CN207705235U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN207705235U CN207705235U CN201721611552.1U CN201721611552U CN207705235U CN 207705235 U CN207705235 U CN 207705235U CN 201721611552 U CN201721611552 U CN 201721611552U CN 207705235 U CN207705235 U CN 207705235U
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Abstract
The utility model is related to a kind of LED encapsulation structures, including：Package substrate (21)；LED chip is fixed on the package substrate (21)；Layer of silica gel, including：It is successively set on the first layer of silica gel (22) and the second layer of silica gel (24) of the LED chip upper surface, and it is additionally provided with multiple sphere lens (23) between first layer of silica gel (22) and second layer of silica gel (24), wherein, second layer of silica gel (24) contains yellow fluorescent powder.The utility model embodiment is arranged by the way that multiple sphere lens are arranged, and by yellow fluorescent powder in the second layer of silica gel so that illumination is more concentrated, and avoids increase extra lens, reduces production cost.
Description
Technical field
The utility model belongs to photoelectric device technical field, and in particular to a kind of LED encapsulation structure.
Background technology
White light emitting diode (Lighting Emitting Diode) has efficient, long lifespan, and reliability is high, ring
Protect it is energy saving, using it is flexible many advantages, such as, be commonly recognized the lighting source for forth generation, have vast potential for future development.It crosses
Go over several years the demand for LED increasingly increase, especially high brightness and high-power LED.
In the prior art, the white-light LED structure of mainstream is blue chip+yellow fluorescent powder at present, is by by fluorescent powder
It is coated on chip with the mixture of silica gel and (also cries dispensing), though however, high brightness and high-power LED can be generated largely
Light, but also a large amount of heat is will produce, so that the temperature around chip is increased rapidly, high temperature to be applied directly on chip surface
The quantum efficiency of fluorescent powder is remarkably decreased, and the luminous efficiency of fluorescent powder constantly declines due to heated, to seriously affect LED
The luminous efficiency and service life of encapsulating structure.
Therefore, LED luminous efficiencies how to be improved and extend the hot research problem that LED service lifes are this fields.
Utility model content
For the problem present on, the utility model proposes a kind of new LED encapsulation structure, specific embodiments
It is as follows.
Specifically, the utility model embodiment provides a kind of LED encapsulation structure, including：
Package substrate (21)；
LED chip is fixed on the package substrate (21)；
Layer of silica gel, including：It is successively set on the first layer of silica gel (22) and the second layer of silica gel of the LED chip upper surface
(24), multiple sphere lens (23) and between first layer of silica gel (22) and second layer of silica gel (24) are additionally provided with,
Wherein, second layer of silica gel (24) contains yellow fluorescent powder.
In one embodiment of the utility model, the upper surface of second layer of silica gel (24) is arc-shaped.
In one embodiment of the utility model, a diameter of 10-200 microns of the sphere lens (23), and it is multiple
Sphere lens (23) the uniform intervals arrangement, spacing are 10-200 microns.
In one embodiment of the utility model, multiple sphere lens (23) can with rectangular evenly distributed,
It can be arranged in a rhombus shape.
In one embodiment of the utility model, the substrate (21) is solid aluminium sheet, the thickness of the substrate (21)
More than 0.5 millimeter, less than 10 millimeters.
Further include holder in one embodiment of the utility model, the substrate (21) passes through buckle or viscose glue
Mode is fixed on the holder.
The beneficial effects of the utility model are：
1, by being arranged sphere lens between the first layer of silica gel and the second layer of silica gel, and by the upper table of the second layer of silica gel
Face forms arc so that encapsulating structure itself has the function of lens, while ensureing that illumination is more concentrated, it is thus also avoided that increases
Add extra lens to carry out shaping to light, reduces production cost；
2, sphere lens and the second layer of silica gel are made by using the silica gel containing yellow fluorescent powder, avoid fluorescent powder with
LED chip is in direct contact, and improves the efficiency of light extraction of LED encapsulation.
Description of the drawings
Fig. 1 is the structural schematic diagram for the LED encapsulation structure that the utility model embodiment provides；
Fig. 2 is the structural schematic diagram for the GaN base blue chip that the utility model embodiment provides；
Fig. 3 A, Fig. 3 B are the arrangement schematic diagram for multiple sphere lens that the utility model embodiment provides.
Reference sign：
21- package substrates；
The first layer of silica gel of 22-；
23- sphere lens；
The second layer of silica gel of 24-.
Specific implementation mode
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings to this
The specific implementation mode of utility model is described in detail.
Referring to FIG. 1, Fig. 1 is the structural schematic diagram for the LED encapsulation structure that the utility model embodiment provides；Wherein, originally
The LED encapsulation structure that utility model embodiment provides, the encapsulating structure include：Package substrate 21；LED chip is fixed in institute
It states on package substrate 21；Specifically, the LED chip is GaN base blue chip.
Further, which further includes layer of silica gel, wherein layer of silica gel includes successively in the utility model embodiment
The first layer of silica gel 22 and the second layer of silica gel 24 in the LED chip upper surface is set, that is, in the utility model embodiment
Layer of silica gel is made of two layers of layer of silica gel, specifically, the first layer of silica gel 22 is applied directly to the upper surface of LED chip, with LED chip
It is in direct contact, and does not contain yellow fluorescent powder in the first layer of silica gel 22, the second layer of silica gel 24 is located at 22 top of the first layer of silica gel not
It is contacted with LED chip, and contains yellow fluorescent powder in the second layer of silica gel 24, be achieved LED chip and fluorescent powder point
From purpose, avoid LED chip absorb reflections from phosphor particles return light, improve light extraction efficiency；And the indigo plant that LED chip is sent out
The illumination of color is mapped on yellow fluorescent powder, and photochromic mixing can form white light.Therefore, by mixing yellow fluorescent powder in the present embodiment
It closes into the second layer of silica gel 24, the quantum efficiency for solving fluorescent powder caused by yellow fluorescent powder is in direct contact with LED chip is aobvious
Write the technical issues of declining.
It should be noted that the LED chip in the utility model embodiment is GaN base blue chip, structure such as Fig. 2 institutes
Show, Fig. 2 is the structural schematic diagram for the GaN base blue chip LED chip that the utility model embodiment provides；Wherein, layer 1 is substrate
Material, layer 2 are GaN buffer layers, and layer 3 is N-type GaN layer, and layer 4 and layer 6 are p-type GaN Quantum Well wide bandgap materials, and layer 5 is INGaN
Luminescent layer, layer 7 are AlGaN barrier materials, and layer 8 is p-type GaN layer, the thickness of LED chip between 90 microns -140 microns it
Between, in addition, LED chip can also be other kinds of, the utility model is not restricted this.
Further, it in the utility model embodiment, is additionally provided between the first layer of silica gel 22 and the second layer of silica gel 24
Then multiple sphere lens 23 remove lower semisphere specifically, silica-gel sphere is made first with episphere mold and lower semisphere mold
Silica-gel sphere is placed in the hemispherical groove of 22 upper surface of the first layer of silica gel by mold, after high-temperature shaping, removes episphere mould
Tool forms sphere lens 23, wherein the size phase of the size of silica-gel sphere and the hemispherical groove of the first layer of silica gel upper surface
Match.
In the utility model embodiment, multiple sphere lens 23 are set in the first layer of silica gel 22, finally in multiple spherical shapes
The second layer of silica gel 24, referring again to Fig. 1, adjacent two sphere lens 23 is arranged in lens 23 and 22 top of the first layer of silica gel
Between connected by silica gel strip, the second layer of silica gel 24 and the first layer of silica gel 22 are kept apart, the utility model embodiment passes through
Increase multiple sphere lens 23 between the first layer of silica gel 22 and the second layer of silica gel 24, such GaN base blue chip is through the
After one layer of silica gel 22, into sphere lens 23, sphere lens 23 have the amplification factor than ordinary lens bigger, therefore,
Illumination range is expanded, the illumination after diverging is mapped in the second layer of silica gel 24, and excitation yellow fluorescent powder sends out white light.Thus may be used
Know, the utility model embodiment is changed by adding multiple sphere lens 23 between the first layer of silica gel 22 and the second layer of silica gel 24
It has been apt to LED chip to shine the problem of disperseing so that light beam is more uniform in concentration zones, improves the light extraction of LED light emitting diodes
Efficiency and outgoing light homogeneity.
It should be noted that referring again to Fig. 1, bottom surface and the LED chip upper table of the sphere lens 23 in the present embodiment
The distance between face is L, it is preferred that L is more than 3 microns.
Multiple sphere lens 23 in the utility model embodiment are " convexo-convex mirror ", the focal length f=R/ (2 of " convexo-convex mirror "
(n2-n1)), wherein n2 is the refractive index of sphere lens 23, and n1 takes the refractive index of the first layer of silica gel 22 and the second layer of silica gel 24
Mean value (23 upper layer and lower layer silica gel refractive index close of sphere lens in the utility model embodiment), R is the radius of sphere lens 23.
In order to ensure that light does not gather state after lens outgoing, without dissipating, in the utility model embodiment, the second silicon
The height that glue-line 24 is higher by 23 top surface of sphere lens should be within 2 times of focal lengths namely the second layer of silica gel 24 should be higher by spherical shape
23 top surface R/ (n2-n1) of lens, in practical applications, the thickness of the second layer of silica gel 24 are generally higher by 23 top surface 50- of sphere lens
500 microns.
Since the LED light sent out is distributed in divergence expression so that it needs to carry out shaping to LED beam by outer lens,
Production cost is improved, in order to solve the technical problem, in the utility model embodiment, the upper surface of the second layer of silica gel 24 is in arc
Specifically arc is made, institute in the utility model embodiment using hemispherical in the upper surface of second layer of silica gel 24 by shape
It states arc and is specifically as follows hemispherical, parabolic type or pancake, wherein hemispherical beam angle is maximum, is suitable for general lighting
Using；Paraboloid beam angle is minimum, is suitable for local lighting application；And pancake falls between, and is suitable for guidance lighting.
Therefore, specific shape can be selected according to products application place, to reach best using effect.It is intermediate high in this way, two
The low surface structure in side makes the second silica gel be provided with the effect of lens, when illumination is mapped to the second 24 surface of layer of silica gel, passes through
The shaping of second layer of silica gel 24 so that illumination is more concentrated uniformly, and need not increase outer lens, is reduced and is produced into
This.
In the present embodiment, in order to preferably make GaN base blue chip excite yellow fluorescent powder to send out white light, this implementation
In example, contain yellow fluorescent powder in multiple sphere lens 23, specifically, the light beam that GaN base blue chip is sent out irradiates first
It onto the first layer of silica gel 22, is then irradiated on sphere lens 23, sphere lens 23 can change the direction of propagation of light, Neng Gouyou
Effect ground inhibits total reflection effect, is conducive to outside more light emittings to LED, improves the luminous efficiency of LED.Due to sphere lens
23 and second contain yellow fluorescent powder in layer of silica gel 24, ensure that the light beam that GaN base blue chip is sent out can be irradiated to more
Yellow fluorescent powder on so that LED illumination effects are more preferable, LED illumination effects are poor caused by avoiding fluorescent powder amount deficiency
The technical issues of.
It should be noted that in order to ensure that the light beam that GaN base blue chip is sent out constantly expands, not only need setting can
Expand multiple sphere lens 23 of range of exposures and set the upper surface of the second layer of silica gel 24 to arc, it is also necessary in material
Aspect meets the following conditions：The refractive index of first encapsulated layer 22 is less than the refractive index of second encapsulated layer 24, and described
The refractive index of sphere lens 23 is more than the refractive index of second encapsulated layer 24.Specifically, in the utility model embodiment, silica gel
The set-up mode that the refractive index of layer is sequentially increased from bottom to top, can preferably inhibit total reflection phenomenon, and the second encapsulated layer
24 refractive index is the smaller the better, forms refringence to avoid between the second encapsulated layer 24 and outside air, causes to be totally reflected, and leads to
This kind of set-up mode is crossed, to make illumination maximumlly shine out, avoids total reflection so that light is packaged structure absorption and becomes
Heat improves efficiency of light extraction.
In the utility model embodiment, the lens silica gel material of multiple sphere lens 23 can be by polycarbonate, poly- first
Base methacrylate and glass mix, and the refractive index of sphere lens 23 can be adjusted according to the difference of each ingredient.
And can be methyl silicone rubber and phenyl high refractive index organic silicon rubber mix the material of the second layer of silica gel 24, this practicality is new
The refractive index of the second layer of silica gel 24 is the smaller the better in type embodiment, is the upper limit with 1.5.The light that GaN base blue chip is sent out in this way
To when external radiation, can obtaining preferable light emission rate, and make light more uniform in irradiated region.
It should be noted that since the first layer of silica gel 22 is applied directly in LED chip, it is desirable to be able to be resistant to LED chip
The a large amount of heat come out, therefore the first layer of silica gel 22 contacted with LED chip is made of heat safe silica gel, thus may be used
The problem of causing light transmittance to decline to avoid the heated easy aging jaundice of silica gel.
In addition, yellow fluorescent powder can be used (Y, Gd) in the utility model embodiment3(Al,Ga)5O12:Ce、(Ca,Sr,
Ba)2SiO4:Eu、AESi2O2N2:Eu、M-α-SiAlON:The materials such as Eu, light penetrate sphere lens 23 and the second layer of silica gel 24
Afterwards, yellow fluorescent powder is excited, it is 570nm-620nm to make the wave-length coverage of its fluorescence sent out.
In the utility model embodiment, the size of sphere lens 23 is limited, if the size mistake of sphere lens 23
It is small, then do not have the effect of optically focused, and when sphere lens 23 it is oversized when, then it is even to be easy to cause uneven illumination, therefore,
In the present embodiment, the diameter 2R of sphere lens 23 is between 10-200 microns, and 23 uniform intervals of multiple sphere lens are arranged
Row namely spacing are equal, and in the present embodiment, the spacing A between two neighboring sphere lens 23 is 10-200 microns, it is preferred that
Spacing A between two neighboring sphere lens is in 5 microns -10 microns, the utility model embodiment, adjacent two spherical shapes
Spacing between lens 23 is the smaller the better.
It should be noted that in the utility model embodiment, the spacing between multiple sphere lens 23 can not also be equal,
The actual needs being subject in industrial production.
It should be noted that in the utility model embodiment, sphere lens 23 so that the irradiation of GaN base blue chip light into
Go shaping so that light beam is more concentrated, as shown in Figure 3A and Figure 3B, the multiple sphere lens formed in the first layer of silica gel 22
23 can also be assumed diamond in shape evenly distributed with rectangular evenly distributed, in addition, the arrangement mode of multiple sphere lens 23 can be with
It is round, ellipse or irregular shape, can ensure that the light of light source is uniformly distributed i.e. in concentration zones to the maximum extent
Can, the utility model embodiment is not restricted this.
It since LED chip is contacted with package substrate 21, and is radiated by package substrate 21, the utility model is implemented
Package substrate 21 uses the preferably solid aluminium sheet of thermal diffusivity in example, and aluminium sheet thermal capacitance is big, good heat conduction effect, and package substrate 21
For thickness between 0.5mm-10mm, the thicker package substrate 21 of use can prevent basal plate heated from deforming, this addresses the problem
Package substrate temperature distortion leads to contact not close, the technical problem of heat dissipation effect difference with LED chip.
Further include holder in the utility model embodiment, substrate 21 is fixed on described by way of buckle or viscose glue
On holder, in the utility model embodiment, after substrate 21 is fixed on holder, in actual use, it can secure a bracket to appoint
What is used at component or the position of the light emitting diode.
The above content is combine specific preferred embodiment to made by the utility model embodiment further specifically
It is bright, and it cannot be said that the specific implementation of the utility model is confined to these explanations.For the utility model technical field
For those of ordinary skill, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made,
It all shall be regarded as belonging to the scope of protection of the utility model.
Claims (6)
1. a kind of LED encapsulation structure, which is characterized in that including：
Package substrate (21)；
LED chip is fixed on the package substrate (21)；
Layer of silica gel, including：It is successively set on the first layer of silica gel (22) and the second layer of silica gel (24) of the LED chip upper surface,
And it is additionally provided with multiple sphere lens (23) between first layer of silica gel (22) and second layer of silica gel (24), wherein
Second layer of silica gel (24) contains yellow fluorescent powder.
2. LED encapsulation structure according to claim 1, which is characterized in that the upper surface of second layer of silica gel (24) is in
Arc.
3. LED encapsulation structure according to claim 1, which is characterized in that a diameter of 10- of the sphere lens (23)
200 microns, and multiple sphere lens (23) uniform intervals arrange, spacing is 10-200 microns.
4. LED encapsulation structure according to claim 1, which is characterized in that multiple sphere lens (23) can be in square
Shape is evenly distributed, can also be arranged in a rhombus shape.
5. LED encapsulation structure according to claim 1：It is characterized in that, the substrate (21) is solid aluminium sheet, the base
The thickness of plate (21) is more than 0.5 millimeter, is less than 10 millimeters.
6. LED encapsulation structure according to claim 1, which is characterized in that further include holder, the substrate (21) passes through card
The mode of button or viscose glue is fixed on the holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721611552.1U CN207705235U (en) | 2017-11-28 | 2017-11-28 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721611552.1U CN207705235U (en) | 2017-11-28 | 2017-11-28 | A kind of LED encapsulation structure |
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| Publication Number | Publication Date |
|---|---|
| CN207705235U true CN207705235U (en) | 2018-08-07 |
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| CN201721611552.1U Expired - Fee Related CN207705235U (en) | 2017-11-28 | 2017-11-28 | A kind of LED encapsulation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107994110A (en) * | 2017-11-28 | 2018-05-04 | 西安科锐盛创新科技有限公司 | A kind of LED encapsulation structure |
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- 2017-11-28 CN CN201721611552.1U patent/CN207705235U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107994110A (en) * | 2017-11-28 | 2018-05-04 | 西安科锐盛创新科技有限公司 | A kind of LED encapsulation structure |
| CN107994110B (en) * | 2017-11-28 | 2020-03-24 | 西安科锐盛创新科技有限公司 | LED packaging structure |
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Granted publication date: 20180807 Termination date: 20201128 |