JP2006324646A5 - - Google Patents
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- Publication number
- JP2006324646A5 JP2006324646A5 JP2006110157A JP2006110157A JP2006324646A5 JP 2006324646 A5 JP2006324646 A5 JP 2006324646A5 JP 2006110157 A JP2006110157 A JP 2006110157A JP 2006110157 A JP2006110157 A JP 2006110157A JP 2006324646 A5 JP2006324646 A5 JP 2006324646A5
- Authority
- JP
- Japan
- Prior art keywords
- metal thin
- thin film
- circuit board
- circuit boards
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 12
- 239000010409 thin film Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 229960001716 benzalkonium Drugs 0.000 claims 1
- 125000005501 benzalkonium group Chemical group 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
Claims (9)
前記複数の回路基板のうち少なくとも１つの回路基板上に設けられる金属薄膜と、
前記金属薄膜が設けられた回路基板と接合される１または複数の電子部品と、
前記複数の回路基板のうち最下部の回路基板の下面に設けられ、前記電子部品と配線パターンを介して電気的に接続される端子と、
前記電子部品の上下に位置する回路基板間の領域に前記電子部品を封止するように形成された封止層とを備え、
前記金属薄膜が設けられた回路基板の上方に位置する他の１または複数の回路基板または封止層は、前記金属薄膜上部に切り欠き部または開口部を有し、
前記金属薄膜上部の切り欠き部または開口部に放熱器が取り付けまたは取り外し可能とされることを特徴とするモジュール基板。 A plurality of circuit boards stacked in the vertical direction;
A metal thin film provided on at least one circuit board of the plurality of circuit boards;
One or a plurality of electronic components bonded to a circuit board provided with the metal thin film;
A terminal provided on a lower surface of a lowermost circuit board among the plurality of circuit boards, and electrically connected to the electronic component via a wiring pattern;
A sealing layer formed so as to seal the electronic component in a region between circuit boards located above and below the electronic component;
One or more other circuit boards or sealing layers located above the circuit board provided with the metal thin film have a notch or an opening above the metal thin film,
Module substrate radiator into the notch or opening of the metal thin film upper is characterized Rukoto is a mounting or removable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006110157A JP4919689B2 (en) | 2005-04-19 | 2006-04-12 | Module board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005120570 | 2005-04-19 | ||
| JP2005120570 | 2005-04-19 | ||
| JP2006110157A JP4919689B2 (en) | 2005-04-19 | 2006-04-12 | Module board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006324646A JP2006324646A (en) | 2006-11-30 |
| JP2006324646A5 true JP2006324646A5 (en) | 2011-06-16 |
| JP4919689B2 JP4919689B2 (en) | 2012-04-18 |
Family
ID=37544052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006110157A Expired - Fee Related JP4919689B2 (en) | 2005-04-19 | 2006-04-12 | Module board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4919689B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5756321B2 (en) * | 2011-04-05 | 2015-07-29 | 新光電気工業株式会社 | Heat dissipation member and semiconductor module |
| JP2017220566A (en) * | 2016-06-08 | 2017-12-14 | 本田技研工業株式会社 | Multilayer substrate |
| JP6725378B2 (en) * | 2016-09-15 | 2020-07-15 | 株式会社東芝 | Antenna module |
| JP7144732B2 (en) * | 2018-09-19 | 2022-09-30 | 株式会社デンソーウェーブ | laminated substrate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0669613A (en) * | 1992-08-20 | 1994-03-11 | Ibiden Co Ltd | Printed wiring board |
| JP2003086733A (en) * | 2001-09-11 | 2003-03-20 | Matsushita Electric Ind Co Ltd | Semiconductor device and method of manufacturing the same, and electronic apparatus using the same |
| JP4018575B2 (en) * | 2002-04-03 | 2007-12-05 | 松下電器産業株式会社 | Semiconductor built-in millimeter-wave band module |
| JP2004071597A (en) * | 2002-08-01 | 2004-03-04 | Renesas Technology Corp | Semiconductor module |
| JP2004241645A (en) * | 2003-02-06 | 2004-08-26 | Murata Mfg Co Ltd | Circuit board device |
| JP4934022B2 (en) * | 2005-03-17 | 2012-05-16 | パナソニック株式会社 | Module board |
-
2006
- 2006-04-12 JP JP2006110157A patent/JP4919689B2/en not_active Expired - Fee Related
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