CN106028640B - A kind of silver paste hole filled double-deck perforation printed wiring board and its manufacturing process - Google Patents
A kind of silver paste hole filled double-deck perforation printed wiring board and its manufacturing process Download PDFInfo
- Publication number
- CN106028640B CN106028640B CN201610423669.0A CN201610423669A CN106028640B CN 106028640 B CN106028640 B CN 106028640B CN 201610423669 A CN201610423669 A CN 201610423669A CN 106028640 B CN106028640 B CN 106028640B
- Authority
- CN
- China
- Prior art keywords
- silver paste
- wiring board
- printed wiring
- hole filled
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of silver paste hole filled double-deck perforation printed wiring board and its manufacturing process, including upper layer circuit layer, lower layer's line layer and the multiple perforations for running through upper layer circuit layer and lower layer's line layer along the vertical direction, silver paste is filled in multiple perforations, upper layer circuit layer and lower layer's line layer are realized by silver paste hole filled technique to be electrically connected, wherein, upper layer circuit layer, lower layer's line layer and perforation pass through surface modification treatment before implementing silver paste hole filled technique.The surface treatment and silver paste of the present invention plays synergistic effect, improves the stability of silver paste, restrained effectively the migration of silver ion.
Description
Technical field
The present invention relates to a kind of double-deck perforation printed wiring board and its manufacturing process, and in particular to a kind of silver paste hole filled pair
Layer perforation printed wiring board and its manufacturing process.
Background technology
Printed wiring board makes circuit miniaturization, intuitiveization, the batch production for permanent circuit and optimization electrical appliance layout
It plays an important role.Printed wiring board can be described as printed circuit board, and English name is Printed Circuit Board (PCB).Print
Brush wiring board is the supplier of electronic component electrical connection.Its development has more than 100 years history；Its design master
If layout design；Major advantage using circuit board is to greatly reduce the mistake of wiring and assembly, improves automatization level
With productive labor rate.
As shown in Figure 1, silver paste hole filled printing is to make a kind of new technology of dual platen, and the method that it uses physics, perforation
Two-sided conducting wire plate connection, manufacturing technology is biting by screen mesh printing plate using silver electrocondution slurry, is penetrated into pre-
In the hole made, then silver paste is penetrated into hole using capillary theory, silver conductive ink is filled in the hole made, and
Form interconnection.
However, printed wiring board is using after silver paste hole filled, after applying voltage or being influenced by temperature, humidity, it may appear that empty
Between " dendroid " silver migration, cause insulation resistance to decline.I.e. under high humidity environment, silver can in the insulator be moved by ion
Dynamic, insulation performance reduces and ultimately forms short circuit between causing satin.
Invention content
For this purpose, in view of the defects and deficiencies of the prior art, the present invention intends to provide a kind of structures and simple for process
The silver paste hole filled double-deck perforation printed wiring board and its manufacturing process, solve in the prior art since temperature, humidity are to silver
Transport phenomena caused by slurry avoids insulation resistance due to resistance decrease problem caused by this problem.
To achieve the above object, the technical solution adopted by the present invention is：The silver paste hole filled double-deck perforation printed wiring board packet
Upper layer circuit layer, lower layer's line layer and the multiple perforations for running through upper layer circuit layer and lower layer's line layer along the vertical direction are included, it is multiple
It is realized and is electrically connected by silver paste hole filled technique filled with silver paste, upper layer circuit layer and lower layer's line layer in perforation, wherein upper layer
Line layer, lower layer's line layer and perforation pass through surface modification treatment before implementing silver paste hole filled technique.
Further, silver paste by following parts by weight at being grouped as：Nano silicon dioxide 5-13, nickel acetate 7-12, toluene
Cyclohexanone 12-19, glyceryl tristearate 8-15, ethyl orthosilicate 5-9, inositol hexaphosphate 4-8, aminopropyl-triethoxy silicon
Alkane 4-6, methylisobutylketone 15-22, nano magnesia 5-10, nano-silver powder 64-80.
Further, surface modification treatment includes that the double-deck perforation printed wiring board with multiple perforations is immersed in table
Sonic oscillation in the modified solution of face then takes out vacuum drying to get the modified double-deck perforation printed wiring board in surface.
Further, surface modification solution by following parts by weight at being grouped as：Methyl triacetoxysilane 50-60,
Zinc acetate 5-10, glycerol stearate monoesters 3-8.
Further, the average grain diameter of nano silicon dioxide is 50-200nm.
Further, the average grain diameter of nano magnesia is 60-500nm.
Further, the average grain diameter of nano-silver powder is 20-100nm.
The present invention also provides a kind of manufacturing methods of the silver paste hole filled double-deck perforation printed wiring board, include the following steps：
(1) surface modification solution is made according to the raw material of following parts by weight：Methyl triacetoxysilane 50-60, acetic acid
Zinc 5-10, glycerol stearate monoesters 3-8；
(2) the double-deck perforation printed wiring board with multiple perforations is immersed in sonic oscillation in surface modification solution, so
Vacuum drying is taken out afterwards to get the modified double-deck perforation printed wiring board in surface；
(3) toluene cyclohexanone 12-19, glyceryl tristearate 8-15, ethyl orthosilicate 5-9, flesh are taken according to parts by weight
Six phosphate 4-8 of alcohol, aminopropyl triethoxysilane 4-6, methylisobutylketone 15-22, mix above-mentioned organic matter obtain mixing it is molten
Nano silicon dioxide 5-13, nickel acetate 7-12, nano magnesia 5- is added according to parts by weight in above-mentioned mixed solution in liquid
10, nano-silver powder 64-80 is stirred evenly, and obtains silver paste；
(4) silver paste modified double-deck the multiple of perforation printed wiring board in surface are packed into using silver paste hole filled technique to pass through
Kong Zhong is stood, dry to get the silver paste hole filled double-deck perforation printed wiring board.
Further, the time of the sonic oscillation of step (2) is 1-5h.
Further, the vacuum drying temperature of step (2) is 60-100 DEG C, and the time is 2-6h.
Further, the time of repose of step (4) is 1-3h, and drying temperature is 80-100 DEG C, drying time 2-5h.
The present invention has the following advantages：
1, contain glyceryl tristearate and inositol hexaphosphate in the formula of through-hole silver paste, can inhibit to a certain extent
The ionization of silver, improves the stability of silver paste.
2, the double-deck perforation printed wiring board first carries out surface modification treatment, using first before implementing silver paste hole filled technique
After base triacetoxysilane vinegar, sour zinc, glycerol stearate monoesters are modified the double-deck perforation printed wiring board, with the present invention
Silver paste play synergistic effect, greatly improve the stability of silver paste, restrained effectively the migration of silver ion.
Description of the drawings
Fig. 1 is the schematic diagram of the silver paste hole filled double-deck perforation printed wiring board.
Specific implementation mode
With reference to the accompanying drawings to invention is more fully described, wherein illustrating exemplary embodiment of the present invention.
Embodiment 1
(1) surface modification solution is made according to the raw material of following parts by weight：Methyl triacetoxysilane 50, zinc acetate 5,
Glycerol stearate monoesters 3；
(2) the double-deck perforation printed wiring board with multiple perforations is immersed in sonic oscillation 2h in surface modification solution,
It then takes out and is dried in vacuo 5h at 80 DEG C to get the modified double-deck perforation printed wiring board in surface；
(3) toluene cyclohexanone 12, glyceryl tristearate 8, ethyl orthosilicate 5, phytic acid are taken according to parts by weight
Ester 4, aminopropyl triethoxysilane 4, methylisobutylketone 15 mix above-mentioned organic matter and obtain mixed solution, molten in above-mentioned mixing
In liquid according to parts by weight be added the silica 5 of average grain diameter 100nm, nickel acetate 7, average grain diameter 100nm magnesia 5,
The nano-silver powder 64 of average grain diameter 50nm, stirs evenly, obtains silver paste；
(4) silver paste modified double-deck the multiple of perforation printed wiring board in surface are packed into using silver paste hole filled technique to pass through
Kong Zhong stands 1h, and dry 2h is to get the silver paste hole filled double-deck perforation printed wiring board at 80 DEG C.
The obtained silver paste hole filled double-deck perforation printed wiring board is subjected to following silver ion migration test：The silver that will be obtained
The double-deck perforation printed wiring board of slurry perforation is put into constant temperature and humidity cabinet, under conditions of 85 DEG C, humidity are 95%, away from perforation
At silver paste boundary 3mm, the both sides of printed wiring board apply the DC voltage of 100V, measure its resistance value, measurement is opened from experiment
Time when time beginning and arrival insulation breakdown.In addition, insulating resistance value is 106It is broken that existing insulation is determined at the time of Ω or less
Ring.
By test, silver ion migration time of the silver paste hole filled double-deck perforation printed wiring board of embodiment 1 be more than
1000 hours.
Embodiment 2
(1) surface modification solution is made according to the raw material of following parts by weight：Methyl triacetoxysilane 60, zinc acetate
10, glycerol stearate monoesters 8；
(2) the double-deck perforation printed wiring board with multiple perforations is immersed in sonic oscillation 5h in surface modification solution,
100 DEG C of vacuum drying 2h are then taken out to get the modified double-deck perforation printed wiring board in surface；
(3) toluene cyclohexanone 19, glyceryl tristearate 15, ethyl orthosilicate 9, phytic acid are taken according to parts by weight
Ester 8, aminopropyl triethoxysilane 6, methylisobutylketone 22 mix above-mentioned organic matter and obtain mixed solution, molten in above-mentioned mixing
200nm silica 1s 3, nickel acetate 12,500nm magnesia 10,100nm silver powder 80 is added according to parts by weight in liquid, stirring is equal
It is even, obtain silver paste；
(4) silver paste modified double-deck the multiple of perforation printed wiring board in surface are packed into using silver paste hole filled technique to pass through
Kong Zhong stands 3h, and 100 DEG C of dry 2h are to get the silver paste hole filled double-deck perforation printed wiring board.
Silver ion migration test by such as embodiment 1, the silver paste hole filled double-deck perforation printed wiring board of embodiment 2
The silver ion migration time is more than 1000 hours.
Embodiment 3
(1) surface modification solution is made according to the raw material of following parts by weight：Methyl triacetoxysilane 55, zinc acetate 8,
Glycerol stearate monoesters 5；
(2) the double-deck perforation printed wiring board with multiple perforations is immersed in sonic oscillation 3h in surface modification solution,
60 DEG C of vacuum drying 6h are then taken out to get the modified double-deck perforation printed wiring board in surface；
(3) toluene cyclohexanone 15, glyceryl tristearate 12, ethyl orthosilicate 6, phytic acid are taken according to parts by weight
Ester 7, aminopropyl triethoxysilane 5, methylisobutylketone 19 mix above-mentioned organic matter and obtain mixed solution, molten in above-mentioned mixing
50nm silica 1s 1, nickel acetate 10,60nm magnesia 7,20nm silver powder 75 is added according to parts by weight in liquid, stirs evenly,
Obtain silver paste；
(4) silver paste modified double-deck the multiple of perforation printed wiring board in surface are packed into using silver paste hole filled technique to pass through
Kong Zhong stands 2h, and 90 DEG C of dry 3h are to get the silver paste hole filled double-deck perforation printed wiring board.
Silver ion migration test by such as embodiment 1, the silver paste hole filled double-deck perforation printed wiring board of embodiment 3
The silver ion migration time is more than 1000 hours.
Comparative example 1
In addition to being modified without surface, other steps and embodiment 1 are just the same.
Silver ion migration test by such as embodiment 1, the silver paste hole filled double-deck perforation printed wiring board of comparative example 1
The silver ion migration time is 600 hours.
Comparative example 2
Except silver paste is by the polyethylene glycol group of the silver powder of 60-90% weight, the frit and 10-35% weight of 1-6% weight
Except, other steps and embodiment 1 are just the same.
Silver ion migration test by such as embodiment 1, the silver paste hole filled double-deck perforation printed wiring board of comparative example 2
The silver ion migration time is 200 hours.
Comparative example 3
Except modified and silver paste is by the silver powder of 60-90% weight, the frit and 10- of 1-6% weight without surface
Except the polyethylene glycol composition of 35% weight, other steps and embodiment 1 are just the same.
Silver ion migration test by such as embodiment 1, the silver paste hole filled double-deck perforation printed wiring board of comparative example 3
The silver ion migration time is 180 hours.
The above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (10)
1. a kind of silver paste hole filled double-deck perforation printed wiring board, including upper layer circuit layer, lower layer's line layer and along the vertical direction
Through multiple perforations of the upper layer circuit layer and lower layer's line layer, be filled with silver paste in the multiple perforation, it is described on
Sandwich circuit layer and lower layer's line layer, which pass through silver paste hole filled technique, to be realized and is electrically connected, wherein the upper layer circuit layer, described
Lower layer's line layer and the perforation pass through surface modification treatment before implementing silver paste hole filled technique；
Silver paste is by following parts by weight at being grouped as：Nano silicon dioxide 5-13, nickel acetate 7-12, toluene cyclohexanone 12-
19, glyceryl tristearate 8-15, ethyl orthosilicate 5-9, inositol hexaphosphate 4-8, aminopropyl triethoxysilane 4-6, first
Base isobutyl ketone 15-22, nano magnesia 5-10, nano-silver powder 64-80.
2. the silver paste hole filled double-deck perforation printed wiring board according to claim 1, wherein the surface modification treatment packet
It includes, the double-deck perforation printed wiring board with multiple perforations is immersed in sonic oscillation in surface modification solution, then take out true
Sky is dry to get the modified double-deck perforation printed wiring board in surface.
3. the silver paste hole filled double-deck perforation printed wiring board according to claim 2, wherein the surface modification solution by
Following parts by weight at being grouped as：Methyl triacetoxysilane 50-60, zinc acetate 5-10, glycerol stearate monoesters 3-8.
4. the silver paste hole filled double-deck perforation printed wiring board according to claim 2 or 3, wherein nano silicon dioxide is flat
Equal grain size is 50-200nm.
5. the silver paste hole filled double-deck perforation printed wiring board according to claim 4, the wherein average grain of nano magnesia
Diameter is 60-500nm.
6. the silver paste hole filled double-deck perforation printed wiring board according to claim 4, the wherein average grain diameter of nano-silver powder
It is 20-100nm.
7. a kind of manufacturer of silver paste hole filled double-deck perforation printed wiring board according to any one of claim 1-6
Method includes the following steps：
(1) surface modification solution is made according to the raw material of following parts by weight：Methyl triacetoxysilane 50-60, zinc acetate 5-
10, glycerol stearate monoesters 3-8；
(2) the double-deck perforation printed wiring board with multiple perforations is immersed in sonic oscillation in surface modification solution, then taken
Go out vacuum drying to get the modified double-deck perforation printed wiring board in surface；
(3) toluene cyclohexanone 12-19, glyceryl tristearate 8-15, ethyl orthosilicate 5-9, inositol six are taken according to parts by weight
Phosphate 4-8, aminopropyl triethoxysilane 4-6, methylisobutylketone 15-22 mix above-mentioned organic matter and obtain mixed solution,
Nano silicon dioxide 5-13, nickel acetate 7-12, nano magnesia 5-10, nanometer is added according to parts by weight in above-mentioned mixed solution
Silver powder 64-80, stirs evenly, and obtains silver paste；
(4) silver paste is packed by the described more of the modified double-deck perforation printed wiring board in surface using silver paste hole filled technique
It in a perforation, stands, the dry double-deck perforation printed wiring board to get silver paste perforation.
8. the manufacturing method of the silver paste hole filled double-deck perforation printed wiring board according to claim 7, wherein step (2)
The time of sonic oscillation is 1-5h.
9. the manufacturing method of the silver paste hole filled double-deck perforation printed wiring board according to claim 7 or 8, wherein step
(2) vacuum drying temperature is 60-100 DEG C, and the time is 2-6h.
10. the manufacturing method of the silver paste hole filled double-deck perforation printed wiring board according to claim 9, wherein step (4)
Time of repose be 1-3h, drying temperature be 80-100 DEG C, drying time 2-5h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610423669.0A CN106028640B (en) | 2016-06-15 | 2016-06-15 | A kind of silver paste hole filled double-deck perforation printed wiring board and its manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610423669.0A CN106028640B (en) | 2016-06-15 | 2016-06-15 | A kind of silver paste hole filled double-deck perforation printed wiring board and its manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106028640A CN106028640A (en) | 2016-10-12 |
| CN106028640B true CN106028640B (en) | 2018-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610423669.0A Expired - Fee Related CN106028640B (en) | 2016-06-15 | 2016-06-15 | A kind of silver paste hole filled double-deck perforation printed wiring board and its manufacturing process |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132448B (en) * | 2019-12-30 | 2021-03-26 | 广德新三联电子有限公司 | Silver paste multilayer board for monitoring operation of generator set and preparation process thereof |
| WO2023131855A1 (en) * | 2022-01-05 | 2023-07-13 | SCG Chemicals Public Company Limited | Antimicrobial composition |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066004A (en) * | 1992-06-19 | 1994-01-14 | Cmk Corp | Printed wiring board |
| CN1476287A (en) * | 2002-07-17 | 2004-02-18 | �ձ�������ҵ��ʽ���� | Copper size and wiring board using same |
| CN102811561A (en) * | 2012-07-31 | 2012-12-05 | 杭州新三联电子有限公司 | Treatment process before printing of printed circuit board |
| CN104538084A (en) * | 2015-01-08 | 2015-04-22 | 安徽凤阳德诚科技有限公司 | High-temperature-resistant electric conducting silver paste |
| CN105430926A (en) * | 2015-12-03 | 2016-03-23 | 建业科技电子（惠州）有限公司 | Fabrication method of copper paste through hole PCB |
-
2016
- 2016-06-15 CN CN201610423669.0A patent/CN106028640B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066004A (en) * | 1992-06-19 | 1994-01-14 | Cmk Corp | Printed wiring board |
| CN1476287A (en) * | 2002-07-17 | 2004-02-18 | �ձ�������ҵ��ʽ���� | Copper size and wiring board using same |
| CN102811561A (en) * | 2012-07-31 | 2012-12-05 | 杭州新三联电子有限公司 | Treatment process before printing of printed circuit board |
| CN104538084A (en) * | 2015-01-08 | 2015-04-22 | 安徽凤阳德诚科技有限公司 | High-temperature-resistant electric conducting silver paste |
| CN105430926A (en) * | 2015-12-03 | 2016-03-23 | 建业科技电子（惠州）有限公司 | Fabrication method of copper paste through hole PCB |
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| Publication number | Publication date |
|---|---|
| CN106028640A (en) | 2016-10-12 |
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Granted publication date: 20180918 Termination date: 20200615 |