CN207766657U - A kind of pcb board of high current carrying capacity - Google Patents
A kind of pcb board of high current carrying capacity Download PDFInfo
- Publication number
- CN207766657U CN207766657U CN201721923170.2U CN201721923170U CN207766657U CN 207766657 U CN207766657 U CN 207766657U CN 201721923170 U CN201721923170 U CN 201721923170U CN 207766657 U CN207766657 U CN 207766657U
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- copper sheet
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- soldermask
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Abstract
The utility model discloses a kind of pcb boards of high current carrying capacity, including packing layer, top soldermask layer and bottom soldermask layer, top soldermask layer is covered in the top of packing layer, bottom soldermask layer is covered in the bottom of packing layer, there is top trace between top soldermask layer and packing layer, there is bottom trace between bottom soldermask layer and packing layer；Top soldermask layer is equipped with the first notch of strip, first notch is located at the top of top trace, the top surface of packing layer has the first fixing groove, the first copper sheet of strip is equipped in first notch, first copper sheet is equipped with the first mounting hole, and the first fixing glue is located in the first mounting hole and the first fixing groove；First copper sheet and top trace fitting, the first fixing glue are connected with the top trace.The utility model has stronger current-carrying capability.Top trace is connected by the first copper coin and the first fixing glue, can reduce the resistance of top trace, to improve the current-carrying capability of printed circuit board.
Description
Technical field
The utility model is related to printed circuit boards, more particularly to a kind of pcb board of high current carrying capacity.
Background technology
With the rapid development of information technology and microelectronics, the requirement of power supply source is also continuously improved, high current low-voltage
It is used widely in industries such as computer, communications, electric current is excessive to cause prodigious loss, this loss pair in loop
Product stability and reliability will exert far reaching influence.It is lost in vain to reduce this loop, this just proposes the current-carrying of pcb board
Very high request.
Utility model content
The purpose of the utility model is to provide a kind of pcb boards of high current carrying capacity, compared to conventional printed circuit board
With stronger current-carrying capability.
In order to solve the above technical problems, the utility model adopts the following technical scheme：
A kind of pcb board of high current carrying capacity, including packing layer, top soldermask layer and bottom soldermask layer, top soldermask layer cover
It covers at the top of packing layer, bottom soldermask layer is covered in the bottom of packing layer, has top between top soldermask layer and packing layer
Cabling has bottom trace between bottom soldermask layer and packing layer；First notch of the top soldermask layer equipped with strip, first
Notch is located at the top of top trace, and the top surface of packing layer has the first fixing groove, the first of strip is equipped in the first notch
Copper sheet, the first copper sheet are equipped with the first mounting hole, and the first fixing glue is located in the first mounting hole and the first fixing groove；First copper sheet
It is bonded with the top trace, the first fixing glue is connected with the top trace.First copper coin and the first fixing glue are and top
Cabling is connected, and can reduce the resistance of top trace.
In a kind of pcb board of high current carrying capacity above-mentioned, bottom soldermask layer is equipped with the second notch of strip, the second slot
Mouth is located at the lower section of bottom trace, and the bottom surface of packing layer has the second fixing groove, the second bronze medal of strip is equipped in the second notch
Piece, the second copper sheet are equipped with the second mounting hole, and the second fixing glue is located in the second mounting hole and the second fixing groove；Second copper sheet and
The bottom trace fitting, the second fixing glue are connected with the bottom trace.Second copper coin and the second fixing glue are walked with bottom
Line is connected, and can reduce the resistance of bottom trace.
In a kind of pcb board of high current carrying capacity above-mentioned, in order to further decrease the inside of top trace and bottom trace,
The width of first copper sheet is more than or equal to the width of top trace, and the width of the second copper sheet is more than or equal to bottom trace
Width.
Preferably, in a kind of pcb board of high current carrying capacity above-mentioned, the thickness of the first copper sheet is more than the thickness of top soldermask layer
Degree, the thickness of the second copper sheet are more than the thickness of bottom soldermask layer.
As one of which embodiment, in a kind of pcb board of high current carrying capacity above-mentioned, first mounting hole and
Second mounting hole is via.
Compared with prior art, the utility model has stronger current-carrying capability.Top trace passes through the first copper coin and
One fixing glue is connected, and can reduce the resistance of top trace；Bottom trace with the second copper wire and the second fixing glue by being connected, energy
The resistance for enough reducing bottom trace, to improve the current-carrying capability of printed circuit board.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of embodiment of the utility model.
Reference numeral：1- packing layers, the first notches of 2-, the first fixing glues of 3-, the first copper sheets of 4-, the first mounting holes of 5-, 6-
Top soldermask layer, 7- top traces, the second notches of 8-, the second fixing glues of 9-, the second copper sheets of 10-, the second mounting holes of 11-, the bottoms 12-
Portion's soldermask layer, 13- bottom traces.
The utility model is further described with reference to the accompanying drawings and detailed description.
Specific implementation mode
The embodiments of the present invention 1：As shown in Figure 1, a kind of pcb board of high current carrying capacity, including packing layer 1, top
Soldermask layer 6 and bottom soldermask layer 12, top soldermask layer 6 are covered in the top of packing layer 1, and bottom soldermask layer 12 is covered in packing layer
1 bottom has top trace 7 between top soldermask layer 6 and packing layer 1, have bottom between bottom soldermask layer 12 and packing layer 1
Portion's cabling 13；Top soldermask layer 6 is equipped with the first notch 2 of strip, and the first notch 2 is located at the top of top trace 7, filler
The top surface of layer 1 has the first fixing groove, and the first copper sheet 4 of strip is equipped in the first notch 2, and the first copper sheet 4 is equipped with first
Mounting hole 5, the first fixing glue 3 are located in the first mounting hole 5 and the first fixing groove；First copper sheet 4 and the top trace 7 paste
It closes, the first fixing glue 3 is connected with the top trace 7.
Bottom soldermask layer 12 is equipped with the second notch 8 of strip, and the second notch 8 is located at the lower section of bottom trace 13, fills out
The bottom surface of the bed of material 1 has the second fixing groove, and the second copper sheet 10 of strip is equipped in the second notch 8, and the second copper sheet 10 is equipped with
Second mounting hole 11, the second fixing glue 9 are located in the second mounting hole 11 and the second fixing groove；Second copper sheet 10 and the bottom are walked
Line 13 is bonded, and the second fixing glue 9 is connected with the top trace 7.
Embodiment 2：As shown in Figure 1, a kind of pcb board of high current carrying capacity, including packing layer 1, top soldermask layer 6 and bottom
Soldermask layer 12, top soldermask layer 6 are covered in the top of packing layer 1, and bottom soldermask layer 12 is covered in the bottom of packing layer 1, top
There is top trace 7 between soldermask layer 6 and packing layer 1, there is bottom trace 13 between bottom soldermask layer 12 and packing layer 1；Top
Portion's soldermask layer 6 is equipped with the first notch 2 of strip, and the first notch 2 is located at the top of top trace 7, the top surface tool of packing layer 1
There is the first fixing groove, is equipped with the first copper sheet 4 of strip in the first notch 2, the first copper sheet 4 is equipped with the first mounting hole 5, and first
Fixing glue 3 is located in the first mounting hole 5 and the first fixing groove；First copper sheet 4 and the top trace 7 are bonded, the first fixing glue 3
It is connected with the top trace 7.
Bottom soldermask layer 12 is equipped with the second notch 8 of strip, and the second notch 8 is located at the lower section of bottom trace 13, fills out
The bottom surface of the bed of material 1 has the second fixing groove, and the second copper sheet 10 of strip is equipped in the second notch 8, and the second copper sheet 10 is equipped with
Second mounting hole 11, the second fixing glue 9 are located in the second mounting hole 11 and the second fixing groove；Second copper sheet 10 and the bottom are walked
Line 13 is bonded, and the second fixing glue 9 is connected with the bottom trace 13.The width of first copper sheet 4 is more than or equal to top trace 7
Width, the width of the second copper sheet 10 is more than or equal to the width of bottom trace 13.The thickness of first copper sheet 4 is anti-more than top
The thickness of layer 6, the thickness of the second copper sheet 10 are more than the thickness of bottom soldermask layer 12.First mounting hole 5 and second is installed
Hole 11 is via.
Claims (5)
1. a kind of pcb board of high current carrying capacity, which is characterized in that anti-welding including packing layer (1), top soldermask layer (6) and bottom
Layer (12), top soldermask layer (6) are covered in the top of packing layer (1), and bottom soldermask layer (12) is covered in the bottom of packing layer (1)
Portion has top trace (7), between bottom soldermask layer (12) and packing layer (1) between top soldermask layer (6) and packing layer (1)
With bottom trace (13)；Top soldermask layer (6) is equipped with the first notch (2) of strip, and the first notch (2) is walked positioned at top
The top surface of the top of line (7), packing layer (1) has the first fixing groove, and the first copper sheet of strip is equipped in the first notch (2)
(4), the first copper sheet (4) is equipped with the first mounting hole (5), and the first fixing glue (3) is located at the first mounting hole (5) and the first fixing groove
It is interior；First copper sheet (4) and the top trace (7) fitting, the first fixing glue (3) are connected with the top trace (7).
2. a kind of pcb board of high current carrying capacity according to claim 1, which is characterized in that bottom soldermask layer is set on (12)
There is the second notch (8) of strip, the second notch (8) is located at the lower section of bottom trace (13), and the bottom surface of packing layer (1) has the
Two fixing grooves, interior the second copper sheet (10) for being equipped with strip of the second notch (8), the second copper sheet (10) are equipped with the second mounting hole
(11), the second fixing glue (9) is located in the second mounting hole (11) and the second fixing groove；Second copper sheet (10) and the bottom trace
(13) it is bonded, the second fixing glue (9) is connected with the bottom trace (13).
3. a kind of pcb board of high current carrying capacity according to claim 2, which is characterized in that the width of the first copper sheet (4) is big
In or equal to top trace (7) width, the width of the second copper sheet (10) is more than or equal to the width of bottom trace (13).
4. a kind of pcb board of high current carrying capacity according to claim 3, which is characterized in that the thickness of the first copper sheet (4) is big
Thickness in top soldermask layer (6), the thickness of the second copper sheet (10) are more than the thickness of bottom soldermask layer (12).
5. a kind of pcb board of high current carrying capacity according to claim 4, which is characterized in that first mounting hole (5) and
Second mounting hole (11) is via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721923170.2U CN207766657U (en) | 2017-12-29 | 2017-12-29 | A kind of pcb board of high current carrying capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721923170.2U CN207766657U (en) | 2017-12-29 | 2017-12-29 | A kind of pcb board of high current carrying capacity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766657U true CN207766657U (en) | 2018-08-24 |
Family
ID=63182845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721923170.2U Active CN207766657U (en) | 2017-12-29 | 2017-12-29 | A kind of pcb board of high current carrying capacity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207766657U (en) |
-
2017
- 2017-12-29 CN CN201721923170.2U patent/CN207766657U/en active Active
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