CN102905474B - The manufacture method of circuit board conductive projection - Google Patents

The manufacture method of circuit board conductive projection Download PDF

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Publication number
CN102905474B
CN102905474B CN201110213268.XA CN201110213268A CN102905474B CN 102905474 B CN102905474 B CN 102905474B CN 201110213268 A CN201110213268 A CN 201110213268A CN 102905474 B CN102905474 B CN 102905474B
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China
Prior art keywords
layer
protective layer
circuit board
conductive
hole
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CN201110213268.XA
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Chinese (zh)
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CN102905474A (en
Inventor
张谦为
林定皓
陈亚详
邱继明
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景硕科技股份有限公司
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Priority to CN201110213268.XA priority Critical patent/CN102905474B/en
Publication of CN102905474A publication Critical patent/CN102905474A/en
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Publication of CN102905474B publication Critical patent/CN102905474B/en

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Abstract

A manufacture method for circuit board conductive projection, the method comprises: formation comprises the double layer material structure of welding resisting layer and protective layer on circuit board; Laser drilling forms hole; Formed conductive material layer, with fill up hole and the height of conductive material layer higher than double layer material structure; Remove the conductive material layer of protective layer, in hole, the height of electric conducting material equals the height of hole; And removal protective layer; make electric conducting material in protrusion of surface; and form conductive projection, by protective layer resistance to processing procedure and easily divest characteristic, can be applicable in processing procedure; directly by Laser drill; but not make with image transfer, the alignment tolerance of interlayer can be avoided, accurately can form conductive projection; and then promote the density of conductive projection, make circuit board have better electrical connection performance.

Description

The manufacture method of circuit board conductive projection

Technical field

The present invention relates to a kind of manufacture method of circuit board conductive projection, especially apply double-decker and make.

Background technology

Make the conductive projection on circuit board traditionally, to connect chip or other assembly, normally on substrate, first form welding resisting layer, then hole is formed in the mode of image transfer, then electro-coppering, on copper, form photoresist or dry film in image transfer mode again, remove non-essential copper in etching, finally remove photoresist or dry film and complete conductive projection.

But, traditional mode, need the image transfer by twice, because etching must have tolerance, need to maintain certain space so must design, cause the problem of electric short circuit to avoid conductive projection to overlap, so be difficult to the density improving conductive projection, and connect the quantity of chip or other assembly.Therefore, a kind of method that can promote the density of conductive projection is needed.

Summary of the invention

Main purpose of the present invention is to provide a kind of manufacture method of circuit board conductive projection, and the method comprises: prepare circuit board, and in the upper surface of circuit board and lower surface, at least one of them has at least one connection gasket and is embedded among this circuit board; In the upper surface and lower surface of circuit board, at least one of them forms double layer material structure, and double layer material structure comprises welding resisting layer and protective layer; For the position of at least one connection gasket, in double layer material structure, directly form at least one hole; Form conductive seed layer, conductive seed layer is formed in the surface of protective layer and the hole wall of at least one hole; Plating is to form a conductive material layer, and the conductive material layer electroplated fills up at least one hole and formed on the protection layer, and the height of conductive material layer is higher than double layer material structure; Remove at the conductive material layer of protective layer, and the height of electric conducting material at least one hole equals the height of at least one hole in double layer material structure; And remove this protective layer, make electric conducting material on the surface of this circuit board from this welding resisting layer projection, and form at least one conductive projection, the material wherein forming conductive seed layer and conductive material layer at least comprises copper.

Wherein protective layer is dry film or anti-solder ink, W140, W250 that dry film can be produced for Du Pont company; AQ-1558, AQ-1550, ASG-302 of Asahi company, RY-3525, RD1225, H-7034 of Hitachi company, A238, AF5040, AF5075 of Nanya Longlite company at least one of them, anti-solder ink formed with the curing agent of the ink host of percentage by weight 85% and 15%, comprise in this ink host lower than acryl resin and filler, the percentage by weight of this acryl resin is lower than 30%, and in filler, at least comprise barium sulfate and silicon dioxide solvent, make the characteristic that this anti-solder ink has acid and alkali-resistance and easily divests.

Feature of the present invention is; resistance to process characteristics by protective layer can directly apply among whole processing procedure; and protective layer is easy to divest and does not have the problem that material remains, affects outward appearance and character; in addition; directly by Laser drill; directly form opening on the protection layer; and not formed in the mode of traditional image transfer; the alignment tolerance of interlayer can be avoided; and conductive projection can be formed more accurately; the density of conductive projection can be made further to promote, and make same circuit board have better electrical connection performance.

Accompanying drawing explanation

Fig. 1 to Fig. 7 is the progressively flow chart of the manufacture method of circuit board conductive projection of the present invention.

Embodiment

Below coordinate accompanying drawing to do more detailed description to embodiments of the present invention, make to be familiar with those skilled in the art and can implement according to this after reading this specification.

As shown in Figures 1 to 7, the progressively flow chart of the manufacture method of circuit board conductive projection of the present invention.As shown in Figure 1, first prepare a circuit board 10, in the upper surface of this circuit board 10 and lower surface at least in one of there is at least one connection gasket 15 be embedded among this circuit board, the present invention, as example but is not limited thereto with single substrate, two-sided support plate.As shown in Figure 2, in the upper surface and lower surface of circuit board 10, at least one of them forms pair of lamina material structure 20, this double layer material structure 20 comprises welding resisting layer 21 and a protective layer 23, this welding resisting layer 21 is insulating material, such as conventional green paint, and this protective layer 23 is positioned at the outer surface of this welding resisting layer 21, is a dry film or an anti-solder ink, such as, dry film W140, W250 that can produce for Du Pont company; AQ-1558, AQ-1550, ASG-302 of Asahi company, RY-3525, RD1225, H-7034 of Hitachi company, A238, AF5040, AF5075 of Nanya Longlite company at least one of them, and anti-solder ink formed with the curing agent of the ink host of percentage by weight 85% and 15%, comprise in this ink host lower than acryl resin and filler, the percentage by weight of this acryl resin is lower than 30%, and in filler, at least comprise barium sulfate and silicon dioxide solvent, make the characteristic that this anti-solder ink has acid and alkali-resistance and easily divests.

As shown in Figure 3, in Laser drill mode, in the position of connection gasket 15, directly form hole 30 in double layer material structure 20.As shown in Figure 4, form a conductive seed layer 40 in upper and lower surface, this conductive seed layer 40 is formed in the surface of protective layer 23 and the hole wall of hole 30, and follow-up electrodeposited coating is easily adhered to.As shown in Figure 5; to electroplate formation one conductive material layer 50 on conductive seed layer 40; this conductive material layer 50 fills up hole and is formed on protective layer 23; and the height of conductive material layer 50 is higher than double layer material structure 20, the material wherein forming conductive seed layer 40 and conductive material layer 50 at least comprises copper.

As shown in Figure 6, with chemical etching or mechanical lapping, remove the conductive material layer 50 on protective layer 30 surface, and the height staying the electric conducting material 55 in hole 30 equals the height of double layer material structure 20 Hole 30.As shown in Figure 7, remove protective layer 23 with stripper, make electric conducting material 55 on the surface of circuit board 10, from welding resisting layer 21 projection, and form conductive projection.

Feature of the present invention is; resistance to process characteristics by protective layer can directly apply among whole processing procedure; and protective layer is easy to divest and does not have the problem that material remains, affects outward appearance and character; in addition; directly by Laser drill; directly on protective layer 23, form opening; and not formed in the mode of traditional image transfer; the alignment tolerance of interlayer can be avoided; and conductive projection can be formed more accurately; the density of conductive projection can be made further to promote, and make same circuit board have better electrical connection usefulness.

The above is only explain preferred embodiment of the present invention, not attempt does any pro forma restriction to the present invention according to this, therefore, all have any modification for the present invention or the change done under identical invention spirit, all must be included in the category of the claims in the present invention.

Claims (8)

1. a manufacture method for circuit board conductive projection, is characterized in that, this manufacture method comprises:
Prepare a circuit board, in the upper surface of this circuit board and lower surface, at least one of them has at least one connection gasket and is embedded among this circuit board;
In this upper surface and this lower surface of this circuit board, at least one of them forms pair of lamina material structure, and this double layer material structure comprises a welding resisting layer and a protective layer, and this protective layer is positioned at the outer surface of this welding resisting layer;
For the position of this at least one connection gasket, in this double layer material structure, directly form at least one hole;
Form a conductive seed layer, this conductive seed layer is formed in the surface of this protective layer and the hole wall of this at least one hole;
This protective layer is electroplated form a conductive material layer, make this conductive material layer fill up this at least one hole and be formed on this protective layer, and the height of this conductive material layer is higher than this double layer material structure;
Remove at this conductive material layer of this protective layer, and the height of electric conducting material in this at least one hole equals the height of this at least one hole in this double layer material structure; And
Remove this protective layer with a stripper, make this electric conducting material on the surface of this circuit board from this welding resisting layer projection, and form at least one conductive projection.
2. method as described in claim 1, it is characterized in that, this protective layer is a dry film or an anti-solder ink, and this anti-solder ink formed with the curing agent of the ink host of percentage by weight 85% and 15%.
3. method as described in claim 2, is characterized in that, W140, W250 that this dry film is produced for Du Pont company; AQ-1558, AQ-1550, ASG-302 of Asahi company; RY-3525, RD1225, H-7034 of Hitachi company, A238, AF5040, AF5075 of Nanya Longlite company at least one of them.
4. method as described in claim 2, it is characterized in that, in this anti-solder ink, in this ink host, comprise acryl resin and filler, the percentage by weight of this acryl resin in this ink host, lower than 30%, comprises barium sulfate and silicon dioxide solvent in this filler.
5. method as described in claim 1, it is characterized in that, the material forming this conductive seed layer and this electric conducting material at least comprises copper.
6. method as described in claim 1, is characterized in that, except completing in chemical etching mode in this electric conducting material system of this protective layer.
7. method as described in claim 1, is characterized in that, except completing in mechanical lapping mode in this electric conducting material system of this protective layer.
8. method as described in claim 1; it is characterized in that; further in plating with before forming this conductive material layer; first form a conductive seed layer; this conductive seed layer is formed in the surface of this protective layer and the hole wall of this at least one hole, then is formed on this conductive seed layer by this conductive material layer.
CN201110213268.XA 2011-07-28 2011-07-28 The manufacture method of circuit board conductive projection CN102905474B (en)

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Application Number Priority Date Filing Date Title
CN201110213268.XA CN102905474B (en) 2011-07-28 2011-07-28 The manufacture method of circuit board conductive projection

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CN102905474B true CN102905474B (en) 2015-09-30

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1596062A (en) * 2003-09-08 2005-03-16 日东电工株式会社 Process for producing wiring circuit board
TW201010555A (en) * 2008-08-20 2010-03-01 Unimicron Technology Corp Wiring board
CN102111954A (en) * 2009-12-25 2011-06-29 欣兴电子股份有限公司 Circuit board and manufacturing process thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252446A (en) * 2001-02-23 2002-09-06 Sony Chem Corp Manufacturing method of flexible wiring board
TWI471073B (en) * 2009-12-31 2015-01-21 Unimicron Technology Corp Circuit substrate and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1596062A (en) * 2003-09-08 2005-03-16 日东电工株式会社 Process for producing wiring circuit board
TW201010555A (en) * 2008-08-20 2010-03-01 Unimicron Technology Corp Wiring board
CN102111954A (en) * 2009-12-25 2011-06-29 欣兴电子股份有限公司 Circuit board and manufacturing process thereof

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