CN207781556U - Nozzle unit and the substrate board treatment for having it - Google Patents
Nozzle unit and the substrate board treatment for having it Download PDFInfo
- Publication number
- CN207781556U CN207781556U CN201820232266.2U CN201820232266U CN207781556U CN 207781556 U CN207781556 U CN 207781556U CN 201820232266 U CN201820232266 U CN 201820232266U CN 207781556 U CN207781556 U CN 207781556U
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- substrate
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- injection nozzle
- nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model is related to a kind of nozzle unit and the substrate board treatment for having it, nozzle unit includes：First injection nozzle includes the vibration fluid of vibrational energy to the injection of the surface of substrate；Second injection nozzle accordingly, can be improved the cleaning efficiency of substrate and can promote cleaning performance to the surface jet cleaning fluid of substrate, cleaning fluid in the form of inclined for being cleaned to the foreign matter isolated from substrate by vibrating fluid.
Description
Technical field
The utility model is related to a kind of nozzle unit and the substrate board treatment for having it, the nozzle unit and has it
Substrate board treatment can improve the cleaning efficiency of substrate, and cleaning performance can be promoted.
Background technology
Semiconductor element is to be integrated in the form of highdensity by fine circuit line and manufactured, and accordingly, is needed in wafer
Surface carries out precise finiss corresponding with this.In order to more critically carry out the grinding of wafer, mechanical lapping and change can be carried out
It learns and grinds parallel chemical mechanical milling tech (CMP process).
Chemical mechanical grinding (CMP) technique is one kind in semiconductor element manufacturing process, in order to realize according to comprehensively flat
Smoothization is improved with the wafer surface roughness of contact (the contact)/wiring UF membrane and integrated component that are used to form circuit
Deng and to the surface of wafer carry out precise finiss processing technique, the global planarization refer to removal by being covered by being repeated
Cover the unit (cell) caused by the bumps of (masking), etching (etching) and the wafer surface generated with Wiring technology etc.
Region and the interregional difference in height of peripheral circuits.
The CMP process is carried out by following form：With the technical face of the wafer state facing with grinding pad to described
Wafer is pressurizeed and is carried out at the same time chemical grinding and the mechanical lapping of technical face, and the wafer for completing grinding technics is ground head and grabs
Hold and wash the cleaning for the foreign matter for being stained on technical face.
In other words, as shown in Figure 1, generally, the chemical mechanical milling tech of wafer is carried out by following form：If brilliant
Member is supplied to chemical grinding system X1 from load units 20, then so that wafer W is to be tightly attached to carrier head S1, S2, S1', S2'；S
State carry out chemical machinery on multiple grinding flat plate P1, P2, P1', P2' while move 66-68 along regulation path P o
Grinding technics.The wafer W for having carried out chemical mechanical milling tech is transferred to the rack 10 of unloading unit by carrier head S,
And it is transferred to the cleaning unit X2 for carrying out next cleaning, it is stained on wafer to carry out cleaning in multiple cleaning modules 70
The technique of foreign matter on W.
In addition, can be in the remained on surface foreign matter of wafer after the cleaning that cleaning module completes wafer.Therefore,
Truth is additionally to carry out remaining in wafer surface for removing before carrying out next technique (for example, film vapor deposition technique)
Foreign matter rear cleaning (post cleaning process).
But wash equipment after being dividually additionally arranged with cleaning module is needed in the prior art, therefore problem is,
Not only bad for the layout of equipment, and wafer transfer and cleaning treatment technique become complicated, scavenging period increases, thus has
There is the problem of expense rising and yield reduce.
Therefore, although a variety of researchs for having carried out the cleaning efficiency and yield for improving substrate recently and having saved money,
But still it is insufficient, to need the exploitation to this.
Utility model content
The purpose of the utility model is to provide a kind of nozzle unit and the substrate board treatment for having it, the nozzle
Unit and have the cleaning efficiency that its substrate board treatment can improve substrate, promotes cleaning performance.
In addition, the purpose of this utility model is that, it can be effectively removed the foreign matter for remaining on substrate, and receipts can be improved
Rate.
In addition, the purpose of this utility model is that, design freedom can be promoted, and can make device miniaturization.
In addition, the purpose of this utility model is that, stability and reliability can be improved.
According to the preferred embodiment of the utility model for realizing the purpose of this utility model, to the table of substrate
Jet cleaning fluid while face injection includes the vibration fluid of vibrational energy, so as to improve the cleaning efficiency of substrate, and carries
Rise cleaning performance.
As described above, following advantageous effects can be obtained according to the utility model：The cleaning efficiency of substrate is improved, is promoted clear
Wash effect.
In particular, following advantageous effects can be obtained according to the utility model：The foreign matter detached from the surface of substrate again
Before being attached to the surface of substrate foreign matter is effectively removed within the faster time.
In addition, following advantageous effects can be obtained according to the utility model：It can be effectively removed and remain on the different of substrate
Object, and promote yield.
In addition, following advantageous effects can be obtained according to the utility model：Design freedom can be promoted, and helps to set
Standby miniaturization.
In addition, the expense needed for base-plate cleaning can be saved according to the utility model, and process efficiency can be improved.
In addition, following advantageous effects can be obtained according to the utility model：Improving stability and reliability.
Description of the drawings
Fig. 1 is the figure for the composition for showing existing chemical mechanical grinding equipment,
Fig. 2 is the figure for illustrating substrate board treatment according to the present utility model,
Fig. 3 is the figure of the use example of the nozzle unit for illustrating substrate board treatment according to the present utility model,
Fig. 4 to Fig. 8 is the figure for illustrating nozzle unit according to the present utility model,
Fig. 9 is the figure of other use examples of the nozzle unit for illustrating substrate board treatment according to the present utility model.
Specific implementation mode
Hereinafter, the preferred embodiment of the utility model is described in detail with reference to attached drawing, but the utility model is not
It is affected by the limitation or restriction of example.As reference, in the present note, identical label substantially refers to identical element,
Under such rule, the content that is recorded in other accompanying drawings can be quoted to illustrate, and can be omitted to fields practitioner
For apparent or content repeatedly.
Fig. 2 is the figure for illustrating substrate board treatment according to the present utility model, and Fig. 3 is for illustrating according to this practicality
The figure of the use example of the nozzle unit of novel substrate board treatment, Fig. 4 to Fig. 8 are for illustrating spray according to the present utility model
The figure of mouth unit.In addition, Fig. 9 is other uses of the nozzle unit for illustrating substrate board treatment according to the present utility model
The figure of example.
With reference to Fig. 2 to Fig. 9, substrate board treatment 10 according to the present utility model includes：Means of abrasion 100, into the hand-manipulating of needle
To chemical mechanical grinding (CMP) technique of substrate；Preparation cleaning part 200 carries out pre- for the substrate for completing grinding technics
Standby cleaning；Follow-up cleaning part 300, the substrate for receiving the prepared cleaning of the progress that transfer comes go forward side by side the hand-manipulating of needle to substrate
Subsequent cleaning processes；Nozzle unit 230 is set at least arbitrary in preparation cleaning part 200 and follow-up cleaning part 300
More than one, carries out prepared cleaning or follow-up cleaning, and includes the first injection nozzle 232 and the second injection nozzle 234, and first
Injection nozzle 232 includes the vibration fluid of vibrational energy to the injection of the surface of substrate 10, and the second injection nozzle 234 is in the form of inclined
To the surface jet cleaning fluid of substrate 10, cleaning fluid be used for by vibrating fluid from the foreign matter that substrate 10 is isolated into
Row cleaning.
Its object is to so that the foreign matter for being again attached to substrate minimizes, and improves the cleaning efficiency of substrate.
If being stained on polishing particles of the abradant surface of substrate etc., in abradant surface, problem is for solidification while dry,
The cleaning taken longer for when removal solidification is in the particle of abradant surface, and cleaning performance also reduces.In order to solve
Described problem is attempted to have carried out following effort in the prior art：Shorten the milling time of substrate most possibly and as far as possible
Promptly by the base plate transfer for being ground technique to cleaning part to start cleaning in the fast time.But into
The foreign matter isolated from substrate can not be avoided to be again attached to the surface of substrate during the cleaning of row substrate, thus, even if
Pay the effort, if but have limitation when solving the problems, such as that cleaning takes a long time and cleaning performance is relatively low,
There are problems.
But the utility model jet cleaning stream while including the vibration fluid of vibrational energy to the injection of the surface of substrate
Body, vibration fluid and cleaning fluid so as to include foreign matter are rapidly expelled to the outside of substrate to greatest extent, thus
Following advantageous effects can be obtained：Improve the separative efficiency of foreign matter so that the foreign matter detached from substrate is again attached to substrate
Situation minimizes.
Means of abrasion 100 could be provided as the various structures for being able to carry out chemical mechanical milling tech, and this practicality is new
Type is not limited or restriction by the structure and layout of means of abrasion 100 (lay out).
Can be provided with multiple grinding flat plates 110 in means of abrasion 100, the upper surface of each grinding flat plate 110 can be attached
Grinding pad.The substrate 10 of supply to the load units being set on the region of means of abrasion 100 can be to be tightly attached to along pre-
First set path movement carrier head 120 state and be fed with the upper surface of grinding pad of lapping liquid rotating contact, so as to
To execute chemical mechanical milling tech.
Carrier head 120 can move on 100 region of means of abrasion along preset circulating path, and supply extremely
The substrate 10 (substrate for being hereinafter referred to as supplied to the " loaded " position of substrate) of load units can be to be tightly attached to carrier head 120
State transferred by carrier head 120.Hereinafter, beginning to pass through grinding flat plate 110 approximately along four from load units with carrier head 120
It is illustrated for the composition of the circulating path movement of side shape form.
Unlike, it is provided with center shifting between the opposed facing abrasive areas of a pair for being set to means of abrasion 100
Line sending, the substrate 10 into means of abrasion 100 can also be transferred first along center transfer line, ground in each abrasive areas
After mill, it is offloaded to unloading area P1 immediately.In this way, being transferred first by center before abrasive areas obtains grinding with regard to substrate 10
For the mode that line is transferred, following advantageous effects can be obtained：Eliminate the wet type of the substrate 10 for keeping completing to grind
The other injection apparatus of state, and prevent the generation of watermark.
The side of means of abrasion is provided with unloading area P1, the substrate 10 for completing grinding technics is unloaded in unloading area P1
It carries.
The purpose that preparation cleaning part 230 is arranged is that the substrate 10 to completing grinding technics carries out prepared cleaning (pre-
cleaning)。
As reference, in the present invention, the preparation cleaning of substrate 10 is it is to be understood that in subsequently cleaning part 300
It is present in the work of the foreign matter on the surface (in particular, abradant surface of substrate) of substrate 10 before being cleaned for cleaning to the maximum extent
Skill.In particular, bigger different of size in the foreign matter on the surface for being present in substrate 10 can be removed in the preparation cleaning of substrate 10
Object (for example, foreign matter of the size bigger than 100nm), and the organic matter on the surface for being present in substrate 10 can be removed.
For example, preparation cleaning part distribution is placed in unloading area, unloading area is set to the inside of means of abrasion, so as to complete
It is unloaded at the substrate of grinding technics.Depending on the situation, preparation cleaning part can also be set to the outer of unloading area
Side.
In this way, while unloading area P1 unloads the substrate 10 for completing grinding technics, it is clear that preparation is carried out together
It washes, accordingly, the other space for carrying out prepared cleaning is not set additionally, therefore, can not change or not
It adds the layout of existing equipment and almost keeps intact, and can reduce and immediately enter cleaning part because completing the substrate 10 of grinding
The dustiness that part 300 is subsequently cleaned caused by point increases.
In particular, being detached in the frame that cleaning part is cleaned from existing, will be ground in means of abrasion
Substrate abradant surface be transferred to point before cleaning part, simple in the progress of the direct ready mode of means of abrasion and the short time preparation is clear
Technique is washed, to which the advantageous effects for the cleaning efficiency more increased can be obtained by removing foreign matter under moisture state.
In other words, during will be ground base plate transfer to the cleaning part of technique, if in grinding technics
In be stained with polishing particles of abradant surface of substrate etc. it is dry while be bonded to abradant surface, then have the following problems：It is solid in removal
The cleaning taken longer for when the particle of abradant surface, and cleaning performance is also lower.But the utility model
In, after the CMP process for carrying out substrate, prepared scavenger is carried out with the state unloaded immediately in the unloading area of means of abrasion
Skill can obtain following effect accordingly：So that the case where polishing particles etc. are bonded to abradant surface while substrate abradant surface is dried
It minimizes, to minimize the process time needed for subsequent cleaning processes.
For example, being provided with substrate placement section 220 in unloading area P1, the base of overturning rotation is obtained by roll-over unit 210
Plate 10 carries out prepared cleaning to be flatly positioned over the state of substrate placement section 220.
Substrate placement section 220 is configured to pivot about with rotary shaft 221, and in substrate placement section 220
The upper surface of could be formed with and place needle 224, the bottom surface of substrate 10, which is positioned over, places needle 224.It is being formed with substrate placement section 220
The upper surface of rolling clamp plate (not shown) can be formed with multiple placement needles 224, and substrate in the form of the regulation spacing of interval
10 bottom surface can be positioned over the upper end for placing needle 224.The number and configuration structure for placing needle 224 according to desired condition and are set
Meter pattern can carry out diversified change.
In addition, substrate placement section 220 may include the edge placement section 222 at the edge for placing substrate 10.For example, substrate is put
The edge of substrate 10 can be connected and supported with rolling clamp plate by setting portion 220.Preferably, in order to prevent substrate 10 in high speed rotation
Middle shaking could be formed with the concave portion (not shown) of the periphery end for accommodating supporting substrate 10 in substrate placement section 220.
Also, the covering for stopping the cleaning solution that disperses from substrate 10 can be set between shell 242 and substrate placement section 220
Component 226.Depending on the situation, substrate placement section can also be formed as in the case of no placement needle or edge placement section
Simple plate form.
More specifically, preparation cleaning part 200 includes nozzle unit 230, and nozzle unit 230 includes：First injection spray
Mouth 232 includes the vibration fluid of vibrational energy to the injection of the surface of substrate 10；Second injection nozzle 234, in the form of inclined
To the surface jet cleaning fluid of substrate 10, cleaning fluid be used for by vibrating fluid from the foreign matter that substrate 10 is isolated into
Row cleaning.
First injection nozzle 232 to the surface of substrate 10 to spray comprising vibrational energy (for example, high-frequency vibrational energy or low frequency
Rate vibrational energy) the form of vibration fluid be configured.
For example, the first injection nozzle 232 is configured to, with liquid fluid (for example, DIW) for table of the medium to substrate 10
Face supplies vibrational energy.Depending on the situation, as liquid fluid, chemicals or other different liquid streams can also be used
Body.Unlike, the first injection nozzle 232 can also be that medium supplies vibration to the surface of substrate 10 with bubble (bubble)
Energy.
As reference, by the cleaning way of vibration fluid be it is following it is a kind of in the way of：Make using by ultrasonic wave
Generated shock wave is cleaned in the bubbles burst for the vacuum that liquid fluid generates.
In other words, if radiating ultrasonic wave into liquid, liquid is impacted and is shaken, and is locally generated pressure
High part and low part.The low part of pressure generates the cavity of small vacuum in a liquid, is referred to as cavity
(cavity), when pressure increases because of ultrasonic activation again, which obtains pressure and ruptures, while generating impact
Wave.In fact, the bubbles of vacuum is with high pressure, then there is burst when pressure reduction is negative (-) pressure suddenly.The punching
The pollutant that wave is hit to product applies impact, to be cleaned.
Preferably, in order to enable being maximized using the cleaning performance of vibration fluid, the first injection nozzle 232 is with relative to vertical
Histogram sprays vibration fluid to the form for tilting 1 °~30 ° (θ 1) to the surface of substrate 10.
Also, the first injection nozzle 232 separates height (H) the injection vibration stream of 10~30 ㎜ from the surface with substrate 10
Body, it is hereby achieved that following advantageous effects：The foreign matter on the surface for being present in substrate 10 can be hit down by sufficient hitting power,
And it can more improve the foreign matter separative efficiency using vibration fluid.
Moreover, can be different according to the size of the particle (foreign matter) of the frequency band of vibration removal, but generate the mega sonic wave of vibration
Generator (not shown) can selectively so that frequency band is different according to the size of particle.With regard to the frequency band change mode
Speech, in the inside for being formed in the groove on surface of substrate 10 (trench) or contact hole (contact hole) there are when bubble,
Can solve the problems, such as because bubble and so that ultrasonic activation can not be transmitted to the surface of substrate 10, and can be to substrate 10
Surface supply the vibration fluid of uniformly applied ultrasonic activation.
Second injection nozzle 234 and the first injection nozzle 232 are adjacent to configuration, and shake to the injection of the surface of substrate 10
During dynamic fluid, it is used for the surface jet cleaning fluid of substrate 10, cleaning fluid to passing through vibration in the form of inclined
Fluid and the foreign matter isolated from substrate 10 are cleaned.
It is defined as, will be detached from substrate 10 here, so-called cleaning fluid carries out cleaning to the foreign matter isolated from substrate 10
The foreign matter gone out is expelled to the outside of substrate 10.
As cleaning fluid, a variety of of the outside that the foreign matter for remaining on substrate 10 can be expelled to substrate 10 can be used
Fluid, and the utility model is not limited or restriction by the type of cleaning fluid.For example, as cleaning fluid, can use
Pure water (DIW), chemicals (for example, SC1, ammonia, sulfuric acid, ozone hydrofluoric acid, hydrogen peroxide) etc..Depending on the situation,
Xenogenesis fluid or steam etc. can also be used as cleaning fluid.
Preferably, the second injection nozzle 234 with the second spray angle θ 2 different from the first spray angle θ 1 to substrate 10
Surface obliquely jet cleaning fluid.So so that the second spray angle θ 2 and first injection sprays of the second injection nozzle 234
First spray angle θ 1 of mouth 232 is different, it is hereby achieved that following advantageous effects：So that being isolated from substrate 10 different
Object is more efficiently expelled to the outside of substrate 10.
More specifically, the second injection nozzle 234 is sprayed along from the inside of substrate 10 towards the direction in the outside of substrate 10
Penetrate cleaning fluid, the second spray angle θ 2 is formed in the form of higher than the first spray angle θ 1.
In other words, the second injection nozzle 234 is sprayed along from the inside of substrate 10 towards the direction in the outside of substrate 10
Fluid is cleaned, and by the second spray angle θ 2 of the second injection nozzle 234 with the first injection more than the first injection nozzle 232
The form of angle, θ 1 forms (the second injection nozzle 234 is configured to more be laid flat than the first injection nozzle 232 by 2 ＞ θ 1 of θ), accordingly,
The cleaning fluid sprayed to the surface of substrate 10 splashes, so that remaining on the surface of substrate 10 (for example, in substrate
Centre portion surface) the case where minimize, and can will cleaning fluid more rapidly towards the lateral direction of substrate 10 be discharged.Cause
This, can obtain following advantageous effects：It can make the vibration fluid comprising foreign matter and cleaning fluid to the maximum extent promptly
The case where being expelled to the outside of substrate 10, and the foreign matter isolated from substrate 10 is made to be again attached to substrate 10 minimizes.
Preferably, in order to enable the expulsion efficiency of cleaning fluid maximizes, the second injection nozzle 234 is with relative to Vertical Square
To tilt 2 °~60 ° (θ 2) surface jet cleaning fluid from form to substrate 10.It is further preferred that the second injection nozzle 234
The second spray angle θ 2 formed with 1 twice or more of the angles of the first spray angle θ at least more than the first injection nozzle 232.
Hereinafter, the second spray angle θ 2 for illustrating the second injection nozzle 234 is 10 °, the first jet angle of the first injection nozzle 232
Spend the composition that θ 1 is 20 °.
It is further preferred that on the surface of substrate 10, the first eject position and cleaning fluid that vibration fluid is sprayed are sprayed
The distance between the second eject position penetrated L is preferably 2~40 ㎜.
In other words, if the distance between the first eject position and the second eject position L are less than 2 ㎜, fluid is vibrated
It may be overlapped with the eject position of cleaning fluid, thus, it can be lower using the foreign matter separative efficiency of vibration fluid.On the contrary, if
The distance between first eject position and the second eject position L are more than 40 ㎜, then can be because of the row of the foreign matter using cleaning fluid
Go out time delay and worries the surface that foreign matter is again attached to substrate 10.Therefore, by the first eject position and the second eject position
The distance between L be set to 2~40 ㎜, following advantageous effects can be obtained accordingly：Improve foreign matter separative efficiency, and make from
The foreign matter that substrate 10 is isolated is again attached to the case where substrate 10 and minimizes.
In addition, nozzle unit 230 includes tilting member 236, tilting member 236 is along the central portion RP1 courts from substrate 10
To swing (swing) the track SP of the edge RP2 of substrate 10 swing rotary, and the first injection nozzle are carried out relative to substrate 10
232 are installed on tilting member 236, after the second injection nozzle 234 along swinging track SP to be configured at the first injection nozzle 232
The form of side is installed on tilting member 236.
In this way, the second injection nozzle 234 is configured at the first injection nozzle by the swinging track SP along tilting member 236
232 rear, that is, the first injection nozzle 232 moved along the edge RP2 of the central portion RP1 from substrate 10 towards substrate 10
Moving direction the second injection nozzle 234 is configured to the rear of the first injection nozzle 232, accordingly, can obtain following advantageous
Effect：By the foreign matter D isolated from the surface of substrate 10 by vibrating fluid from the central portion of substrate 10 towards substrate 10
Edge sweeps out the outside come and foreign matter D is expelled to substrate 10, and foreign matter D can be made in the residual on the surface of substrate 10
Or attachment minimizes again.
Also, in substrate 10 during unloading area obtains unloading, tilting member 236 is configured at the outside of substrate 10
Region, it is hereby achieved that following effect：It prevents from conflicting with peripheral devices such as roll-over unit 210 or transfer units in advance.
In front in described the embodiments of the present invention, one is installed on the first injection nozzle and the second injection nozzle
It is illustrated in case of a tilting member, but depending on the situation, the first injection nozzle and the second injection nozzle
It can also be configured to independently carry out swing rotary by mutually different tilting member.
In other words, other embodiment according to the present utility model, nozzle unit 230 include：First tilting member 236',
It carries out swing rotary along the swinging track at the central portion from substrate 10 towards the edge of substrate 10 relative to substrate 10；First
Injection nozzle 232 is installed on the first tilting member 236', and includes the vibration stream of vibrational energy to the injection of the surface of substrate 10
Body；Second tilting member 236 ", along the central portion from substrate 10 towards the edge of substrate 10 swinging track relative to base
Plate 10 carries out swing rotary；Second injection nozzle 234, to be configured at the rear of the first injection nozzle 232 along swinging track
Form be installed on the second tilting member 236 ", and to the surface jet cleaning fluid of substrate 10 in the form of inclined, cleaning stream
Body is used to the foreign matter isolated being expelled to the outside of substrate 10 from substrate 10 by vibrating fluid.
At this point, the first tilting member 236' and the second tilting member 236 " are configured to, the edge in the form of being mutually in step
It identical swinging track and carries out swing rotary relative to substrate 10.
In addition, preparation cleaning part point includes isolation block 240, and during unloading area P1 executes preparation cleaning, partition
Unit 240 opens in the preparation cleaning treatment space of unloading area P1 with the space partition except it.
Here, the preparation cleaning treatment space of so-called unloading area P1 can be understood as carrying out the space of prepared cleaning,
And preparation cleaning treatment space could be provided as the chamber structure independently sealed by isolation block 240.
Isolation block 240 when can prevent prepared cleaning base plate 10 used cleaning solution (for example, chemicals) etc. to
Other adjacent equipments (for example, grinding pad) flow into.
Isolation block 240 could be provided as being capable of providing the various structures for the independent sealing space opened with external partition.
For example, isolation block 240 includes：Shell 242 is arranged in the form of surrounding around substrate 10 and to provide independent preparation clear
Wash processing space；Opening and closing member 244 is opened and closed the entrance of shell 242.
For example, shell 242 could be provided as being formed with the general square shape box form of entrance, opening and closing member in upper end
244 are configured to, by common driving portion (for example, combination of motor and power transmission member) centered on one place
Rotated and be opened and closed the entrance of shell 242.Depending on the situation, opening and closing member can also be configured to move linearly and open
Entrance is closed, unlike, entrance can also be formed in the side of sidewall portion of shell.
And it is possible to include：Exhaust outlet 242a is formed in the wall surface of shell 242；Exhaust chamber 242b, with shell
242 outside connects and is formed with the exhaust space being connected with exhaust outlet 242a；Exhaust pipe 242c, with exhaust chamber 242b
Connection, exhaust chamber 242b are formed in the form of with the sectional area broader than exhaust pipe 242c.
In this way, in the utility model, the internal gas (for example, harmful floating outstanding particle) of shell 242 passes through exhaust outlet 242a
With outside can be expelled to after exhaust chamber 242b by exhaust pipe 242c, and exhaust outlet 242a and exhaust chamber 242b have
The sectional area broader than exhaust pipe 242c accordingly can be uniform by exhaust chamber 242b by the exhaust pressure of exhaust pipe 242c
Ground acts on the whole region of exhaust outlet 242a, it is hereby achieved that following effect：It is arranged to outside in the internal gas of shell 242
It prevents from generating abnormal vortex inside shell 242 when going out.More preferably so that exhaust outlet 242a and exhaust chamber 242b
(for example, annular state) is integrally formed along the side periphery of shell 242, it is hereby achieved that following advantageous effects：In shell 242
Inside form uniform exhaust pressure.
With reference to Fig. 2 to Fig. 9, follow-up part 300 of cleaning is set to the adjacent side of means of abrasion 100, and in order to residual
The foreign matter in the surface of the substrate 10 in unloading area P1 by preparation cleaning is stayed to be cleaned and be arranged.
As reference, in the utility model, the so-called cleaning in the substrate 10 that subsequently cleaning part 300 carries out can be managed
Xie Wei, to the maximum extent to remain in after prepared cleaning substrate 10 surface (in particular, the abradant surface of substrate 10, can also
The non-abrasive side of cleaning base plate 10) the technique cleaned of foreign matter.In particular, in the cleaning of substrate 10, residual can be removed
The foreign matter (for example, foreign matter of 40~100nm sizes) of smaller size and with stronger in the foreign matter on the surface of substrate 10
Adhesive force attachment foreign matter.
Also, it is preset next with the state execution of no cleaning in the substrate 10 that subsequently cleaning part 300 is cleaned
A technique.Here, so-called so that substrate 10 executes next technique it is to be understood that subsequently to clean with the state of no cleaning
The cleaning of part 300 is all cleanings finally completed to substrate 10, and for the substrate for completing cleaning
10 can carry out next technique (for example, evaporation process) in the case where additionally not adding cleaning.
Follow-up cleaning part 300 could be provided as the cleaning for being able to carry out multiple steps and the structure of drying process, and
The utility model is not by the structure for the cleaning station for constituting follow-up cleaning part 300 and layout is limited or restriction.
Preferably, subsequently cleaning part 300 in order to can be effectively performed for removing the surface for remaining in substrate 10
The cleaning of organic matter and other foreign matters may include：Contact cleaning unit 400 is physically contacted in the surface of substrate 10 simultaneously
It is cleaned；Contactless cleaning unit 500, physical contactless is in the surface of substrate 10 and is cleaned.According to circumstances
Difference, cleaning part can also only include any one in contact cleaning unit and contactless cleaning unit.Also, it constitutes
Multiple cleaning units of cleaning part are configurable to single layer structure, but depending on the situation, it can also be cleaned constituting
Partial multiple cleaning units are laminated along upper and lower directions and are configured to multilayered structure.
In contact cleaning unit 402,404, cleaning brush 404a, chemicals supply unit etc. can be set.
It, can in the state that substrate 10 is positioned over rack as unit of by individual in contactless cleaning unit 502,504
With by cleaning fluid injection portion (cleaning solution ejection section, steam generating part, xenogenesis fluid injection portion), isopropanol ejection section, million
At least any one is cleaned in sonic generator.
For example, nozzle unit 502a is set to the inside of follow-up cleaning part 300, substrate is being carried out by cleaning brush 404a
It is follow-up cleaning before or after, substrate 10 can subsequently be cleaned.As previously mentioned, nozzle unit 502a may include
One injection nozzle (with reference to the 232 of Fig. 7) and the second injection nozzle (with reference to the 234 of Fig. 7), by tilting member (with reference to Fig. 7's
236) while swing rotary so that foreign matter is detached from the surface of substrate 10 and is discharged to the outside of substrate 10.
Depending on the situation, nozzle unit can also be configured to the outside of follow-up cleaning part, in follow-up cleaning part
Substrate is cleaned in the outside divided.
As described above, although the preferred embodiment with reference to the utility model is illustrated, it is understood that, if
It is the skilled practitioner of the technical field, then in thought and the field for not departing from the utility model for being recorded in claim
In the range of can carry out a variety of modifications and changes to the utility model.
Label declaration
10：Substrate 100：Means of abrasion
110：Grinding flat plate 120：Carrier head
200：Preparation cleaning part 210：Roll-over unit
220：Substrate placement section 230,502：Nozzle unit
232：First injection nozzle 234：Second injection nozzle
236：Tilting member 240：Isolation block
242：Shell 244：Opening and closing member
300：Clean part 400：Contact cleaning unit
500：Contactless cleaning unit
Claims (16)
1. a kind of nozzle unit, which is characterized in that including：
First injection nozzle includes the vibration fluid of vibrational energy to the injection of the surface of substrate；
Second injection nozzle is used for the surface jet cleaning fluid of the substrate, cleaning fluid to logical in the form of inclined
The foreign matter crossed the vibration fluid and isolated from the substrate is cleaned.
2. nozzle unit according to claim 1, which is characterized in that
First injection nozzle to the surface of the substrate relative to the first spray angle inclined vertically to spray institute
Vibration fluid is stated,
Second injection nozzle with the second spray angle different from the first spray angle to the surface of the substrate obliquely
Spray the cleaning fluid.
3. nozzle unit according to claim 2, which is characterized in that
Second injection nozzle sprays the cleaning along from the inside of the substrate towards the direction in the outside of the substrate
Fluid,
Second spray angle is formed in the form of higher than first spray angle.
4. nozzle unit according to claim 3, which is characterized in that
First injection nozzle is in the form of relative to 1 ° inclined vertically~30 ° to described in the injection of the surface of the substrate
Fluid is vibrated,
Second injection nozzle is in the form of relative to 2 ° inclined vertically~60 ° to described in the injection of the surface of the substrate
Clean fluid.
5. nozzle unit as claimed in any of claims 1 to 4, which is characterized in that
The height that first injection nozzle separates 10~30 ㎜ from the surface with the substrate sprays the vibration fluid.
6. nozzle unit as claimed in any of claims 1 to 4, which is characterized in that
On the surface of the substrate, the first eject position and the cleaning fluid that the vibration fluid is sprayed sprayed the
The distance between two eject positions are 2~40 ㎜.
7. nozzle unit as claimed in any of claims 1 to 4, which is characterized in that
The vibration fluid supplies the vibrational energy as medium using liquid fluid or bubble to the surface of the substrate.
8. a kind of nozzle unit, which is characterized in that including：
Tilting member, along the central portion from substrate towards the edge of the substrate swinging track relative to the substrate into
Row swing rotary；
First injection nozzle is installed on the tilting member, and includes the vibration of vibrational energy to the injection of the surface of the substrate
Fluid；
Second injection nozzle, to be installed in the form of being configured at the rear of first injection nozzle along the swinging track
The tilting member, and to the surface jet cleaning fluid of the substrate in the form of inclined, cleaning fluid will be for that will pass through institute
State vibration fluid and the foreign matter isolated from the substrate is expelled to the outside of the substrate.
9. a kind of nozzle unit, which is characterized in that including：
First tilting member, along the central portion from substrate towards the edge of the substrate swinging track relative to the base
Plate carries out swing rotary；
First injection nozzle is installed on first tilting member, and is sprayed to the surface of the substrate comprising vibrational energy
Vibrate fluid；
Second tilting member, along the central portion from substrate towards the edge of the substrate swinging track relative to the base
Plate carries out swing rotary；
Second injection nozzle, to be installed in the form of being configured at the rear of first injection nozzle along the swinging track
Second tilting member, and to the surface jet cleaning fluid of the substrate in the form of inclined, cleaning fluid will be for that will lead to
Cross the outside that the foreign matter for vibrating fluid and being isolated from the substrate is expelled to the substrate.
10. nozzle unit according to claim 8 or claim 9, which is characterized in that
First injection nozzle to the surface of the substrate relative to the first spray angle inclined vertically to spray institute
Vibration fluid is stated,
Second injection nozzle towards the direction in the outside of the substrate along being more than described from the inside of the substrate
Second spray angle of one spray angle obliquely sprays the cleaning fluid to the surface of the substrate.
11. a kind of substrate board treatment, which is characterized in that including：
Means of abrasion carries out chemical mechanical grinding (CMP) technique for substrate；
Preparation cleaning part carries out prepared cleaning for the substrate for completing the grinding technics；
Follow-up cleaning part, receives the substrate for having carried out the prepared cleaning that transfer comes and goes forward side by side the hand-manipulating of needle to the base
The subsequent cleaning processes of plate；
Nozzle unit is set in preparation cleaning part and the follow-up cleaning part at least more than any one, into
The row preparation cleaning or the follow-up cleaning, and include the first injection nozzle and the second injection nozzle, the first injection nozzle
Include the vibration fluid of vibrational energy to the injection of the surface of substrate, the second injection nozzle is in the form of inclined to the surface of the substrate
Jet cleaning fluid, cleaning fluid are used to clean the foreign matter isolated from the substrate by the vibration fluid.
12. substrate board treatment according to claim 11, which is characterized in that
The nozzle unit includes tilting member, and tilting member is along the central portion from substrate towards the pendulum at the edge of the substrate
Dynamic rail mark carries out swing rotary relative to the substrate,
First injection nozzle is installed on the tilting member, and second injection nozzle along the swinging track to configure
Form in the rear of first injection nozzle is installed on the tilting member.
13. substrate board treatment according to claim 11, which is characterized in that
First injection nozzle to the surface of the substrate relative to the first spray angle inclined vertically to spray institute
Vibration fluid is stated,
Second injection nozzle towards the direction in the outside of the substrate along being more than described from the inside of the substrate
Second spray angle of one spray angle obliquely sprays the cleaning fluid to the surface of the substrate.
14. substrate board treatment according to claim 11, which is characterized in that
The prepared cleaning part distribution is placed in unloading area, and unloading area is set to the inside of the means of abrasion, so as to complete
It is unloaded at the substrate of the grinding technics.
15. substrate board treatment according to claim 11, which is characterized in that
The follow-up cleaning part point includes contact cleaning unit, and contact cleaning unit is physically contacted in the surface of the substrate
And the substrate is subsequently cleaned,
The nozzle unit is set to the inside of the follow-up cleaning part, and substrate is being carried out by the contact cleaning unit
Follow-up cleaning before or after the follow-up cleaning is carried out to the substrate.
16. substrate board treatment according to claim 15, which is characterized in that
The contact cleaning unit includes cleaning brush, and cleaning brush is in contact in the form of rotating with the surface of the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180000233A KR102570224B1 (en) | 2018-01-02 | 2018-01-02 | Substrate procesing apparatus |
| KR10-2018-0000233 | 2018-01-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207781556U true CN207781556U (en) | 2018-08-28 |
Family
ID=63210199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820232266.2U Active CN207781556U (en) | 2018-01-02 | 2018-02-09 | Nozzle unit and the substrate board treatment for having it |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102570224B1 (en) |
| CN (1) | CN207781556U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113198771A (en) * | 2020-01-31 | 2021-08-03 | 爱思开矽得荣株式会社 | First cleaning device, cleaning equipment comprising same and cleaning method |
| CN116864377A (en) * | 2023-09-04 | 2023-10-10 | 江苏京创先进电子科技有限公司 | Taihe wafer processing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3323384B2 (en) * | 1995-12-21 | 2002-09-09 | 大日本スクリーン製造株式会社 | Substrate cleaning apparatus and substrate cleaning method |
| KR100445259B1 (en) * | 2001-11-27 | 2004-08-21 | 삼성전자주식회사 | Cleaning method and cleaning apparatus for performing the same |
| KR101786485B1 (en) * | 2016-03-08 | 2017-10-18 | 주식회사 케이씨텍 | Chemical mechanical polishing system |
-
2018
- 2018-01-02 KR KR1020180000233A patent/KR102570224B1/en active IP Right Grant
- 2018-02-09 CN CN201820232266.2U patent/CN207781556U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113198771A (en) * | 2020-01-31 | 2021-08-03 | 爱思开矽得荣株式会社 | First cleaning device, cleaning equipment comprising same and cleaning method |
| US11488844B2 (en) | 2020-01-31 | 2022-11-01 | Sk Siltron Co., Ltd. | First cleaning apparatus, cleaning equipment including the same, and cleaning method |
| CN116864377A (en) * | 2023-09-04 | 2023-10-10 | 江苏京创先进电子科技有限公司 | Taihe wafer processing method |
| CN116864377B (en) * | 2023-09-04 | 2023-11-10 | 江苏京创先进电子科技有限公司 | Taihe wafer processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102570224B1 (en) | 2023-08-25 |
| KR20190082525A (en) | 2019-07-10 |
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