CN207637784U - A kind of bonding wire fixed engagement semiconductor package - Google Patents
A kind of bonding wire fixed engagement semiconductor package Download PDFInfo
- Publication number
- CN207637784U CN207637784U CN201720990887.2U CN201720990887U CN207637784U CN 207637784 U CN207637784 U CN 207637784U CN 201720990887 U CN201720990887 U CN 201720990887U CN 207637784 U CN207637784 U CN 207637784U
- Authority
- CN
- China
- Prior art keywords
- joint sheet
- chip
- bonding wire
- substrate
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Wire Bonding (AREA)
Abstract
The utility model discloses a kind of bonding wire fixed engagement semiconductor package, including substrate, die bond on substrate chip, be set to the first joint sheet on chip positioned at chip both ends and the second bonding pad, the third joint sheet for being located on substrate the setting of two side position of chip and the 4th bonding pad, realize the bonding wire that the first joint sheet connect with third joint sheet and the second joint sheet and the 4th joint sheet connect；First, second, third and fourth joint sheet is equipped with the inverted T shaped groove of invagination, and bonding wire includes a linear portion and both ends are block portion, and the block portion of bonding wire is pressed into inverted T-slot and forms secure bond；The bottom of each joint sheet is equipped with pillar, and the top surface of chip and substrate is set to the installation groove hole that interference fit is formed with pillar；Chip, which is fixed with substrate using mucigel, to be binded, and the position that substrate corresponds to chip bonding is equipped with tooth angle protrusion or tooth angle recess.
Description
Technical field
The utility model is related to a kind of semiconductor package more particularly to a kind of bonding wire fixed engagement semiconductor packages knots
Structure.
Background technology
In the prior art, all universal real for the encapsulation field of the chips such as the encapsulation field of semiconductor, especially LED
Use bonding wire（The connecting line of copper wire or gold thread）Realize that the connection conducting of chip and substrate connects electric effect.Traditional bonding wire with
The connection of chip or substrate is all to make bonding wire end and core by semiconductor packages bonding equipment or semiconductor packages bonding equipment etc.
The jointing end face of piece or substrate forms engagement；When engagement, the end of bonding wire is deformed its joint surface through pressure and increases, and then passes through
Special vibratory process makes the end of bonding wire and the jointing end face of chip or substrate bind directly fixation.Due to chip or substrate
Joint surface be planar structure, after bonding wire end is combined with the end face of planar structure, due to not certain position limiting structure or
Other auxiliary fixing structures etc. can engage unstable situation with chip or substrate it is easy to appear bonding wire, and be produced after engagement
Raw certain external force is also easily separated from when pullling bonding wire；Although having gradually appeared some now between bonding wire and jointing end face
Increased bonding glue, adhesive layer or the fixation glue-line etc. for covering bonding wire and jointing end face binding site, but these glue-lines can only rise
To engagement and order covering fixed function is reinforced, does not play strength fixed engagement or engagement locking, limiting dead effect, while not yet
Has the effect that bonding wire cannot be pulled out or be detached from, effect and effect are limited, also need to be improved.
Invention content
The shortcomings that the purpose of this utility model is to overcome the above-mentioned prior arts and deficiency provide a kind of fixation of bonding wire and connect
Semiconductor package is closed, which is equipped with invagination on the jointing end face of chip and substrate
Inverted T-slot, when bonding wire end is engaged through pressure deformation and the operations such as vibratory process with jointing end face, bonding wire end quilt completely
In indentation inverted T-slot and the space of inverted T-slot is filled up, after completing engagement, bonding wire end, that is, stuck cannot extract in inverted T-slot
It falls off, forms strength and engage, do not fall off permanently；When firmly pullling bonding wire, its end of wire bond fracture can not extract；In addition,
The covering and solidification for being aided with insulation protection glue are fixed, and the work of required insulation effect and stronger protection bonding wire end is further reached
With；Joint sheet pillar and the cooperation of corresponding installation groove hole, realize the fixed installation of each joint sheet not loose or dislocation；Simultaneously in base
Plate, which is equipped with tooth angle protrusion or tooth angle recess, can reinforce the fastness with mucigel, make chip also can stable connection with substrate.This
The bonding wire encapsulation splicing results of bonding wire fixed engagement semiconductor package are strongly stablized, and not easily to fall off after engagement and connection is steady
Fixed, structure is also relatively simple, the other good engagement fixed effects of energy, and yields is also high.
Technical solution adopted by the utility model to solve its technical problems is：A kind of bonding wire fixed engagement semiconductor packages
Structure, including substrate, die bond on substrate chip, be set on chip be located at chip both ends the first joint sheet and the second knot
Close pad, on substrate be located at two side position of chip setting third joint sheet and the 4th bonding pad, realize the first joint sheet and
Third joint sheet connects and the bonding wire of the second joint sheet and the connection of the 4th joint sheet；First, second, third and fourth joint sheet
It is equipped with the inverted T shaped groove of invagination, bonding wire includes a linear portion and both ends are block portion, and the block portion of bonding wire is pressed into inverted T-slot
And form secure bond；The bottom of each joint sheet is equipped with pillar, and the top surface of chip and substrate is set to and pillar forms interference
The installation groove hole of cooperation；Chip, which is fixed with substrate using mucigel, to be binded, and the position that substrate corresponds to chip bonding is equipped with tooth angle
Protrusion or tooth angle recess.
Further, the chip top surface is equipped with the first joint sheet of covering, the second joint sheet, bonding wire and the first joint sheet
With the insulation protection glue of the second joint sheet secure bond position.
Further, the top surface of chip is completely covered in the insulation protection glue.
Further, the substrate surface coats matcoveredn.
In conclusion jointing end face of the bonding wire fixed engagement semiconductor package of the utility model in chip and substrate
It is equipped with the inverted T-slot of invagination, when bonding wire end is engaged through operations such as pressure deformations and vibratory process with jointing end face, bonding wire
End is pressed into inverted T-slot and fills up the space of inverted T-slot, after completing engagement, bonding wire end, that is, stuck in inverted T-slot completely
Interior cannot extract falls off, and forms strength and engages, does not fall off permanently；When firmly pullling bonding wire, its end of wire bond fracture can not
It extracts；In addition, being aided with covering and the solidification fixation of insulation protection glue, further reach required insulation effect and stronger protection weldering
The effect of thread end；Joint sheet pillar and the cooperation of corresponding installation groove hole, it is de- to realize that the fixed installation of each joint sheet does not loosen
It falls；The fastness with mucigel can be reinforced by being equipped with tooth angle protrusion or tooth angle recess on substrate simultaneously, and chip is made also with substrate
Stable connection.The bonding wire encapsulation splicing results of this bonding wire fixed engagement semiconductor package are strongly stablized, and are not easy after engagement
Fall off and stable connection, structure is also relatively simple, can other good engagement fixed effects, yields is also high.
Description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and examples：
Fig. 1 is a kind of structure diagrammatic cross-sectional view of bonding wire fixed engagement semiconductor package of the present embodiment 1；
Fig. 2 is the structural schematic diagram of substrate；
Fig. 3 is the structural schematic diagram of joint sheet；
Fig. 4 is the structural schematic diagram of bonding wire；
Fig. 5 is the structural schematic diagram of chip；
Identical component uses identical label in figure.
Specific implementation mode
Embodiment 1
A kind of bonding wire fixed engagement semiconductor package described in the present embodiment 1, as shown in Figure 1, Figure 2, Fig. 3, Fig. 4 and figure
Shown in 5, including substrate 1, die bond on substrate chip 2, be set to the first joint sheet 3 and the on chip positioned at chip both ends
Two bonding pads 4, the third joint sheet 5 that the setting of two side position of chip is located on substrate and the 4th bonding pad 6 realize that first connects
Close the bonding wire 16 that pad is connected with third joint sheet and the second joint sheet and the 4th joint sheet connect；First, second, third and
Four joint sheets are equipped with the inverted T shaped groove 7 of invagination, and bonding wire includes a linear portion 8 and both ends are block portion 9, the block portion pressure of bonding wire
Enter in inverted T-slot and forms secure bond；The bottom of each joint sheet is equipped with pillar 10, the top surface of chip and substrate be set to
Pillar forms the installation groove hole 11 of interference fit；Chip, which is fixed with substrate using mucigel 12, to be binded, and it is glutinous that substrate corresponds to chip
The position of conjunction is equipped with tooth angle protrusion 13.
The chip top surface is equipped with the first joint sheet of covering, the second joint sheet, bonding wire and the first joint sheet and the second joint sheet
The insulation protection glue 14 of secure bond position.
The top surface of chip is completely covered in the insulation protection glue.
The substrate surface coats matcoveredn 15.
The above descriptions are merely preferred embodiments of the present invention, not makees to the structure of the utility model any
Formal limitation.It is any simple modification made by the above technical examples according to the technical essence of the present invention, equivalent
Variation and modification, in the range of still falling within the technical solution of the utility model.
Claims (4)
1. a kind of bonding wire fixed engagement semiconductor package, which is characterized in that including substrate, die bond on substrate chip,
It is set to the first joint sheet and the second bonding pad on chip positioned at chip both ends, set positioned at two side position of chip on substrate
The third joint sheet and the 4th bonding pad set realize that the first joint sheet connects and the second joint sheet and the 4th with third joint sheet
The bonding wire of joint sheet connection；First, second, third and fourth joint sheet is equipped with the inverted T shaped groove of invagination, and bonding wire includes one linear
Portion and both ends are block portion, and the block portion indentation inverted T-slot of bonding wire is interior and forms secure bond；The bottom of each joint sheet is equipped with
The top surface of pillar, chip and substrate is set to the installation groove hole that interference fit is formed with pillar；Chip uses viscose with substrate
The fixed bonding of layer, the position that substrate corresponds to chip bonding are equipped with tooth angle protrusion or tooth angle recess.
2. a kind of bonding wire fixed engagement semiconductor package according to claim 1, which is characterized in that the chip
Top surface is equipped with the first joint sheet of covering, the second joint sheet, bonding wire and the first joint sheet and the second joint sheet secure bond position
Insulation protection glue.
3. a kind of bonding wire fixed engagement semiconductor package according to claim 2, which is characterized in that the insulation
The top surface of chip is completely covered in Protection glue.
4. a kind of bonding wire fixed engagement semiconductor package according to claim 3, which is characterized in that the substrate
Surface coats matcoveredn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720990887.2U CN207637784U (en) | 2017-08-09 | 2017-08-09 | A kind of bonding wire fixed engagement semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720990887.2U CN207637784U (en) | 2017-08-09 | 2017-08-09 | A kind of bonding wire fixed engagement semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207637784U true CN207637784U (en) | 2018-07-20 |
Family
ID=62861746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720990887.2U Active CN207637784U (en) | 2017-08-09 | 2017-08-09 | A kind of bonding wire fixed engagement semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207637784U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112117268A (en) * | 2020-09-25 | 2020-12-22 | 中科芯(苏州)微电子科技有限公司 | Chip integrated module |
-
2017
- 2017-08-09 CN CN201720990887.2U patent/CN207637784U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112117268A (en) * | 2020-09-25 | 2020-12-22 | 中科芯(苏州)微电子科技有限公司 | Chip integrated module |
| WO2022062387A1 (en) * | 2020-09-25 | 2022-03-31 | 中科芯(苏州)微电子科技有限公司 | Chip integrated module |
| CN112117268B (en) * | 2020-09-25 | 2023-02-10 | 中科芯(苏州)微电子科技有限公司 | Chip integrated module |
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