CN207752433U - A kind of cpu heat - Google Patents

Abstract

The utility model belongs to technical field of heat dissipation, more particularly to a kind of cpu heat, including heat sink assembly, several radiation aluminium bottoms and several heat conducting pipes, one end of heat conducting pipe is plugged in heat sink assembly, the other end of heat conducting pipe is plugged in radiation aluminium bottom, it is at least plugged with a heat conducting pipe in each radiation aluminium bottom, the utility model passes through several heat conducting pipes of grafting in same heat sink assembly, several radiation aluminium bottoms are connected by several heat conducting pipes, in actual use, several radiation aluminium bottoms may be connected on different CPU, realize that a radiator radiates to multiple CPU simultaneously, the utilization rate of the radiator is high, the cost of the effectively save installation radiator of energy and the occupied space of installation radiator, and the heat spreader structures are simple, it is easy to use.

Description

A kind of cpu heat

Technical field

The utility model belongs to technical field of heat dissipation, and in particular to a kind of cpu heat.

Background technology

The fever of electronic component has become the bottleneck for restricting microelectric technique.With the development of technology, individual calculus The power of machine CPU is higher and higher, and some has been over 100W.In view of the geometric dimension of CPU, the hair on CPU unit areas Heat is very surprising.Therefore, the heat dissipation of CPU is also increasingly taken seriously.In general, setting radiator structure in electronic product as CPU Heat dissipation is provided, radiator structure generally all includes fan, fastener, radiator (including bottom plate and fin), heat-conducting medium etc..

Since the power consumption of CPU is larger, often the volume of radiator is bigger than normal, in order to install radiator, it is desirable to be equipped with The space of the mainboard of multiple CPU is opposite to increase, however this does not meet the requirement of device miniaturization again, therefore urgently exploitation is a kind of scattered Thermal effect is good, the high radiator of radiator utilization rate.

Utility model content

In order to overcome shortcoming and defect existing in the prior art, the purpose of this utility model is to provide a kind of CPU to dissipate Hot device, the radiator can give multiple CPU to radiate simultaneously, and radiating efficiency is high, utilization rate is high and simple in structure, easy to use.

The purpose of this utility model is achieved through the following technical solutions：A kind of cpu heat, if including heat sink assembly, Dry radiation aluminium bottom and several heat conducting pipes, one end of heat conducting pipe are plugged in heat sink assembly, and the other end of heat conducting pipe is plugged in In radiation aluminium bottom, a heat conducting pipe is at least plugged in each radiation aluminium bottom.

Further, two heat conducting pipes are plugged in each radiation aluminium bottom.

Further, the radiation aluminium bottom include the first radiation aluminium bottom and be set to the first radiation aluminium bottom side second dissipate Hot aluminium bottom, the heat conducting pipe are four, and two one end of heat conducting pipe far from heat sink assembly are plugged in the first radiation aluminium bottom, separately The one end of outer two heat conducting pipes far from heat sink assembly is plugged in the second radiation aluminium bottom.

Further, four heat conducting pipes are generally aligned in the same plane with the first radiation aluminium bottom, the second radiation aluminium bottom, and four Heat conducting pipe and the first radiation aluminium bottom, the second radiation aluminium bottom are in the same side of heat sink assembly.

Further, two heat conducting pipes in the outer part are plugged in the first radiation aluminium bottom, two heat conducting pipe grafting in the inner part In the second radiation aluminium bottom, the second radiation aluminium bottom is between the first radiation aluminium bottom and heat sink assembly.

Further, two heat conducting pipes in the outer part include the longitudinal pipe being connected with heat sink assembly and with longitudinal direction The transverse pipe that pipe is connected, the transverse pipe are plugged in the first radiation aluminium bottom.

Further, arc interconnecting piece is connected between the longitudinal pipe and transverse pipe.

Further, first radiation aluminium bottom offers mounting groove with the second radiation aluminium bottom.

Further, the heat conducting pipe is copper heat conducting pipe, and the heat sink assembly is aluminium radiator fin component.

Further, the heat sink assembly includes the heat sink body of spaced setting and is installed in heat sink body Both ends are used to fix the buckle of heat conducting pipe.

The beneficial effects of the utility model are：The utility model passes through several heat conduction of grafting in same heat sink assembly Pipe connects several radiation aluminium bottoms by several heat conducting pipes, and in actual use, several radiation aluminium bottoms may be connected on different CPU, It realizes a radiator while radiating to multiple CPU, the utilization rate of the radiator is high, can the effectively save cost for installing radiator With installation radiator occupied space, and the heat spreader structures are simple, easy to use.

Description of the drawings

Fig. 1 is the dimensional structure diagram of the utility model；

Fig. 2 is the overlooking structure diagram of the utility model；

Fig. 3 is the structural schematic diagram of buckle described in the utility model.

Reference numeral is：

1- heat sink assemblies；2- heat conducting pipes；The first radiation aluminiums of 3- bottom；

The second radiation aluminiums of 4- bottom；5- mounting grooves；11- heat sink bodies；

12- buckles；21- longitudinal pipes；22- transverse pipes；

23- interconnecting pieces.

Specific implementation mode

For the ease of the understanding of those skilled in the art, with reference to embodiment and attached drawing 1-2 to the utility model make into The explanation of one step, the content that embodiment refers to not are the restriction to the utility model.

Please refer to attached drawing 1-2, a kind of cpu heat, including heat sink assembly 1, several radiation aluminium bottoms and several heat conduction One end of pipe 2, heat conducting pipe 2 is plugged in heat sink assembly 1, and the other end of heat conducting pipe 2 is plugged in radiation aluminium bottom, each described A heat conducting pipe 2 is at least plugged in radiation aluminium bottom.

The utility model is connected by several heat conducting pipes 2 of grafting in same heat sink assembly 1 by several heat conducting pipes 2 Several radiation aluminium bottoms, in actual use, several radiation aluminium bottoms may be connected on different CPU, realize that a radiator is given simultaneously Multiple CPU heat dissipations, the utilization rate of the radiator is high, and the cost and installation radiator of the effectively save installation radiator of energy are occupied Space, and the heat spreader structures are simple, it is easy to use.

Further, two heat conducting pipes 2 are plugged in each radiation aluminium bottom.

The utility model, can be faster by heat transfer by two heat conducting pipes 2 of grafting in each radiation aluminium bottom To heat sink assembly 1, more effectively heat dissipation is realized.

Further, the radiation aluminium bottom includes the first radiation aluminium bottom 3 and is set to the second of 3 side of the first radiation aluminium bottom Radiation aluminium bottom 4, the heat conducting pipe 2 are four, and one end of the separate heat sink assembly 1 of two heat conducting pipes 2 is plugged in the first heat dissipation In aluminium bottom 3, one end of the separate heat sink assembly 1 of another two heat conducting pipes 2 is plugged in the second radiation aluminium bottom 4.

The utility model is connected to by two heat conducting pipes 2 in the first radiation aluminium bottom 3, and in addition two heat conducting pipes 2 are connected to In second radiation aluminium bottom 4, two CPU can be given to radiate simultaneously, that is, ensure that radiating efficiency, and the space of installing radiator can be saved And the cost of the multiple radiators of installing.

Further, four heat conducting pipes 2 are generally aligned in the same plane with the first radiation aluminium bottom 3, the second radiation aluminium bottom 4, and Four heat conducting pipes 2 and the first radiation aluminium bottom 3, the second radiation aluminium bottom 4 are in the same side of heat sink assembly 1.

Four heat conducting pipes 2 and the first radiation aluminium bottom 3 in the utility model, the second radiation aluminium bottom 4 be generally aligned in the same plane and It is in the same side of heat sink assembly 1 so that more convenient using the radiator.

Further, two heat conducting pipes 2 in the outer part are plugged in the first radiation aluminium bottom 3, and two heat conducting pipes 2 in the inner part are inserted It is connected to the second radiation aluminium bottom 4, the second radiation aluminium bottom 4 is between the first radiation aluminium bottom 3 and heat sink assembly 1.

The utility model is plugged in the first radiation aluminium bottom 3 by two heat conducting pipes 2 in the outer part, two heat conduction in the inner part Pipe 2 is plugged in the second radiation aluminium bottom 4 so that the heat of two CPU will not intersect transmission, effectively increase radiating efficiency.

Further, two heat conducting pipes 2 in the outer part include the longitudinal pipe 21 being connected with heat sink assembly 1 and with Longitudinal pipe 21 is at an angle and the transverse pipe 22 that is connected, the transverse pipe 22 are plugged in the first radiation aluminium bottom 3.

It is slotting to state transverse pipe 22 by being arranged with longitudinal pipe 21 at an angle and the transverse pipe 22 that is connected for the utility model Be connected in the first radiation aluminium bottom 3, can by the size at the first radiation aluminium bottom 3 and the second radiation aluminium bottom 4 respectively according to actual needs with Meaning setting.

Further, arc interconnecting piece 23 is connected between the longitudinal pipe 21 and transverse pipe 22.

The utility model is connected to arc interconnecting piece 23 between longitudinal pipe 21 and transverse pipe 22 by setting so that longitudinal pipe 21 is gentler with 22 transition of transverse pipe, is conducive to the release of stress in heat conducting pipe 2 so that heat conducting pipe 2 and the first radiation aluminium bottom 3 Connection is more secured.

Further, first radiation aluminium bottom 3 and the second radiation aluminium bottom 4 offer mounting groove 5.

The utility model at the first radiation aluminium bottom 3 and the second radiation aluminium bottom 4 by opening up mounting groove 5, in use, passing through line Radiator is connected on CPU by spring so that it is more convenient to install and dismantle the radiator.

Further, the heat conducting pipe 2 is copper heat conducting pipe 2, and the heat sink assembly 1 is aluminium radiator fin component 1.

The utility model uses copper heat conducting pipe 2 so that heat conduction faster, can quickly transmit heat；Use aluminium radiator fin component 1 Heat dissipation, can effectively reduce the cost while ensureing heat dissipation effect.

Further, the heat sink assembly 1 includes the heat sink body 11 of spaced setting and is installed in cooling fin 11 both ends of ontology are used to fix the buckle 12 of heat conducting pipe 2.

The utility model at the both ends of heat sink body 11 by being fixedly connected with buckle 12 so that copper pipe can be fixed preferably In on radiator body so that heat dissipation effect is more preferable and anti seismic efficiency when using is more preferable.

Above-described embodiment is the preferable implementation of the utility model, and in addition to this, the utility model can be with other sides Formula realizes that any obvious replacement is in the protection model of the utility model without departing from the concept of the premise utility Within enclosing.

Claims (10)

1. a kind of cpu heat, it is characterised in that：Including heat sink assembly, several radiation aluminium bottoms and several heat conducting pipes, heat conduction One end of pipe is plugged in heat sink assembly, and the other end of heat conducting pipe is plugged in radiation aluminium bottom, in each radiation aluminium bottom At least it is plugged with a heat conducting pipe.

2. a kind of cpu heat according to claim 1, it is characterised in that：It is plugged with two in each radiation aluminium bottom Root heat conducting pipe.

3. a kind of cpu heat according to claim 2, it is characterised in that：The radiation aluminium bottom includes the first radiation aluminium Bottom and the second radiation aluminium bottom for being set to the first radiation aluminium bottom side, the heat conducting pipe are four, and two heat conducting pipes are far from heat dissipation One end of piece component is plugged in the first radiation aluminium bottom, and in addition two one end of heat conducting pipe far from heat sink assembly are plugged in second In radiation aluminium bottom.

4. a kind of cpu heat according to claim 3, it is characterised in that：Four heat conducting pipes and the first radiation aluminium Bottom, the second radiation aluminium bottom are generally aligned in the same plane, and four heat conducting pipes and the first radiation aluminium bottom, the second radiation aluminium bottom are in heat dissipation The same side of piece component.

5. a kind of cpu heat according to claim 4, it is characterised in that：Two heat conducting pipes in the outer part are plugged in One radiation aluminium bottom, two heat conducting pipes in the inner part are plugged in the second radiation aluminium bottom, and the second radiation aluminium bottom is located at the first radiation aluminium bottom Between heat sink assembly.

6. a kind of cpu heat according to claim 5, it is characterised in that：Two heat conducting pipes in the outer part include The longitudinal pipe being connected with heat sink assembly and the transverse pipe being connected with longitudinal pipe, the transverse pipe are plugged in the first radiation aluminium In bottom.

7. a kind of cpu heat according to claim 6, it is characterised in that：It is connected between the longitudinal pipe and transverse pipe There is arc interconnecting piece.

8. a kind of cpu heat according to claim 7, it is characterised in that：First radiation aluminium bottom and the second heat dissipation Aluminium bottom offers mounting groove.

9. a kind of cpu heat according to claim 1, it is characterised in that：The heat conducting pipe is copper heat conducting pipe, described to dissipate Backing component is aluminium radiator fin component.

10. a kind of cpu heat according to claim 1, it is characterised in that：The heat sink assembly includes spaced The heat sink body of setting and heat sink body both ends are installed in for fixing the buckle of heat conducting pipe.