CN208589417U - Base plate processing system and substrate board treatment - Google Patents

Base plate processing system and substrate board treatment Download PDF

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Publication number
CN208589417U
CN208589417U CN201820876979.2U CN201820876979U CN208589417U CN 208589417 U CN208589417 U CN 208589417U CN 201820876979 U CN201820876979 U CN 201820876979U CN 208589417 U CN208589417 U CN 208589417U
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China
Prior art keywords
substrate
cleaning
base plate
processing system
unit
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CN201820876979.2U
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Chinese (zh)
Inventor
蔡熙成
崔光洛
权宁奎
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Case Polytron Technologies Inc
KCTech Co Ltd
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Case Polytron Technologies Inc
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Priority claimed from KR1020180001439A external-priority patent/KR102461597B1/en
Priority claimed from KR1020180001438A external-priority patent/KR20190083599A/en
Priority claimed from KR1020180004441A external-priority patent/KR20190086202A/en
Application filed by Case Polytron Technologies Inc filed Critical Case Polytron Technologies Inc
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Abstract

The utility model relates to base plate processing system and substrate board treatments, the base plate processing system is used to be formed with pattern (pattern) or film (layer) to front surface and rear surface is unpatterned or the substrate of film is handled, including carrying out grinding process to substrate front surface and carrying out the grind section of grinding process to substrate rear surface.The utility model has the integrated level for further increasing semiconductor package part as a result, and the effect of precision is improved in the subsequent handling that light is utilized.

Description

Base plate processing system and substrate board treatment
Technical field
The utility model relates to base plate processing system and substrate board treatments, and more specifically, being related to one kind can grind It is unpatterned the substrate rear surface of (pattern) or film (layer) and is formed with the substrate of the substrate front surface of pattern or film Processing system.
Background technique
Semiconductor element is manufactured by fine circuit line High Density Integration, therefore, is carried out with this corresponding in substrate surface Precise finiss.In order to more closely carry out the grinding of substrate, the chemical machine of mechanical polishing and chemical formula grinding parallel is carried out Tool formula grinding process (CMP process).
That is, carrying out flat grinding process to substrate, exquisite grinding layer thickness control is carried out, to mount the shape of fine element State manufactures semiconductor package part.
In the past, for manufacturing the substrate of semiconductor package part, the grinding process to form the front surface of pattern or film is carried out.But It is, only in the case where substrate front surface carries out grinding process, in terms of the semiconductor package part of manufacture stacking form, due to layer Folded height is not fixed, thus is noted in terms of improving integrated level that there are boundaries.
In the exposure process especially carried out after grinding process, due to the convex-concave of substrate rear surface, substrate inclines slightly Tiltedly place, thus mistake occurs for the positioning states of substrate and mask, causes to be difficult to the problem of forming exact pattern.
It is coarse due to rear surface in addition, with the substrate of light lateral direction penetrating to manufacture semiconductor package part Uneven convex-concave, the light for being irradiated in substrate are scattered by the convex-concave of rear surface, there is a problem of that the boundary for etching position is not clear enough.
Therefore, there is an urgent need to a kind of schemes of manufacturing process's problem for eliminating semiconductor package part as described above.
Utility model content
Technical problem to be solved
The utility model aim is that the base for being unpatterned (pattern) or film (layer) can be ground by providing one kind Plate rear surface and be formed with pattern or film substrate front surface base plate processing system and substrate board treatment.
In addition, the utility model aim is, can be improved in process (for example, exposure process) after substrate grinding Stability and reliability.
In addition, the utility model aim is, the remaining foreign matter of substrate rear surface can be removed, can be made caused by foreign matter Secondary pollution, which is realized, to be minimized.
In addition, the utility model aim is, structure can simplify, increase the degree of design freedom.
In addition, the utility model aim is, grinding efficiency and cleaning efficiency can be improved, yield can be improved.
In addition, the utility model aim is, it can disposably remove and be present in front of the grinding process for carrying out substrate The foreign matter of substrate, because of substrate damage caused by foreign matter when preventing grinding process.
In addition, the utility model aim is, though change or not additional existing equipment layout, and process effect is not reduced Rate can also be such that the foreign matter for remaining on substrate realizes and minimize.
Solve the scheme of technical problem
According to the preferred embodiment in the utility model for being intended to reach described the utility model aim, figure is formed with to front surface Case (pattern) or film (layer) and in the base plate processing system that rear surface is unpatterned or the substrate of film is handled, packet The grind section of the grinding process and the grinding process carried out to substrate rear surface to the progress of substrate front surface is included, thereby, it is possible to mention The integrated level of high semiconductor package part can further increase the precision being utilized in the subsequent handling of light.
As reference, the term of " front surface " printed words recorded in present specification and claims is defined to indicate that shape At the surface for the side for having the patterns such as oxide, metal or film, the term of " rear surface " printed words, which is defined to indicate that, to be unpatterned Or " opposite side surfaces of front surface " of film.
In addition, in the present invention, " the preparing cleaning " of so-called substrate, it is meant that in the grinding process carried out to substrate Before (front surface grinding process and rear surface grinding process), in other words, for unrealized grinding substrate surface for the first time The cleaning process of execution.
In addition, in the present invention, " prerinse " of so-called substrate, it is meant that for the substrate surface for completing grinding The cleaning process that (front surface and rear surface) executes for the first time, it can be understood as before carrying out subsequent cleaning, it is intended to disposable clear Wash into the cleaning process of the remaining foreign matter of substrate surface of grinding.
In addition, in the present invention, the so-called subsequent cleaning based on cleaning part, it can be understood as after carrying out prerinse, It is intended to the final cleaning process of cleaning base plate foreign matter remained on surface.
It is intended to reach the base plate processing system of the utility model of described the utility model aim, for being formed to front surface There are pattern or film and rear surface is unpatterned or the substrate of film is handled, comprising: grind section is carried out to the substrate The grinding process of front surface and grinding process to the substrate rear surface.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the grind section packet Include: the first abrasive disk carries out grinding process to the surface in the front surface and rear surface of the substrate；Roll-over unit, Receive the substrate from first abrasive disk and is allowed to overturning rotation；Second abrasive disk receives institute from the roll-over unit Substrate is stated, grinding process is carried out to another surface in the front surface and rear surface of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the roll-over unit is matched It is placed in the movement routine that the substrate moves between first abrasive disk and second abrasive disk or is configured at and is described The outside of movement routine.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, table after the substrate The state faced to the lower part is supplied to the grind section, in first abrasive disk, grind the substrate rear surface Grinder sequence carries out the grinding process of the front surface to the substrate in second abrasive disk.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, match in the first abrasive disk The first grinding pad is had, the shape of first grinding pad is contacted with the surface in a front surface and a rear surface of the substrate State grinding, in the second abrasive disk equipped with the second grinding pad, with another table in a front surface and a rear surface of the substrate The state of second grinding pad described in face contact is ground.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the grind section packet It includes: the first grind section comprising grinding process is carried out to the surface in a front surface and a rear surface of the first substrate 1-1 abrasive disk, receive from the 1-1 abrasive disk first substrate and be allowed to overturning rotation the first roll-over unit, Receive the first substrate from first roll-over unit and to described another in a front surface and a rear surface of the first substrate The 1-2 abrasive disk of one surface progress grinding process；Second grind section comprising front surface and rear table to the second substrate A surface in face carries out the 2-1 abrasive disk of grinding process, receives the second substrate simultaneously from the 2-1 abrasive disk It is allowed to the second roll-over unit of overturning rotation, receives the first substrate from second roll-over unit and to the second substrate A front surface and a rear surface in another surface carry out the 2-2 abrasive disk of grinding process.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the first prerinse list Member is provided to the grind section, to the institute in a front surface and a rear surface for the substrate that first abrasive disk is ground It states a surface and carries out prerinse.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the second prerinse list Member is provided to the grind section, to the institute in a front surface and a rear surface for the substrate that second abrasive disk is ground It states another surface and carries out prerinse.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, cleaning part, to complete It is cleaned at the substrate of grinding.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, comprising: prerinse area Domain is provided to the grind section, and for the substrate for completing grinding process, the front surface for carrying out cleaning the substrate is with after Prerinse (pre-cleaning) process on at least surface in surface, the substrate is by being provided to the pre- of prerinse region Cleaning unit and cleaning part is transplanted on after prerinse.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the prerinse unit Cleaning fluid injection portion including from the surface jet cleaning fluid to the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning fluid spray The portion of penetrating includes the cleaning solution ejection section to the surface jet cleaning liquid of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning solution includes Chemicals, SC1 (Standard Clean-1, APM), ammonia, hydrogen peroxide, hydrofluoric acid (HF), at least one in pure water (DIW) Kind.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning fluid spray The portion of penetrating includes the steam generating part to the surface of substrate injection steam.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning fluid spray The portion of penetrating includes the heterogeneous fluid injection portion that mutually different heterogeneous fluid is sprayed to the surface of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the heterogeneous fluid spray The portion of penetrating includes: dry ice supply department, supplies dry ice particles；Fluid sprays to the surface of the substrate in fluid injection portion, described Dry ice particles and the fluid are sprayed with the state being mutually mixed to the surface of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the prerinse unit Including the mega sonic wave unit to the surface of substrate supply vibrational energy.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the prerinse unit Cleaning brush including substrate surface described in rotating contact.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the prerinse unit It include: the first cleaning brush of the front surface of substrate described in rotating contact；Second cleaning brush of substrate rear surface described in rotating contact, The a front surface and a rear surface of the substrate is cleaned simultaneously.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, prerinse overturning is single Member is provided to the prerinse region, collects the substrate in the prerinse region and is allowed to overturning rotation.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the preceding table of the substrate A surface in face and rear surface, carries out prerinse in the prerinse region, in the prerinse region, in institute first It states after substrate overturns rotation by means of the prerinse roll-over unit, described in a front surface and a rear surface of the substrate Another surface is cleaned.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, blocker unit, During the prerinse region carries out prerinse process, by the space outside the prerinse processing space in the prerinse region and its Barrier is opened.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the blocker unit packet Include: shell forms independent prerinse processing space in a manner of surrounding the substrate periphery；Open and close member, switching station State the entrance of shell.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning part includes Multiple cleaning units of cleaning are executed to the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the multiple cleaning is single The above laminated configuration along the vertical direction of a part of member.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning part includes At least one in multiple contact cleaning units, multiple contactless cleaning units, wherein the multiple contact cleaning unit The surface of the substrate is physically contacted, the cleaning to the substrate is individually executed；The multiple contactless cleaning is single Member is not contacted with the surface physics of the substrate, individually executes the cleaning to the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the contact cleaning Unit includes the cleaning brush on the surface of substrate described in rotating contact.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning brush is by one To composition, while contacting a front surface and a rear surface for cleaning the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, chemicals supply Portion, during the cleaning brush contacts the substrate, the contact site supplying chemical system of Xiang Suoshu cleaning brush and the substrate Agent.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the chemicals is At least one of SC1 (Standard Clean-1, APM) and hydrofluoric acid (HF).
It is described contactless clear in the base plate processing system for being intended to reach the utility model of described the utility model aim Washing unit includes to the cleaning fluid injection portion of the surface jet cleaning fluid of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning fluid spray The portion of penetrating includes the cleaning solution ejection section to the surface jet cleaning liquid of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning solution is to change Length of schooling agent, SC1 (Standard Clean-1, APM), ozone hydrofluoric acid (O3HF), hydrofluoric acid (HF), ammonia, hydrogen peroxide, pure water At least one of (DIW).
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning fluid spray The portion of penetrating includes the steam generating part to the surface of substrate injection steam.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the cleaning fluid spray The portion of penetrating includes the heterogeneous fluid injection portion that mutually different heterogeneous fluid is sprayed to the surface of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the heterogeneous fluid spray The portion of penetrating includes: the dry ice supply department for supplying dry ice particles；It is described dry to the fluid injection portion of the surface of substrate injection fluid Ice particle and the fluid are sprayed with the state being mutually mixed to the surface of the substrate.
It is described contactless clear in the base plate processing system for being intended to reach the utility model of described the utility model aim Washing unit includes the mega sonic wave unit to the surface of substrate supply vibrational energy.
It is described contactless clear in the base plate processing system for being intended to reach the utility model of described the utility model aim Washing unit includes the isopropanol ejection section to the surface sparged isopropanol (IPA) of the substrate.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, roll-over unit is cleaned, It is provided to the cleaning part, collects the substrate and is allowed to overturning rotation.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the preceding table of the substrate A surface described in face and rear surface, is cleaned in the cleaning part, first in a front surface and a rear surface of the substrate Another surface, the quilt in the state that cleaning part overturns rotation by means of the cleaning roll-over unit with the substrate Cleaning.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the substrate is described Cleaning part is cleaned along the cleaning path by least one in the multiple cleaning unit.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the multiple cleaning is single In member it is pre-set at least one can exclude (skip) except the cleaning path.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, blocker unit, solely The cleaning space on the spot obstructing the cleaning unit and the space except it.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, including base plate transfer Portion, by the base plate transfer to the cleaning part before grind section grinding, the substrate progress grinding process it Before, after the cleaning part prepares cleaning first, into the grind section.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the substrate is being carried out Before grinding process, cleaning is prepared along the preparation cleaning path by least one in the multiple cleaning unit.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, the multiple cleaning is single In member it is pre-set at least one can exclude (skip) the preparation clean path except.
In the base plate processing system for being intended to reach the utility model of described the utility model aim, wettability treatment unit, It is provided to the grind section, and is configured at the substrate in the mobile movement routine of the grind section, protects the substrate Hold wetting state.
It is intended to reach the substrate board treatment of the utility model of described the utility model aim, for being formed to front surface There are pattern or film and rear surface is unpatterned or the substrate of film is handled, comprising: the first grind section, to the substrate A surface in a front surface and a rear surface carries out grinding process；Roll-over unit receives the substrate from first grind section And it is allowed to overturning rotation；Second grind section receives the substrate from the roll-over unit, to the front surface of the substrate with after Another surface in surface carries out grinding process.
In the substrate board treatment for being intended to reach the utility model of described the utility model aim, first grind section The first abrasive disk of grinding process is carried out including the surface in a front surface and a rear surface to the substrate.
In the substrate board treatment for being intended to reach the utility model of described the utility model aim, first grind section Include: 1-1 abrasive disk, grinding work for the first time is carried out to the surface in a front surface and a rear surface of the substrate Sequence；1-2 abrasive disk separates outfit with first abrasive disk, described in a front surface and a rear surface of the substrate One surface carries out second of grinding process.
In the substrate board treatment for being intended to reach the utility model of described the utility model aim, second grind section The second abrasive disk of grinding process is carried out including another surface in a front surface and a rear surface to the substrate.
In the substrate board treatment for being intended to reach the utility model of described the utility model aim, second grind section Include: 2-1 abrasive disk, grinding work for the first time is carried out to another surface in a front surface and a rear surface of the substrate Sequence；2-2 abrasive disk separates outfit with first abrasive disk, described in a front surface and a rear surface of the substrate Another surface carries out second of grinding process.
In the substrate board treatment for being intended to reach the utility model of described the utility model aim, the roll-over unit is matched It is placed in the movement routine that the substrate moves between first grind section and second grind section, or is configured at described The outside of movement routine.
In the substrate board treatment for being intended to reach the utility model of described the utility model aim, table after the substrate The state faced to the lower part is supplied to first grind section, carries out first to the substrate rear surface in first grind section Grinding process then carries out grinding process in front surface of second grind section to the substrate.
Beneficial effect
In conclusion according to the utility model, effectively grinding can be obtained and be unpatterned or the substrate rear surface of film With the advantageous effects for the substrate front surface for being formed with pattern or film.
It can be obtained in particular according to the utility model by means of grinding base plate front surface and substrate rear surface together In the exposure process carried out after grinding process, the mask alignment mistake caused by the convex-concave that substrate rear surface is formed, shape are prevented At the advantageous effects of accurate pattern.
In addition, in the case where forming substrate by translucency material, substrate rear surface is flatly ground according to the utility model Mill, thus the light irradiated in exposure process is inhibited to scatter because of the convex-concave of substrate rear surface, can obtain to be able to carry out makes to expose The effect of the specific photo-mask process in the boundary of light region and non-exposed areas.
In addition, according to the utility model, by means of the rear surface of grinding base plate, it is remaining different that substrate rear surface can be removed Object, thus the secondary pollution between substrate caused by making foreign matter can be obtained and realize the advantageous effects minimized.
In addition, grinding efficiency and cleaning efficiency can be improved, yield can be improved according to the utility model.
In addition, according to the utility model, simplified structure can be obtained, increased the degree of design freedom advantageous effects.
In addition, can effectively remove the remaining foreign matter of substrate according to the utility model, the cleaning of simplified substrate can be obtained The advantageous effects of process.
In addition, foreign matter can be made to realize in substrate surface fixation and minimized, substrate can be made bad according to the utility model Rate, which is realized, to be minimized, and stability and reliability are improved.
In addition, according to the utility model substrate can be made in the case where not reducing process efficiency, before grinding process Remaining foreign matter, which is realized, to be minimized, and can be obtained in grinding process, be prevented the substrate of scratch occurred by foreign matter etc. The advantageous effects of damage.
In addition, can obtain according to the utility model and reduce the occupied area (footprint) of cleaning part, improve space The advantageous effects of efficiency.
Detailed description of the invention
Fig. 1 is the figure for illustrating the base plate processing system of the utility model,
Base plate processing system of the Fig. 2 as the utility model is the figure for illustrating processing substrate mode,
Base plate processing system of the Fig. 3 and Fig. 4 as the utility model is another implementation for illustrating processing substrate mode The figure of example,
Base plate processing system of the Fig. 5 as the utility model is for illustrating substrate placement section and cleaning fluid injection portion Figure,
Base plate processing system of the Fig. 6 as the utility model is the figure for illustrating cleaning solution ejection section,
Base plate processing system of the Fig. 7 as the utility model is the figure for illustrating heterogeneous fluid injection portion,
Base plate processing system of the Fig. 8 as the utility model is another exemplary figure for illustrating heterogeneous fluid injection portion,
Base plate processing system of the Fig. 9 as the utility model is the figure for illustrating the oscillation functions in heterogeneous fluid injection portion,
Base plate processing system of the Figure 10 as the utility model is the figure for illustrating steam generating part,
Base plate processing system of the Figure 11 and Figure 12 as the utility model is the another example for illustrating heterogeneous fluid injection portion Figure,
Base plate processing system of the Figure 13 as the utility model is the figure for illustrating cleaning brush,
Base plate processing system of the Figure 14 as the utility model is the figure for illustrating mega sonic wave generating unit,
Base plate processing system of the Figure 15 as the utility model is the first cleaning brush for illustrating contact cleaning unit Figure,
Base plate processing system of the Figure 16 and Figure 17 as the utility model is the foreign matter for illustrating contact cleaning unit The figure in removal portion,
Base plate processing system of the Figure 18 as the utility model is the figure for illustrating the pressing element of contact cleaning unit,
Base plate processing system of the Figure 19 as the utility model is for illustrating that the frictional force of contact cleaning unit is adjusted The figure in portion,
Base plate processing system of the Figure 20 as the utility model is the normal load tune for illustrating contact cleaning unit The figure in section portion,
Base plate processing system of the Figure 21 as the utility model is the second cleaning brush for illustrating contact cleaning unit Figure,
Base plate processing system of the Figure 22 as the utility model is the figure for illustrating cleaning part,
Base plate processing system of the Figure 23 to Figure 26 as the utility model is the support for illustrating contactless cleaning unit The figure of the structure and operational structure of frame and returnable,
Base plate processing system of the Figure 27 as the utility model is another example for illustrating contactless cleaning unit Figure,
Base plate processing system of the Figure 28 to Figure 31 as the utility model is the preparation cleaning process for illustrating substrate Figure,
Figure 32 is the figure for illustrating the base plate processing system of another embodiment of the utility model,
Figure 33 to 34 is the figure of roll-over unit shown in pictorial image 32,
Figure 35 is the figure of the rotating arm for the base plate processing system that diagram can be applied to the utility model,
Figure 36 is the figure for illustrating the base plate processing system of another embodiment of the utility model,
Figure 37 is the figure for the cleaning part of base plate processing system shown in explanatory diagram 36,
Figure 38 to Figure 40 is the figure for illustrating the base-plate cleaning process based on cleaning part shown in Figure 36,
Figure 41 is the figure for illustrating to be applied to the closure member of base plate processing system shown in Figure 36,
Figure 42 to Figure 45 is the figure for illustrating the preparation cleaning process of the substrate based on cleaning part shown in Figure 36,
Figure 46 and Figure 47 is the figure for illustrating the base plate processing system of another embodiment of the utility model,
Figure 48 to Figure 51 is the figure for illustrating the base plate processing system of another embodiment of the utility model.
Appended drawing reference
100: grind section 113,213,313: roll-over unit
112,114: abrasive disk 122,124: carrier head
201: cleaning fluid injection portion 210: shell
212: open and close member 220: substrate placement section
230: cleaning solution ejection section 240,260: heterogeneous fluid injection portion
250: steam generating part 270: mega sonic wave unit
300: cleaning part 400: contact cleaning unit
420: chemicals supply department 430: foreign matter removal portion
432: contact member 434: ultrasonic wave generating unit
440: pressing element 450: frictional force adjustment portion
452: connecting elements 454: sense part
456: brush moving portion 460: normal load adjustment portion
462: vertical connecting member 464: sense part
466: brush moving portion 500: contactless cleaning unit
520: bracket 530: returnable
532~538: recycling cup 540: chemicals ejection section
550: steam generating part 560: heterogeneous fluid injection portion
570: isopropanol ejection section 610: base plate transfer portion
700: dustiness measurement portion
Specific embodiment
With reference to the accompanying drawings, the preferred embodiment of the utility model is described in detail, but the utility model is not by embodiment Limitation limits.As reference, in the present note, identical appended drawing reference indicates substantially the same element, in this rule Under, the content recorded in other figs. can be quoted and be illustrated, it is convenient to omit be judged as that those of ordinary skill in the art do not say And explain or duplicate content.
Referring to figs. 1 to Figure 51, the base plate processing system 1 of the utility model includes: grind section 100, is carried out to substrate 10 The grinding process of front surface and grinding process to 10 rear surface of substrate；Cleaning part 300 carries out the substrate 10 for completing grinding Cleaning.
For example, substrate can be handled along processing path shown in FIG. 1.As reference, enumerates and grinding in Fig. 1 There are four abrasive disk PL1, PL2, PL1 ', PL2' for the outfit of portion 100, and mutually different substrate rear surface and front surface are through different Two abrasive disks be ground primary example respectively and be illustrated, but be different from this, can also be as shown in figure 46, in grind section 100 outfits two abrasive disks PL1, PL2, grind single substrate rear surface respectively and front surface is each primary.
Grind section 100 executes a variety of knots of chemical-mechanical polishing process can be directed to 10 rear surface of substrate and front surface Structure provides, and the utility model is not limited or limited by the structure and layout (lay out) of grind section 100.
As reference, in the present invention, so-called 10 rear surface of substrate, it is meant that substrate is unpatterned (pattern) or the one side of film (layer).In contrast, the front surface of so-called substrate 10, it is meant that substrate be formed with pattern or The another side of film.
As an example, grind section 100 includes: the first abrasive disk 112,112', carries out the front surface to substrate 10 With the grinding process on the surface in rear surface；Roll-over unit 113,113' receive substrate from the first abrasive disk 112,112' 10 and be allowed to overturning rotation；Second abrasive disk 114,114' receive substrate 10 from roll-over unit 113,113', carry out to substrate The grinding process on another surface in 10 a front surface and a rear surface.
More specifically, multiple abrasive disks 112,112', 114,114' can be provided in grind section 100, in each abrasive disk 112,112', 114, the upper surface of 114' can be attached with grinding pad.Supplied to the loading unit on 100 region of grind section Substrate 10, to be adjacent to the state of the carrier head 122,124 moved along pre-set path, rotating contact has supplied slurry The upper surface of grinding pad, thereby executing chemical-mechanical polishing process.
Be set forth below grind section 100 include the first grind section PA ground to first substrate (being not shown on figure), it is right The example for the second grind section PB that the second substrate (being not shown on figure) is ground is illustrated.
First grind section PA includes: 1-1 abrasive disk 112, to the surface in first substrate a front surface and a rear surface Carry out grinding process；First roll-over unit 113 receives first substrate from 1-1 abrasive disk 112 and is allowed to overturning rotation；The 1-2 abrasive disk 114 receives first substrate from the first roll-over unit 113 and to another in first substrate a front surface and a rear surface One surface carries out grinding process.
Second grind section PB includes: 2-1 abrasive disk 112', to the surface in the second substrate a front surface and a rear surface Carry out grinding process；Second roll-over unit 113 receives the second substrate from 2-1 abrasive disk 112' and is allowed to overturning rotation；The 2-2 abrasive disk 114' receives the second substrate from the second roll-over unit 113 and to another in the second substrate a front surface and a rear surface One surface carries out grinding process.
Roll-over unit 113,113' are for collecting substrate 10 and being allowed to overturning rotation 180 degree.More specifically, roll-over unit 113,113' is used for after completing to the grinding of 10 rear surface of substrate (or front surface), in the front surface (after or of grinding base plate 10 Surface) before, make the overturning rotation 180 degree of substrate 10, so that the front surface of substrate 10 is towards lower part.
Roll-over unit 113,113' can be formed as the various structures that can make the overturning rotation of substrate 10, and the utility model is not It is limited or is limited by roll-over unit 113, the structure of 113' and drive manner.
Preferably, roll-over unit 113,113' be configured at substrate 10 can be in the first abrasive disk 112,112' and the second abrasive disk 114, mobile (between 1-1 abrasive disk and 1-2 abrasive disk or between 2-1 abrasive disk and 2-2 abrasive disk) between 114' Movement routine on.As described above, roll-over unit 113,113' are configured at substrate 10 in the first abrasive disk 112,112' and In the movement routine moved between two abrasive disks 114,114', by means of this, can obtain overturns substrate 10 needed for process 10 movement routine of substrate realizes the advantageous effects minimized.Although that is, being also possible to roll-over unit 113,113' is in substrate 10 The outside of movement routine, but in this case, in order to overturn substrate 10, need to move from predetermined movement routine is additional The problem of moving to the roll-over unit being configured on the outside of movement routine, thus being inevitably present the increase of 10 movement routine of substrate. But if roll-over unit 113,113' are configured in the mobile movement routine of substrate 10, without being moved to substrate 10 On the outside of movement routine, mobile predetermined movement routine, thus can obtain keeps the movement routine of substrate 10 minimum The advantageous effects of change.
As an example, substrate 10 is supplied to grind section 100 with the state of substrate 10 rear surface towards lower part, first The grinding process to 10 rear surface of substrate is carried out in abrasive disk 112,112', carries out overturning rotation by means of roll-over unit 113,113' Turn, so that the front surface of substrate 10 carries out grinding 10 front surface of substrate in the second abrasive disk 114,114' towards behind lower part Grinder sequence.
More specifically, in the first abrasive disk 112,112' equipped with the first grinding pad (115' referring to Fig.1), substrate 10 Rear surface is ground with the state for contacting the first grinding pad.In addition, in the second abrasive disk 114,114' equipped with the second grinding pad The front surface of 115', substrate 10 are ground with the state for contacting the second grinding pad 115'.
According to circumstances, the grinding process to substrate front surface can also be carried out in the first abrasive disk, in the second abrasive disk The middle grinding process carried out to substrate rear surface.
It, can be by the unit time of substrate rear surface grinding process compared with substrate front surface grinding process as reference Amount of grinding adjusts lower.According to circumstances, it is also possible in substrate rear surface grinding process and substrate front surface grinding process Any one is carried out by means of mechanical grinding processes, another is carried out by means of chemical-mechanical polishing process.Different from this, Can make substrate rear surface grinding process and substrate front surface grinding process all by means of chemical-mechanical polishing process into Row, and mutually different slurry is used in substrate rear surface grinding process and substrate front surface grinding process.
Carrier head 122,124 can move on 100 region of grind section along pre-set circulating path, be supplied to and add The substrate 10 (being hereinafter referred to as supplied to the substrate of substrate loading position) of carrier unit is to be adjacent to the state of carrier head 122,124, quilt Carrier head 122,124 is transferred.Substrate 10 is set forth below since loading unit, by abrasive disk 112,112', 114,114', presses Substantially quadrangle form circulating path carries out mobile example and is illustrated.
In addition, can provide transfer unit and washing unit 130 in grind section 100, the transfer unit will enter grinding The substrate 10 of the loading area in portion 100 is transplanted on abrasive disk 112,112', 114,114', and the washing unit 130 is in sheet Member washs the loading surface of transfer unit before loading area loads substrate 10.
As transfer unit, carrier head 122,124 can be used, washing unit 130 allows in carrier head 122,124 Before loading substrate 10, loading surface is washed in advance, so as to prevent the loading surface (lower surface) because of carrier head 122,124 may Remaining foreign matter and cause substrate 10 to pollute or damage before the grinding.Moreover, washing unit 130 can be loaded in substrate 10 The position for not interfering load is configured at during the loading area of grind section 100, it is mobile after substrate 10 loads on loading area To loading area.
Washing unit 130 is provided with the various structures that can wash transfer unit (for example, carrier head) loading surface, this is practical new Type is not limited or is limited by the structure and mode of washing of washing unit 130.As an example, in grind section 100, base 10 rear surface of plate can be configured towards lower part, and washing unit 130 may include can be along up and down direction jet cleaning water toward upper Multiple washing (operating) water nozzles.Preferably, washing unit 130 can be in the state of being configured at transfer unit lower part, can be to move It send and rotates on the basis of unit center.
In addition, the wettability treatment unit 160 is configured at substrate 10 in grind section 100 equipped with wettability treatment unit 160 In mobile movement routine, substrate is handled, is allowed to keep wetting (wetting) state.
Wherein, the wetting state of so-called substrate 10, it is meant that the surface of substrate 10 is not dried and wet state, so-called base The wettability treatment of plate 10, it is meant that 10 surface of substrate is made to keep not drying and the process of moisture state.
As an example, as wettability treatment unit 160, the wetting bathtub of integrally contained substrate 10 can be used.Root According to situation, as wettability treatment unit, the fluid injection portion of injection fluid also can be used.
In addition, in grind section 100 grinding completed to a front surface and a rear surface can be unloaded equipped with prerinse region P1 The substrate 10 of process, 10 rear surface of substrate and front surface for unloading carry out prerinse (pre-cleaning).
As reference, in the present invention, the prerinse of so-called substrate 10, it can be understood as in cleaning part 300 Before being cleaned, surface (especially substrate rear surface and front surface) remaining foreign matter of cleaning base plate 10 to the maximum extent Process.Especially in the prerinse of substrate 10, the foreign matter that size is bigger in the foreign matter remained on surface of substrate 10 can be removed (for example, foreign matter that size is greater than 100nm), can remove the organic matter remained on surface of substrate 10.
As described above, by means of prerinse region P1 unload complete grinding process substrate 10 and together carry out it is pre- clearly It washes, carries out prewashed other space without adding to match to be ready for use on, thus do not change existing equipment layout or add just almost It can keep originally, and can reduce and be polluted because the substrate 10 for completing grinding is directly entered cleaning part 300 caused by cleaning part Degree increases.
It is highly preferred that blocker unit can be provided, the blocker unit is during prerinse region P1 executes prerinse, resistance Space except the prerinse processing space of prerinse region P1 and its.Wherein, at the prerinse of so-called prerinse region P1 Manage space, it can be understood as realize prewashed space, prerinse processing space can be independent close by means of blocker unit Closed chamber cell structure.
Blocker unit is provided with that can provide with the various structures in the independent closed space of outer barrier.It is single that barrier is set forth below Member includes that the example of shell 210 and open and close member 212 is illustrated, wherein the shell 210 is to surround the side on 10 periphery of substrate Formula, provides independent prerinse processing space, and the entrance of shell 210 is opened and closed in the open and close member 212.
As an example, shell 210, which can be, is formed with the substantially square box form of entrance, open and close member in upper end 212 can move linearly by means of common driving portion 214 (for example, combination of motor and power transfer member), externally The entrance of shell 210 is opened and closed.According to circumstances, entrance can also be formed in the sidewall portion of shell, open and close member is along upper Lower direction is mobile, and entrance is opened and closed.
Moreover, can be equipped with substrate placement section 220 in prerinse region P1, the substrate placement section 220 is in upper water Safety puts substrate 10, is rotated centered on rotary shaft 221 inside shell 210.
As reference, in the present invention, so-called substrate placement section 220, it can be understood as detachable carried base board 10, pre- During cleaning carries out, the apparatus for placing of 10 configuration status of substrate can be kept.
As an example, it could be formed with the placement pin of the placement of substrate 10 in the upper surface of substrate placement section 220 224.In the upper surface for the rolling clamp plate (being not shown on figure) for forming substrate placement section 220, specified interval can be separated and formed There are multiple placement pins 224, the lower surface of substrate 10 can be placed in the upper end for placing pin 224.Place the quantity and configuration of pin 224 Structure can diversely be changed according to desired condition and design specification.
In addition, the edge placement section 222 that the edge that substrate placement section 220 may include substrate 10 is placed.As one Example, substrate placement section 220 can connect in rolling clamp plate, thus the edge of supporting substrate 10.Preferably, it is placed in substrate Portion 220 could be formed with for accommodating, the concave portion (being not shown on figure) of 10 periphery end of supporting substrate, so as in high speed rotation In prevent substrate 10 shake.Moreover, can provide between shell 210 and substrate placement section 220 for stopping to fly from substrate 10 The cover component 226 of the cleaning solution splashed.According to circumstances, substrate placement section can also be without placing pin or edge placement section, with simple Plate form formed.
In prerinse region P1, prewashed prerinse unit is carried out equipped with a front surface and a rear surface to substrate 10 200.Prerinse unit 200 can carry out prerinse to substrate with a variety of cleaning ways according to desired condition and design specification.
As an example, in prerinse region, P1 can provide cleaning fluid injection portion 201, the cleaning fluid injection Portion 201 executes prerinse to 10 rear surface of substrate and front surface jet cleaning fluid.
Wherein, so-called cleaning fluid, it can be understood as cleaning solution, steam, heterogeneous fluid etc., all including that can spray The concept of prewashed injection object substance is penetrated in substrate rear surface and front surface and executes, the utility model is not flowed by cleaning The type of body is limited or is limited.
As an example, referring to Fig. 6, cleaning fluid injection portion 201 may include be provided to prerinse region P1, and to The cleaning solution ejection section 230 of 10 rear surface of substrate and front surface jet cleaning liquid.
Cleaning solution ejection section 230 can spray a variety of clear according to desired condition to 10 rear surface of substrate and front surface Washing lotion.As an example, cleaning solution ejection section 230 can spray SC1 (Standard Clean-1, APM), ammonia, peroxidating At least one in hydrogen, pure water (DIW).Especially in the present invention, the prerinse processing space of prerinse region P1 is with only Closed chamber structure is found to provide, thus as cleaning solution, the chemicals (chemical) of such as SC1 can be used, due to It can use chemicals and execute prerinse, thus 10 rear surface of substrate and front surface can be removed in advance before aftermentioned cleaning Remaining a part of organic matter.
Referring to Fig. 7 and Fig. 8, cleaning fluid injection portion 201 may include being provided to prerinse region P1, and to after substrate 10 Surface and front surface spray the heterogeneous fluid injection portion 240 of mutually different heterogeneous (heterogeneity) fluid.
Heterogeneous fluid injection portion 240 is provided with the various structures that can spray heterogeneous fluid.As an example, heterogeneous fluid Ejection section 240 may include the first fluid supply department 241 for supplying first fluid, supply the second fluid different from first fluid Second fluid supply department 242, first fluid and second fluid are to mix or isolated state, by means of such as usual nozzle Injection apparatus is sprayed in 10 rear surface of substrate and front surface.
As an example, referring to Fig. 7, heterogeneous fluid injection portion 240 may include the first fluid injection separately provided Nozzle 241 and second fluid injection nozzle 242, in first fluid injection nozzle and second fluid injection nozzle, first fluid And second fluid is sprayed with the state being separated from each other in 10 rear surface of substrate and front surface.
As another example in heterogeneous fluid injection portion 240, referring to Fig. 8, heterogeneous fluid injection portion 240 may include supply The first fluid access 241' of first fluid, the second fluid access 242' for supplying second fluid, mixing jetting first fluid and The mixing jetting access 243' of second fluid, in mixing jetting access 243', first fluid and second fluid are to be mutually mixed State, to 10 rear surface of substrate and front surface high speed spray.
The type and characteristic of the sprayable heterogeneous fluid in heterogeneous fluid injection portion 240 can be according to desired conditions and design Specification and diversely change.As an example, first fluid can be any one in gaseous fluid and fluid liquid, the Two fluids can be any one in gaseous fluid and fluid liquid.For example, heterogeneous fluid injection portion 240 can spray together Pure water (DIW) as fluid liquid and the nitrogen (N2) as gaseous fluid, to improve foreign matter removal efficiency.According to feelings Two different kinds of liquid stream also can be used as long as the hitting power and foreign matter removal efficiency of heterogeneous fluid can be ensured in condition Body or two different kinds of gaseous fluid.
Additionally, it is preferred that cleaning solution ejection section 230 and the cleaning solution and/or heterogeneous fluid of the injection of heterogeneous fluid injection portion 240 High-pressure injection, so as to sufficient hitting power, strike 10 rear surface of substrate and the remaining foreign matter of front surface.
Moreover, at least one in cleaning solution ejection section 230 and heterogeneous fluid injection portion 240 can be relative to base referring to Fig. 9 10 rear surface of plate and front surface are vibrated (oscillation), thus to 10 rear surface of substrate and front surface oscillatory spray (oscillation spray) cleaning solution and/or heterogeneous fluid.
At least one in cleaning solution ejection section 230 and heterogeneous fluid injection portion 240 can be according to desired condition and design Specification can be provided oscillatorily in many ways.Being set forth below puts cleaning solution ejection section 230 and heterogeneous fluid injection portion 240 Dynamic (swing) rotation, so that cleaning solution and/or heterogeneous fluid can be with oscillatory sprays in the example of substrate 10 rear surface and front surface It is illustrated.This structure make cleaning solution and/or heterogeneous fluid can with oscillatory spray in 10 rear surface of substrate and front surface, from And the cleaning efficiency of cleaning solution and/or heterogeneous fluid can be made to realize and maximize, further decrease cleaning solution and/or heterogeneous fluid Usage amount.In addition, the effect that this mode can obtain is, by means of cleaning solution and/or heterogeneous fluid cleaning force (including Hitting power) and separate foreign matter from 10 surface of substrate (rear surface with front surface), and isolated foreign matter is rinsed and is arranged 10 outside of substrate is arrived out.
In addition, referring to Fig.1 0, cleaning fluid injection portion 201 may include being provided to prerinse region P1, and to substrate 10 The steam generating part 250 for the steam that rear surface and front surface injection occur from vapor generation part 252.
The steam especially sprayed from steam generating part 250 is to removal 10 rear surface of substrate and the remaining organic matter of front surface Effectively.As reference, steam generating part 250 while ensureing the organic matter removal efficiency of steam can prevent substrate 10 from damaging The temperature of wound sprays steam.Preferably, steam generating part 250 sprays steam with 60 DEG C~120 DEG C of temperature.
Identical as cleaning solution ejection section 230 and heterogeneous fluid injection portion 240, steam generating part 250 can also be relative to substrate 10 rear surfaces and front surface vibrate, thus to 10 rear surface of substrate and front surface oscillatory spray steam (referring to Fig. 9).
1 and Figure 12 referring to Fig.1, cleaning fluid injection portion 201 may include being provided to prerinse region P1, and to substrate 10 Rear surface and front surface spray the heterogeneous fluid injection portion 260 of mutually different heterogeneous fluid, and heterogeneous fluid injection portion 260 can With include supply dry ice particles dry ice supply department, to 10 rear surface of substrate and front surface injection fluid fluid injection portion.
Fluid injection portion can spray multiple fluid according to desired condition and design specification.As an example, it flows Body ejection section can spray in gaseous fluid and fluid liquid at least any one.Heterogeneous fluid injection portion is set forth below to spray together It penetrates dry ice particles and the example of gaseous fluid 261a is illustrated.According to circumstances, it is also possible to heterogeneous fluid injection portion to spray together Penetrate dry ice particles and fluid liquid (for example, DIW).
Fluid injection portion is provided with the various structures for capableing of mixing jetting dry ice particles 262a and fluid.Show as one Example, fluid injection portion may include the gaseous fluid feed path 261 for supplying gaseous fluid, the dry ice feed path for supplying dry ice 262, mix and spray the ejectisome drain passageway 263 of gaseous fluid 261a Yu dry ice particles 262a.
The dry ice that being set forth below makes to supply by dry ice feed path 262 is supplied with the carbon dioxide of liquid condition, is being passed through The example that dry ice solid particle is solidified into while overspray body drain passageway 263 is illustrated.
For this purpose, gaseous fluid feed path 261 kept constant by section along the flow direction of gaseous fluid 261a One constant cross-section region S1, section reduce region S2, section along the section that the flow direction of gaseous fluid 261a is gradually reduced A part of the second constant cross-section region S31 kept constant along the flow direction of gaseous fluid 261a is constituted.
Therefore, while by the first constant cross-section region S1, flowing is realized to be stabilized gaseous fluid 261a, is being passed through While section reduces region S2, pressure is gradually decreased, and gas flow rate is accelerated, by a part of second constant cross-section region While S31, flowing, which is realized, to be stabilized.At this point, being lighted since the second constant cross-section region S31, at a distance of predetermined distance The first place, formed tributary circuit (dry ice feed path) outlet, thus by gaseous fluid feed path 261 supply Compressed gas while reducing region S2 by section, accelerate by flow velocity, is beginning to pass through the same of the second constant cross-section region S31 When, become steady state of flow.
In this state, if by tributary circuit (dry ice feed path), the carbon dioxide stream of the high pressure of liquid condition Enter the first position X1 in the second constant cross-section region, while the carbon dioxide of liquid condition reaches second section of relative lower pressure Face constant region domains S31, then pressure strongly reduces and is solidified into dry ice solid particle.
On the other hand, gas supply department it is lazy can to supply air, nitrogen, argon gas etc. by gaseous fluid feed path 261 More than one in property gas.In the case where passing through 261 supplying inert gas of gaseous fluid feed path, due on substrate 10 Chemical reaction is suppressed, thus has the advantages that cleaning effect can be improved.
Tributary circuit had not only had direction ingredient identical with the gas flow direction along gaseous fluid feed path 261, but also Acute angle is constituted relative to the gaseous fluid feed path 261 along rectilinear configuration center line supply gaseous fluid.By means of this, pass through Tributary circuit and the carbon dioxide of liquid condition flowed into smoothly flow therein first of 261 end of gaseous fluid feed path Set X1.
As an example, in tributary circuit (dry ice feed path), the pressure pan from 40bar to 60bar supplies liquid The carbon dioxide of body state.Moreover, the carbon dioxide for being injected into the liquid condition of tributary circuit also keeps elevated pressures.Therefore, The carbon dioxide for the liquid condition supplied by tributary circuit is collaborated in first position X1 in the wink of gaseous fluid feed path 261 Between, the pressure carbon dioxide of high pressure conditions falls to low pressure from high pressure, and therefore, the carbon dioxide solidification of liquid condition is at solid-like The dry ice of state.
Further, replace the dry ice particles for supplying solid state by tributary circuit, supply liquid by tributary circuit The carbon dioxide of state, so that liquid condition carbon dioxide solidifies while reaching the gaseous fluid feed path 261 of low pressure At subtle dry ice solid particle, thus together with the air-flow flowed by gaseous fluid feed path 261, by being discharged It is equably mixed while access.
The section of tributary circuit is formed as less than gaseous fluid feed path 261, the cured dry ice of X1 in first position The size of grain can be adjusted by means of adjusting the cross-sectional sizes of tributary circuit.For example, the diameter of dry ice particles with 100 μm extremely 2000 μm of sizes are formed.
Ejectisome drain passageway 263 is continuous with gaseous fluid feed path 261 and is configured to linear type state, logical with branch The first position X1 of road connection, dry ice particles and gas as made of the liquid condition carbon dioxide solidification supplied by tributary circuit State fluid is combined to form ejectisome.Moreover, because the gaseous flow supplied from gaseous fluid feed path 261 and tributary circuit The flowing pressure of body and carbon dioxide, ejectisome is mobile towards discharge opening and is discharged.
At this point, the second constant cross-section area that the discharging area S3 of ejectisome discharge is kept constant by section along flow direction The cross-sectional expansion region S32 that domain S31, section are gradually expanded along flow direction is formed.Therefore, in the second constant cross-section region The first position X1 of S31, in the air-flow of steady flow, subtle dry ice solid particle equably scatters and by discharging area S3.Therefore, in the ejectisome that discharge opening spues, gaseous fluid is arranged with subtle dry ice solid particle with uniformly mixed state Out.
Especially flow velocity reduces the gaseous fluid that region S2 accelerates, while by section magnification region, gas in section Body expands and reduces temperature, thus obtains the effect that can reduce the temperature of the ejectisome to be spued.Therefore, substrate 10 is hit The ejectisome of 10 rear surface of substrate and front surface is cooled down, thus during cleaning base plate 10, by means of thermophoresis (Thermo- Phoresis) effect, can obtain be able to suppress from the fine particle (foreign particles) that substrate 10 is fallen periphery floating after again It is attached to the effect of substrate 10.
As described above, the heterogeneous fluid injection portion 240 of injection dry ice and fluid can neatly remove in a shorter time 10 rear surface of substrate of chemical-mechanical polishing process and a variety of dirts of front surface fixation have been carried out, aftermentioned scrub is not only shortened Activity time, and can reduce removal 10 rear surface of substrate and front surface contamination foreign matter needed for chemicals amount.
On the other hand, in the embodiments of the present invention, enumerating makes liquid condition carbon dioxide solidification and supplies dry ice The example of solid particle is illustrated, but according to circumstances, and the dry ice solid particle having been cured can also be made to supply by dry ice Access is answered to be supplied.Alternatively, it is also possible to make the heterogeneous fluid injection portion for spraying dry ice and fluid with long length Gar shape forms discharge opening.
In addition, spray together dry ice and fluid heterogeneous fluid injection portion 260 can also relative to 10 rear surface of substrate with Front surface oscillation, so as to 10 rear surface of substrate and front surface oscillatory spray dry ice and fluid (referring to Fig. 9).
Moreover, the heterogeneous fluid injection portion for enumerating injection dry ice and fluid includes gas in the embodiments of the present invention The example of state fluid feed path, tributary circuit and drain passageway is illustrated, but according to circumstances, can also make cleaning solution or Chemicals by means of with include the heterogeneous fluid injection portion of gaseous fluid feed path, tributary circuit and drain passageway it is identical or Similar structure and high speed is sprayed.
Even in addition, injection gaseous fluid and fluid liquid (or two kinds of gaseous fluids or two kinds of fluid liquids) it is different Mass flow body ejection section, can also be using the heterogeneous same or similar injection structure in fluid injection portion with injection dry ice and fluid. For example, the heterogeneous fluid injection portion of injection gaseous fluid and fluid liquid may include gas feed path (referring to Fig.1 1 261) with liquid feed path (referring to Fig.1 the 262 of 1), the gas feed path has section along the flow direction of gas The section for being gradually reduced and increasing gas flow rate reduces region, reduces region to discharge opening from section and is formed with third region, The liquid feed path makes liquid interflow to gas feed path in the first position close to discharge opening.
Referring to Fig.1 3, in prerinse region P1 can have 10 front surface of rotating contact substrate the first cleaning brush 280a, Second cleaning brush 280b of 10 rear surface of rotating contact substrate.
As the first cleaning brush 280a and the second cleaning brush 280b, 10 rear surface of energy CONTACT WITH FRICTION substrate can be used with before The brush being made of usual material (for example, polyvinyl alcohol of porous material) on surface.Moreover, in each cleaning brush 280a, 280b Surface could be formed with for improve brush contact performance multiple cleanings protrusion.Certainly, according to circumstances, nothing also can be used Clean the brush of protrusion.
Furthermore it is possible to include cleaning solution ejection section 230, the cleaning solution ejection section 230 is contacted in cleaning brush 280a, 280b During substrate 10, to the contact site supplying chemical preparation of cleaning brush 280a, 280b and substrate 10, so as to be able to carry out by It is clear caused by improving because of the CONTACT WITH FRICTION of cleaning brush 280a, 280b and substrate 10 during the cleaning of each cleaning brush 280a, 280b Wash effect.
Cleaning solution ejection section 230 at least one can spray chemicals into substrate 10 or cleaning brush 280a, 280b, to The type and characteristic of the chemicals of cleaning brush 280a, 280b injection can according to desired condition and design specification and diversely Change.Preferably as the chemicals sprayed to cleaning brush 280a, 280b, can be used SC1 (Standard Clean-1, APM) and at least one of hydrofluoric acid (HF), so as to improve the removal efficiency of subtle organic matter.According to circumstances, it can also take For chemicals, pure water (or other cleaning solutions) are sprayed to the contact site of cleaning brush 280 and substrate, or injection chemistry system together Agent and pure water.
Referring to Fig.1 4, in prerinse region, P1 can have million sound to 10 rear surface of substrate and front surface supply vibrational energy Wave unit 270.
Mega sonic wave unit 270 can according to desired condition and design specification, in many ways to 10 rear surface of substrate with Front surface supplies vibrational energy (for example, high-frequency vibration energy or low-frequency vibration energy).Mega sonic wave unit 270 is set forth below to pass through cleaning The cleaning solution or chemicals that liquid ejection section 230 is sprayed to 10 rear surface of substrate and front surface are medium, make 10 rear surface of substrate It is vibrated with front surface, the example that 10 rear surface of substrate and the remaining foreign matter of front surface are efficiently separated from substrate 10 carries out Explanation.According to circumstances, mega sonic wave unit can also directly supply vibrational energy to substrate.
In addition, particle (foreign matter) size of removal can be different because vibrating frequency band, mega sonic wave unit 270 can be big according to particle It is small, selectively use different frequency bands.
On the other hand, in prerinse region P1 carried out prewashed substrate 10 can by means of common transfer arm (figure On be not shown) be transplanted on aftermentioned cleaning part 300.Transferring arm can be in prerinse region P1 and cleaning part (for example, aftermentioned contact Formula cleaning unit) between move back and forth, can be served only for for prewashed substrate 10 being transplanted on the purposes of cleaning part 300.As With reference to during prerinse region P1 and cleaning part 300 clean each mutually different substrate 10 simultaneously, transfer arm can be temporary It is standby in the avoidance zone provided between prerinse region P1 and cleaning part 300.
In addition, prerinse region P1 can equipped with collect substrate 10 and be allowed to overturning rotation prerinse roll-over unit 213.As an example, prerinse roll-over unit 213 can be in 10 rear surface of substrate (or front surface) towards the state on top Under, after carrying out the prerinse to 10 rear surface of substrate, rotation is overturn before the front surface (or rear surface) of prerinse substrate 10 180 degree, so that the front surface of substrate 10 is towards top.
As described above, a surface carries out prerinse, base first in 10 rear surface of substrate and front surface in prerinse region P1 Another surface can overturn the shape of rotation in substrate 10 by means of prerinse roll-over unit 213 in 10 rear surface of plate and front surface Prerinse is carried out under state.
According to circumstances, also may not need makes substrate independently overturn rotation in prerinse region, but carries out simultaneously to base The prerinse of plate rear surface and front surface.
Cleaning part 300 is located at the adjacent side of grind section 100, for clean carried out in prerinse region P1 it is prewashed 10 rear surface of substrate and the remaining foreign matter of front surface.
As reference, in the present invention, the so-called substrate 10 carried out in cleaning part 300 is cleaned, it can be understood as uses In after carrying out prerinse, the work of surface (substrate rear surface and front surface) remaining foreign matter of cleaning base plate 10 to greatest extent Sequence.Especially in the cleaning of substrate 10, the foreign matter (example that size is smaller in the foreign matter remained on surface of substrate 10 can be removed Such as, the foreign matter of 40~100nm size), with stronger adhesive force adhere to foreign matter.
Moreover, executing pre-set next process in the substrate 10 that cleaning part 300 is cleaned with state free of cleaning. Wherein, so-called that substrate 10 is executed into next process with state free of cleaning, it can be understood as the cleaning process in cleaning part 300 is most Process afterwards completes all cleaning process to substrate 10, for completing the substrate 10 of cleaning process, without additional scavenger Sequence can carry out next process (for example, deposition procedures).
Cleaning part 300 is provided with the cleaning for being able to carry out multiple steps and the structure of drying process, and the utility model is not It is limited or is limited by the cleaning platform structure and layout that constitute cleaning part 300.
Preferably, cleaning part 300 may include physically contacting 10 rear surface of substrate and front surface and executing cleaning Contact cleaning unit 400, the contactless cleaning for not contacting 10 rear surface of substrate and front surface physically and executing cleaning Unit 500 is intended to remove 10 rear surface of substrate and the remaining organic matter of front surface and other foreign matters so as to perform effectively Cleaning.According to circumstances, cleaning part can also only include any one in contact cleaning unit and contactless cleaning unit.
In addition, cleaning part 300 can equipped with collect substrate 10 and be allowed to overturning rotation roll-over unit 313.As one A example, the roll-over unit 313 of cleaning part 300 can in the state that 10 rear surface of substrate (or front surface) is towards top, into After row is to the subsequent cleaning of 10 rear surface of substrate, overturn before the front surface (or rear surface) to substrate 10 carries out subsequent cleaning 180 degree is rotated, so that the front surface of substrate 10 is towards top.
As an example, the roll-over unit 313 of cleaning part 300 can be configured to adjacent first contactless cleaning unit 502.According to circumstances, the roll-over unit of cleaning part can also be configured to the inside of the first contactless cleaning unit (with first On the identical region of contactless cleaning unit).
As described above, 10 rear surface of substrate can carry out subsequent first with the surface in front surface in cleaning part 300 Another surface overturns the state of rotation in substrate 10 by means of roll-over unit 313 in cleaning, 10 rear surface of substrate and front surface Under can carry out subsequent cleaning.
According to circumstances, it also may not need and independently overturn rotary plate in cleaning part, but carried out simultaneously to table after substrate The subsequent cleaning in face and front surface.
Contact cleaning unit 400 is can physically contact 10 rear surface of substrate and front surface and execute the more of cleaning Kind structure provides.It includes that the first contact cleaning unit 402 and the second contact are cleaned that contact cleaning unit 400, which is set forth below, The example of unit 404 is illustrated.
Referring to Fig.1 5, as an example, the first contact cleaning unit 402 may include table before rotating contact substrate 10 Second cleaning brush 410' of first cleaning brush 410 in face, 10 rear surface of rotating contact substrate.
As an example, through prewashed substrate 10 in the shape rotated by means of common spin (being not shown on figure) The first cleaning brush 410 that can be rotated under state and the second cleaning brush 410' cleaning.According to circumstances, also it is configured to substrate It does not rotate, but with the cleaned brush cleaning of stationary state.Different from this, can just for any one surface of substrate, only by One the first cleaning brush executes cleaning.
As the first cleaning brush 410 and the second cleaning brush 410', can be used can 10 rear surface of CONTACT WITH FRICTION substrate with The brush of front surface being made of usual material (for example, polyvinyl alcohol of porous material).Moreover, in the first cleaning brush 410 Surface could be formed with multiple cleanings protrusion of the contact performance for improving brush.Certainly, according to circumstances, also can be used without clear Wash the brush of protrusion.
Furthermore it is possible to include chemicals supply department 420, the chemicals supply department 420 is in cleaning brush 410,410' During contacting substrate 10, to the contact site supplying chemical preparation of each cleaning brush 410,410' and substrate 10, so as to holding During cleaning of the row by means of the first cleaning brush 410 and the second cleaning brush 410', each cleaning brush 410,410' and substrate 10 are improved Cleaning effect caused by CONTACT WITH FRICTION.
Chemicals supply department 420 at least one can spray chemicals into substrate 10 or cleaning brush 410,410', To cleaning brush 410,410' spray chemicals type and characteristic can according to desired condition and design specification multiplicity Ground change.Preferably as the chemicals sprayed to cleaning brush 410,410', SC1 (Standard Clean- can be used 1, APM) and at least one of hydrofluoric acid (HF), so as to improve the removal efficiency of subtle organic matter.It according to circumstances, can also be with Substituted chemistry preparation sprays pure water to the contact site of cleaning brush and substrate, or sprays chemicals and pure water together.
On the other hand, if be attached to due to the cleaning of the CONTACT WITH FRICTION of cleaning brush 410,410' from the isolated foreign matter of substrate 10 Cleaning brush 410,410', then substrate 10 can be low by recontamination or cleaning efficiency, and there are substrates 10 because of cleaning brush 410,410' The foreign matter of upper attachment and the possibility damaged.
In order to solve this problem, the foreign matter that can provide the foreign matter for removing cleaning brush 410, the attachment of the surface 410' is gone Except portion 430.
Foreign matter removal portion 430 is provided with the various structures that can remove the foreign matter of cleaning brush 410, the attachment of the surface 410', this Utility model is not limited or is limited by the structure and mode in foreign matter removal portion 430.
As an example, referring to Fig.1 6, foreign matter removal portion 430 may include can contact cleaning brush 410, outside 410' Contact member 432 that the mode on surface provides, the ultrasonic wave generating unit 434 for applying ultrasonic wave to contact member 432.
Contact member 432 by can contact cleaning brush 410, the outer surface 410' various structures and in the form of provide.As one A example, contact member 432 can be formed to have the item (bar) or stick of length corresponding with cleaning brush 410,410' length State.According to circumstances, contact member can be formed to have the structure of circular section, alternatively, contact member can be formed as Surface has the structure of contact projection.
Ultrasonic wave generating unit 434 applies ultrasonic wave to contact member 432, allows to mention to the surface of contact member 432 For vibrational energy.As ultrasonic wave generating unit 434, the usual ultrasonic generator that ultrasonic wave can occur can be used.
The surface of contact member 432 can be vibrated because of ultrasonic wave generating unit 434, therefore, by means of cleaning brush 410,410' And it can be not attached to cleaning brush 410, the surface 410' from the isolated foreign matter of substrate 10, but with the contact member vibrated 432 contact and from cleaning brush 410, the surface 410' separate.According to circumstances, it is also possible by means collecting vessel or sucking dress in addition Set the foreign matter collected and separated due to contact member from cleaning brush.
As another example, referring to Fig.1 7, foreign matter removal portion 430 may include: fluid injection portion 432', in cleaning brush Fluid liquid is sprayed towards outside direction in 410 inside；Ultrasonic wave generating unit 434', to what is sprayed from fluid injection portion 432' Fluid liquid applies ultrasonic wave.
Fluid injection portion 432' with can the inside of cleaning brush 410 towards outside direction injection fluid liquid a variety of knots Structure provides.As an example, fluid injection portion 432' may include: fluid supply flow path 432a', supply fluid liquid； Fluid injection pipe 432b' is connected to fluid supply flow path 432a', is configured at cleaning brush along the length direction of cleaning brush 410 410 inside is formed with multiple spray-hole 432c' radially on the surface of fluid injection pipe 432b'.
The fluid liquid supplied from fluid supply flow path 432a' can be along fluid injection pipe 432b', in cleaning brush 410 Inside is axially transferred, and the fluid liquid supplied to fluid injection pipe 432b' can supply flow path 432a''s by means of fluid The rotary force of supply pressure and cleaning brush 410 and sprayed by spray-hole 432c'.
Ultrasonic wave generating unit 434' is used to apply ultrasonic wave to the fluid liquid sprayed from fluid injection portion 432', as super The usual ultrasonic generator that ultrasonic wave can occur can be used in sound wave generating unit 434'.
As the fluid liquid that can be sprayed from the fluid injection portion 432' in foreign matter removal portion 430, can be used with liquid The usual fluid of state, the type and characteristic of fluid liquid can diversely be changed according to desired condition and design specification. As an example, the fluid injection portion 432' in foreign matter removal portion 430 can spray pure water (DIW).
By means of fluid injection portion 432' ultrasonic wave generating unit 434', in the inside of cleaning brush 410, the liquid with vibrational energy State fluid can be sprayed towards outside direction (for example, radial direction of cleaning brush), therefore, by means of cleaning brush 410 from base The isolated foreign matter of plate 10 can be not attached to 410 surface of cleaning brush, but from cleaning together with the fluid liquid with vibrational energy Brush the separation of 410 surfaces.
In addition, referring to Fig.1 8, it can be provided under the contactless state of cleaning brush 410,410' relative to substrate 10, to The pressing element 440 of the surface-pressure of one cleaning brush 410.
Wherein, so-called cleaning brush 410, contactless state of the 410' relative to substrate 10, it can be understood as cleaning brush 410, 410' does not contact substrate 10 and separates the state of configuration relative to substrate 10.For example, the substrate of cleaned brush 410,410' cleaning 10 can be transplanted on next process, and the cleaning area of cleaning brush 410,410' can be transplanted on for other substrates 10 of cleaning, During substrate 10 is transferred as described above, cleaning brush 410,410' are configured relative to substrate 10 with contactless state.
In the cleaning process based on cleaning brush 410,410', surface (the rear table of cleaning brush 410,410' contact substrate 10 Face and front surface), it is cleaned with the state of cleaning brush 410, the surface 410' pressurized (or pressurization), cleaning brush 410,410' The brushing conditions such as rotation speed and frictional force are on the basis of the state (state of pressurization) that cleaning brush 410,410' contact substrate 10 It is configured.
But during cleaning brush 410,410' are configured relative to substrate 10 with contactless state, chemicals and cleaning Liquid etc. is sloughed from cleaning brush 410,410', thus once compressed cleaning brush 410, the surface 410' can restore (or expansion be bordering on original Shape).As described above, in the state of cleaning brush 410,410' surface renewal, if another substrate 10 is cleaned, due to cleaning brush 410, the frictional force of 410' and plus-pressure are different, are difficult to keep for each substrate 10 there are the cleaning effect of cleaning brush 410,410' Uniform problem.
For this purpose, pressing element 440 is in the case where cleaning brush 410,410' are relative to the contactless state of substrate 10 to cleaning brush 410,410' surface-pressure, so that the cleaning effect of cleaning brush 410,410' can keep uniform.Preferably, pressing element 440 in such a way that the section pressurizeed with the state on the surface of cleaning brush 410,410' contact 10 surface of substrate is corresponding to cleaning Brush 410,410' surface-pressure.Therefore, cleaning brush 410,410' can contacted with substrate 10 and contactless state under, surface is equal It is pressurized with identical condition, it is thus possible to keep cleaning brush 410,410' to the cleaning effect of each substrate 10.
Pressing element 440 is can provide the various structures of cleaning brush 410,410' surface-pressure.As an example, Pressing element 440 can be formed as length item (bar) corresponding with cleaning brush 410,410' length or stick state.According to circumstances, Pressing element can be formed to have the structure of circular section, or the structure on covering cleaning brush entirety surface.
On the other hand, by means of cleaning brush 410,410' and during cleaning base plate 10, cleaning brush 410,410' are to substrate 10 frictional force has an immense impact on to the cleaning effect of substrate 10, thus the cleaning effect in order to equably keep substrate 10, Cleaning brush 410,410' should be able to keep uniform to the frictional force of substrate 10.Cleaning brush 410,410' are adjusted for this purpose, can provide To the frictional force adjustment portion 450 of the frictional force of substrate 10.
Frictional force adjustment portion 450 mentions the various structures of the frictional force of substrate 10 with that can adjust cleaning brush 410,410' For.Preferably, frictional force adjustment portion 450 can carry out based on cleaning brush 410,410' cleaning process during, in real time adjust Cleaning brush 410,410' are to the frictional force of substrate 10.
As an example, referring to Fig.1 9, frictional force adjustment portion 450 may include: connecting elements 452, be connected to clear It scrubs the rotary shaft of 410,410': sense part 454, perceives because cleaning brush 410,410' caused by the frictional force of substrate 10 to connecting Connection member 452 is displaced；Brush moving portion 456, according to the perception of sense part 454 as a result, making cleaning brush 410,410' relative to base Plate 10 is mobile.
Connecting elements 452 is integrally connected to the rotary shaft of cleaning brush 410,410', according to cleaning brush 410,410' to substrate 10 frictional force FfVariation, if horizontal direction displacement occurs for cleaning brush 410,410', connecting elements 452 can also occur identical Displacement.
The a variety of devices that can perceive the displacement of connecting elements 452 can be used in sense part 454.As an example, as sense Know portion 454, common load cell can be used.According to circumstances, other common sensing devices, perception connection structure be can use The displacement of part.
Brush moving portion 456 can be according to the perception of sense part 454 as a result, moving cleaning brush 410,410' relative to substrate 10 It is dynamic, regulating friction force.Assuming that if cleaning brush 410,410' are to the frictional force F of substrate 10fGreater than pre-set condition, then brush Moving portion 456 can make cleaning brush 410,410' mobile to the direction that cleaning brush 410,410' are separated relative to substrate 10, on the contrary, If cleaning brush 410,410' are to the frictional force F of substrate 10fLess than pre-set condition, then brush moving portion 456 can make clearly It is mobile to direction cleaning brush 410,410' close relative to substrate 10 to scrub 410,410'.
A variety of knots of the brush moving portion 456 cleaning brush 410,410' can be made mobile to the direction for being toward or away from substrate 10 Structure provides, and the utility model is not limited or limited by the structure and move mode of brush moving portion 456.As an example, Brush moving portion 456 may include the driving force by means of drive motor and the driving screw that rotates and draw along what driving screw moved Lead component.
In addition, being made by means of cleaning brush 410,410' and during cleaning base plate 10 by means of cleaning brush 410,410' Normal load for substrate 10, which has an immense impact on to the cleaning effect of substrate 10, (for example, if normal load increases, rubs Power is wiped to increase), thus the cleaning effect in order to equably keep substrate 10, should be able to equably keep by means of cleaning brush 410, 410' and the normal load for acting on substrate 10.Substrate is acted on by means of the first cleaning brush 410 for this purpose, adjusting can be provided The normal load adjustment portion 460 of 10 normal load.
Normal load adjustment portion 460 acts on the vertical negative of substrate 10 can adjust by means of cleaning brush 410,410' The various structures of load provide.Preferably, normal load adjustment portion 460 can adjust by means of cleaning brush 410,410' in real time and make Normal load for substrate 10.
As an example, referring to Figure 20, normal load adjustment portion 460 may include: vertical connecting member 462, hang down Directly it is connected to the rotary shaft of cleaning brush 410,410'；Sense part 464 is perceived and is contacted because of cleaning brush 410,410' with substrate 10 And vertical connecting member 462 is displaced caused by acting on the normal load of vertical connecting member 462；Brush moving portion 466, root According to the perception of sense part 464 as a result, keeping cleaning brush 410,410' mobile relative to substrate 10.
Vertical connecting member 462 is integrally connected to the rotary shaft of cleaning brush 410,410', so that vertical along gravity direction Ground configuration acts on substrate 10 with by means of cleaning brush 410,410' when cleaning brush 410,410' contact substrate 10 Normal load FnVariation, if vertical direction displacement occurs for cleaning brush 410,410', phase can also occur for vertical connecting member 462 Same displacement.
Sense part 464 is configured on vertical line identical with vertical connecting member 462, cleaning brush 410,410' relative to Under the contact of substrate 10 and contactless state, the vertical displacement of the perception generation of vertical connecting member 462.
The a variety of dresses that can perceive the vertical direction displacement of vertical connecting member 462 can be used in perceptually portion 464 It sets.As an example, perceptually portion 464, can be used common load cell.According to circumstances, it is logical that other be can use Normal sensing device perceives the displacement of vertical connecting member.
Assuming that being perceived when cleaning brush 410,410' do not contact substrate 10 by vertical connecting member 462, sense part 464 It as a result is " A " that when cleaning brush 410,410' contact substrate 10, the result that sense part 464 perceives is perceived as " B " less than " A ", then By the difference of " A " and " B ", the normal load F for acting on substrate 10 can be calculatedn.As reference, if cleaning brush 410, 410' does not contact and (separates) substrate 10, then sense part can merely perceive the load (" A ") of the first cleaning brush 410.On the contrary, such as The first cleaning brush of fruit 410 contacts substrate 10, then a part load of cleaning brush 410,410' can be distributed to substrate 10, thus feel Know that " B " value of portion's perception has the value less than " A ".Therefore, by the difference of " A " and " B ", it can calculate and act on substrate 10 Normal load Fn。
Brush moving portion 466 can be according to the perception of sense part 464 as a result, moving cleaning brush 410,410' relative to substrate 10 Dynamic, adjustment effect is in the normal load F of substrate 10n.Assuming that acting on the normal load F of substrate 10nGreater than pre-set item Part, then brush moving portion 466 can make cleaning brush 410,410' mobile to the direction far from substrate 10, on the contrary, if acting on base The normal load F of plate 10nLess than pre-set condition, then brush moving portion 466 makes cleaning brush 410,410' to close to substrate 10 Direction it is mobile.
A variety of knots of the brush moving portion 466 cleaning brush 410,410' can be made mobile to the direction for approaching and leaving substrate 10 Structure provides, and the utility model is not limited or limited by the structure and move mode of brush moving portion 466.As an example, Brush moving portion 466 may include the driving force by means of drive motor and the driving screw that rotates and draw along what driving screw moved Lead component.
On the other hand, referring to Figure 21, the second contact cleaning unit 405 may include 10 front surface of rotating contact substrate Second cleaning brush 412' of the first cleaning brush 412,10 rear surface of rotating contact substrate.
First cleaning brush 412 and the second cleaning brush 412' with the first contact cleaning unit above-mentioned cleaning brush 410, The same or similar structure of 410' and mode execute the cleaning to substrate 10.According to circumstances, contact cleaning unit can exclude Second contact cleaning unit, and be only made of the first contact cleaning unit.
Moreover, even if foreign matter removal also can be used during being executed substrate 10 by means of cleaning brush 412,412' and being cleaned Portion 430, chemicals supply department 420, pressing element 440, frictional force adjustment portion 450, at least one in normal load adjustment portion 460 A, the cleaning process based on the second cleaning brush 412 can diversely be changed according to desired condition and design specification.
Moreover, each cleaning brush 410,410', 412,412' can by means of each other blocker unit (referring to Figure 22 402,404) and provide independent cleaning treatment space execute cleaning process respectively.
On the other hand, the substrate 10 of first contact cleaning unit (for example, cleaning brush) cleaning treatment can be by means of Common transfer arm is transplanted on the second contact cleaning unit (for example, cleaning brush).Transfer arm can be cleaned in the first contact It is moved back and forth between unit and the second contact cleaning unit, it can will be in the substrate of the first contact cleaning unit cleaning treatment 10 are transplanted on the second contact cleaning unit.As reference, in the first contact cleaning unit and the second contact cleaning unit During cleaning each mutually different substrate 10 simultaneously, transfer arm can be clear in the first contact cleaning unit and the second contact It washes interim standby in the avoidance zone provided between unit.
In addition, the substrate 10 in the second contact cleaning unit (for example, second cleaning brush) cleaning treatment can be by means of Common transfer arm is transplanted on aftermentioned contactless cleaning unit 500.Transfer arm can the second contact cleaning unit with It moves back and forth, can will be moved in the substrate 10 of the second contact cleaning unit cleaning treatment between contactless cleaning unit 500 It is sent to contactless cleaning unit 500.It is clear simultaneously in the second contact cleaning unit and contactless cleaning unit as reference During washing each mutually different substrate 10, transfer arm can the second contact cleaning unit and contactless cleaning unit it Between it is interim standby in the avoidance zone that provides.
Contactless cleaning unit 500 is clear can not physically contact and execute with front surface with 10 rear surface of substrate The various structures washed provide.It includes the first contactless cleaning unit 502 and second that contactless cleaning unit 500, which is set forth below, The example that contactless cleaning unit 504 is constituted is illustrated.According to circumstances, contactless cleaning unit can also be only by one Cleaning unit is constituted.
Preferably, blocker unit 502,504 can be provided, it, will during contactless cleaning unit 500 executes cleaning The cleaning treatment space of contactless cleaning unit 500 and the space obstacle except it.Wherein, so-called contactless cleaning unit 500 cleaning treatment space, it can be understood as the space of cleaning is realized by means of contactless cleaning unit 500, it is non-contact The cleaning treatment space of formula cleaning unit 500 is provided with by means of blocker unit and independently closed chamber structure.
Blocker unit 502,504 is provided with being capable of providing with the various structures in the independent closed space of outer barrier.Below It enumerates blocker unit 502,504 to be illustrated including the example of shell 502a, 504a and open and close member 502b, 504b, wherein institute It states shell 502a, 504a and independent cleaning treatment space is provided in a manner of surrounding 10 periphery of substrate, the open and close member 502b, The entrance of shell 502a, 504a is opened and closed (referring to Figure 22) in 504b.
As an example, shell 502a, 504a is provided in the form of being formed with the substantially square box of entrance in sidewall portion, is opened Closing component 502b, 504b can be straight along the vertical direction by means of common driving portion (combination of motor and power transfer member) Line is mobile, and is opened and closed the entrance of shell 502a, 504a.
Moreover, contactless cleaning unit 500 may include: bracket 520, upper part presses monolithic unit and places substrate 10, It is rotated centered on rotary shaft 521 in the inside of shell 402a；Returnable 530 surrounds 520 periphery of bracket, recycles from base The treatment fluid that 10 surface of plate (rear surface and front surface) is splashed.
Preferably, bracket 520 is provided in a manner of it can move along the vertical direction, the inner wall of returnable 530 can be with shape At there is multiple recycling cups 532~538, the recycling cup 532~538 is formed along the vertical direction for returning in mutually different height Receive multiple recycling grooves of mutually different treatment fluid.It includes separately forming four that returnable 530, which is set forth below, The example of four recycling cups 532~538 of recycling groove is illustrated.According to circumstances, returnable may include three or less Or five or more recycling cups are (referring to Figure 23 to Figure 26).
This structure can be in single treatment space, using different 520 height of bracket, to be made using a variety of chemistry Agent and/or fluid etc., in many ways cleaning base plate 10, it is thus possible to improve the removal efficiency of the remaining foreign matter of substrate 10.
It, can be configured with for being sprayed to 10 rear surface of substrate (upper surface) for being placed in bracket 520 on the top of bracket 520 The aftermentioned ejection section for penetrating chemicals, fluid, heterogeneous fluid and steam etc., the treatment fluid splashed from 10 rear surface of substrate (fluid for substrate rear surface cleaning treatment) can be recovered in mutually different recycling cup 532 according to the height of bracket 520 ~538.Moreover, the drainage channel for the treatment fluid being separately recovered to be discharged is individually connected to recycling cup 532~538.
Contactless cleaning unit 500 can execute cleaning according to desired condition and design specification in many ways.
Referring to Figure 23, contactless cleaning unit 500 may include to 10 rear surface of substrate and front surface injection at least one Kind or more chemicals (chemical) chemicals ejection section 540.
In the present invention, the cleaning treatment space of contactless cleaning unit 500 forms and is independent airtight chamber Structure, thus as cleaning solution, chemicals (chemical) can be used.
As chemicals ejection section 540, the common nozzle that can spray chemicals can be used, the utility model is simultaneously It is non-to be limited or limited by the type and characteristic of nozzle.Preferably, can be used can be with high pressure, equably to table after substrate 10 The nozzle in face and front surface injection chemicals.
Chemicals ejection section 540 can be according to desired condition and design specification, to 10 rear surface of substrate and front surface Spray a variety of chemicals.Preferably, the chemicals ejection section of contactless cleaning unit 500 can spray organic to removing The effective ozone hydrofluoric acid (O of object3) and at least one of hydrofluoric acid (HF) HF.According to circumstances, the change of contactless cleaning unit Length of schooling agent ejection section can also spray other chemistry systems of such as SC1 (Standard Clean-1, APM), ammonia, hydrogen peroxide etc. Agent.
In addition, the chemicals ejection section 540 of contactless cleaning unit 500 can be to be equipped with prerinse region P1 The same or similar mode of chemicals ejection section is vibrated relative to 10 rear surface of substrate with front surface (oscillation), thus to substrate 10 rear surface and front surface oscillatory spray (oscillation spray) chemicals (referring to Fig. 9).
As reference, the placement condition (height) of bracket 520 can according to desired condition and design specification and diversely Change.As an example, when the chemicals ejection section 540 of contactless cleaning unit 500 sprays chemicals, bracket 520 can be configured at the treatment fluid (chemicals) topmost, splashed from substrate 10 can be returned by the first recycling cup 532 It receives.
Referring to Figure 24, contactless cleaning unit 500 may include spraying rear surface from steam to substrate 10 and front surface Steam generating part 550.
The steam especially sprayed from steam generating part 550 is remaining organic to the rear surface and front surface of removal substrate 10 Object is effective.As reference, steam generating part 550 is can prevent substrate 10 while ensureing the organic matter removal efficiency of steam The temperature of damage sprays steam.Preferably, steam generating part 550 sprays steam with 60 DEG C~120 DEG C of temperature.
As an example, when the steam generating part 550 of contactless cleaning unit 500 sprays steam, bracket 520 can be with Being configured at the treatment fluid against first lower end of the top, splashed from substrate 10 can be recycled by the second recycling cup 534.
In addition, contactless cleaning unit 500 may include to the clear of 10 rear surface of substrate and front surface jet cleaning liquid Washing lotion ejection section (referring to the 230 of Fig. 6).
Cleaning solution ejection section can spray multiple kinds of cleaning agent to 10 rear surface of substrate and front surface according to desired condition. As an example, cleaning solution ejection section can spray the cleaning solution of such as pure water (DIW).According to circumstances, it can also hold repeatedly Row sprays the process of pure water after spraying chemicals.
In addition, contactless cleaning unit 500 may include mutually different to 10 rear surface of substrate and front surface injection The heterogeneous fluid injection portion (being not shown on figure) of heterogeneous (heterogeneity) fluid.
Heterogeneous fluid injection portion is provided with the various structures that can spray heterogeneous fluid.As an example, heterogeneous fluid Ejection section may include supply the first fluid supply department of first fluid, the supply second fluid different from first fluid second Fluid supply portion, first fluid and second fluid are to mix or isolated state, by the injection apparatus of such as common nozzle, It is sprayed to substrate rear surface and front surface.
If heterogeneous fluid injection portion may include the first fluid injection nozzle being provided independently and second fluid injection Nozzle, in first fluid injection nozzle and second fluid injection nozzle, the shape of first fluid and second fluid to be separated from each other State is sprayed to 10 rear surface of substrate and front surface (referring to Fig. 7).
As another example in heterogeneous fluid injection portion, heterogeneous fluid injection portion may include supply first fluid first Fluid passage, second fluid access, first fluid and the second fluid for supplying second fluid mix and the mixing jetting sprayed is logical Road, in mixing jetting access, the state of first fluid and second fluid to be mutually mixed, at a high speed to 10 rear surface of substrate with before Surface injection (referring to Fig. 8).
The type and characteristic of the sprayable heterogeneous fluid in heterogeneous fluid injection portion can be advised according to desired condition and design Lattice and diversely change.As an example, first fluid can be any one in gaseous fluid and fluid liquid, second Fluid can be any one in gaseous fluid and fluid liquid.For example, heterogeneous fluid injection portion can spray conduct together The pure water (DIW) of fluid liquid and nitrogen (N2) as gaseous fluid, so as to improve foreign matter removal efficiency.According to feelings Condition, if it is possible to which two different kinds of liquid stream also can be used in the hitting power and foreign matter removal efficiency for ensureing heterogeneous fluid Body or two different kinds of gaseous fluid.
It is identical as chemicals ejection section 540, cleaning solution ejection section, steam generating part, in heterogeneous fluid injection portion at least One can be vibrated relative to 10 rear surface of substrate with front surface, can be to 10 rear surface of substrate and front surface oscillatory spray Cleaning solution, steam and heterogeneous fluid (referring to Fig. 9).
In addition, contactless cleaning unit 500 may include mutual to 10 rear surface of substrate and front surface injection referring to Figure 25 The heterogeneous fluid injection portion 560 of different heterogeneous fluid, and heterogeneous fluid injection portion 560 may include supply dry ice particles Dry ice supply department, the fluid injection portion that fluid is sprayed to 10 rear surface of substrate and front surface.
Fluid injection portion can spray multiple fluid according to desired condition and design specification.As an example, fluid Ejection section can spray at least one in gaseous fluid and fluid liquid.Heterogeneous fluid injection portion 560 is set forth below to spray together Dry ice particles and the example of gaseous fluid are illustrated.According to circumstances, heterogeneous fluid injection portion is also configured to spray together Dry ice particles and fluid liquid (for example, DIW).
In addition, contactless cleaning unit 500 may include different to 10 rear surface of substrate and front surface injection referring to Figure 26 The isopropanol ejection section 570 of propyl alcohol (IPA).
As isopropanol ejection section 570 is to 10 rear surface of substrate and front surface sparged isopropanol, 10 rear surface of substrate is with before Surface can be dried, can be with the cleaning process of completing substrate 10.
Moreover, the first contactless 502 cleaning treatment of cleaning unit substrate 10 can by means of common transfer arm, It is transplanted on the second contactless cleaning unit 504.Transferring arm can be non-contact in the first contactless cleaning unit 502 and second It moves back and forth, the substrate 10 of the first contactless 502 cleaning treatment of cleaning unit can be transplanted between formula cleaning unit 504 Second contactless cleaning unit 504.As reference, in the first contactless cleaning unit 502 and the second contactless cleaning During unit 504 cleans each mutually different substrate 10 simultaneously, transfer arm can the first contactless cleaning unit 502 with It is interim standby in the avoidance zone provided between second contactless cleaning unit 504.
On the other hand, in the embodiments of the present invention, although enumerate contactless cleaning unit (or contact cleaning Unit) example that is arranged on simple layer is illustrated, but according to circumstances, contactless cleaning unit can be formed as multilayer Structure.
It can be formed as double-layer structure referring to Figure 27, contactless cleaning unit 500', may include that offer is independent close Multiple blocker unit 501'~504' of processing space are closed, substrate 10 can be moved to multiple resistances along pre-set path It is cleaned every unit 501'~504'.According to circumstances, contactless cleaning unit can be formed as three layers or more of structure, this Utility model is not limited or is limited by the configuration structure and configuration mode of blocker unit.
In addition, base plate processing system 1 may include that substrate 10 is transplanted on cleaning part before grind section 100 is ground 300 base plate transfer portion 610, substrate 10 can be first to prepare for cleaning before carrying out grinding process in cleaning part 300 (primary cleaning) enters grind section 100 afterwards.
Substrate 10 can be transplanted on cleaning part 300 before grind section 100 is ground by base plate transfer portion 610.Change sentence It talks about, base plate transfer portion 610 is transplanted on cleaning part before the substrate 10 of processing to be ground is transplanted on grind section 100 first 300。
As an example, as base plate transfer portion 610, common robotic arm, the kind in base plate transfer portion 610 be can use Class and structure can diversely be changed according to desired condition and design specification.
In general, substrate is transplanted directly on after grind section ground, cleaned in cleaning part.But in substrate In the state that rear surface and front surface remain foreign matter, if grinding process is carried out, in grinding process, it may occur however that because different Object and the damage of scratch etc. occurs in substrate rear surface and front surface.
Therefore, the utility model is prepared cleaning to substrate 10 before the grinding process for carrying out substrate 10 (primary cleaning) to prevent the damage of substrate, and carries out the preparation of substrate 10 in the cleaning part 300 being pre-equipped with Cleaning is not equipped with equipment and the space for preparing cleaning for substrate 10 independently by means of this, thus can not change or add original There is the layout of equipment and keep original state, in grinding process, can obtain makes to retain foreign matter because of 10 rear surface of substrate and front surface Caused substrate damage (for example, scratch) realizes the advantageous effects minimized.
Moreover, after the substrate 10 that cleaning part 300 completes preparation cleaning is drawn by base plate transfer portion 610 again, by means of Other transfer devices are transplanted on grind section 100.
Before carrying out grinding process, the substrate 10 into cleaning part 300 can be along a variety of standards of the definition of cleaning part 300 Standby cleaning path (for example, PC1, PC2, PC3, PC4 of Figure 28 to Figure 31) is prepared cleaning.Wherein, the standard of so-called substrate 10 Standby cleaning path is interpreted as before substrate 10 carries out grinding process, and the sequence or substrate cleaned in cleaning part 300 are moved The path sent and cleaned.
More specifically, make substrate 10 in cleaning part 300 along by multiple cleaning units 402,404,502,504 The cleaning path of at least one is cleaned.Preferably, substrate 10 can be transplanted on composition cleaning part by base plate transfer portion 610 Any one of closest base plate transfer portion 610 in 300 multiple cleaning units 402,404,502,504, so as to make base The movement routine of plate 10, which is realized, to be minimized, and the preparation scavenging period of substrate 10 is shortened.
Moreover, in multiple cleaning units 402,404,502,504 it is pre-set at least one can exclude (skip) and exist Except the preparation cleaning path of substrate 10.In other words, multiple cleaning units 402,404,502,504 can be completely used for substrate 10 preparation cleaning, however, you can also not be same as this, a part in only multiple cleaning units 402,404,502,504 is used for base The preparation of plate 10 is cleaned.
As an example, referring to Figure 28, substrate 10 can be non-along pass through closest base plate transfer portion 610 second After the preparation cleaning path P C1 of contact cleaning unit 504 is cleaned, it is transplanted on grind section 100 and is ground.
As another example, referring to Figure 29, substrate 10 can be along the standard by the first contactless cleaning unit 502 After standby cleaning path P C2 is cleaned, it is transplanted on grind section 100 and is ground.
In addition, substrate 10 preparation cleaning path all by least one in multiple contact cleaning units 402,404, The cleaning efficiency of substrate 10 can be improved by means of this at least one in multiple contactless cleaning units 502,504.
As an example, referring to Figure 30, substrate 10 can along successively pass through the second contactless cleaning unit 504, After the preparation cleaning path P C3 of second contact cleaning unit 404 is cleaned, it is transplanted on grind section 100 and is ground.
As another example, referring to Figure 31, substrate 10 can along successively pass through the first contactless cleaning unit 502, After the preparation cleaning path P C4 of second contact cleaning unit 404 is cleaned, it is transplanted on grind section 100 and is ground.
In the embodiments of the present invention, the preparation cleaning path of substrate 10 is enumerated by positive (contactless cleaning list Member → contact cleaning unit) example that constitutes of sequence is illustrated, but according to circumstances, the preparation cleaning path of substrate can also be with It is constituted by reverse direction (contact cleaning unit → contactless cleaning unit) sequence.For example, it can be substrates first After contact cleaning unit (or second contact cleaning unit) cleans first, in the first contactless cleaning unit (or second Contactless cleaning unit) it is cleaned, then it is transplanted on grind section.
On the other hand, it in the embodiments of the present invention, enumerates prerinse region and is formed as simple independent closed chamber The example of cell structure is illustrated, but according to circumstances, can provide selective resistance every grind section region and cleaning part region Blocker unit.
Blocker unit is provided with the various structures that can selectively obstruct grind section region and cleaning part region, this is practical new Type is not limited or is limited by the type and structure of blocker unit.As an example, blocker unit is slided with common left and right Dynamic opening and closing mode or upper and lower shutter mode are realized.
This structure can fundamentally obstruct the abrasive material occurred in grind section region and foreign matter flows into cleaning part area Domain, so that cleaning part region be allow to keep cleaner processing environment.That is, compared with cleaning part region, in grind section region More foreign matter occurs, if cleaning part region is flowed into the foreign matter that grind section region occurs, caused by occurring because of foreign matter Cleaning mistake cleans not foot phenomenon.Therefore, blocker unit obstructs the boundary in grind section region Yu cleaning part region on the whole, from And the abrasive material occurred in grind section region and foreign matter inflow cleaning part region are fundamentally obstructed, so as to improve clear Wash the cleaning efficiency of the cleaning process of portion region execution.
On the other hand, Figure 32 is the figure for illustrating the base plate processing system of another embodiment of the utility model, and Figure 33 to 34 is The figure of the roll-over unit of pictorial image 32.Moreover, assigning identical or phase for identical as aforementioned composition and be equivalent to identical part When in identical appended drawing reference, and omit detailed description thereof.
Referring to Figure 32 to Figure 34, the base plate processing system 1 of another embodiment of the utility model include grind section (referring to Fig.1 100) roll-over unit 140 that is equipped with, the roll-over unit 140 can be moved to pre- clear from the loading area P2 of load substrate 10 Region P1 is washed, collects substrate 10 in loading area P2, is transplanted on prerinse region P1, substrate 10 is to be reversed the support of unit 140 State, prerinse region P1 carry out prerinse.
At this point, roll-over unit 140 can collect substrate 10 in loading area P2 and only be transplanted on prerinse region P1, but root According to situation, roll-over unit 140 can also be while transferring substrate 10, in the substrate 10 that will terminate chemical-mechanical polishing process It is supplied to before cleaning part 300, overturning 10 rear surface of substrate round about, (overturning rotation 180 degree, makes rear surface towards upper Portion direction).
Specifically, roll-over unit 140 includes: mobile component 144, prerinse region is moved to from loading area P2 P1；Rotary components 146 can overturn (turning) and be rotatingly connected to mobile component 144；Clamping component 148, is connected to Rotary components 146, clamping substrate 10.
Mobile component 144 can be moved to from the loading area P2 of load substrate 10 in grind section 100 and unload carried base board 10 Prerinse region P1.
The loading area P2 of substrate 10 can diversely be changed according to desired condition and design specification.Preferably, add Carrying region P2 can hold in the movement routine (for example, circulating path) of transfer unit (for example, carrier head) so as to shorten The movement routine of carrier head 122,124.
That is, at the prerinse region of substrate on the outside of carrier head movement routine in the case where, carrier head moves along road After diameter is mobile, need additionally to re-move the prerinse region for the substrate being on the outside of movement routine, thus it is inevitable Ground has that the movement routine of carrier head increases.But by means of roll-over unit 140 and in the loading area of substrate 10 P2 is collected in the structure of substrate 10, and carrier head 122,124 is only in movement routine movement without being moved to prerinse region P1 Can, thus the movement routine of carrier head 122,124 can be made to realize and minimized.
Mobile component 144 can be toward or away from pre- clear in many ways according to desired condition and design specification Wash region P1.As an example, mobile component 144 can be moved straightly to from loading area P2 prerinse region P1 (or from Prerinse region is to loading area).According to circumstances, mobile component is also rotated on the basis of one place, from loading area It is moved to prerinse region.
The driving force that mobile component 144 can be generated by means of driving assembly 142, is moved to prerinse area from loading area Domain P1.As an example, the driving force that mobile component 144 can be generated by means of driving assembly 142 is straight from loading area P2 Line is moved to prerinse region P1.
As driving assembly 142, can be used can provide the common driving device of driving force, the utility model not by The type and characteristic of driving assembly 142 are limited or are limited.As an example, it as driving assembly 142, can be used common Linear motor.According to circumstances, it can use the combination of common motor and power transfer member (for example, gear or skin The combination of band) and driving assembly is constituted, or driving assembly is constituted using screw member.
Clamping component 146 is connected to mobile component 144, selectively clamping substrate 10, and clamping component 146 can be by means of Mobile component 144 is selectively moved to loading area P2 or prerinse region P1.Preferably, clamping component 146 is in substrate 10 Chemical-mechanical polishing process in (or in the load of substrate), can avoid beyond carrier head 122,124 movement routines Prerinse region P1, only when collecting the substrate 10 for terminating chemical-mechanical polishing process just close to loading area P2.
In addition, rotary components 148, which can overturn (turning), is rotatingly connected to mobile component 144, clamping component 146 connects Rotary components 148 are connected to, overturning rotation can be carried out selectively relative to mobile component 144 by means of rotary components 148.
Rotary components 148 can use common rotary shaft and driving device and constitute, the structure and characteristic of rotary components 148 It can diversely be changed according to desired condition and design specification.According to circumstances, clamping component can also be made to be fixed on movably On component, mobile component can overturn rotation by means of driving assembly.
Clamping component 146 with can selectively clamping substrate 10 various structures provide, the utility model not by clamping The structure and characteristic of component 146 are limited or are limited.As an example, clamping component 146 may include supporting substrate 10 1 First clamping component 442a of side, the second clamping component opposed with the first clamping component 442a and 10 other side of supporting substrate 442b。
In addition, the prerinse in prerinse region is reversed the state that unit 140 is supported with substrate 10 and executes.In other words It says, roll-over unit 140 can execute the placement section for placing substrate while executing the effect for making the overturning rotation of substrate 10 together Effect.
As described above, the prerinse in prerinse region is executed with the state that substrate 10 is reversed the support of unit 140, by In this, the advantageous effects of simplified substrate support process can be obtained, the substrate support process carries out pre- clear in prerinse region Prevent substrate movable during washing.
It is of course also possible to carry out supporting substrate 10 simultaneously by means of other support unit (placement unit) in prerinse region Prerinse is carried out, but by means of the supporting substrate in the substrate overturning process independently executed with prerinse, simplification can be obtained The process of supporting substrate, the advantageous effects for reducing whole process.
As an example, the prerinse in prerinse region can be in 10 rear surface of substrate by means of roll-over unit 140 And towards carrying out under the configuration status of lower part.
As another example, the prerinse in prerinse region with substrate 10 by means of roll-over unit 140 arranged perpendicular State carry out.By means of so making the state of substrate arranged perpendicular carry out prerinse, it can obtain and use in prerinse The cleaning fluid of such as cleaning solution or chemicals is not remained in the surface of substrate 10 (rear surface and front surface), but faster, The advantageous effects being more easily discharged.
According to circumstances, it is also possible in substrate by means of roll-over unit 140 and (substrate rear surface is towards top after overturning The state of ground configuration), substrate carries out prerinse in the state of being reversed unit 140 and supporting.
Moreover, prerinse of the so-called substrate 10 in the state of being reversed unit 140 and supporting, is defined as including all to base The mode of cleaning fluid such as plate rear surface and front surface injection chemicals, pure water (DIW), steam, heterogeneous fluid makes clearly Scrub rotating contact substrate rear surface mode, to substrate rear surface supply vibrational energy mode concept.
On the other hand, Figure 35 is the figure of the rotating arm for the base plate processing system that diagram can be applied to the utility model.
Referring to Figure 35, the base plate processing system 1 of the utility model includes rotating arm 201a, and the rotating arm 201a can revolve It goes in grind section (referring to Fig.1 100) positioned at the first position RP1 of prerinse region P1, in grind section 100 positioned at pre- clear Wash the second position RP1 on the outside of the P1 of region, cleaning fluid injection portion 201 can discretely be installed in rotating arm 201a, to being placed in Surface (rear surface and front surface) jet cleaning fluid of the substrate 10 of substrate placement section (referring to the 220 of Fig. 5).
Wherein, so-called substrate 10 is placed in the state of substrate placement section 220, is interpreted as all being placed in base including substrate 10 The state of plate placement section 220, substrate 10 are reversed the concept of the state of unit (140 of Figure 33) support.
Rotating arm 201a is pivoted about with one end, and from first position, RP1 is moved to second position RP1, if rotation Pivoted arm 201a is located at first position RP1, then cleans surface jet cleaning fluid of the fluid injection portion 201 to substrate 10.
The mode that cleaning fluid injection portion 201 optionally separates is installed in rotating arm 201a.
Wherein, so-called cleaning fluid injection portion 201 may include that can spray such as chemicals, pure water (DIW), steam Chemicals ejection section, cleaning solution ejection section, steam generating part, the heterogeneous fluid injection of the cleaning fluid of vapour, heterogeneous fluid etc. At least one in portion.
As described above, being not necessarily to by means of installing mutually different cleaning fluid injection portion 201 additional on a rotating arm 201a It is equipped with for a variety of rotating arms or support unit needed for installing the ejection section for spraying different type cleaning fluid additional, it can To be used in conjunction with a rotating arm, thus the advantageous effects that simplified structure can be obtained, increase space utilization.Further, In the state of completing substrate prerinse, rotating arm 201a is located at second position RP1, it is hereby achieved that in advance prevent with such as The effect of the peripheral device collision of carrier head, adjuster or roll-over unit.
On the other hand, referring to Figure 36 and Figure 37, the base plate processing system of another embodiment of the utility model includes: grind section 100, chemical-mechanical polishing (CMP) process is executed for substrate；Prerinse region P1, is provided to grind section 100, for The substrate 10 of grinding process is completed, is carried out prerinse (pre-cleaning)；Cleaning part 300 is cleaned in prerinse region P1 Prewashed substrate is carried out, and cleaning part 300 includes multiple cleaning units 402,404,502,504, the multiple cleaning is single 402,404,502,504 laminated configuration along the vertical direction of member, individually executes the cleaning to substrate 10.
There is provided multiple abrasive disks 112,112', 114,114' in grind section 100, each abrasive disk 112,112', 114, Grinding pad is adhered in the upper surface of 114'.It is supplied to the substrate 10 of the loading unit on 100 region of grind section, to be adjacent to along preparatory The state of the mobile carrier head 122,124 in the path of setting, rotating contact has supplied the upper surface of the grinding pad of slurry, to hold Row chemical-mechanical polishing process.
As an example, grind section 100 includes: the first abrasive areas 101, configures multiple first abrasive disks 110；The Two abrasive areas 102, it is opposed with the first abrasive areas, configure multiple second abrasive disk 110'；Base plate transfer line 104, matches It is placed between the first abrasive areas 101 and the second abrasive areas 102, transfer loads on the loading area P2 of the outfit of grind section 100 Substrate 10, load on the substrate 10 of loading area P2 and transferred along base plate transfer line 104, in the first abrasive areas 101 or the After the grinding of two abrasive areas 102, it is unloaded at prerinse region P1.
Base plate transfer line 104 is provided to center between the first abrasive areas 101 and the second abrasive areas 102, loads on After the substrate 10 of load region P2 is transferred along base plate transfer line 104, the first abrasive areas 101 or the second abrasive areas can be entered 102。
As described above, the utility model transfers substrate 10 first along base plate transfer line 104, substrate 10 is in the first milling zone Behind domain 101 or the grinding of the second abrasive areas 102, it is directly unloaded at prerinse region P1, by means of this, is excluded for keeping completing The other injection apparatus of wetting (wet) state of the substrate 10 of grinding, can obtain the advantageous effects for preventing water mark.
It in other words, can also be in the first abrasive areas or the second abrasive areas grinding base plate first, along base plate transfer After the substrate of grinding is completed in line transfer, unloaded in prerinse region, but in the structure (referring to Fig.1) transferred after grinding base plate, It is dried during being transferred along base plate transfer line in the presence of the substrate for completing grinding and water mark or the damage of substrate mounted member occurs The problem of, thus inevitably need to match to be ready for use on base plate transfer line and keep the another of substrate wetting state (moisture state) Outer injection apparatus or wetting bathtub (wetting bath).But in the present invention, it is ground first by being provided to first The base plate transfer line 104 at center between region 101 and the second abrasive areas 102 is ground to transfer substrate 10, in the first abrasive areas 101 or 102 grinding base plate 10 of the second abrasive areas after, by complete grinding substrate 10 be directly unloaded at prerinse region P1, because And even if the equipment for being dependently equipped with wetting substrate 10, it can also prevent the substrate 10 for completing grinding process dry, can obtain Because of substrate mounted member damage caused by drying and because of undesirable advantageous effects caused by water mark.
The substrate 10 of completion grinding process is in the substrate placement section for being placed in prerinse region P1 outfit (referring to Fig. 5's It 220), can be by means of cleaning fluid injection portion (cleaning solution ejection section, steam generating part, heterogeneous fluid injection in the state of Portion), mega sonic wave unit, at least one in cleaning brush cleaned (referring to Fig. 6 to Figure 14).
Cleaning part 300 including the multiple cleaning units 402,404,502,504 provided with stepped construction, can be according to wanting The condition asked and provided with various structures.Wherein, so-called multiple cleaning units 402,404,502,504 are laminated along the vertical direction, Multiple stacking double-layer structures of cleaning units 402,404,502,504 or three-decker or more is defined as to be configured.
As an example, cleaning unit 402,404,502,504 includes: multiple contact cleaning units 402,404, Laminated configuration along the vertical direction physically contacts substrate rear surface and front surface, individually executes the cleaning to substrate 10；It is more A contactless cleaning unit 502,504, laminated configuration, does not contact 10 rear surface of substrate physically with before along the vertical direction Surface individually executes the cleaning to substrate 10.Two contact cleaning units 402,404 are set forth below and two contactless Cleaning unit 502,504 is illustrated respectively with the example that double-layer structure configures.According to circumstances, it is also possible to only with stepped construction Any one in contact cleaning unit and contactless cleaning unit is provided.
It, can be equipped with cleaning brush (referring to Fig.1 the 410 of 5), chemicals in multiple contact cleaning units 402,404 Supply department (referring to Fig.1 the 420 of 5) etc..
Contactless cleaning unit 502,504 includes: bracket 520, presses monolithic unit on top and places substrate 10, outside The inside of shell 402a is rotated centered on rotary shaft 521；Returnable 530 surrounds 520 periphery of bracket, recycles from substrate 10 The treatment fluid that surface is splashed, substrate 10, can be (clear by means of cleaning fluid injection portion in the state of being placed in bracket 520 Washing lotion ejection section, steam generating part, heterogeneous fluid injection portion), isopropanol ejection section, at least one in mega sonic wave unit carry out it is clear Wash (4, Figure 23 to Figure 26) referring to Fig.1.
Moreover, have a transfer unit 310 in cleaning part 300, the transfer unit 310 is by substrate 10 from multiple cleaning units 402, any one in 404,502,504 is transplanted on another in multiple cleaning units 402,404,502,504, and substrate 10 can be with It is transferred in cleaning part 300 by means of transfer unit 310.
As transfer unit 310, the common robotic arm that can be moved along the vertical direction can be used, the utility model is simultaneously It is non-to be limited or limited by the type and structure of transfer unit 310.
Substrate 10 can be cleaned along a variety of cleaning paths that cleaning part 300 defines.Wherein, so-called substrate 10 is clear Path is washed, the sequence that substrate 10 is cleaned in cleaning part 300 or the path that substrate is transferred and cleaned are interpreted as.
More specifically, make substrate 10 in cleaning part 300 along by multiple cleaning units 402,404,502,504 The cleaning path of at least one is cleaned.Preferably, the cleaning path of substrate 10 by multiple contact cleaning units 402, Substrate 10 can be improved by means of this at least one in 404, at least one in multiple contactless cleaning units 502,504 Cleaning efficiency.
As an example, referring to Figure 38, the substrate of cleaning part 300 is entered after prerinse region P1 carries out prerinse 10, it can be contactless clear along the first contact cleaning unit 402, the second contact cleaning unit 404, second is successively passed through Wash unit 504 cleaning path C1 cleaned after be discharged.At this point, the base cleaned in the first contact cleaning unit 402 Plate 10 can be transplanted on the second contact cleaning unit 404 by means of transfer unit 310, in the second contact cleaning unit 404 substrates 10 cleaned can be transplanted on the second contactless cleaning unit 504 by means of transfer unit 310.
As another example, referring to Figure 39, the substrate of cleaning part 300 is entered after prerinse region P1 carries out prerinse 10, it can be contactless clear along the first contact cleaning unit 402, the first contact cleaning unit 404, first is successively passed through It is discharged after washing the cleaning path C2 cleaning of unit 502.At this point, the substrate 10 in the cleaning of the first contact cleaning unit 402 can be with It is transplanted on the second contact cleaning unit 404 by means of transfer unit 310, is carried out clearly in the second contact cleaning unit 404 The substrate 10 washed can be transplanted on the first contactless cleaning unit 502 by means of transfer unit 310.
In addition, in multiple cleaning units 402,404,502,504 it is pre-set at least one can exclude (skip) and exist Except the cleaning path of substrate 10.
Wherein, in so-called multiple cleaning units 402,404,502,504 it is pre-set at least one exclude in substrate 10 Cleaning path except, be interpreted as in cleaning part, substrate is cleaned without the specific cleaning unit being left out.
As an example, referring to Figure 38, the substrate of cleaning part 300 is entered after prerinse region P1 carries out prerinse 10, it can be without the first contact cleaning unit 402, but along successively passing through the second contact cleaning unit 404 and the The cleaning path C3 of two contactless cleaning units 504 is discharged after being cleaned.At this point, the substrate 10 into cleaning part 300 can To be transplanted on the second contact cleaning unit 404 by means of transfer unit 310, cleaned in the second contact cleaning unit 404 Substrate 10 can be transplanted on the second contactless cleaning unit 504 by means of transfer unit 310.
As another example, referring to Figure 39, the substrate of cleaning part 300 is entered after prerinse region P1 carries out prerinse 10, it can be without the first contact cleaning unit 402, but along successively passing through the second contact cleaning unit 404 and the The cleaning path C4 of one contactless cleaning unit 502 is discharged after being cleaned.At this point, the substrate 10 into cleaning part 300 can To be transplanted on the second contact cleaning unit 404 by means of transfer unit 310, cleaned in the second contact cleaning unit 404 Substrate 10 can be transplanted on the first contactless cleaning unit 502 by means of transfer unit 310.
As another example, referring to Figure 40, the substrate of cleaning part 300 is entered after prerinse region P1 carries out prerinse 10, it can be without the second contact cleaning unit 404, but along successively passing through the first contact cleaning unit 402 and the It is discharged after the cleaning path C5 cleaning of two contactless cleaning units 504.At this point, being cleaned in the first contact cleaning unit 402 Substrate 10 can be transplanted on the second contactless cleaning unit 504 by means of transfer unit 310.
As another example, referring to Figure 40, the substrate of cleaning part 300 is entered after prerinse region P1 carries out prerinse 10, can without the second contact cleaning unit 404, but along by the first contact cleaning unit 402 and first it is non- The cleaning path C6 of contact cleaning unit 502 is discharged after being cleaned.At this point, being cleaned in the first contact cleaning unit 402 Substrate 10 can be transplanted on the first contactless cleaning unit 502 by means of transfer unit 310.
In the embodiments of the present invention, the cleaning path of substrate 10 is enumerated by direction (contact cleaning unit → contactless cleaning unit) example that constitutes is illustrated, but according to circumstances, the cleaning path of substrate can also be by reverse Direction (contactless cleaning unit → contact cleaning unit) is constituted.For example, entering after prerinse region carries out prerinse The substrate of cleaning part, can also be first after the second contactless cleaning unit be cleaned, in the first contact cleaning unit It is cleaned, is then discharged out.
On the other hand, constitute cleaning part 300 multiple cleaning units 402,404,502,504 include by each cleaning space with The blocker unit that space except it independently obstructs.
As an example, blocker unit includes: shell (referring to 402a, 404a, 502a, 504a of Figure 22), is surrounded Substrate periphery provides independent cleaning treatment space；Open and close member (referring to 402b, 404b, 502b, 504b of Figure 22), is opened Close the entrance of shell (referring to 402a, 404a, 502a, 504a).
As described above, each cleaning space of multiple cleaning units 402,404,502,504 is blocked the independent barrier of unit, By means of this, can obtain prevents the smog (fume) because occurring when substrate 10 cleans from flowing into the clear of other adjacent cleaning units It washes caused by space and cleans mistake and the insufficient effect of cleaning.
In addition, gap is equipped with closed institute between the shell 502a and open and close member 502b of cleaning unit 502 referring to Figure 41 The closure member 150 needed, it is hereby achieved that more effectively each cleaning of closed multiple cleaning units 402,404,502,504 is empty Between effect.
As closure member 150, the elastic material of such as rubber, polyurethane, silicone can be used, closure member 150 Material can diversely be changed according to desired condition and design specification.
Preferably, closure member 150 include closed upper part portion 152, closed upper part portion 152 one end bending bending envelope Closing part 154, bending closure 154 one end bending and be configured at lower part closure with 152 different height of closed upper part portion 154, closed upper part portion 152, bending closure 154, lower part closure 154 are closely attached on shell 502a's and closure member 502b The staggered floor portion that mutually opposed face is formed.
With such an arrangement, even if smog leakage is between closed upper part portion 152 and shell 502a (or open and close member), It can also be realized second and be sealed by means of the bending closure 154 in the vertical bending in closed upper part portion 152, by means of rolling over The lower part closure 156 of curved 154 bending of closure and realize that third time seals, thus improve multiple cleaning units 402,404, 502, the airtight performance of 504 each cleaning space can obtain the smog leakage that occurs when more effective barrier cleaning to outside Advantageous effects.
On the other hand, even if in the layer along the vertical direction of multiple cleaning units 402,404,502,504 for constituting cleaning part 300 In the structure of folded configuration, substrate 10 can also be transferred before grind section 100 is ground by means of base plate transfer portion 610 Cleaning is prepared to cleaning part 300.Existing equipment layout is not changed or is added as a result, can be obtained in grinding process, Substrate damage (for example, scratch) caused by making because of 10 rear surface of substrate and front surface retained foreign body realizes the advantageous effect minimized Fruit.
Before carrying out grinding process, the substrate 10 into the cleaning part 300 of multilayered structure can be fixed along cleaning part 300 A variety of preparations cleaning path (for example, PC1, PC2, PC3, PC4 of Figure 42 to Figure 45) of justice is prepared cleaning.
More specifically, make substrate 10 cleaning part 300 along by multiple cleaning units 402,404,502,504 extremely Few one cleaning path is cleaned.Moreover, in multiple cleaning units 402,404,502,504 it is pre-set at least one (skip) can be excluded to clean except path in the preparation of substrate 10.In other words, multiple cleaning units 402,404,502,504 Although the preparation cleaning of substrate 10 can be completely used for, be different from this, can also only have multiple cleaning units 402,404, 502, a part in 504 is cleaned for the preparation of substrate 10.
As an example, referring to Figure 42, substrate 10 non-can connect along by the first of most adjacent base plate transfer portion 610 After the preparation cleaning path P C1 of touch cleaning unit 502 is cleaned, it is transplanted on grind section 100 and is ground.
As another example, referring to Figure 43, substrate 10 can be along the preparation by the second contactless cleaning unit 504 After cleaning path P C2 is cleaned, it is transplanted on grind section 100 and is ground.
In addition, the preparation cleaning path of substrate 10 is by least one in multiple contact cleaning units 402,404, multiple The cleaning efficiency of substrate 10 can be improved by means of this at least one in contactless cleaning unit 502,504.
As an example, referring to Figure 44, substrate 10 can along successively pass through the first contactless cleaning unit 502, After the preparation cleaning path P C3 of second contact cleaning unit 404 is cleaned, it is transplanted on grind section 100 and is ground.This When, in the substrate 10 that the first contactless cleaning unit 502 cleans the second contact can be transplanted on by means of transfer unit 310 Formula cleaning unit 404 can be transferred in the substrate 10 of the second contact cleaning unit 404 cleaning by means of transfer unit 310 To the first contactless cleaning unit 502.
As another example, referring to Figure 45, substrate 10 can along successively pass through the second contactless cleaning unit 504, After the preparation cleaning path P C4 cleaning of second contact cleaning unit 404, it is transplanted on grind section 100 and is ground.At this point, It is clear that the substrate 10 that second contactless cleaning unit 504 cleans can be transplanted on the second contact by means of transfer unit 310 Unit 404 is washed, the can be transplanted on by means of transfer unit 310 in the substrate 10 of the second contact cleaning unit 404 cleaning Two contactless cleaning units 504.
Different from this, it is clear in the first contact cleaning unit (or second contact cleaning unit) first to be also possible to substrate After washing, in the first contactless cleaning unit (or second contactless cleaning unit) cleaning, it is then transplanted on grind section.
In addition, each cleaning unit 402,404,502,504 in cleaning part may include dustiness measurement portion 700, it is described The measurement of dustiness measurement portion 700 is prepared the dustiness of the substrate 10 of cleaning in cleaning unit 402,404,502,504.
Dustiness measurement portion 700 is measured the dustiness for preparing the substrate 10 of cleaning, single so as to detect each cleaning Whether member 402,404,502,504 runs well, and in other words, can detecte based on each cleaning unit 402,404,502,504 Substrate 10 clean and whether be normally carried out (to the detection before the final cleaning for the substrate for completing grinding process).For example, polluting 10 dustiness of substrate of the measurement of measurement portion 700 is spent greater than in the case where pre-set a reference value, it can be determined that is cleaning unit 402, it 404,502,504 does not run well or the internal contamination degree of cleaning unit 402,404,502,504 is high.
Dustiness measurement portion 700 measures substrate rear surface and the remaining particle of front surface, so as to measure substrate 10 Dustiness, the utility model are not limited or are limited by the type and measurement method of dustiness measurement portion 700.
On the other hand, referring to Figure 46 and Figure 47, grind section 100 may include: the first prerinse unit 200, be configured at Between first abrasive disk 112 and the second abrasive disk 114；Second prerinse unit 200', is configured at the unloading for unloading carried base board 10 Region.
As an example, 10 rear surface of substrate (or front surface) is ground in the first abrasive disk 112, the first prerinse Unit 200' carries out prerinse to 10 rear surface of substrate in advance before the grinding of 10 front surface of substrate.
Preferably, 10 rear surface of substrate is being placed in roll-over unit 113 " in the state of carry out.As described above, making substrate 10 The prerinse of rear surface is being placed in roll-over unit 113 " in the state of carry out, by means of this, raising design can be obtained freely The advantageous effects spent, minimize substrate movement routine.
The prewashed substrate 10 to rear surface is completed, by means of roll-over unit 113 " and the state for overturning 180 degree is moved It is sent to the second abrasive disk 114, the front surface (or rear surface) of substrate 10 is ground in the second abrasive disk 114.
It completes to be unloaded at the substrate 10 of the grinding of rear surface unloading area, the second prerinse unit that unloading area is equipped with 200 pairs of substrate rear surfaces carry out prerinse.
As reference, the first prerinse unit 200 and the second prerinse unit 200' can use cleaning solution ejection section, steam Vapour ejection section, heterogeneous fluid injection portion, mega sonic wave unit, at least one in cleaning brush, to surface (rear surface and the preceding table of substrate Face) carry out prerinse.
Illustrate the substrate processing method using same by means of substrate board treatment of the utility model below.
As an example, referring to figs. 1 to Fig. 3, substrate 10 with rear surface (be unpatterned or the surface of film) down It is stored in the state supply of FOUP (front opening unified pod).
Substrate is placed in crystalline substance after FOUP (front opening unified pod) extraction by means of transfer robot (being not shown on figure) Piece platform W/S.
Then, the substrate 10 for being placed in wafer platform W/S is transplanted on grind section 100 by means of transfer robot TR and loaded The loading unit LU that region is equipped with.At this point, transfer robot TR (does not make base with the posture that 10 rear surface of substrate retains towards lower part Plate overturning rotation) mode transfer substrate 10.In other words, transfer robot TR retains towards down 10 rear surface of substrate still Substrate is transplanted on loading unit LU from wafer platform W/S by the posture in portion.
Then, the grinding process to 10 rear surface of substrate is carried out in the first abrasive disk (PL1) 112,112 '.At this point, in base The front surface (upper surface) of plate 10 is adjacent in the state of carrier head, grinds 10 rear surface of substrate configured towards lower part contact first Upper surface (is not shown) in first grinding pad of mill 112,112 ' on figure, carry out the grinding process to 10 rear surface of substrate.
Then, substrate 10 be transplanted on be configured at the first abrasive disk (PL1) 112,112 ' and the second abrasive disk (PL2) 114, Roll-over unit 113,113' between 114 ' overturn rotation by means of roll-over unit 113,113'.At this point, substrate 10 stirs rotation Turnback makes front surface towards lower part.
Then, substrate 10 is transplanted on 114,114 ' the second abrasive disk (PL2), in the second abrasive disk (PL2) 114,114 ', Carry out the grinding process to 10 front surface of substrate.At this point, making in the state that 10 rear surface of substrate (upper surface) is adjacent to carrier head The first grinding pad of front surface contact the second abrasive disk (PL2) 114,114 ' of the substrate 10 configured towards lower part (does not show on figure Upper surface out) carries out the grinding process to 10 front surface of substrate.
Then, if completing the grinding to 10 surface of substrate (rear surface and front surface), 10 edge of substrate of grinding is completed The transfer of predetermined transfer path, be unloaded at the unloading unit UU that the unloading area of grind section 100 is equipped with.At this point, in base During plate is transplanted on unloading unit UU from the second abrasive disk (PL2) 114,114 ', it can be configured on predetermined path There are multiple wettability treatment units (for example, wetting bathtub) 160 (WB), so that the surface of substrate 10 is able to maintain wetting state.
Then, the surface for completing the substrate of grinding is equipped with by means of the prerinse region P1 (unloading area) of grind section 100 Prerinse unit (for example, cleaning solution ejection section, steam generating part, heterogeneous fluid injection portion, mega sonic wave unit, in cleaning brush More than any one) and carry out prerinse process.
According to circumstances, can also with as shown in figure 3, without to complete grinding substrate 10 prerinse, but will complete The substrate 10 of grinding is transplanted directly on cleaning part 300 and executes subsequent cleaning.In addition, completing the substrate 10 of grinding in grind section 100 Cleaning part is transplanted on the state that the roll-over unit 213 being equipped with by means of unloading area overturns rotation again.It, can also different from this To be after having carried out the prerinse to the substrate for completing grinding, so as to complete the state transfer that prewashed substrate is overturn again To cleaning part.
Then, it has carried out prewashed substrate 10 and has been transplanted on cleaning part 300, carried out subsequent cleaning.At this point, substrate 10 according to It is secondary by cleaning part 300 be equipped with the first cleaning brush brush 1, the second cleaning brush brush 2, cleaning fluid injection portion NCC, from Cleaning and drying process are carried out while rotating flushing drying unit SRD.
Then, if cleaning and the drying process of completing substrate 10, substrate 10 is again by transfer robot (on figure It is not shown) and it is stored in FOUP (front opening unified pod).At this point, substrate 10 is identical as when drawing, (it is unpatterned with rear surface Or the face of film) state downward is stored in FOUP (front opening unified pod).
As described above, it is whole by means of 10 rear surface of grinding base plate and front surface, flat grinding is carried out, so that after substrate 10 The subtle convex-concave on surface planarizes, meanwhile, 10 rear surface of substrate is parallel to each other with front surface.Therefore, in the grinding work of substrate 10 In the exposure process carried out after sequence, mask alignment caused by preventing the convex-concave because being formed in 10 rear surface of substrate can be obtained Mistake, the advantageous effects for forming exact pattern.
As another example of substrate processing method using same, referring to Fig.1 and Fig. 4, substrate 10 (is unpatterned or film with rear surface Face) be stored in downward FOUP (front opening unified pod) state supply.
Substrate is placed in crystalline substance by means of transfer robot (being not shown on figure) and after FOUP (front opening unified pod) extraction Piece platform W/S.
Then, the substrate 10 for being placed in wafer platform W/S is transplanted on grind section 100 by means of transfer robot TR and loaded The loading unit LU that region is equipped with.At this point, transfer robot TR makes 10 front surface of substrate making the overturning of substrate 10 rotation 180 degree Substrate 10 is transferred while towards lower part.
Then, the grinding process to 10 front surface of substrate is carried out in the first abrasive disk (PL1) 112,112 '.At this point, in base 10 rear surface of plate (upper surface) is adjacent in the state of carrier head, makes the first grinding of 10 front surface of substrate configured towards lower part contact Upper surface (is not shown) in first grinding pad of disk 112,112 ' on figure, carry out the grinding process to 10 front surface of substrate.
Then, substrate 10 be transplanted on be configured at the first abrasive disk (PL1) 112,112 ' and the second abrasive disk (PL2) 114, Roll-over unit 113,113' between 114 ' overturn rotation by means of roll-over unit 113,113'.At this point, the overturning rotation of substrate 10 Turnback makes rear surface towards lower part.
Then, substrate 10 is transplanted on 114,114 ' the second abrasive disk (PL2), the second abrasive disk (PL2) 114,114 ' into Grinding process of the row to 10 rear surface of substrate.At this point, making in the state that the front surface (upper surface) of substrate 10 is adjacent to carrier head The first grinding pad (being not shown on figure) of 10 rear surface of substrate contact the second abrasive disk (PL2) 114,114 ' configured towards lower part Upper surface carries out the grinding process to 10 rear surface of substrate.
Then, if completing the grinding to 10 surface of substrate (rear surface and front surface), 10 edge of substrate of grinding is completed The transfer of predetermined transfer path, be unloaded to the unloading unit UU of 100 unloading area of grind section outfit.At this point, preparatory It determining path can be configured with multiple wettability treatment units (for example, wetting bathtub) 160 (WB), so that substrate is ground from second Mill (PL2) 114,114 ' is transplanted on during unloading unit UU, and the surface of substrate 10 can keep wetting state.
Then, the prerinse unit that the substrate surface of grinding is equipped with by means of the prerinse region P1 of grind section 100 is completed (for example, cleaning solution ejection section, steam generating part, heterogeneous fluid injection portion, mega sonic wave unit, it is more than any one in cleaning brush) Carry out prerinse process.
Then, prewashed substrate 10 is carried out and is transplanted on cleaning part 300 to carry out subsequent cleaning.At this point, substrate 10 is successively The first cleaning brush brush 1, the second cleaning brush brush 2, the cleaning fluid injection portion NCC, spin being equipped with by cleaning part 300 Formula carries out cleaning and drying process while rinsing drying unit SRD.
Then, if cleaning and the drying process of completing substrate 10, substrate 10 is again by means of transfer robot (on figure It is not shown) and it is stored in FOUP (front opening unified pod).At this point, substrate 10 is identical as when drawing, (it is unpatterned with rear surface Or the surface of film) state downward is stored in FOUP (front opening unified pod).
As an example, referring to Figure 46 and Figure 47, substrate 10 is with rear surface (be unpatterned or the face of film) under Just it is stored in the state supply of FOUP (front opening unified pod).
Substrate is placed in crystalline substance after FOUP (front opening unified pod) extraction by means of transfer robot (being not shown on figure) Piece platform W/S.
Then, the substrate 10 for being placed in wafer platform W/S is transplanted on grind section 100 by means of transfer robot TR and loaded The loading unit LU that region is equipped with.At this point, transfer robot TR is not so that the posture that 10 rear surface of substrate retains towards lower part (makes Substrate overturning rotation) mode transfer substrate 10.In other words, transfer robot TR is so that 10 rear surface of substrate still keeps court Substrate is transplanted on loading unit LU from wafer platform W/S by the mode of posture to the lower part.
Then, the grinding process to 10 rear surface of substrate is carried out in the first abrasive disk (PL1) 112.At this point, before substrate 10 Surface (upper surface) is adjacent in the state of carrier head, make towards lower part configure 10 rear surface of substrate contact the first abrasive disk 112, Upper surface (is not shown) in 112 ' the first grinding pad on figure, carry out the grinding process to 10 rear surface of substrate.
Then, 10 rear surface of substrate is pre- clear by be configured between the first abrasive disk 112 and the second abrasive disk 114 first It washes unit 200' and carries out prerinse process.
Then, it has carried out the prewashed substrate 10 of front surface and has been ground by the first abrasive disk (PL1) 112 and second is configured at Roll-over unit 113 between disk (PL2) 114 " and overturn rotation.At this point, the overturning rotation 180 degree of substrate 10, so that front surface court To the lower part.
Then, substrate 10 is transplanted on the second abrasive disk (PL2) 114, carries out in the second abrasive disk (PL2) 114 to substrate 10 The grinding process of front surface.At this point, making to configure towards lower part in the state that 10 rear surface of substrate (upper surface) is adjacent to carrier head Substrate 10 front surface contact the second abrasive disk (PL2) 114 the first grinding pad upper surface (is not shown) on figure, carry out to base The grinding process of 10 front surface of plate.
Then, 10 front surface of substrate for completing grinding is matched by means of prerinse region P1 (unloading area) of grind section 100 Standby the second prerinse unit is (for example, cleaning solution ejection section, steam generating part, heterogeneous fluid injection portion, mega sonic wave unit, clear Scrub more than any one) 200 progress prerinse processes.
Then, it has carried out the prewashed substrate 10 of rear surface and has been transplanted on cleaning part 300, carried out subsequent cleaning.At this point, substrate 10 by cleaning part 300 be equipped with the first cleaning brush brush 1, the second cleaning brush brush2, cleaning fluid injection portion NCC, Self-rotary carries out cleaning and drying process while rinsing drying unit SRD.
Then, if the cleaning of substrate 10 and drying process are completed, substrate 10 is again by transfer robot (on figure It is not shown) and it is stored in FOUP (front opening unified pod).At this point, substrate 10 is identical as when drawing, (it is unpatterned with rear surface Or the face of film) state downward is stored in FOUP (front opening unified pod).
As another example, the substrate processing method using same of the utility model includes: to carry out to 10 rear surface of substrate and front surface Prepare the preparation cleaning step of cleaning (primary cleaning)；It is held to prewashed 10 rear surface of substrate is completed with front surface The grinding steps of row chemical-mechanical polishing (CMP) process；Using cleaning part 300, to completing grinding process in grinding steps 10 rear surface of substrate and the cleaning step that is cleaned of front surface.
Step 1:
Firstly, being prepared cleaning (primary cleaning) to substrate rear surface and front surface.
In preparing cleaning step, before carrying out the grinding process to substrate 10, after disposably removing substrate 10 Surface and the remaining foreign matter of front surface are prepared cleaning to 10 rear surface of substrate and front surface.
This is in order to by being prepared to 10 rear surface of substrate with front surface before carrying out 10 grinding process of substrate It cleans (primary cleaning), to prevent in grinding process, due to 10 rear surface of substrate is with front surface retained foreign body Lead to the damage (for example, scratch) of substrate.
In preparing cleaning step, can be carried out in many ways according to desired condition and design specification to substrate 10 The preparation of rear surface and front surface is cleaned.
Preferably, prepare cleaning step to carry out using the cleaning part 300 used in cleaning step.As described above, pre- The cleaning part 300 for being first equipped with and (preparing in advance in cleaning step for the cleaning of substrate) carries out the preparation cleaning of substrate 10, borrows Help this, it is not additional with the equipment for being ready for use on the preparation cleaning of substrate 10 and space, thus can not be changed or be added and is just several Originally the advantageous effects of existing equipment layout are kept.
As reference, cleaning part 300 includes multiple cleanings that cleaning is individually executed to 10 rear surface of substrate and front surface Unit 402,404,502,504.As an example, cleaning part 300 may include: contact cleaning unit 400, physical Ground contact 10 rear surface of substrate and front surface simultaneously execute cleaning；Contactless cleaning unit 500, does not contact substrate 10 physically Rear surface and front surface simultaneously execute cleaning, are intended to remove 10 rear surface of substrate and front surface is remaining has so as to perform effectively The cleaning of machine object and other different foreign matters.According to circumstances, cleaning part can also only include contact cleaning unit and contactless Any one in cleaning unit.
Preferably, cleaning unit 402,404,502,504 includes: multiple contact cleaning units 402,404, vertically Direction laminated configuration physically contacts substrate rear surface and front surface, individually executes to 10 rear surface of substrate and front surface Cleaning；Multiple contactless cleaning units 502,504, laminated configuration, does not contact substrate 10 physically along the vertical direction Rear surface and front surface individually execute the cleaning to 10 rear surface of substrate and front surface (referring to Figure 37).As described above, by In the multiple cleaning units 402,404,502,504 of laminated configuration, the occupied area for reducing cleaning part 300 can be obtained (footprint), the advantageous effects of space efficiency are improved.Certainly, as shown in Figure 28 to Figure 31, it is also possible to constitute cleaning part 300 multiple cleaning units 402,404,502,504 are configured with single layer structure.
In preparing cleaning step, the substrate 10 into cleaning part 300 can be along a variety of standards defined in cleaning part 300 Standby cleaning path (PC1~PC4 of Figure 28 to Figure 31, Figure 37 to Figure 40) is prepared cleaning.Wherein, the preparation of so-called substrate 10 Path is cleaned, substrate 10 is defined as and carries out the sequence cleaned in cleaning part 300 before grinding process or base plate transfer and carry out The path of cleaning.
More specifically, in preparing cleaning step, substrate 10 is in cleaning part 300 along by multiple cleaning units 402, the cleaning path of at least one in 404,502,504 is cleaned.Preferably, it in preparing cleaning step, can use Constitute cleaning part 300 multiple cleaning units 402,404,502,504 in closest to base plate transfer portion 610 some, execute The preparation of 10 rear surface of substrate and front surface is cleaned, so as to minimize the movement routine of substrate 10, shortens substrate 10 Prepare scavenging period.
Moreover, prepare cleaning step in, in multiple cleaning units 402,404,502,504 it is pre-set at least one (skip) can be excluded to clean except path in the preparation of substrate 10.In other words, multiple cleaning units 402,404,502,504 It can be completely used for the preparation cleaning of substrate 10, but be different from this, can also there was only multiple cleaning units 402,404,502,504 In a part for substrate 10 preparation clean.
Moreover, can measure and be prepared in cleaning part 300 after cleaning part 300 completes the preparation cleaning to substrate 10 The dustiness of the substrate 10 of cleaning.
In dustiness measuring process, it is measured the dustiness for preparing the substrate 10 of cleaning, it is each clear so as to detect Wash whether unit 402,404,502,504 runs well, in other words, can detecte based on each cleaning unit 402,404,502, 504 substrate 10 cleans whether be normally carried out (to the detection before the final cleaning for the substrate for completing grinding process).For example, in dirt In the case that 10 dustiness of substrate measured in dye degree measuring process is greater than pre-set a reference value, it can be determined that single for cleaning Member 402,404,502,504 does not run well or the internal contamination degree of cleaning unit 402,404,502,504 is high.
Step 2:
Then, for 10 rear surface of substrate and front surface for completing to prepare to clean, chemical-mechanical polishing (CMP) work is executed Sequence.
In grinding steps, the grinding process to 10 rear surface of substrate is carried out first, makes the overturning rotation 180 degree of substrate 10 Afterwards, the grinding process to 10 front surface of substrate is carried out again.According to circumstances, it compared with substrate rear surface, can also grind first Substrate front surface.
Preferably, in grinding steps, flat grinding is carried out, so that the subtle convex-concave of 10 rear surface of substrate planarizes, together When, 10 rear surface of substrate is parallel to each other with front surface.
Step 3:
Then, after completing grinding steps, 10 rear surface of substrate and front surface for completing grinding process can be carried out pre- It cleans (pre-cleaning).
As reference, the prerinse of so-called substrate 10, it can be understood as carrying out in cleaning part 300 to the clear of substrate 10 Before washing, the process of surface (substrate rear surface and front surface) remaining foreign matter of cleaning base plate 10 to greatest extent.
Preferably, prerinse step is carried out in the prerinse region P1 that grind section (referring to the 100 of Figure 36) is equipped with.That is, The prerinse region P1 that grind section 100 is equipped with, the substrate 10 of grinding process is completed in unloading, in prerinse step, for unloading Substrate 10 carry out prerinse.
At this point, after the substrate 10 for completing grinding process is unloaded at prerinse region P1 180 degree can be overturn, in prerinse In step, substrate 10 carries out prerinse in the state of overturning rotation.
As described above, still keeping being transplanted on cleaning after the substrate 10 for completing grinding process is unloaded at prerinse region P1 The process sequence in portion, and in the prerinse region P1 for unloading carried base board 10, first time prerinse is carried out to the remaining foreign matter of substrate 10, By means of this, even if not changing or adding existing equipment layout, can also carried out in the case where process efficiency will not decline Before subsequent cleaning process (cleaning step based on cleaning part), the advantageous effect for minimizing the remaining foreign matter of substrate 10 is obtained Fruit.
As reference, in prerinse step, such as chemicals, pure water are sprayed to 10 rear surface of substrate and front surface (DIW), the cleaning fluid of steam, heterogeneous fluid etc., or make 10 rear surface of cleaning brush rotating contact substrate and front surface or Xiang Ji 10 rear surface of plate and front surface supply vibrational energy, by means of this, can execute prerinse (referring to Fig. 6 to Figure 15).
Step 4:
Then, in grinding steps, using cleaning part 300, to 10 rear surface of substrate and front surface for completing grinding process Carry out subsequent cleaning.
In cleaning step, using cleaning part 300, to carried out in prerinse step prewashed substrate rear surface with Front surface carries out subsequent cleaning again.
As reference, the subsequent cleaning of substrate 10 in so-called cleaning step, it can be understood as carrying out prerinse Afterwards, process needed for 10 surface of cleaning base plate (substrate rear surface and front surface) remaining foreign matter.
Moreover, the substrate 10 cleaned in cleaning step executes pre-set next work with state free of cleaning Sequence.Wherein, so-called that substrate 10 is executed into next process with state free of cleaning, it can be understood as the cleaning process in cleaning step is Finishing operation completes all cleaning process to substrate 10, for completing the substrate 10 of cleaning process, without additional cleaning Process can carry out next process (for example, deposition procedures).
Moreover, to 10 rear surface of substrate and front surface injection such as chemicals, pure water (DIW), being steamed in cleaning step The cleaning fluid of vapour, heterogeneous fluid etc., or make 10 rear surface of cleaning brush rotating contact substrate and front surface, or to table after substrate 10 Face and front surface supply vibrational energy, or can be held to 10 rear surface of substrate and front surface sparged isopropanol (IPA) by means of this Row cleaning.
On the other hand, in the utility model embodiment for preceding addressing diagram, substrate front surface and substrate rear surface are enumerated Primary example is only ground respectively to be illustrated, but according to circumstances, can also be made in substrate front surface and substrate rear surface extremely Few each grinding is more than twice.
As an example, referring to Figure 48, another embodiment according to the present utility model is supplied to the base of grind section 100 Plate 10 passes through the first grind section PA and the second grind section PB, grinds rear surface and front surface respectively, and 10 rear surface of substrate can be with It is ground twice in the first grind section PA, the front surface of substrate 10 can be ground twice in the second grind section PB.
For example, the first grind section PA may include: 1-1 abrasive disk 112, carry out to 10 a front surface and a rear surface of substrate In a surface first time grinding process；1-2 abrasive disk 114 separates outfit with the first abrasive disk, carries out to substrate 10 Second of grinding process on the surface in a front surface and a rear surface.Second grind section PB may include: 2-1 abrasive disk 112' carries out the first time grinding process to another surface in 10 a front surface and a rear surface of substrate；2-2 abrasive disk 114' separates outfit with the first abrasive disk, carries out grinding for the second time to another surface in 10 a front surface and a rear surface of substrate Grinder sequence.According to circumstances, can there was only any one in the first grind section PA and the second grind section PB includes multiple abrasive disks.No It is same as this, being also possible at least one in the first grind section PA and the second grind section PB includes three with top lap.
More specifically, referring again to Figure 48, substrate 10 is supplied to grind section 100 in such a way that rear surface is towards lower part, In the 1-1 abrasive disk 112 of the first grind section PA, the first time grinding process to 10 rear surface of substrate is carried out, then grind in 1-2 Second of grinding process to 10 rear surface of substrate is carried out in mill 114.
After the first grind section PA completes to the grinding of 10 rear surface of substrate, substrate 10 is by being configured at the first grind section PA Roll-over unit overturning rotation 180 degree between the second grind section PB, so that front surface is towards lower part.
Then, substrate 10 carries out the first time to 10 front surface of substrate in the 2-1 abrasive disk 112' of the second grind section PB Grinding process, then second of grinding process to 10 front surface of substrate is carried out in 2-2 abrasive disk 114'.
As reference, in the embodiments of the present invention, enumerate 10 rear surface of the first grind section PA grinding base plate, The example of second grind section PB grinding base plate, 10 lower surface is illustrated, but according to circumstances, can also be in the second grind section PB 10 rear surface of grinding base plate, in 10 front surface of the first grind section PA grinding base plate.
As another example, referring to Figure 49 and Figure 50, another embodiment according to the present utility model is also configured to base 10 rear surface of plate is only once ground, and the front surface of substrate 10 is ground twice.
More specifically, referring to Figure 49, another embodiment according to the present utility model, substrate 10 is with rear surface towards lower part Mode be supplied to grind section 100, only carry out to 10 rear surface of substrate in the 1-1 abrasive disk 112 of the first grind section PA Grinding process.
Then, if completing grinding to 10 rear surface of substrate in the first grind section PA, substrate 10 is by being configured at the Roll-over unit between one grind section PA and the second grind section PB and overturn rotation 180 degree so that front surface is towards lower part.
Then, substrate 10 carries out the first time to 10 front surface of substrate in the 2-1 abrasive disk 112' of the second grind section PB Grinding process, then second of grinding process to 10 front surface of substrate is carried out in 2-2 abrasive disk 114'.
As shown in figure 50, another embodiment according to the present utility model, substrate 10 supply in such a way that rear surface is towards lower part Grind section 100 should be arrived, in the 2-1 abrasive disk 112' of the second grind section PB, only carries out grinding the first time of 10 rear surface of substrate Grinder sequence.
Then, if completing grinding to 10 rear surface of substrate in the second grind section PB, substrate 10 is by being configured at the Roll-over unit between two grind section PB and the first grind section PA and overturn rotation 180 degree so that front surface is towards lower part.
Then, substrate 10 grind the first time of 10 front surface of substrate in the 1-1 abrasive disk 112 of the first grind section PA Grinder sequence, then second of grinding process to 10 front surface of substrate is carried out in 1-2 abrasive disk 114.
According to circumstances, can also make to the first time grinding process of 10 rear surface of substrate the second grind section PB 2-2 The 1-2 abrasive disk of abrasive disk 114'(or the first grind section) it carries out.
In addition, referring to Figure 51, another embodiment according to the present utility model is also configured to the progress of 10 rear surface of substrate It grinds twice, the front surface of substrate 10 is only once ground.
That is, substrate 10 is supplied to grind section 100 in such a way that rear surface is towards lower part, in the first grind section referring to Figure 51 The 1-2 abrasive disk 114 of PA carries out the first time grinding process to 10 rear surface of substrate, then carries out pair in 1-1 abrasive disk 112 Second of grinding process of 10 rear surface of substrate.
Then, if completing grinding to 10 rear surface of substrate in the first grind section PA, substrate 10 is by being configured at the Roll-over unit between one grind section PA and the second grind section PB and overturn rotation 180 degree so that front surface is towards lower part.
Then, substrate 10 only carries out first to 10 front surface of substrate in the 2-1 abrasive disk 112' of the second grind section PB Secondary grinding process.
According to circumstances, can also make to the first time grinding process of 10 rear surface of substrate the first grind section PA 1-1 Abrasive disk 112 (or 2-2 abrasive disk of the second grind section) carries out.
As described above, being illustrated referring to the preferred embodiment in the utility model, but as long as being ordinary skill people Member, can be to this just it will be appreciated that in the range of the utility model thought recorded without departing from patent claims and field Utility model carries out a variety of revisions and change.

Claims (53)

1. a kind of base plate processing system, for being formed with pattern or film to front surface and rear surface is unpatterned or the substrate of film It is handled characterized by comprising
Grind section carries out the grinding process to the front surface of the substrate and the grinding process to the substrate rear surface,
The grind section includes:
First abrasive disk carries out grinding process to the surface in the front surface and rear surface of the substrate；
Roll-over unit receives the substrate from first abrasive disk and is allowed to overturning rotation；
Second abrasive disk receives the substrate from the roll-over unit, to another in the front surface and rear surface of the substrate One surface carries out grinding process.
2. base plate processing system according to claim 1, which is characterized in that
The roll-over unit is configured at the movement that the substrate moves between first abrasive disk and second abrasive disk On path or it is configured at the outside of the movement routine.
3. base plate processing system according to claim 1, which is characterized in that
The substrate is supplied to the grind section with the state of rear surface towards lower part,
In first abrasive disk, the grinding process to the substrate rear surface is carried out, in second abrasive disk, is carried out To the grinding process of the front surface of the substrate.
4. base plate processing system according to claim 1, which is characterized in that
In the first abrasive disk equipped with the first grinding pad, with the surface contact in a front surface and a rear surface of the substrate The state of first grinding pad is ground,
In the second abrasive disk equipped with the second grinding pad, connect with another surface in a front surface and a rear surface of the substrate Touch the state grinding of second grinding pad.
5. base plate processing system according to claim 1, which is characterized in that
The substrate includes first substrate and the second substrate,
The grind section includes:
First grind section comprising grinding process is carried out to the surface in a front surface and a rear surface of the first substrate 1-1 abrasive disk, receive from the 1-1 abrasive disk first substrate and be allowed to overturning rotation the first roll-over unit, Receive the first substrate from first roll-over unit and to described another in a front surface and a rear surface of the first substrate The 1-2 abrasive disk of one surface progress grinding process；
Second grind section comprising grinding process is carried out to the surface in a front surface and a rear surface of the second substrate 2-1 abrasive disk, receive from the 2-1 abrasive disk the second substrate and be allowed to overturning rotation the second roll-over unit, Receive the first substrate from second roll-over unit and to described another in a front surface and a rear surface of the second substrate The 2-2 abrasive disk of one surface progress grinding process.
6. base plate processing system according to claim 1 characterized by comprising
First prerinse unit, is provided to the grind section, the preceding table to the substrate ground in first abrasive disk A surface in face and rear surface carries out prerinse.
7. base plate processing system according to claim 6 characterized by comprising
Second prerinse unit, is provided to the grind section, the preceding table to the substrate ground in second abrasive disk Another surface in face and rear surface carries out prerinse.
8. base plate processing system according to claim 1, which is characterized in that further include:
Cleaning part cleans the substrate for completing grinding.
9. base plate processing system according to claim 8 characterized by comprising
Prerinse region is provided to the grind section, for the substrate for completing grinding process, carries out cleaning the substrate A front surface and a rear surface in an at least surface prerinse (pre-cleaning) process,
The substrate is transplanted on cleaning part by the prerinse unit for being provided to prerinse region after prerinse.
10. base plate processing system according to claim 9, which is characterized in that
The prerinse unit includes to the cleaning fluid injection portion of the surface jet cleaning fluid of the substrate.
11. base plate processing system according to claim 10, which is characterized in that
The cleaning fluid injection portion includes the cleaning solution ejection section to the surface jet cleaning liquid of the substrate.
12. base plate processing system according to claim 11, which is characterized in that
The cleaning solution include chemicals, SC1 (Standard Clean-1, APM), ammonia, hydrogen peroxide, hydrofluoric acid (HF), At least one of pure water (DIW).
13. base plate processing system according to claim 10, which is characterized in that
The cleaning fluid injection portion includes the steam generating part to the surface of substrate injection steam.
14. base plate processing system according to claim 10, which is characterized in that
The cleaning fluid injection portion includes the heterogeneous fluid spray that mutually different heterogeneous fluid is sprayed to the surface of the substrate Penetrate portion.
15. base plate processing system according to claim 14, which is characterized in that
The heterogeneous fluid injection portion includes:
Dry ice supply department supplies dry ice particles；
Fluid sprays to the surface of the substrate in fluid injection portion,
The dry ice particles and the fluid are sprayed with the state being mutually mixed to the surface of the substrate.
16. base plate processing system according to claim 9, which is characterized in that
The prerinse unit includes the mega sonic wave unit to the surface of substrate supply vibrational energy.
17. base plate processing system according to claim 9, which is characterized in that
The prerinse unit includes the cleaning brush of substrate surface described in rotating contact.
18. base plate processing system according to claim 17, which is characterized in that
The prerinse unit includes:
First cleaning brush of the front surface of substrate described in rotating contact；
Second cleaning brush of substrate rear surface described in rotating contact,
The a front surface and a rear surface of the substrate is cleaned simultaneously.
19. base plate processing system according to claim 9 characterized by comprising
Prerinse roll-over unit is provided to the prerinse region, collects the substrate in the prerinse region and is allowed to Overturning rotation.
20. base plate processing system according to claim 19, which is characterized in that
A surface in a front surface and a rear surface of the substrate carries out prerinse in the prerinse region first,
In the prerinse region, after the substrate overturns rotation by means of the prerinse roll-over unit, to the base Another surface in a front surface and a rear surface of plate is cleaned.
21. base plate processing system according to claim 9, which is characterized in that further include:
Blocker unit, during the prerinse region carries out prerinse process, at the prerinse in the prerinse region It is opened with the space obstacle outside it in reason space.
22. base plate processing system according to claim 21, which is characterized in that
The blocker unit includes:
Shell forms independent prerinse processing space in a manner of surrounding the substrate periphery；
Open and close member is opened and closed the entrance of the shell.
23. according to described in any item base plate processing systems of claim 8 to 22, which is characterized in that
The cleaning part includes multiple cleaning units that cleaning is executed to the substrate.
24. base plate processing system according to claim 23, which is characterized in that
The above laminated configuration along the vertical direction of a part of the multiple cleaning unit.
25. base plate processing system according to claim 24, which is characterized in that
The cleaning part includes multiple contact cleaning units, at least one in multiple contactless cleaning units, wherein
The multiple contact cleaning unit physically contacts the surface of the substrate, individually executes to the clear of the substrate It washes；
The multiple contactless cleaning unit is not contacted with the surface physics of the substrate, is individually executed to the base The cleaning of plate.
26. base plate processing system according to claim 25, which is characterized in that
The contact cleaning unit includes the cleaning brush on the surface of substrate described in rotating contact.
27. base plate processing system according to claim 26, which is characterized in that
The cleaning brush is made of a pair, while contacting a front surface and a rear surface for cleaning the substrate.
28. base plate processing system according to claim 26, which is characterized in that further include:
Chemicals supply department, during the cleaning brush contacts the substrate, Xiang Suoshu cleaning brush connects with the substrate Contact portion position supplying chemical preparation.
29. base plate processing system according to claim 28, which is characterized in that
The chemicals is at least one of SC1 (Standard Clean-1, APM) and hydrofluoric acid (HF).
30. base plate processing system according to claim 25, which is characterized in that
The contactless cleaning unit includes to the cleaning fluid injection portion of the surface jet cleaning fluid of the substrate.
31. base plate processing system according to claim 30, which is characterized in that
The cleaning fluid injection portion includes the cleaning solution ejection section to the surface jet cleaning liquid of the substrate.
32. base plate processing system according to claim 31, which is characterized in that
The cleaning solution is chemicals, SC1 (Standard Clean-1, APM), ozone hydrofluoric acid (O3HF), hydrofluoric acid (HF), at least one of ammonia, hydrogen peroxide, pure water (DIW).
33. base plate processing system according to claim 30, which is characterized in that
The cleaning fluid injection portion includes the steam generating part to the surface of substrate injection steam.
34. base plate processing system according to claim 30, which is characterized in that
The cleaning fluid injection portion includes the heterogeneous fluid spray that mutually different heterogeneous fluid is sprayed to the surface of the substrate Penetrate portion.
35. base plate processing system according to claim 34, which is characterized in that
The heterogeneous fluid injection portion includes:
Supply the dry ice supply department of dry ice particles；
The fluid injection portion of fluid is sprayed to the surface of the substrate,
The dry ice particles and the fluid are sprayed with the state being mutually mixed to the surface of the substrate.
36. base plate processing system according to claim 25, which is characterized in that
The contactless cleaning unit includes the mega sonic wave unit to the surface of substrate supply vibrational energy.
37. base plate processing system according to claim 25, which is characterized in that
The contactless cleaning unit includes the isopropanol ejection section to the surface sparged isopropanol (IPA) of the substrate.
38. base plate processing system according to claim 23 characterized by comprising
Roll-over unit is cleaned, the cleaning part is provided to, collect the substrate and is allowed to overturning rotation.
39. the base plate processing system according to claim 38, which is characterized in that
A surface described in a front surface and a rear surface of the substrate is cleaned first in the cleaning part,
Another surface in a front surface and a rear surface of the substrate, in the cleaning part with the substrate by means of described Cleaning roll-over unit and overturn rotation in the state of be cleaned.
40. base plate processing system according to claim 23, which is characterized in that
The substrate carries out clear in the cleaning part along the cleaning path by least one in the multiple cleaning unit It washes.
41. base plate processing system according to claim 40, which is characterized in that
In the multiple cleaning unit it is pre-set at least one can exclude (skip) except the cleaning path.
42. base plate processing system according to claim 23, which is characterized in that further include:
Blocker unit, the cleaning space for independently obstructing the cleaning unit and the space except it.
43. base plate processing system according to claim 23, which is characterized in that
Including base plate transfer portion, by the base plate transfer to the cleaning part before grind section grinding,
The substrate is before carrying out grinding process, after the cleaning part prepares cleaning first, into the grind section.
44. base plate processing system according to claim 43, which is characterized in that
The substrate cleans road before carrying out grinding process, along the preparation by least one in the multiple cleaning unit Diameter is prepared cleaning.
45. base plate processing system according to claim 44, which is characterized in that
In the multiple cleaning unit it is pre-set at least one can exclude (skip) the preparation clean path except.
46. base plate processing system according to any one of claim 1 to 8 characterized by comprising
Wettability treatment unit is provided to the grind section, and is configured at the substrate mobile road mobile in the grind section On diameter, the substrate is made to keep wetting state.
47. a kind of substrate board treatment, for being formed with pattern or film to front surface and rear surface is unpatterned or the base of film Plate is handled characterized by comprising
First grind section carries out grinding process to the surface in a front surface and a rear surface of the substrate；
Roll-over unit receives the substrate from first grind section and is allowed to overturning rotation；
Second grind section receives the substrate from the roll-over unit, to another in a front surface and a rear surface of the substrate One surface carries out grinding process.
48. substrate board treatment according to claim 47, which is characterized in that
First grind section includes that the surface in a front surface and a rear surface to the substrate carries out grinding process First abrasive disk.
49. substrate board treatment according to claim 48, which is characterized in that
First grind section includes:
1-1 abrasive disk carries out first time grinding process to the surface in a front surface and a rear surface of the substrate；
1-2 abrasive disk separates outfit with first abrasive disk, described in a front surface and a rear surface of the substrate One surface carries out second of grinding process.
50. substrate board treatment according to claim 47, which is characterized in that
Second grind section includes that another surface in a front surface and a rear surface to the substrate carries out grinding process The second abrasive disk.
51. substrate board treatment according to claim 50, which is characterized in that
Second grind section includes:
2-1 abrasive disk carries out grinding work for the first time to another surface in a front surface and a rear surface of the substrate Sequence；
2-2 abrasive disk separates outfit with first abrasive disk, described in a front surface and a rear surface of the substrate Another surface carries out second of grinding process.
52. substrate board treatment according to claim 47, which is characterized in that
The roll-over unit is configured at the movement that the substrate moves between first grind section and second grind section On path, or it is configured at the outside of the movement routine.
53. substrate board treatment according to claim 47, which is characterized in that
The substrate is supplied to first grind section with the state of rear surface towards lower part,
Grinding process is carried out to the substrate rear surface first in first grind section, then in second grind section to institute The front surface for stating substrate carries out grinding process.
CN201820876979.2U 2018-01-04 2018-06-07 Base plate processing system and substrate board treatment Active CN208589417U (en)

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TWI844818B (en) * 2021-02-26 2024-06-11 南韓商凱斯科技股份有限公司 Substrate transfering system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI844818B (en) * 2021-02-26 2024-06-11 南韓商凱斯科技股份有限公司 Substrate transfering system

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