 2018-09-18
Anticipated expiration: 2027-11-28

Abstract

The utility model discloses a kind of Projecting Lamp (10), including：Holder (11), pedestal (12), LED light (13), reflector (14), cooling fin (15) and lens (16)；Wherein, the pedestal (12) is connected with the holder (11)；The LED light (13) is fixed in the pedestal (12) upper surface middle position；The reflector (14) is fixed in the pedestal (12) upper surface and the outside positioned at the LED light (13)；The cooling fin (15) is fixed in the pedestal (12) upper surface and the outside positioned at the reflector (14)；The lens (16) are fixed in the reflector (14) top.Projecting Lamp provided by the utility model, good heat dissipation effect is simple in structure, and service life is long.

Description

Projecting Lamp

Technical field

The utility model belongs to lighting area, and in particular to a kind of Projecting Lamp.

Background technology

Projecting Lamp is a kind of projection illumination lamps and lanterns simple in structure, easy to use and flexible, is mainly used for large area operation field The places such as mine, contour of building, stadium, viaduct, monument, park and flower bed.

Current projecting lamp is substantially using LED chip as its light emitting source, since the brightness requirement of projecting lamp is higher, Its light emitting source generally use high-power LED chip will produce a large amount of heat under the conditions of working long hours.Due to heat dissipation Improper measures so that in the high temperature environment, device aging is serious for core component long-term work, highly shortened making for Projecting Lamp Use the service life.

Utility model content

In order to solve the above-mentioned problems in the prior art, the utility model provides a kind of good heat dissipation effect, Gao Ke By the Projecting Lamp of property.The Projecting Lamp 10 includes：Holder 11, pedestal 12, LED light 13, reflector 14, cooling fin 15 and lens 16； Wherein,

The pedestal 12 is connected with the holder 11；

The LED light 13 is fixed in 12 upper surface middle position of the pedestal；

The reflector 14 is fixed in 12 upper surface of the pedestal and the outside positioned at the LED light 13；

The cooling fin 15 is fixed in 12 upper surface of the pedestal and the outside positioned at the reflector 14；

The lens 16 are fixed in 14 top of the reflector.

In one embodiment of the utility model, the interconnecting piece of the pedestal 12 and the holder 11 is adjustable angle knot Structure.

In one embodiment of the utility model, the pedestal 12 is made by aluminum material to be formed.

In one embodiment of the utility model, the cooling fin 15 is made by aluminum material to be formed.

In one embodiment of the utility model, 15 outer surface of the cooling fin is provided with concave channels.

In one embodiment of the utility model, silica gel sealing is provided between the lens 16 and the reflector 14 Circle.

Compared with prior art, the utility model has the beneficial effects that：

Projecting Lamp provided by the utility model, good heat dissipation effect is simple in structure, and service life is long.

Description of the drawings

Fig. 1 is a kind of structural schematic diagram for Projecting Lamp that the utility model embodiment provides；

Fig. 2 is a kind of structural schematic diagram for LED light that the utility model embodiment provides；

Fig. 3 is a kind of LED encapsulation method flow diagram that the utility model embodiment provides；

Fig. 4 is a kind of structural schematic diagram for GaN base blue chip that the utility model embodiment provides；

Fig. 5 is a kind of LED light principle of luminosity schematic diagram that the utility model embodiment provides；

Fig. 6 A are a kind of arrangement schematic diagram for multiple hemispherical lens that the utility model embodiment provides；

Fig. 6 B are the arrangement schematic diagram for the multiple hemispherical lens of another kind that the utility model embodiment provides.

Specific implementation mode

The utility model is described in further detail With reference to embodiment.But this should not be interpreted as to this The range of the above-mentioned theme of utility model is only limitted to embodiment below, and all technologies realized based on the utility model content are belonged to In the scope of the utility model.

Embodiment one

Fig. 1 is referred to, Fig. 1 is a kind of structural schematic diagram for Projecting Lamp that the utility model embodiment provides.The Projecting Lamp 10 include：Holder 11, pedestal 12, LED light 13, reflector 14, cooling fin 15 and lens 16；Wherein,

The pedestal 12 is connected with the holder 11；

The lens 16 are fixed in 14 top of the reflector.

Projecting Lamp provided in this embodiment has carried out optimizing thermal solution design, good heat dissipation effect, structure near its light source Simply, service life is long.

Embodiment two

The present embodiment is made further to the principles of the present invention and realization method on the basis of embodiment one It is bright.

Specifically, the interconnecting piece of the pedestal 12 and the holder 11 is adjustable angle structure.In practicing, light projector The irradiating angle of lamp 10 is often different, therefore is designed as adjustable angle structure here, to ensure that it is used in various places.

Preferably, the pedestal 12 is made to be formed by aluminum material with the cooling fin 15.Aluminum material density is small, price It is low, it is a kind of good heat sink material, is widely used in electronic product.

Further, 15 outer surface of cooling fin is provided with concave channels.It is arranged in 15 outer surface of cooling fin recessed The purpose of shape groove is for increasing heat radiation area, to improve its radiating efficiency.

Preferably, the reflector 163 is high-purity aluminum material.Because the cost of rafifinal reflector is relatively low, heat resistance It is good, and also have the effect of heat dissipation.

Preferably, the reflector 14 is made by PPS materials and is formed.PPS materials have heat safe characteristic.Due to light projector LED light 13 will produce a large amount of heat in lamp 10, cause internal temperature higher, and PPS materials not will produce change at this temperature Shape.In addition, PPS materials also have the characteristics such as corrosion-resistant and superior mechanical performance, therefore can be as the material of reflector.

Preferably, the lens 16 are made by tempered glass forms.Tempered glass is big, non-breakable with intensity, is easy to Processing, the features such as translucency is good, therefore can preferably make the material of lens 16.

Further, it is provided with silica gel sealing ring between the lens 16 and the reflector 14.The silica gel sealing ring is used In preventing steam from passing in and out to inside Projecting Lamp 10, play a protective role to each device in its inside.

In addition, in order to improve the luminous efficiency and heat dissipation effect of LED light 13, design is also optimized to its structure, is had Body, Fig. 2 is referred to, Fig. 2 is a kind of structural schematic diagram for LED light that the utility model embodiment provides, the LED light 13 packet It includes：

Heat-radiating substrate 21；

LED chip is fixed on the heat-radiating substrate 21；

Layer of silica gel, including it is set in turn in the first lens jacket 22 of the LED chip upper surface, the first encapsulated layer 23, Two lens jackets 24 and the second encapsulated layer 25, wherein the refractive index of first lens jacket 22 is more than first encapsulated layer 23 Refractive index, second lens jacket 24 are more than the refractive index of second encapsulated layer 25, the refractive index of first encapsulated layer 23 Less than the refractive index of second encapsulated layer 25.

First lens jacket 22 and second lens jacket 24 are made of multiple hemispherical lens respectively.

Further, second lens jacket 24 and second encapsulated layer 25 contain fluorescent powder.

Further, 21 material of the heat-radiating substrate is solid copper coin, and the thickness of the heat-radiating substrate 21 is more than 0.5 milli Rice is less than 10 millimeters.

Further, the refractive index of first lens jacket 22 is more than the refractive index of first encapsulated layer 23, and described the Two lens jackets 24 are more than the refractive index of second encapsulated layer 25, and the refractive index of first encapsulated layer 23 is less than second envelope Fill the refractive index of layer 25.

Further, the upper surface of second encapsulated layer 25 is arc.

Further, first lens jacket 22 and first encapsulated layer 23 are made of high temperature resistant silica gel.

Further, a diameter of 10-200 microns of multiple hemispherical lens, and multiple hemispherical lens are equal Even to be alternatively arranged, spacing is 10-200 microns.

Further, multiple rectangular arrangements of the hemispherical lens, or be staggered.

Further, further include holder, the heat-radiating substrate 21 is fixed on by buckle or viscose glue mode on the holder.

Further, the LED chip is gallium nitride base blue light chip.

The beneficial effects of the utility model are specially：

1, pass through and the first lens jacket and the second lens jacket are set so that illumination is more concentrated, and by the upper of the second encapsulated layer Surface is set as arc, carries out shaping to light beam, avoids increase extra lens, reduce production cost.

2, it by the way that fluorescent powder is arranged in the second lens jacket and the second encapsulated layer, avoids and fluorescent powder is applied directly to LED On chip, the quantum efficiency of fluorescent powder caused by solving the problems, such as under the high temperature conditions declines.

3, using the variety classes silica gel feature different with phosphor gel refractive index, the refractive index of the first encapsulated layer is less than the The refractive index of two encapsulated layers, the refractive index of the first lens jacket are more than the refractive index of the first encapsulated layer, the refractive index of the second lens jacket Not only be more than the refractive index of the first encapsulated layer, but also more than the refractive index of the second encapsulated layer, this kind of set-up mode can to avoid total reflection, The light that LED chip is sent out more is shone out through encapsulating material.

4, by using different arrangement modes to hemispherical lens, it is ensured that the light of light source uniformly divides in concentration zones Cloth.

5, the utility model embodiment can change the direction of propagation of light by the way that double lens layer, lens are arranged, can be effective Ground inhibits total reflection effect, is conducive to outside more light emittings to LED, improves the luminous efficiency of LED.

Embodiment three

Fig. 3 is referred to, Fig. 3 is a kind of LED encapsulation method flow diagram that the utility model embodiment provides；Above-mentioned On the basis of embodiment, the present embodiment will in more detail be introduced the technological process of the utility model.This method includes：

Step 1 prepares heat-radiating substrate 21；

Include specifically：Choose the heat-radiating substrate 21；

The heat-radiating substrate 21 is cleaned, the spot above heat-radiating substrate 21, especially oil stain are cleaned up；

The heat-radiating substrate 21 is dried.

Step 2 prepares LED chip, and the LED chip is fixed on the heat-radiating substrate 21；

In the utility model embodiment, as shown in figure 4, Fig. 4 is a kind of GaN base blue light that the utility model embodiment provides The structural schematic diagram of chip；Its middle level 1 is substrate material, and layer 2 is GaN buffer layers, and layer 3 is N-type GaN layer, and layer 4 and layer 6 are p-type GaN Quantum Well wide bandgap materials, layer 5 are INGaN luminescent layers, and layer 7 is AlGaN barrier materials, and layer 8 is p-type GaN layer, the nitrogen Change the thickness of gallium base blue light wick between 90 microns -140 microns；The cathode leg of LED chip and anode tap are utilized Reflow Soldering welding procedure is welded to 21 top of heat-radiating substrate, then checks bonding wire, qualified, then enters lower step process, if It is unqualified, then it welds again.

Step X1, it is respectively provided for preparing the silica gel material of first lens jacket 22 and first encapsulated layer 23；

Specifically, the silica gel material for preparing the first encapsulated layer 23 of silica gel material and preparation of the first lens jacket 22 does not contain Fluorescent powder, and be high temperature resistant silicon glue material；The refractive index of first lens jacket 22 is less than the refraction of first encapsulated layer 23 Rate.

Step X2, it is respectively provided for preparing the silica gel material containing fluorescent powder of second lens jacket 24 and for making The silica gel material containing fluorescent powder of standby second encapsulated layer 25,

Specifically, based in the utility model embodiment, LED chip is gallium nitride base blue light chip, therefore, above-mentioned fluorescence Powder is yellow fluorescent powder；Silica gel and yellow fluorescent powder are mixed, raw material proportioning is adjusted, the silica gel for not having to refractive index is made Material, also, after silica gel is mixed with fluorescent powder, need to carry out color measurement to mixed silica gel material, ensure LED chip It is irradiated on fluorescent powder, the wave-length coverage of the fluorescence sent out is between 570nm-620nm.

Preferably, the refractive index of second lens jacket 24 is more than the refractive index of first encapsulated layer 23, also greater than institute State the refractive index of the second encapsulated layer 25.

Step 3 forms the first lens jacket 22 in the upper surface of the LED chip, and first lens jacket 22 includes multiple First hemispherical lens；

Step 31 forms multiple semispherical silicon glueballs using the first hemispherical above the LED chip；

Step 32 carries out the multiple semispherical silicon glueballs the first just roasting, demoulding and polishing, to form the first lens jacket 22, roasting temperature at the beginning of described first is 90-125 °, and the time is 15-60 minutes.

Preferably, the arrangement mode of multiple first hemispherical lens on the first lens jacket 22 can be rectangle or water chestnut Shape, or be staggered, the spacing of adjacent two the first hemispherical lens is the smaller the better.

Step 4 forms the first encapsulated layer 23 above the LED chip upper surface and first lens jacket 22；

Step 41 coats the first layer of silica gel above the LED chip upper surface and first lens jacket 22；

Step 42 carries out first layer of silica gel the second just roasting and polishing, described to form first encapsulated layer 23 Roasting temperature is 90-125 ° at the beginning of second, and the time is 15-60 minutes.

Specifically, the lower surface of the first layer of silica gel contacts with LED chip or is contacted with the first lens jacket 22, wherein the The upper surface of one layer of silica gel is plane, and in order to which the second lens jacket 24 is arranged on it, and good flatness is conducive to light Beam penetrates the first encapsulated layer 23.

Step 5 forms the second lens jacket 24 above first encapsulated layer 23, and second lens jacket 24 includes multiple Second hemispherical lens, and multiple second hemispherical lens contain fluorescent powder；

Step 51 forms multiple semispherical silicon glueballs using the second hemispherical above first encapsulated layer 23, Contain fluorescent powder in the semispherical silicon glueballs；

Step 52 carries out the multiple semispherical silicon glueballs just roasting third, demoulding and polishing, to form the second lens jacket 24, just roasting temperature is 90-125 ° to the third, and the time is 15-60 minutes.

Step 6 forms the second encapsulated layer 25 above second lens jacket 24, and second encapsulated layer 25 is containing glimmering Light powder；

Step 61 coats the second layer of silica gel above second lens jacket 24 and first encapsulated layer 23；

Step 62 makes the upper surface of second layer of silica gel form arc using the hemispherical；

Step 63 carries out second layer of silica gel the 4th just roasting, demoulding and polishing, to form the second encapsulated layer 25, the Roasting temperature is 90-125 ° at the beginning of four, and the time is 15-60 minutes.

Specifically, setting the upper surface of the second encapsulated layer 25 to arc, it is special to form intermediate appearance high, that both ends are low Point so that the second encapsulated layer 25 is provided with the effect of big lens, can carry out secondary reshaping to light beam, and need not increase outside Lens reduce production cost.

Step 7 will include first lens jacket 22, first encapsulated layer 23, second lens jacket 24 and institute State the second encapsulated layer 25 LED light carry out it is long roasting, to complete the encapsulation of the LED.

Specifically, long roasting baking temperature is 100~150 DEG C, baking time is 4~12h, to eliminate the inside of LED light Stress.

Further include in LED light of test, the LED of go-no-go encapsulation completion and Package Testing qualification etc. after completing LED encapsulation Hold, in favor of subsequent product application.

Example IV

Shown in Fig. 2, Fig. 5 and Fig. 6 A and Fig. 6 B, Fig. 2 is a kind of LED light that the utility model embodiment provides Structural schematic diagram；Fig. 5 is a kind of LED light principle of luminosity schematic diagram that the utility model embodiment provides；Fig. 6 A are this practicality A kind of arrangement schematic diagram for multiple hemispherical lens that new embodiment provides；Fig. 6 B provide another for the utility model embodiment A kind of arrangement schematic diagram of multiple hemispherical lens.

Wherein, the LED light that the utility model embodiment provides, including

Heat-radiating substrate 21；

LED chip is fixed on the package cooling substrate 21；

Layer of silica gel, including it is set in turn in the first lens jacket 22 of the LED chip upper surface, the first encapsulated layer 23, Two lens jackets 24 and the second encapsulated layer 25, wherein first lens jacket 22 and second lens jacket 24 are respectively by multiple half Sphere lens form.

It follows that in the LED light of the utility model embodiment, the first lens jacket 22 and the second lens jacket 24 stack, shape At multilayer lens arrangement, this kind of structure so that illumination is more uniform in concentration zones, and the first lens jacket contacted with LED chip 22 and first encapsulated layer 23 do not contain fluorescent powder, this avoid chips to fall the light absorption to radiate backward, thus improve Efficiency of light extraction.

In the utility model embodiment, LED chip is gallium nitride base blue light chip, second lens jacket 24 and described Second encapsulated layer 25 contains yellow fluorescent powder, when gallium nitride base blue light chip light emitting, as shown in figure 5, LED chip is irradiated to yellow When on fluorescent powder, excitation yellow fluorescent powder, which shines, ultimately forms white light, in this way detaches LED chip with fluorescent powder, solves The problem of quantum efficiency of caused fluorescent powder declines under hot conditions.

In the utility model embodiment, 21 material of the heat-radiating substrate is solid copper coin, and the thickness of the heat-radiating substrate 21 Degree is more than 0.5 millimeter, is less than 10 millimeters, wherein and the thermal capacitance of copper coin is big, and thermal conductivity is good, the heat that LED chip generates when working, Solid copper coin can be quickly move through to distribute, and the thickness of heat-radiating substrate 21, between 0.5-10mm, thickness is larger 21 temperature distortion of heat-radiating substrate can be prevented, ensures that heat-radiating substrate 21 is in close contact with LED chip, ensures heat dissipation effect.

In the utility model embodiment, the refractive index of first lens jacket 22 is more than the refraction of first encapsulated layer 23 Rate, second lens jacket 24 are more than the refractive index of second encapsulated layer 25, and the refractive index of first encapsulated layer 23 is less than The refractive index of second encapsulated layer 25.It is more on the first lens jacket 22 and the second lens jacket 24 in the utility model embodiment The material of a hemispherical lens can be mixed by polycarbonate, polymethyl methacrylate and glass, according to it is each at Point difference the refractive index of hemispherical lens is adjusted, the first encapsulated layer 23 does not contain fluorescent powder, and main composition material can be with It is organosilicon material etc., and the material of the second encapsulated layer 25 can be that methyl silicone rubber and phenyl high refractive index organic silicon rubber are mixed It closes, in the utility model embodiment, the refractive index of lens jacket is more than the refractive index of encapsulated layer, and the refractive index of encapsulated layer is under It is sequentially increased upwards, this kind of set-up mode can preferably inhibit total reflection phenomenon so that illumination maximumlly shines out, and keeps away Exempt from total reflection so that light be packaged structure absorb become heat, improve efficiency of light extraction.

It should be noted that in the utility model embodiment, the refractive index of the second encapsulated layer 25 is the smaller the better, is no more than 1.5, larger refringence is formed to avoid with outside air, leads to light total reflection, packed material absorption switchs to heat, shadow Ring light extraction efficiency.

It should be noted that include multiple first hemispherical lens in the utility model embodiment, on the first lens jacket 22, Those first hemispherical lens are " planoconvex lens ", focal length f=R/ (n2-n1), wherein n2 is the refractive index of the first lens jacket 22 It is averaged with the refractive index of the second lens jacket 24, n1 is that the refractive index of the second lens jacket 24 upper layer and lower layer encapsulated layer is taken to be averaged (refractive index of the first encapsulated layer 23 is less than the second encapsulated layer 25, but the refractive index value of the two to value in the utility model embodiment More close, refringence is little), R is the radius of the first hemispherical lens.

In order to gather state, the utility model when ensureing that light reaches the second lens jacket 24 after the outgoing of the first lens jacket 22 In embodiment, the height of the distance between the first lens jacket 22 and the second lens jacket 24 L should be within 2 times of focal lengths namely L Range is no more than 2R/ (n2-n1).

In addition, in the utility model embodiment, the thickness of the second encapsulated layer 25 is thicker, the top surface of the second lens jacket 24 to The upper surface of two encapsulated layers 25 is generally between 50-500 microns.

In the utility model embodiment, the upper surface of second encapsulated layer 25 is arc, and the arc is specifically as follows Hemispherical, parabolic type or pancake, wherein hemispherical beam angle are maximum, are suitable for general lighting application；Paraboloid light extraction Angle is minimum, is suitable for local lighting application；And pancake falls between, and is suitable for guidance lighting；It therefore, can be according to product Application places select specific shape, to reaching best using effect.Intermediate high in this way, the low surface structure in both sides makes Obtaining the second encapsulated layer 25 has the function of lens, when illumination is mapped to the second 25 surface of encapsulated layer, by the second encapsulated layer 25 Shaping so that illumination is more concentrated uniformly, and need not increase outer lens, reduces production cost.

When due to LED operation, a large amount of heat is will produce, causes silica gel material is heated yellow can occur, influences lighting color And product service life, therefore, the first lens jacket 22 being in direct contact with LED chip in the utility model embodiment and One encapsulated layer 23 is made of high temperature resistant silica gel.

In the utility model embodiment, a diameter of 10-200 microns of multiple hemispherical lens, and multiple described half Sphere lens uniform intervals arrange, and spacing is 10-200 microns, as shown in Fig. 2, a diameter of 2R of multiple hemispherical lens, between Between 10-200 microns, it should be noted that the diameter of multiple hemispherical lens can be the same or different, and two neighboring half The distance between sphere lens be A, the range of A between 10-200 microns, between adjacent two hemispherical lens away from From the smaller the better, and spacing A can be different, can also be evenly distributed, and the present embodiment is without limitation.

In the utility model embodiment, appropriate restriction is also carried out to the arrangement mode of multiple hemispherical lens, such as Fig. 6 A It is shown, multiple rectangular arrangements of hemispherical lens, or as shown in Figure 6B, multiple hemispherical lens are staggered.Specifically, this In utility model embodiment, the first lens jacket 22 uses rectangular arranged, and the use of the second lens jacket 24 is staggered or phase intermodulation It changes, to realize the staggered effect of hemispherical lens of the first lens jacket 22 and the second lens jacket 24, being staggered can incite somebody to action Light between adjacent lens is gathered, and focussing force is generated.

And when the first lens jacket 22 is consistent with the arrangement mode of hemispherical lens of the second lens jacket 24, it can be to LED The rambling light that chip generates carries out shaping, and light is made to gather.

In the utility model embodiment, the encapsulating structure further includes holder, and heat-radiating substrate 21 is fixed on holder, fixed Mode has the modes such as buckle, viscose glue.

Specifically, in the utility model embodiment, heat-radiating substrate 21 is solid copper substrate, the thickness D of heat-radiating substrate 21 Between 0.5-10mm, the width W of heat-radiating substrate 21 is cut according to the size of LED chip, is not limited herein, copper Substrate thermal capacitance is big, and thermal conductivity is good, and is not easy temperature distortion so that more preferable to the thermal diffusivity of LED chip.First lens jacket 22, The radius of each hemispherical lens is R, and the spacing of two neighboring hemispherical lens is A, the top surface of the first lens jacket 22 to second The distance of the bottom surface of lens jacket 24 is L, and for L between 0-2R/ (n2-n1), the second lens jacket 24 is set to the first encapsulated layer 23 Top, the radiuses of multiple hemispherical lens on the second lens jacket 24 is also R, and multiple hemisphericals on the second lens jacket 24 The top surface of lens to the upper surface of the second encapsulated layer 25 distance between 50-500 microns, in the utility model embodiment, second The upper surface of encapsulated layer 25 is arc, forms a larger lens, to carry out secondary reshaping to light beam, and avoids increase Outer lens, therefore reduce production cost.

Finally it should be noted that：Above example is only to illustrate the technical solution of the utility model, rather than its limitations； Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that： It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc. With replacement；And these modifications or replacements, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution The spirit and scope of scheme.

Claims

1. a kind of Projecting Lamp (10), which is characterized in that including：Holder (11), pedestal (12), LED light (13), reflector (14), Cooling fin (15) and lens (16)；Wherein,

The pedestal (12) is connected with the holder (11)；

The LED light (13) is fixed in the pedestal (12) upper surface middle position；

The reflector (14) is fixed in the pedestal (12) upper surface and the outside positioned at the LED light (13)；

The cooling fin (15) is fixed in the pedestal (12) upper surface and the outside positioned at the reflector (14)；

The lens (16) are fixed in the reflector (14) top.

2. Projecting Lamp (10) according to claim 1, which is characterized in that the company of the pedestal (12) and the holder (11) Socket part is adjustable angle structure.

3. Projecting Lamp (10) according to claim 1, which is characterized in that the pedestal (12) is made by aluminum material to be formed.

4. Projecting Lamp (10) according to claim 1, which is characterized in that the cooling fin (15) makes shape by aluminum material At.

5. Projecting Lamp (10) according to claim 1, which is characterized in that cooling fin (15) outer surface is provided with spill Groove.

6. Projecting Lamp (10) according to claim 1, which is characterized in that the lens (16) and the reflector (14) it Between be provided with silica gel sealing ring.