CN207783245U - A kind of multi-layer H DI wiring boards of water proof type internal layer interconnection - Google Patents
A kind of multi-layer H DI wiring boards of water proof type internal layer interconnection Download PDFInfo
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- CN207783245U CN207783245U CN201721535707.8U CN201721535707U CN207783245U CN 207783245 U CN207783245 U CN 207783245U CN 201721535707 U CN201721535707 U CN 201721535707U CN 207783245 U CN207783245 U CN 207783245U
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- layer
- circuit board
- recess portion
- protrusion
- polywater
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Abstract
The utility model discloses a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection, belong to wiring board art.The utility model at circuit board both ends by being arranged recess portion, it is arranged in correspondence with protrusion in recess location and reaches precise positioning, and the top of circuit board covers one layer of waterproof layer, drainage channel is offered on waterproof layer, and it is equipped with polywater layer in the top of waterproof layer, while offering polywater structure on polywater layer, and then reach precise positioning, can effectively waterproof, so that wiring board is had water-proof function.
Description
Technical field
The utility model is related to wiring board arts, more particularly to a kind of multi-layer H DI lines of water proof type internal layer interconnection
Road plate.
Background technology
Wiring board is a kind of circuit circuit board, and surface is covered with circuit, at the same time, whole by connection component
A circuit board will produce heat at work, become increasingly complex with the functional structure of wiring board, heat dissipation capacity is also increasing.
In addition, as electronic product past " light, thin, short, small " and multifunction develop, high-density installation technology develops very fast, lamination electricity
Precise positioning has obtained effective development between the plate of road.It can while having the component of high-density lamination circuit board connection enormous amount
To reach precise positioning.
However, the multi-layer H DI wiring boards of existing internal layer interconnection can reach precise positioning, but do not have water-proof function.
Therefore, it is necessary to design the multi-layer H DI wiring boards of the internal layer interconnection with water-proof function.
Utility model content
In order to overcome the deficiencies of existing technologies, the technical problem to be solved by the utility model is to propose a kind of water proof type
The multi-layer H DI wiring boards of internal layer interconnection, the utility model are accordingly set by the way that recess portion is arranged at circuit board both ends in recess location
It sets protrusion and reaches precise positioning, and the top of circuit board covers one layer of waterproof layer, and drainage channel is offered on waterproof layer, and
It is equipped with polywater layer in the top of waterproof layer, while offering polywater structure on polywater layer, and then reach precise positioning, Ke Yiyou
Effect ground waterproof, makes wiring board have water-proof function.
For this purpose, the utility model uses following technical scheme：
The utility model provides a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection, including substrate, is located at the base
First circuit board above plate, is located above the second circuit board second circuit board above the first circuit board
Tertiary circuit plate and the 4th circuit board above the tertiary circuit plate；
There is the upper surface of base plate the first recess portion, the first circuit board upper and lower surface to all have and first recess portion
Corresponding first protrusion, the substrate are connected with the first circuit board by first recess portion and first convex combination
It connects；
The second circuit board upper and lower surface all has the second recess portion corresponding with first protrusion, first circuit
Plate is combined connection with the second circuit board by first protrusion and second recess portion；
The tertiary circuit plate upper and lower surface all has the second protrusion corresponding with second recess portion, the second circuit
Plate is combined connection with the tertiary circuit plate by second protrusion and second recess portion；
The 4th circuit board lower surface have third recess portion corresponding with second protrusion, the tertiary circuit plate with
4th circuit board combines connection by second protrusion and the third recess portion；
The 4th circuit board upper surface is covered with waterproof layer, the 4th circuit board and the waterproof layer by blind hole into
Row connection.
Optionally, the waterproof layer upper surface is covered with polywater layer, and the waterproof layer upper surface is provided with drainage channel, described
Drainage channel in the horizontal direction run through the waterproof layer, polywater layer upper surface correspond to the drainage channel position be provided with it is poly-
Water-bound, the polywater structure run through the polywater layer and corresponding with the drainage channel in the vertical direction.
Optionally, the polywater structure opening is great circle, and lower aperture is the funnel shaped of roundlet.
Optionally, the polywater structure is uniformly distributed along the corresponding drainage channel.
Optionally, the drainage channel and the polywater body structure surface are coated with non-hydrophilic composite material wax.
Optionally, the material of the waterproof layer is the polymer parylene of paraxylene.
Optionally, the material of the polywater layer is EVA resin.
Optionally, the blind hole is located at the underface in the adjacent drainage channel centre position.
Optionally, the blind hole is realized by copper facing and is metallized.
Optionally, first recess portion is located at the substrate both ends, and first protrusion is located at the first circuit board two
End, second recess portion are located at the second circuit board both ends, and second protrusion is located at tertiary circuit plate both ends, described
Third recess portion is located at the 4th circuit board both ends.
The beneficial effects of the utility model are：
The utility model is arranged in correspondence with protrusion by the way that recess portion is arranged at circuit board both ends, in recess location and reaches precisely fixed
Position, and the top of circuit board covers one layer of waterproof layer, offers drainage channel on waterproof layer, and set above waterproof layer
Have polywater layer, while polywater structure is offered on polywater layer, and then reaches precise positioning, can effectively waterproof, make circuit
Plate has water-proof function.
Description of the drawings
Fig. 1 is a kind of multi-layer H DI wiring boards for water proof type internal layer interconnection that specific embodiment of the present invention provides
Structural schematic diagram；
Fig. 2 is a kind of multi-layer H DI wiring boards for water proof type internal layer interconnection that specific embodiment of the present invention provides
Vertical view.
In figure：
1, substrate；11, the first recess portion；2, first circuit board；21, the first protrusion；3, the second wiring board；31, the second recess portion
4, tertiary circuit plate；41, the second protrusion, the 5, the 4th circuit board；51, third recess portion, 6, waterproof layer；61, drainage channel；7, polywater
Layer；71, polywater structure；8, blind hole.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Show to Fig. 1 exemplaries a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection provided by the utility model
Structural schematic diagram, as shown in Figure 1, a kind of water proof type internal layer interconnection multi-layer H DI wiring boards, including substrate 1, be located at the substrate
The first circuit board 2 of 1 top, is located on the second circuit board 3 second circuit board 3 above the first circuit board 2
The tertiary circuit plate 4 and the 4th circuit board 5 above the tertiary circuit plate 4 of side；
There is 1 upper surface of the substrate the first recess portion 11,2 upper and lower surface of the first circuit board to all have and described first
11 corresponding first protrusion 21 of recess portion, the substrate 1 pass through first recess portion 11 and described first with the first circuit board 2
Protrusion 21 combines connection；
3 upper and lower surface of the second circuit board all has second recess portion 31 corresponding with first protrusion 21, and described
One circuit board 2 is combined connection with the second circuit board 3 by first protrusion 21 and second recess portion 31；
4 upper and lower surface of tertiary circuit plate all has second protrusion 41 corresponding with second recess portion 31, and described
Two circuit boards 3 are combined connection with the tertiary circuit plate 4 by second protrusion 41 and second recess portion 31；
4th circuit board, 5 lower surface has third recess portion 51 corresponding with second protrusion 41, the third electricity
Road plate 4 is combined connection with the 4th circuit board 5 by second protrusion 41 and the third recess portion 51, these recess portions and
Protrusion is correspondingly connected with, and is allowed between circuit board and is realized precise positioning.
4th circuit board, 5 upper surface is covered with waterproof layer 6, and the 4th circuit board 5 is with the waterproof layer 6 by blind
Hole 8 is attached.
Optionally, 6 upper surface of the waterproof layer is covered with polywater layer 7, and 6 upper surface of the waterproof layer is provided with drainage channel
61, the drainage channel 61 runs through the waterproof layer 6 in the horizontal direction, and it is logical that 7 upper surface of polywater layer corresponds to the draining
61 position of road is provided with polywater structure 71, the polywater structure 71 run through in the vertical direction the polywater layer 7 and with the draining
Channel 61 is corresponding.The polywater structure 71 can collect the moisture in external environment, and reach anti-by drainage channel 61
Water effect.
Optionally, 71 top-open of polywater structure is great circle, and lower aperture is the funnel shaped of roundlet.Infundibulate is poly-
Water-bound 71 is conducive to collect in water, forms droplet, and then water is drained.
Optionally, the polywater structure 71 is uniformly distributed along the corresponding drainage channel 61.
Optionally, the drainage channel 61 and 71 surface of polywater structure are coated with non-hydrophilic composite material wax.
Optionally, the material of the waterproof layer 6 is the polymer parylene of paraxylene.
Optionally, the material of the polywater layer 7 is EVA resin.
Optionally, the blind hole 8 is located at the underface in adjacent 61 centre position of the drainage channel.Due to board space
Position is smaller, so that blind hole 8 is located at the underface in adjacent 61 centre position of the drainage channel, can make full use of space, simultaneously
Also it avoids that blind hole 8 is made so that waterproof layer is easily broken because being opened in weakness.
Optionally, the blind hole 8 is realized by copper facing and is metallized.
Optionally, first recess portion 11 is located at 1 both ends of the substrate, and first protrusion is located at 21 first circuits
2 both ends of plate, second recess portion 31 are located at 3 both ends of the second circuit board, and second protrusion 41 is located at the tertiary circuit
4 both ends of plate, the third recess portion 51 are located at 5 both ends of the 4th circuit board.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case of with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (10)
1. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection, including substrate (1), first above the substrate (1)
Circuit board (2), is located above the second circuit board (3) second circuit board (3) being located above the first circuit board (2)
Tertiary circuit plate (4) and the 4th circuit board (5) above the tertiary circuit plate (4), it is characterised in that：
There is the first recess portion (11), first circuit board (2) upper and lower surface to all have and described for substrate (1) upper surface
Corresponding first protrusion (21) of one recess portion (11), the substrate (1) pass through first recess portion with the first circuit board (2)
(11) and first protrusion (21) combines connection；
The second circuit board (3) second circuit board (3) upper and lower surface all has corresponding with the first protrusion (21)
Second recess portion (31), the first circuit board (2) and the second circuit board (3) pass through first protrusion (21) and described the
Two recess portions (31) combine connection；
Tertiary circuit plate (4) upper and lower surface all has the second protrusion (41) corresponding with the second recess portion (31), described
Second circuit board (3), which is combined with the tertiary circuit plate (4) by second protrusion (41) and second recess portion (31), to be connected
It connects；
4th circuit board (5) lower surface has third recess portion (51) corresponding with the second protrusion (41), the third
Circuit board (4) is combined by second protrusion (41) and the third recess portion (51) with the 4th circuit board (5) and is connected；
4th circuit board (5) upper surface is covered with waterproof layer (6), and the 4th circuit board (5) is logical with the waterproof layer (6)
Cross blind hole (8) connection.
2. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as described in claim 1, it is characterised in that：
Waterproof layer (6) upper surface is covered with polywater layer (7)；
Waterproof layer (6) upper surface is provided with drainage channel (61), and the drainage channel (61) runs through described in the horizontal direction
Waterproof layer (6)；
Polywater layer (7) upper surface corresponds to the drainage channel (61) position and is provided with polywater structure (71), the polywater structure
(71) run through the polywater layer (7) and corresponding with the drainage channel (61) in the vertical direction.
3. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as claimed in claim 2, it is characterised in that：
Polywater structure (71) top-open is great circle, and lower aperture is the funnel shaped of roundlet.
4. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as described in claim 2 or claim 3, feature exist
In：
The polywater structure (71) is uniformly distributed along the corresponding drainage channel (61).
5. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as claimed in claim 2, it is characterised in that：
The drainage channel (61) and the polywater structure (71) surface are coated with non-hydrophilic composite material wax.
6. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as described in claim 1, it is characterised in that：
The material of the waterproof layer (6) is the polymer parylene of paraxylene.
7. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as claimed in claim 2, it is characterised in that：
The material of the polywater layer (7) is EVA resin.
8. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as claimed in claim 2, it is characterised in that：
The blind hole (8) is located at the underface in adjacent drainage channel (61) centre position.
9. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as claimed in claim 8, it is characterised in that：
The blind hole (8) is realized by copper facing and is metallized.
10. a kind of multi-layer H DI wiring boards of water proof type internal layer interconnection as described in claim 1, it is characterised in that：
First recess portion (11) is located at the substrate (1) both ends, and first protrusion (21) is located at the first circuit board (2)
Both ends, second recess portion (31) are located at the second circuit board (3) both ends, and second protrusion (41) is located at third electricity
Road plate (4) both ends, the third recess portion (51) are located at the 4th circuit board (5) both ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721535707.8U CN207783245U (en) | 2017-11-16 | 2017-11-16 | A kind of multi-layer H DI wiring boards of water proof type internal layer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721535707.8U CN207783245U (en) | 2017-11-16 | 2017-11-16 | A kind of multi-layer H DI wiring boards of water proof type internal layer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783245U true CN207783245U (en) | 2018-08-28 |
Family
ID=63233419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721535707.8U Active CN207783245U (en) | 2017-11-16 | 2017-11-16 | A kind of multi-layer H DI wiring boards of water proof type internal layer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783245U (en) |
-
2017
- 2017-11-16 CN CN201721535707.8U patent/CN207783245U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A waterproof multilayer HDI circuit board with inner layer interconnection Effective date of registration: 20210120 Granted publication date: 20180828 Pledgee: Bank of Communications Ltd. Ji'an branch Pledgor: JIANGXI JINGCHAO TECHNOLOGY Co.,Ltd. Registration number: Y2021360000002 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220127 Granted publication date: 20180828 Pledgee: Bank of Communications Ltd. Ji'an branch Pledgor: JIANGXI JINGCHAO TECHNOLOGY CO.,LTD. Registration number: Y2021360000002 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |