CN206806329U - A kind of novel high-density frame structure of semiconductor packages circuit - Google Patents
A kind of novel high-density frame structure of semiconductor packages circuit Download PDFInfo
- Publication number
- CN206806329U CN206806329U CN201720513631.2U CN201720513631U CN206806329U CN 206806329 U CN206806329 U CN 206806329U CN 201720513631 U CN201720513631 U CN 201720513631U CN 206806329 U CN206806329 U CN 206806329U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip carrier
- conducting resinl
- chip
- novel high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
It the utility model is related to technical field of semiconductor encapsulation, a kind of more particularly to novel high-density frame structure of semiconductor packages circuit, including multiple lead frame units, the lead frame unit is connected with each other by dowel, the lead frame cell surface is layers of copper, the lead frame unit includes chip carrier and pin, and chip is pasted onto on chip carrier by conducting resinl, and the chip carrier is provided with the excessive spilling for being used to prevent conducting resinl and hinders glue groove.The lead frame cell surface is layers of copper, and copper and plastic-sealed body associativity are fairly good, ensures adhesion from the selection of basic material, especially the semiconductor devices of one side encapsulation, and the adhesion of lead frame and plastic-sealed body seems more important；In addition on chip carrier set resistance glue groove, can prevent conducting resinl excessive spilling or conducting resinl in sovent diffusion, avoid stain lead frame unit, improve product reliability.
Description
Technical field
It the utility model is related to technical field of semiconductor encapsulation, more particularly to a kind of semiconductor packages circuit is new highly dense
Spend frame structure.
Background technology
With the continuous development of semiconductor packaging industry, in the performance of product, size, cost reliability etc. requirement
Improve constantly, when performance is higher, size is more thin smaller, and cost is lower, and the reliability of product is just more difficult to realize.It is good in order to realize
Electrical property and heat dispersion, many products still more using lead frame be carrier packing forms, lead frame
Arrangement also develops to high density direction, and the product of this classification has good advantage, but plastic packaging in price in performance, size
The coefficient of thermal expansion differences of body and lead frame is very big, and associativity is poor, the wet system such as latitude, plating of being removed photoresist in the post-order process of encapsulation
Steam caused by journey has an opportunity the faying face for invading lead frame and plastic-sealed body, and reliability but runs into very big challenge, and humidity is quick
It is low to feel grade, easily produces layering, or even pulls bonding wire, forms electrical property failure；Other chip is by conductive adhesive in chip
On seat, the electrical and thermal conductivity performance of conducting resinl can also have an impact to the reliability of product, and conducting resinl generally comprises solvent and host,
Once conducting resinl excessive spilling or it is long when place sovent diffusion in conducting resinl, lead frame can be stain, reduce product can
By property.
Utility model content
The purpose of this utility model is to provide a kind of associativity for improving plastic-sealed body and lead frame, the half of high reliability
The novel high-density frame structure of conductor encapsulated circuit.
What the utility model was realized in：A kind of novel high-density frame structure of semiconductor packages circuit, including it is more
Individual lead frame unit, the lead frame unit are connected with each other by dowel, and the lead frame cell surface is layers of copper, described to draw
Wire frame unit includes chip carrier and pin, and chip is pasted onto on chip carrier by conducting resinl, and the chip carrier, which is provided with, to be used to prevent
The only excessive spilling resistance glue groove of conducting resinl.
Wherein, the resistance glue groove section is V-type, depth 0.1mm, width 0.2-0.5mm.
Wherein, it is additionally provided with perforate on the chip carrier and pin.
Wherein, the edge of the chip carrier and pin is provided with groove.
Wherein, the chip carrier and pin surface are additionally provided with half corrosion region.
The beneficial effects of the utility model are：The main material with faying face of the adhesion of lead frame and plastic-sealed body faying face
Expect relevant, the referred to herein as material of lead frame surface, for adhesion, copper and plastic-sealed body associativity are fairly good, and palladium
Gold surface is taken second place, and silver surface then differs many, and lead frame cell surface described in the utility model is layers of copper, from the choosing of basic material
Select guarantee adhesion, especially the semiconductor devices of one side encapsulation, the adhesion of lead frame and plastic-sealed body, which seems, more to be aggravated
Will；In addition on chip carrier set resistance glue groove, can prevent conducting resinl excessive spilling or conducting resinl in sovent diffusion, avoid
Lead frame unit is stain, improves product reliability.
Brief description of the drawings
Fig. 1 is the structural representation of the novel high-density frame structure embodiment of semiconductor packages circuit described in the utility model
Figure；
Fig. 2 is the product diagrammatic cross-section after frame structure encapsulation described in the utility model.
Wherein, 1, lead frame unit；11st, chip carrier；12nd, pin；13rd, glue groove is hindered；14th, perforate；15th, groove；2nd, core
Piece；3rd, plastic-sealed body.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining
The utility model, it is not used to limit the utility model.
As the novel high-density frame structure embodiment of semiconductor packages circuit described in the utility model, such as Fig. 1 and Fig. 2
It is shown, including multiple lead frame units 1, the lead frame unit 1 be connected with each other by dowel, the table of lead frame unit 1
Face is layers of copper, and the lead frame unit 1 includes chip carrier 11 and pin 12, and chip 2 is pasted onto on chip carrier 11 by conducting resinl,
The chip carrier 11 is provided with the excessive spilling for being used to prevent conducting resinl and hinders glue groove 13.
The adhesion of lead frame and plastic-sealed body faying face is mainly relevant with the material of faying face, referred to herein as lead frame
The material on frame surface, for adhesion, copper and plastic-sealed body associativity are fairly good, and porpezite surface is taken second place, and silver surface then differs
Many, the surface of lead frame unit 1 described in the utility model is layers of copper, ensures adhesion from the selection of basic material, especially
The adhesion of the semiconductor devices of one side encapsulation, lead frame unit 1 and plastic-sealed body 3 seems more important；In addition in chip carrier 11
It is upper set resistance glue groove 13, can prevent conducting resinl excessive spilling or conducting resinl in sovent diffusion, avoid stain lead frame list
Member 1, improve product reliability.The resistance glue groove section is V-type, and depth can be depending on the size of chip and chip carrier, preferably
It is 0.1mm, width 0.2-0.5mm to be worth for depth.
In the present embodiment, perforate 14 is additionally provided with the chip carrier 11 and pin 12, it is described to open after chip 2 is packed
Hole 14 forms lock glue hole, is provided with groove 15 in the edge of the chip carrier and pin, can correspondingly form lock glue groove, can be with
Increase the surface of lead frame unit 1 and the adhesion of plastic-sealed body 3.
In the present embodiment, the chip carrier and pin surface are additionally provided with half corrosion region, and the surface of half corrosion region is more thick
It is rough, the contact area of material can be increased, can also increase lead frame surface and the adhesion of plastic-sealed body.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (5)
1. a kind of novel high-density frame structure of semiconductor packages circuit, including multiple lead frame units, the lead frame list
Member is connected with each other by dowel, it is characterised in that the lead frame cell surface is layers of copper, and the lead frame unit includes core
Bar and pin, chip are pasted onto on chip carrier by conducting resinl, and the chip carrier, which is provided with, to be used to prevent the excessive of conducting resinl
Overflow resistance glue groove.
2. the novel high-density frame structure of semiconductor packages circuit according to claim 1, it is characterised in that the resistance glue
Slot cross-section is V-type, depth 0.1mm, width 0.2-0.5mm.
3. the novel high-density frame structure of semiconductor packages circuit according to claim 1, it is characterised in that the chip
Perforate is additionally provided with seat and pin.
4. the novel high-density frame structure of semiconductor packages circuit according to claim 1, it is characterised in that the chip
The edge of seat and pin is provided with groove.
5. the novel high-density frame structure of semiconductor packages circuit according to claim 1, it is characterised in that the chip
Seat and pin surface are additionally provided with half corrosion region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720513631.2U CN206806329U (en) | 2017-05-10 | 2017-05-10 | A kind of novel high-density frame structure of semiconductor packages circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720513631.2U CN206806329U (en) | 2017-05-10 | 2017-05-10 | A kind of novel high-density frame structure of semiconductor packages circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206806329U true CN206806329U (en) | 2017-12-26 |
Family
ID=60739821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720513631.2U Active CN206806329U (en) | 2017-05-10 | 2017-05-10 | A kind of novel high-density frame structure of semiconductor packages circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206806329U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616462A (en) * | 2018-12-04 | 2019-04-12 | 四川金湾电子有限责任公司 | A kind of totally-enclosed symmetric packages lead frame |
| CN113628977A (en) * | 2021-06-21 | 2021-11-09 | 江西万年芯微电子有限公司 | Frame and copper sheet device packaging design method |
-
2017
- 2017-05-10 CN CN201720513631.2U patent/CN206806329U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616462A (en) * | 2018-12-04 | 2019-04-12 | 四川金湾电子有限责任公司 | A kind of totally-enclosed symmetric packages lead frame |
| CN113628977A (en) * | 2021-06-21 | 2021-11-09 | 江西万年芯微电子有限公司 | Frame and copper sheet device packaging design method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |