KR20190082525A - Nozzle unit and substrate procesing apparatus having the same - Google Patents

Abstract

The present invention relates to a nozzle unit and a substrate processing apparatus having the same. A nozzle unit includes: a first spray nozzle spraying vibration fluid having vibration energy onto a surface of a substrate; and a second spray nozzle slantingly spraying cleaning fluid for cleaning foreign substances separated from the substrate by the vibration fluid onto the surface of the substrate, thereby being possible to enhance cleaning efficiency of the substrate and improve a cleaning effect.

Description

TECHNICAL FIELD [0001] The present invention relates to a nozzle unit and a substrate processing apparatus having the nozzle unit.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle unit and a substrate processing apparatus having the same, and more particularly, to a nozzle unit and a substrate processing apparatus having the nozzle unit capable of improving the cleaning efficiency of the substrate and improving the cleaning effect.

As semiconductor devices are fabricated with high density integration of fine circuit lines, corresponding precision polishing must be able to be performed on the wafer surface. In order to perform polishing of the wafer more precisely, a chemical mechanical polishing process (CMP process) in which chemical polishing as well as mechanical polishing is performed can be performed.

The chemical mechanical polishing (CMP) process is widely used for planarization to remove the height difference between the cell area and the peripheral circuit area due to the irregularities of the wafer surface generated by repeatedly performing masking, etching, and wiring processes during the semiconductor device manufacturing process, Polishing the surface of the wafer in order to improve the surface roughness of the wafer due to contact / wiring film separation and highly integrated elements.

The CMP process is performed by pressing the wafer in a state in which the process surface of the wafer faces the polishing pad to simultaneously perform the chemical polishing and the mechanical polishing of the process surface, So that a cleaning process is performed to clean the foreign substances on the process surface.

1, a chemical mechanical polishing process of a wafer is generally carried out in the loading unit 20 when the wafer W is supplied to the chemical mechanical polishing system X1 and the wafer W is transferred to the carrier heads S1, S2, A chemical mechanical polishing process is performed on the plurality of polishing plates P1, P2, P1 ', P2' while moving along the predetermined path Po in a state of being closely contacted to the polishing surfaces S1 ', S2' . The wafer W subjected to the chemical mechanical polishing process is transferred to the loading table 10 of the unloading unit by the carrier head S and transferred to the cleaning unit X2 where the next cleaning process is performed, A step of cleaning the foreign substance adhering to the wafer W is performed in the step (70).

On the other hand, foreign matter may remain on the surface of the wafer even after the cleaning process of the wafer is completed in the cleaning module. Accordingly, a post cleaning process for removing foreign substances remaining on the surface of the wafer is further performed before the next process (for example, the thin film deposition process) proceeds.

However, since a post-cleaning device must be additionally provided separately from the cleaning module, it is not only disadvantageous in terms of facility layout, but also involves a complicated process of transferring and cleaning the wafer and increasing the cleaning time, The yield is lowered.

Accordingly, in recent years, the cleaning efficiency and yield of the substrate can be improved, and various studies have been made to reduce the cost, but it is still insufficient and development thereof is required.

An object of the present invention is to provide a nozzle unit and a substrate processing apparatus having the nozzle unit capable of improving the cleaning efficiency of the substrate and improving the cleaning effect.

It is another object of the present invention to be able to effectively remove foreign matter remaining on a substrate and improve the yield.

Further, the present invention aims at improving the degree of freedom of design and contributing to downsizing of facilities.

It is another object of the present invention to improve stability and reliability.

According to an aspect of the present invention, there is provided a method of cleaning a substrate, comprising: spraying a vibration fluid including vibration energy on a surface of a substrate and injecting a cleaning fluid, The effect can be improved.

As described above, according to the present invention, it is possible to obtain an advantageous effect of increasing the cleaning efficiency of the substrate and improving the cleaning effect.

Particularly, according to the present invention, it is possible to obtain an advantageous effect of effectively removing the foreign matter separated from the surface of the substrate in a short time before reattaching to the surface of the substrate.

In addition, according to the present invention, it is possible to effectively remove foreign matters remaining on the substrate and to obtain an advantageous effect of improving the yield.

Further, according to the present invention, it is possible to improve the degree of freedom of design and to obtain an advantageous effect contributing to downsizing of the facility.

Further, according to the present invention, it is possible to reduce the cost of cleaning the substrate and improve the process efficiency.

According to the present invention, an advantageous effect of improving stability and reliability can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows the construction of a conventional chemical mechanical polishing equipment,
2 is a view for explaining a substrate processing apparatus according to the present invention,
3 is a view for explaining an example of using a nozzle unit as a substrate processing apparatus according to the present invention,
4 to 8 are views for explaining a nozzle unit according to the present invention,
9 is a view for explaining another use example of the nozzle unit as the substrate processing apparatus according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments. For reference, the same numbers in this description refer to substantially the same elements and can be described with reference to the contents described in the other drawings under these rules, and the contents which are judged to be obvious to the person skilled in the art or repeated can be omitted.

FIG. 2 is a view for explaining a substrate processing apparatus according to the present invention, and FIG. 3 is a view for explaining an example of use of a nozzle unit as a substrate processing apparatus according to the present invention, And Fig. 9 is a view for explaining another example of use of the nozzle unit as the substrate processing apparatus according to the present invention.

2 to 9, a substrate processing apparatus 10 according to the present invention includes a polishing part 100 on which a chemical mechanical polishing (CMP) process is performed on a substrate; A preliminary cleaning part (200) for performing preliminary cleaning on a substrate on which a polishing process has been completed; A subsequent cleaning part 300 to which a substrate having undergone the preliminary cleaning process is transferred and a subsequent cleaning process with respect to the substrate is performed; A first injection nozzle (not shown) provided in at least one of the preliminary cleaning part 200 and the subsequent cleaning part 300 for performing preliminary cleaning or subsequent cleaning and spraying vibration fluid including vibration energy on the surface of the substrate 10 A nozzle unit 230 having a second injection nozzle 234 for obliquely spraying a cleaning fluid for cleaning a foreign object separated from the substrate 10 by a vibration fluid onto the surface of the substrate 10; .

This is to minimize the reattachment to foreign matter on the substrate and to improve the cleaning efficiency of the substrate.

When the abrasive grains or the like on the abrasive surface of the substrate are dried and solidified on the abrasive surface, a cleaning process for a much longer time is required to remove the solidified particles on the abrasive surface, and the cleaning effect is also lowered. In order to solve this problem, efforts have been made in the past to shorten the polishing time of the substrate as much as possible and to start the cleaning process by transferring the substrate subjected to the polishing process to the cleaning part as quickly as possible. However, it is inevitable that the foreign matter separated from the substrate again on the surface of the substrate during the cleaning of the substrate is inevitable, so that the cleaning process is long and the cleaning effect is low despite the above efforts. There is a problem.

However, according to the present invention, a vibration fluid including vibration energy and a cleaning fluid can be discharged to the outside of the substrate as quickly as possible by spraying a vibration fluid including vibration energy on the surface of a substrate, It is possible to obtain an advantageous effect of increasing the separation efficiency of the substrate and minimizing the reattachment of the foreign matter separated from the substrate to the substrate.

The polishing part 100 may be provided in various structures capable of performing a chemical mechanical polishing process, and the present invention is not limited or limited by the structure and layout of the polishing part 100.

The polishing part 100 may be provided with a plurality of polishing platens 110 and a polishing pad may be attached to the upper surface of each polishing platen 110. The substrate 10 supplied to the loading unit provided on the area of the polishing part 100 is brought into rolling contact with the upper surface of the polishing pad supplied with the slurry in tight contact with the carrier head 120 moving along a predetermined path A chemical mechanical polishing process can be performed.

The carrier head 120 can move along a predetermined circulation path on the polishing part 100 area and the substrate 10 supplied to the loading unit (hereinafter referred to as the substrate supplied to the loading position of the substrate) The carrier head 120 can be transported in a state of being closely contacted with the carrier head 120. Hereinafter, an example will be described in which the carrier head 120 is configured to move from a loading unit to a circulating path of a substantially rectangular shape through the polishing platen 110. [

Alternatively, a center transfer line may be provided between a pair of opposed abrasive areas provided in the abrasive part 100, and the substrate 10 entering the abrasive part 100 may be first transferred along the center transfer line , It is possible to cause the unloading area P1 to be unloaded immediately after being polished in each polishing area. The method of transferring the substrate 10 through the center transfer line before the substrate 10 is polished in the polishing region is advantageous in that a separate jetting device for maintaining the wet state of the polished substrate 10 is eliminated, Can be obtained.

An unloading area P1 is provided on one side of the polishing part, and the substrate 10 on which the polishing process is completed is unloaded from the unloading area P1.

The preliminary cleaning part 230 is provided for pre-cleaning the substrate 10 on which the polishing process has been completed.

For reference, the preliminary cleaning of the substrate 10 in the present invention refers to preliminary cleaning of the substrate 10 to the extent that the foreign substances present on the surface of the substrate 10 (in particular, the polishing surface of the substrate) As shown in FIG. Particularly, in the preliminary cleaning of the substrate 10, it is possible to remove a relatively large foreign matter (for example, a foreign matter having a size larger than 100 nm) among the foreign matters existing on the surface of the substrate 10, Organic matter present on the surface can be removed.

In one example, the preliminary cleaning part is disposed in an unloading area provided inside the polishing part so that the substrate on which the polishing process is completed is unloaded. In some cases, the preliminary cleaning part may be provided outside the unloading area.

As described above, since the substrate 10 on which the polishing process has been completed in the unloading area P1 is unloaded and the preliminary cleaning is performed together, it is not necessary to additionally provide a separate space for advancing the preliminary cleaning , The layout of the existing facility can be maintained almost unchanged without changing or adding the layout, and the contamination degree of the subsequent cleaning part 300 can be lowered as the polished substrate 10 directly enters the cleaning part directly.

In addition, prior to transferring the abraded surface of the abraded substrate from the abrading part to the cleaning part, the abrading part is subjected to a preliminary simple and short preliminary cleaning process immediately after the cleaning process has been performed in the cleaning part, It is possible to obtain a favorable effect of obtaining a higher cleaning efficiency.

That is, in the process of transferring the substrate on which the polishing process has been performed to the cleaning part, when the abrasive particles or the like on the polishing surface of the substrate are dried and fixed on the polishing surface during the polishing process, There is a problem in that a time cleaning process is required and the cleaning effect is also lowered. However, according to the present invention, after the CMP process of the substrate is performed, the preliminary cleaning process is performed without unreleased in the unloaded area of the polishing part, the substrate polishing surface is dried and the abrasive particles are adhered to the polishing surface So that the processing time required for the subsequent cleaning process can be minimized.

For example, the substrate loading unit 220 is provided in the unloading area P1, and the substrate 10, which has been reversely rotated by the reversing unit 210, A process is performed.

The substrate mounting part 220 is rotatably mounted on the rotation shaft 221 and a mounting pin 224 on which the bottom surface of the substrate 10 is mounted may be formed on the upper surface of the substrate mounting part 220. A plurality of mounting pins 224 may be formed on an upper surface of a spin jig plate (not shown) forming a substrate mounting portion 220 so as to be spaced apart from each other by a predetermined distance. As shown in FIG. The number and arrangement of the mounting pins 224 can be variously changed according to the required conditions and design specifications.

In addition, the substrate mounting part 220 may include an edge mounting part 222 on which the edge of the substrate 10 is mounted. For example, the substrate holder 220 may be connected to the spin jig plate to support the edge of the substrate 10. Preferably, a recessed portion (not shown) for receiving and supporting the outer circumferential end of the substrate 10 may be formed on the substrate mounting portion 220 so as to prevent the substrate 10 from swinging during high-speed rotation. Between the casing 242 and the substrate mounting part 220, a cover member 226 for covering the cleaning liquid scattered from the substrate 10 may be provided. In some cases, it is also possible that the substrate mounting portion is formed in a simple plate shape without a mounting pin or an edge mounting portion.

More specifically, the preliminary cleaning part 200 includes a first injection nozzle 232 for spraying a vibration fluid including vibration energy on the surface of the substrate 10, and a second injection nozzle 232 for applying a foreign substance separated from the substrate 10 by a vibration fluid And a nozzle unit 230 having a second jetting nozzle 234 for obliquely jetting a cleaning fluid for cleaning onto the surface of the substrate 10. [

The first injection nozzle 232 is provided to inject a vibration fluid including vibration energy (for example, high-frequency vibration energy or low-frequency vibration energy) on the surface of the substrate 10.

In one example, the first injection nozzle 232 may be configured to supply vibrational energy to the surface of the substrate 10 via a liquid fluid (e.g., DIW). In some cases, it is also possible to use a chemical or other liquid fluid as the liquid fluid. Alternatively, it is also possible that the first injection nozzle 232 supplies vibrational energy to the surface of the substrate 10 via a bubble.

For reference, a cleaning method using a vibration fluid is a method of cleaning using a shock wave generated when a vacuum bubble generated in a liquid fluid is ruptured by ultrasonic waves

That is, when an ultrasonic wave is applied to a liquid, the liquid is impacted to swing, resulting in locally high and low pressure portions. The low-pressure part creates a small vacuum cavity in the liquid. This cavity is called a cavity. When the pressure is increased by the ultrasonic vibration, the cavity is pressurized to generate a shock wave. Actually, this fear is present at high pressure, but suddenly it explodes when the pressure is low (-). This shock wave impacts the contaminants of the product and is cleaned.

Preferably, the first injection nozzle 232 injects the oscillating fluid at an angle of 1 ° to 30 ° (? 1) with respect to the direction perpendicular to the surface of the substrate 10 so as to maximize the cleaning effect by the oscillating fluid .

The first injection nozzle 232 injects the vibrating fluid at a height H of 10 to 30 mm from the surface of the substrate 10 so that the foreign substances present on the surface of the substrate 10 can be sufficiently struck It is possible to obtain an advantageous effect of further increasing the separation efficiency of the foreign matter by the vibration fluid.

In addition, since the size of particles (foreign matter) removed according to the frequency band of the vibration can be changed, the megasonic generator (not shown) that generates vibration can selectively change the frequency band depending on the particle size. When the bubbles are present in the trenches or the contact holes formed on the surface of the substrate 10, the frequency band changing method transmits the ultrasonic vibrations to the surface of the substrate 10 by the bubbles And the vibration fluid uniformly applied with the ultrasonic vibration can be supplied to the surface of the substrate 10. [

The second injection nozzle 234 is disposed adjacent to the first injection nozzle 232 and is configured to clean the foreign matter separated from the substrate 10 by the vibration fluid while the vibration fluid is sprayed to the surface of the substrate 10 Is inclinedly sprayed on the surface of the substrate (10).

Here, cleaning of the foreign matter separated from the substrate 10 by the cleaning fluid is defined as discharging the foreign matter separated from the substrate 10 to the outside of the substrate 10. [

As the cleaning fluid, various fluids that can discharge the foreign substances remaining on the substrate 10 to the outside of the substrate 10 can be used, and the present invention is not limited or limited by the kind of the cleaning fluid. For example, pure water (DIW), chemical (for example, SC1, ammonia, sulfuric acid, ozone hydrofluoric acid, hydrogen peroxide) and the like may be used as the cleaning fluid. In some cases, a different fluid may be used as the cleaning fluid, or steam may be used.

Preferably, the second injection nozzle 234 injects the cleaning fluid obliquely onto the surface of the substrate 10 at a second injection angle 2 different from the first injection angle 1. As described above, by making the second jetting angle 2 of the second jetting nozzle 234 different from the first jetting angle 1 of the first jetting nozzle 232, the foreign matter separated from the substrate 10 It is possible to obtain an advantageous effect of more effectively discharging to the outside of the substrate 10.

More specifically, the second jetting nozzle 234 injects the cleaning fluid in a direction toward the outside of the substrate 10 from the inside of the substrate 10, and the second jetting angle 2 is the first jetting angle? .

That is, the second jetting nozzle 234 injects the cleaning fluid in the direction toward the outside of the substrate 10 from the inside of the substrate 10, and the second jetting angle? 2 of the second jetting nozzle 234 1 by setting the second spraying nozzle 234 to be higher than the first spraying angle? 1 of the first spraying nozzle 232 (? 2>? 1 and arranging the second spraying nozzle 234 more distant than the first spraying nozzle 232) It is possible to minimize the amount of the cleaning fluid sprayed onto the surface of the substrate 10 and to remain on the surface of the substrate 10 (for example, the central portion surface of the substrate), and to discharge the cleaning fluid toward the outside of the substrate 10 more quickly can do. Accordingly, the vibration fluid including the foreign substance and the cleaning fluid can be discharged to the outside of the substrate 10 as quickly as possible, and an advantageous effect of minimizing reattaching of the foreign matter separated from the substrate 10 to the substrate 10 is obtained .

Preferably, the second injection nozzle 234 injects the cleaning fluid obliquely at an angle of 2 DEG to 60 DEG (? 2) with respect to the direction perpendicular to the surface of the substrate 10, in order to maximize the discharge efficiency of the cleaning fluid. The second jetting angle 2 of the second jetting nozzle 234 is formed to be at least two times higher than the first jetting angle 1 of the first jetting nozzle 232. Hereinafter, an example in which the second jetting angle 2 of the second jetting nozzle 234 is 10 degrees and the first jetting angle? 1 of the first jetting nozzle 232 is 20 degrees is also described .

More preferably, the distance L between the first ejecting position where the vibration fluid is ejected from the surface of the substrate 10 and the second ejecting position where the cleaning fluid is ejected is preferably 2 to 40 mm.

That is, if the distance L between the first injection position and the second injection position is less than 2 mm, the vibration fluid and the jetting position of the cleaning fluid can overlap, thereby reducing the foreign matter separation efficiency by the vibration fluid. On the other hand, if the distance L between the first injection position and the second injection position is larger than 40 mm, the discharge time of the foreign substance by the cleaning fluid may be delayed and the foreign matter may adhere to the surface of the substrate 10. Therefore, by making the distance L between the first injection position and the second injection position 2 to 40 mm, it is possible to increase the separation efficiency of the foreign matter and to prevent foreign matter separated from the substrate 10 from reattaching to the substrate 10 It is possible to obtain an advantageous effect of minimizing the occurrence of the problem.

The nozzle unit 230 includes a swing member SW2 swinging about the substrate 10 along a swing locus SP toward the edge RP2 of the substrate 10 from the central portion RP1 of the substrate 10, The first injection nozzle 232 is mounted on the swing member 236 and the second injection nozzle 234 is disposed on the rear side of the first injection nozzle 232 along the swing locus SP And is mounted on the swing member 236 as much as possible.

In this way, by disposing the second injection nozzle 234 behind the first injection nozzle 232 along the swing locus SP of the swing member 236, in other words, the center portion RP1 of the substrate 10 The second injection nozzle 234 is disposed in the rear of the first injection nozzle 232 along the moving direction of the first injection nozzle 232 moving toward the edge RP2 of the substrate 10, An advantageous effect of sweeping the foreign matter D separated from the surface of the substrate 10 by the vibration fluid toward the edge of the substrate 10 at the central portion of the substrate 10 and discharging it out of the substrate 10 can be obtained , It is possible to obtain an advantageous effect of minimizing the foreign matter (D) remaining on the surface of the substrate (10) or reattaching it.

In addition, while the substrate 10 is unloaded to the unloading area, the swinging member 236 is disposed in the outer region of the substrate 10 so that collision with the peripheral device such as the reversing unit 210, Can be obtained.

In the embodiment of the present invention described above, the first injection nozzle and the second injection nozzle are mounted on one swing member. However, in some cases, the first injection nozzle and the second injection nozzle may have different swing members It is also possible to arrange to swing independently.

That is, according to another embodiment of the present invention, the nozzle unit 230 includes a first swing member (not shown) that swings about the substrate 10 along a swing locus toward the edge of the substrate 10 at a central portion of the substrate 10, A first injection nozzle 232 mounted on the first swing member 236 'for spraying a vibration fluid including vibrational energy on the surface of the substrate 10; A second swing member 236 " for swinging with respect to the substrate 10 along a swing locus toward the edge of the swinging member 10; a second swing member 236 " A second injection nozzle 234 mounted on the first substrate 236 "for slidably spraying a cleaning fluid for discharging foreign matter separated from the substrate 10 from the substrate 10 to the outside of the substrate 10 by a vibration fluid, .

At this time, the first swing member 236 'and the second swing member 236 "may be configured to be synchronized with each other and swing with respect to the substrate 10 along the same swing locus.

The preliminary cleaning part also includes a blocking unit 240 for blocking the preliminary cleaning processing space of the unloading area P1 from the other space while the preliminary cleaning is performed in the unloading area P1.

Here, the pre-cleaning processing space of the unloading area P1 can be understood as a space in which the pre-cleaning is performed, and the pre-cleaning processing space can be provided in an independently sealed chamber structure by the blocking unit 240 have.

The blocking unit 240 prevents the cleaning liquid (e.g., chemical) used during the preliminary cleaning of the substrate 10 from entering other adjacent equipment (e.g., a polishing pad).

The blocking unit 240 may be provided in various structures capable of providing an independent closed space that is shielded from the outside. The shielding unit 240 is provided to enclose the periphery of the substrate 10 and includes a casing 242 for providing an independent preliminary cleaning processing space and an opening and closing member 244 for opening and closing an entrance of the casing 242 .

For example, the casing 242 may be provided in the form of a substantially square box having an entrance at an upper end thereof, and the opening and closing member 244 may be provided with a point by a normal driving part (for example, a combination of a motor and a power transmitting member) And may be configured to open and close the entrance of the casing 242. [ In some cases, the opening and closing member may be linearly moved to open and close the door. Alternatively, the door may be formed in the side wall of the casing.

An exhaust chamber 242a formed on a wall surface of the casing 242 and an exhaust chamber 242b connected to the outside of the casing 242 to form an exhaust space communicating with the exhaust port 242a. And the exhaust chamber 242b is formed to have an expanded cross-sectional area larger than the exhaust pipe 242c.

As described above, the present invention allows the internal gas (e.g., fume) of the casing 242 to be discharged to the outside through the exhaust pipe 242c through the exhaust port 242a and the exhaust chamber 242b, And the exhaust chamber 242b have an expanded sectional area larger than that of the exhaust pipe 242c so that the exhaust pressure by the exhaust pipe 242c can be uniformly applied to the entire region of the exhaust port 242a via the exhaust chamber 242b It is possible to prevent an abnormal vortex from occurring in the casing 242 when the inner gas of the casing 242 is discharged to the outside. More preferably, the exhaust port 242a and the exhaust chamber 242b are integrally formed (for example, in the form of a ring) along the side surface of the casing 242, An advantageous effect of forming the atmospheric pressure can be obtained.

2 and 9, a subsequent cleaning part 300 is provided on an adjacent side of the polishing part 100 to clean foreign matter remaining on the surface of the substrate 10 pre-cleaned in the unloading area P1 Lt; / RTI >

In the present invention, cleaning of the substrate 10 in the subsequent cleaning part 300 means that the surface of the substrate 10 (particularly, the polishing surface of the substrate 10, the surface of the substrate 10 ) Can be cleaned as much as possible. Particularly, in the cleaning of the substrate 10, foreign substances (for example, foreign substances having a size of 40 to 100 nm) relatively small in size and foreign substances adhering with relatively strong adhesion force are removed from the foreign substances existing on the surface of the substrate 10 .

In addition, the substrate 10 cleaned in the subsequent cleaning part 300 is configured to perform the next predetermined process without cleaning. Here, performing the next process without cleaning the substrate 10 can be understood as the completion of the cleaning process in the subsequent cleaning part 300, and the final cleaning process with respect to the substrate 10, The substrate 10 on which the cleaning process has been completed can proceed to the next process (for example, the deposition process) without an additional cleaning process.

The subsequent cleaning part 300 may be provided with a structure capable of performing various stages of cleaning and drying processes and the present invention is not limited or limited by the structure and layout of the cleaning station constituting the subsequent cleaning part 300 .

Preferably, the subsequent cleaning part 300 is physically contacted to the surface of the substrate 10 so as to effectively perform cleaning to remove organic matter and other foreign matter remaining on the surface of the substrate 10, And a non-contact type cleaning unit 500 that is physically in contact with the surface of the substrate 10 and performs cleaning. In some cases, the cleaning part may include only one of the contact type cleaning unit and the non-contact type cleaning unit. Further, the plurality of cleaning units constituting the cleaning part can be arranged in a single layer structure, but in some cases, it is also possible to arrange a plurality of cleaning units constituting the cleaning part in the vertical direction so as to have a multi-layer structure.

The contact type cleaning units 402 and 404 may be provided with a cleaning brush 404a, a chemical supply unit, and the like.

In the noncontact type cleaning units 502 and 504, the substrate 10 is mounted on the base in a sheet-by-sheet manner, and is provided with a cleaning fluid jetting portion (a cleaning liquid jetting portion, a steam jetting portion, a heterogeneous fluid jetting portion), an isopropyl alcohol jetting portion, And the generator can be cleaned by at least one of them.

In one example, the nozzle unit 502a may be provided within the subsequent cleaning part 300 and configured to subsequently clean the substrate 10 before or after the subsequent cleaning of the substrate by the cleaning brush 404a . As described above, the nozzle unit 502a may include a first jetting nozzle (see 232 in FIG. 7) and a second jetting nozzle (see 234 in FIG. 7) The foreign substance can be separated from the surface of the substrate 10 and discharged to the outside of the substrate 10 while swinging.

In some cases, the nozzle unit may be arranged outside the subsequent cleaning part, and the substrate may be cleaned outside the subsequent cleaning part.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. It will be understood that the present invention can be changed.

10: substrate 100: polishing part
110: polishing plate 120: carrier head
200: preliminary cleaning part 210: reversing unit
220: substrate holder 230, 502: nozzle unit
232: First injection nozzle 234: Second injection nozzle
236: swing member 240:
242: casing 244: opening / closing member
300: Cleaning part 400: Contact cleaning unit
500: Non-contact cleaning unit

Claims (16)

As the nozzle unit,
A first injection nozzle for spraying a vibration fluid including vibration energy on a surface of a substrate;
A second injection nozzle for obliquely spraying a cleaning fluid for cleaning a foreign substance separated from the substrate with the vibration fluid on the surface of the substrate;
Wherein the nozzle unit comprises a plurality of nozzles.
The method according to claim 1,
Wherein the first injection nozzle injects the vibration fluid at a first injection angle inclined with respect to a direction perpendicular to the surface of the substrate,
Wherein the second injection nozzle injects the cleaning fluid obliquely onto the surface of the substrate at a second spray angle different from the first spray angle.
3. The method of claim 2,
Wherein the second injection nozzle injects the cleaning fluid in a direction toward the outside of the substrate from the inside of the substrate,
Wherein the second spray angle is higher than the first spray angle.
The method of claim 3,
Wherein the first injection nozzle injects the vibrating fluid at an angle of 1 DEG to 30 DEG with respect to a direction perpendicular to the surface of the substrate,
Wherein the second injection nozzle injects the cleaning fluid at an angle of 2 ° to 60 ° with respect to a direction perpendicular to the surface of the substrate.
5. The method according to any one of claims 1 to 4,
Wherein the first injection nozzle injects the vibrating fluid at a height 10 to 30 mm away from the surface of the substrate.
5. The method according to any one of claims 1 to 4,
Wherein a distance between a first ejection position where the vibration fluid is ejected from the surface of the substrate and a second ejection position where the cleaning fluid is ejected is 2 to 40 mm.
5. The method according to any one of claims 1 to 4,
Wherein the vibrating fluid supplies the vibration energy to a surface of the substrate via a liquid fluid or a bubble.
As the nozzle unit,
A swing member swinging with respect to the substrate along a swing locus toward the edge of the substrate at a central portion of the substrate;
A first injection nozzle mounted on the swing member for spraying a vibration fluid including vibration energy on a surface of the substrate;
A cleaning fluid mounted on the swing member so as to be disposed behind the first injection nozzle along the swing locus and for discharging foreign matter separated from the substrate by the vibration fluid to the outside of the substrate, A second spray nozzle for spraying obliquely;
Wherein the nozzle unit comprises a plurality of nozzles.
As the nozzle unit,
A first swing member swinging with respect to the substrate along a swing locus toward the edge of the substrate at a central portion of the substrate;
A first spray nozzle mounted on the first swing member for spraying a vibration fluid including vibration energy on a surface of the substrate;
A second swing member swinging with respect to the substrate along the swing locus toward the edge of the substrate at a central portion of the substrate;
A cleaning fluid that is mounted on the second swing member so as to be disposed behind the first injection nozzle along the swing locus and discharges foreign matter separated from the substrate by the vibration fluid to the outside of the substrate, A second injection nozzle for spraying obliquely onto the surface;
Wherein the nozzle unit comprises a plurality of nozzles.
10. The method according to claim 8 or 9,
Wherein the first injection nozzle injects the vibration fluid at a first injection angle inclined with respect to a direction perpendicular to the surface of the substrate,
Wherein the second jetting nozzle slants the cleaning fluid obliquely onto the surface of the substrate at a second jetting angle higher than the first jetting angle along a direction toward the outside of the substrate from the inside of the substrate. .
A substrate processing apparatus comprising:
A polishing part on which a chemical mechanical polishing (CMP) process is performed on the substrate;
A preliminary cleaning part for preliminarily cleaning the substrate on which the polishing process is completed;
A subsequent cleaning part on which the substrate subjected to the preliminary cleaning process is transferred and a subsequent cleaning process is performed on the substrate;
A first injection nozzle provided in at least one of the preliminary cleaning part and the subsequent cleaning part for performing the preliminary cleaning or the subsequent cleaning and for spraying a vibration fluid including vibration energy on a surface of the substrate; And a second ejection nozzle for obliquely ejecting a cleaning fluid for cleaning a foreign substance separated from the substrate by the first nozzle;
The substrate processing apparatus comprising:
12. The method of claim 11,
Wherein the nozzle unit comprises:
And a swing member swinging with respect to the substrate along a swing locus toward the edge of the substrate at a central portion of the substrate,
Wherein the first injection nozzle is mounted to the swing member, and the second injection nozzle is mounted to the swing member so as to be disposed behind the first injection nozzle along the swing trajectory.
12. The method of claim 11,
Wherein the first injection nozzle injects the vibration fluid at a first injection angle inclined with respect to a direction perpendicular to the surface of the substrate,
Wherein the second spray nozzle slants the cleaning fluid obliquely onto the surface of the substrate at a second spray angle higher than the first spray angle along the direction toward the outside of the substrate from the inside of the substrate Device.
12. The method of claim 11,
Wherein the preliminary cleaning part is disposed in an unloading area provided inside the polishing part so that the substrate on which the polishing process is completed is unloaded.
12. The method of claim 11,
Wherein the subsequent cleaning part comprises a contact cleaning unit for physically contacting the surface of the substrate and for subsequent cleaning of the substrate,
Wherein the nozzle unit is provided inside the subsequent cleaning part to perform the subsequent cleaning of the substrate before or after the subsequent cleaning of the substrate by the contact cleaning unit.
16. The method of claim 15,
Wherein the contact type cleaning unit includes a cleaning brush which is in rotational contact with the surface of the substrate.

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