CN202473894U - Semiconductor plastic-packaged component with heat radiating plate - Google Patents
Semiconductor plastic-packaged component with heat radiating plate Download PDFInfo
- Publication number
- CN202473894U CN202473894U CN2012200523212U CN201220052321U CN202473894U CN 202473894 U CN202473894 U CN 202473894U CN 2012200523212 U CN2012200523212 U CN 2012200523212U CN 201220052321 U CN201220052321 U CN 201220052321U CN 202473894 U CN202473894 U CN 202473894U
- Authority
- CN
- China
- Prior art keywords
- heat radiating
- radiating plate
- semiconductor plastic
- epoxy resin
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a semiconductor plastic-packaged component with a heat radiating plate, and the semiconductor plastic-packaged component comprises a metal heat radiating plate, a chip, pins and a metal wire, wherein the chip is adhered onto the metal heat radiating plate through adhesive, the pins are connected with the chip through the metal wire, the metal heat radiating plate, the chip, the pins and the metal wire form a semiconductor plastic-packaged body after being plastically packaged by epoxy resin, and the edge of the junction of the metal heat radiating plate and the epoxy resin forms a hem towards the inside of the semiconductor plastic-packaged body; and the hem is provided with a plurality of holes for the epoxy resin to pass through, and the holes are named anchoring holes. The edge of the junction of the metal heat radiating plate and the epoxy resin is designed to be a hem, and the combination of the epoxy resin and the metal heat radiating plate is favored, so that the semiconductor plastic-packaged body has better plastic-packaging effect, can effectively solve the layering problem of the component and is favorable for improving the thermal stress deformation resistance of the component, and the sealing performance, the functional parameters and the reliability of the product are well guaranteed.
Description
Technical field
The utility model relates to the semiconductor packaging field, particularly a kind of semiconductor plastic package components and parts that have heating panel.
Background technology
When semi-conductive encapsulation process; Be in hot environment; On sealed in unit, all be provided with corresponding heat abstractor, the Plastic Package components and parts of existing band heat abstractor are shown in Fig. 1-3; Mainly be to adopt material package such as metallic heat radiating plate 1, epoxy resin 2, chip 5, wire 6, adhesive 4, pin 3 to form; Chip 5 is bonded on the metallic heat radiating plate 1 through adhesive 4, and chip 5 is connected with pin 3 through wire 6 again, thereby makes chip, metallic heat radiating plate, wire 6, pin 3 form an integral body through epoxy resin 2 plastic packagings.
But different material is understood the variation of factors such as Yin Wendu, humidity, vibrations and is caused the generation layering between different material easily; Particularly when hot environment, because the thermal coefficient of expansion of different material is different, all produce push-and-pull stress in various degree, thereby can cause layering between heating panel and the plastic-sealed body; In addition, when using semiconductor product, can use fixedly heating panel of external force, also cause layering between heating panel and the plastic-sealed body easily, can cause both to separate when serious, as shown in Figure 4.When heating panel and plastic-sealed body generation layering break away from, then can finally cause the problems such as functional defect or inefficacy of plastic semiconductor encapsulation components and parts.
The utility model content
The utility model is for solving the problems of the technologies described above; A kind of semiconductor plastic package components and parts that have heating panel are provided; Be beneficial to plastic semiconductor the encapsulation plastic-sealed body of components and parts and combining of heating panel; Solved the lamination problem of components and parts, improved the thermal stress resistance changing capability of components and parts, the sealing of product, functional parameter and reliability all are guaranteed.
The technical scheme of the utility model is following:
A kind of semiconductor plastic package components and parts that have heating panel; Comprise metallic heat radiating plate, chip, pin and wire; Chip is bonded on the metallic heat radiating plate through adhesive; Be connected through wire between pin and the chip, metallic heat radiating plate, chip, pin and wire form the semiconductor plastic package body through the epoxy resin plastic packaging, and it is characterized in that: the edge that said metallic heat radiating plate combines with epoxy resin is formed with bending edge in the semiconductor plastic package body; Said bending edge is provided with the hole that some confession epoxy resin run through, and is called anchor hole.
Said bending edge is positioned at the two sides of semiconductor plastic package body.
Said bending edge can be to face directly, also can be cambered surface or the like.
Said anchor hole can be different shapes such as circular, oval, square or rhombus.
The beneficial effect of the utility model is following:
The utility model is arranged to bending edge with the jointing edge of metallic heat radiating plate and epoxy resin; Help combining of epoxy resin and metallic heat radiating plate; Make semiconductor plastic package body plastic packaging better effects if; Can effectively solve the lamination problem of components and parts, also help the thermal stress resistance changing capability that improves components and parts, make sealing, functional parameter and the reliability of product all be guaranteed.
Description of drawings
Fig. 1 is the main TV structure sketch map that traditional plastic semiconductor encapsulates components and parts
Fig. 2 is the side-looking structural representation of Fig. 1
Fig. 3 is the backsight structural representation of Fig. 1
Fig. 4 is a separated structures sketch map between heating panel and the plastic-sealed body of conventional semiconductors Plastic Package components and parts
Fig. 5 is the main TV structure sketch map of the utility model
Fig. 6 is the side-looking structural representation of the utility model
Wherein Reference numeral is: 1 metallic heat radiating plate, 2 epoxy resin, 3 pins, 4 adhesives, 5 chips, 6 wires, 7 bent faces, 8 anchor holes.
Embodiment
Below in conjunction with accompanying drawing the utility model is done and to be described in further detail:
Shown in Fig. 5-6; A kind of semiconductor plastic package components and parts that have heating panel; Comprise metallic heat radiating plate, chip, pin and wire, chip is bonded on the metallic heat radiating plate through adhesive, is connected through wire between pin and the chip; Metallic heat radiating plate, chip, pin and wire form the semiconductor plastic package body through the epoxy resin plastic packaging; The edge that said metallic heat radiating plate combines with epoxy resin is formed with bending edge in the semiconductor plastic package body, said bending edge is provided with the hole that some confession epoxy resin run through, and is called anchor hole.
Said bending edge is positioned at the two sides of semiconductor plastic package body.
Said bending edge can be to face directly, also can be cambered surface or the like.
Said anchor hole can be different shapes such as circular, oval, square or rhombus.
More than, describe with reference to the example of concrete example the utility model.But the utility model is not limited in above-mentioned concrete example.
For example, about the concrete form or the configuration relation of metallic heat radiating plate, plastic-sealed body among the present invention, the insider also belongs to present technique scheme scope to what it carried out suitable design alteration.
Claims (4)
1. semiconductor plastic package components and parts that have heating panel; Comprise metallic heat radiating plate, chip, pin and wire; Chip is bonded on the metallic heat radiating plate through adhesive; Be connected through wire between pin and the chip, metallic heat radiating plate, chip, pin and wire form the semiconductor plastic package body through the epoxy resin plastic packaging, and it is characterized in that: the edge that said metallic heat radiating plate combines with epoxy resin is formed with bending edge in the semiconductor plastic package body; Said bending edge is provided with the hole that some confession epoxy resin run through, and is called anchor hole.
2. semiconductor plastic package components and parts according to claim 1 is characterized in that: said bending edge is positioned at the two sides of semiconductor plastic package body.
3. semiconductor plastic package components and parts according to claim 1 and 2 is characterized in that: said bending edge is to face directly, perhaps cambered surface.
4. semiconductor plastic package components and parts according to claim 1 is characterized in that: said anchor hole is circular, and is perhaps oval, perhaps square, perhaps rhombus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200523212U CN202473894U (en) | 2012-02-17 | 2012-02-17 | Semiconductor plastic-packaged component with heat radiating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200523212U CN202473894U (en) | 2012-02-17 | 2012-02-17 | Semiconductor plastic-packaged component with heat radiating plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202473894U true CN202473894U (en) | 2012-10-03 |
Family
ID=46922037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200523212U Expired - Fee Related CN202473894U (en) | 2012-02-17 | 2012-02-17 | Semiconductor plastic-packaged component with heat radiating plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202473894U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
-
2012
- 2012-02-17 CN CN2012200523212U patent/CN202473894U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20160217 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |