CN207802520U - High reliability filling holes with resin wiring board - Google Patents
High reliability filling holes with resin wiring board Download PDFInfo
- Publication number
- CN207802520U CN207802520U CN201820284908.3U CN201820284908U CN207802520U CN 207802520 U CN207802520 U CN 207802520U CN 201820284908 U CN201820284908 U CN 201820284908U CN 207802520 U CN207802520 U CN 207802520U
- Authority
- CN
- China
- Prior art keywords
- resin
- wiring board
- high reliability
- hole
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model belongs to wiring board technology field more particularly to a kind of high reliability filling holes with resin wiring board.It solves the prior art and designs the technical problems such as unreasonable.This high reliability filling holes with resin wiring board includes glass fabric of epoxy resin, it is respectively equipped with copper wire layer on two surfaces of glass fabric of epoxy resin, it is equipped with fire-retardant ink layer in any one layer of one side of the copper wire layer far from glass fabric of epoxy resin, several through-holes through glass fabric of epoxy resin thickness direction are equipped on glass fabric of epoxy resin, it is equipped with copper plate on the hole wall of through-hole, column resin is respectively equipped in the copper plate of each through-hole.The utility model has the advantage of：Resin vacuum consent can be accomplished to flush with copper without cavity, crackle, surface in hole, solve the mass defects such as cavity, the crackle in conventional printing ink filling holes with resin, realize the high reliability of product.
Description
Technical field
The utility model belongs to wiring board technology field more particularly to a kind of high reliability filling holes with resin wiring board.
Background technology
With the high speed development of electronic information technology, the gradual microminaturization of component, wiring board wiring density is gradually increased,
Graphical design area also reduces continuous therewith, and product reliability requires higher and higher.
In order to adapt to this development trend, the making of the design and manufacture of PCB in constantly more new designing concept and technique
Method, to reach the requirement of high-precision and high reliability.
However, the high density high reliability of existing aperture filament is difficult to reach higher precision, lead to that there are more
Defective work, production cost are higher.
Utility model content
The purpose of this utility model is in view of the above-mentioned problems, providing a kind of high density height that can improve aperture filament
The high reliability filling holes with resin wiring board of reliability.
In order to achieve the above objectives, the utility model uses following technical proposal：This high reliability filling holes with resin wiring board
Including glass fabric of epoxy resin, it is respectively equipped with copper wire layer on two surfaces of glass fabric of epoxy resin, in any one layer of copper wire
One side of the road floor far from glass fabric of epoxy resin is equipped with fire-retardant ink layer, is equipped on glass fabric of epoxy resin several through epoxy
The through-hole of plexiglas cloth thickness direction is equipped with copper plate on the hole wall of through-hole, is set respectively in the copper plate of each through-hole
There is column resin.
In this application, resin vacuum consent can be accomplished to flush with copper without cavity, crackle, surface in hole, solve conventional
The mass defects such as cavity, crackle in ink resin consent realize the high reliability of product.
The fire-retardant ink layer of design, can further increase flame retardant property.
In above-mentioned high reliability filling holes with resin wiring board, the column resin length is equal to or more than epoxy resin
The thickness of glass cloth.
The design of the structure easy to process can manufacture.
In above-mentioned high reliability filling holes with resin wiring board, the through-hole is in array distribution.
The design of the structure, manufacture easy to process.
In above-mentioned high reliability filling holes with resin wiring board, the glass fabric of epoxy resin thickness is more than copper wire layer
Thickness.
In above-mentioned high reliability filling holes with resin wiring board, the column resin is vacuum resin.
Compared with prior art, the advantages of this high reliability filling holes with resin wiring board, is：
1, resin vacuum consent can be accomplished to flush with copper without cavity, crackle, surface in hole, solve conventional printing ink resin plug
The mass defects such as cavity, crackle in hole realize the high reliability of product.
2, the fire-retardant ink layer designed, can further increase flame retardant property.
3, simple in structure and easy to manufacture.
Description of the drawings
Fig. 1 is structural schematic diagram provided by the utility model.
In figure, glass fabric of epoxy resin 1, copper wire layer 2, fire-retardant ink layer 3, copper plate 4, column resin 5.
Specific implementation mode
It is the specific embodiment of utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
As shown in Figure 1, this high reliability filling holes with resin wiring board includes glass fabric of epoxy resin 1, in glass epoxy
Two surfaces of cloth 1 are respectively equipped with copper wire layer 2, in any one layer of copper wire layer 2 setting on one side far from glass fabric of epoxy resin 1
There is fire-retardant ink layer 3, several through-holes through 1 thickness direction of glass fabric of epoxy resin are equipped on glass fabric of epoxy resin 1,
The hole wall of through-hole is equipped with copper plate 4, and column resin 5 is respectively equipped in the copper plate 4 of each through-hole.
5 length of column resin is equal to or more than the thickness of glass fabric of epoxy resin 1.
The through-hole is in array distribution.
1 thickness of glass fabric of epoxy resin is more than the thickness of copper wire layer 2.
The column resin 5 is vacuum resin.
In the present embodiment
The aluminium flake of one 0.3mm is bored bigger 0.05mm than wiring board consent aperture by the hole site of wiring board requirement consent
Hole；The consent aluminium flake being drilled is sticked to and (is sticked other than figure) on a silk-screen halftone to have stretched tight, graph area is then prescinded
The unwanted silk screen in domain is fabricated to a consent halftone；Halftone is aligned with the circuit plate hole of consent is wanted with hole, special jack is used
Ink is printed using the method for silk-screen printing in vacuum screen printer, and stopple is full.The half-finished circuit board of resin will be stoppered
It after the baking-curing of 150 DEG C of hours, is first roughly ground with amary tape grinding machine, then in the grinder with dedicated ceramics brush
Upper fine grinding will be above the Excess resin removal on copper surface.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (5)
1. high reliability filling holes with resin wiring board, which is characterized in that this wiring board includes glass fabric of epoxy resin (1), in epoxy
Two surfaces of plexiglas cloth (1) are respectively equipped with copper wire layer (2), in any one layer of copper wire layer (2) far from epoxy resin
The one side of glass cloth (1) is equipped with fire-retardant ink layer (3), is equipped on glass fabric of epoxy resin (1) several through epoxy resin glass
The through-hole of glass cloth (1) thickness direction is equipped with copper plate (4) on the hole wall of through-hole, in the copper plate (4) of each through-hole respectively
Equipped with column resin (5).
2. high reliability filling holes with resin wiring board according to claim 1, which is characterized in that the column resin (5)
Length is equal to or more than the thickness of glass fabric of epoxy resin (1).
3. high reliability filling holes with resin wiring board according to claim 1, which is characterized in that the through-hole is in array point
Cloth.
4. high reliability filling holes with resin wiring board according to claim 1, which is characterized in that the glass epoxy
Cloth (1) thickness is more than the thickness of copper wire layer (2).
5. high reliability filling holes with resin wiring board according to claim 1, which is characterized in that the column resin (5)
For vacuum resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820284908.3U CN207802520U (en) | 2018-02-28 | 2018-02-28 | High reliability filling holes with resin wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820284908.3U CN207802520U (en) | 2018-02-28 | 2018-02-28 | High reliability filling holes with resin wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207802520U true CN207802520U (en) | 2018-08-31 |
Family
ID=63275685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820284908.3U Expired - Fee Related CN207802520U (en) | 2018-02-28 | 2018-02-28 | High reliability filling holes with resin wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207802520U (en) |
-
2018
- 2018-02-28 CN CN201820284908.3U patent/CN207802520U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180831 Termination date: 20210228 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |