CN207625873U - A kind of novel double-layer wiring board - Google Patents
A kind of novel double-layer wiring board Download PDFInfo
- Publication number
- CN207625873U CN207625873U CN201721851242.7U CN201721851242U CN207625873U CN 207625873 U CN207625873 U CN 207625873U CN 201721851242 U CN201721851242 U CN 201721851242U CN 207625873 U CN207625873 U CN 207625873U
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- plate body
- heat conducting
- conducting pipe
- buried layer
- copper
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Abstract
The utility model discloses a kind of novel double-layer wiring boards,Including plate body,Upper layers of copper and lower layers of copper,The upper layers of copper and the lower layers of copper are respectively embedded into and are set to the upper of the plate body,Lower both sides,Four apex angles of the plate body are equipped with mounting hole,The top of the plate body, which is run through, is equipped with several guide holes,The both sides of the plate body are equipped with card slot,One end insertion of the plate body is provided with buried layer,The buried layer is made of the first buried layer and the second buried layer,The plate body is internally provided with the first heat conducting pipe and the second heat conducting pipe,First heat conducting pipe is specifically equipped with " 2 " root,And it is set between first buried layer and second buried layer,First heat conducting pipe described in described second heat conducting pipe connection " 2 " root,And both ends insertion is set to the both sides of the plate body,One end of the plate body is equipped with barcode scanning area,This kind of double-layered circuit board thermal diffusivity is good,Installation is stablized,And there is trackability.
Description
Technical field
The utility model is related to wiring board technology field, specially a kind of novel double-layer wiring board.
Background technology
It is constituted in general, circuit base plate is mainly superimposed by multi-layered patterned line layer and dielectric layer.Wherein,
Patterned line layer be defined to be formed with etch process by lithographic by copper foil layer, and dielectric layer be configured at patterned line layer it
Between, two adjacent patterned line layers are isolated.In addition, being through through dielectric layer between adjacent patterned line layer
Conductive through hole or conductive vias and be electrically connected to each other.Finally, in the various electronic components of the surface configuration of circuit base plate, and pass through
The circuit design of internal wiring and achieve the purpose that electronic signal transmit.However, as market should have gently electronic product
Thin short and small and easy to carry demand, therefore in current electronic product, will originally be welded in the electronics on circuit base plate surface
Element is designed as that an embedded element of the inside of circuit base plate can be embedded in, and can increase the wiring side on circuit base plate surface in this way
Product, to achieve the purpose that electronic product is thinned.Existing embedded element maintainability is poor, and the heat dissipation performance of wiring board
Difference seriously affects the service life of component and wiring board, and trackability is poor, and wiring board quality problems are without very fast preferable monitoring
Flow, and inconvenience is installed, wiring is easy to intersect mixed.
So how to design a kind of novel double-layer wiring board, becoming us will currently solve the problems, such as.
Utility model content
It is mentioned above in the background art to solve the purpose of this utility model is to provide a kind of novel double-layer wiring board
Problem.
To achieve the above object, the utility model provides the following technical solutions：A kind of novel double-layer wiring board, including plate
Body, upper layers of copper and lower layers of copper, the upper layers of copper and the lower layers of copper are respectively embedded into the upper and lower both sides for being set to the plate body, institute
Four apex angles for stating plate body are equipped with mounting hole, and the top of the plate body, which is run through, is equipped with several guide holes, and the both sides of the plate body are equal
Equipped with card slot, one end insertion of the plate body is provided with buried layer, and the buried layer is made of the first buried layer and the second buried layer, institute
That states plate body is internally provided with the first heat conducting pipe and the second heat conducting pipe, and first heat conducting pipe is specifically equipped with " 2 " root, and is set to institute
It states between the first buried layer and second buried layer, second heat conducting pipe is through the first heat conducting pipe described in " 2 " root, and both ends are embedded in
It is set to the both sides of the plate body.
Further, copper facing inside the guide hole.
Further, one end of the plate body is equipped with barcode scanning area, and the barcode scanning area is sprayed with Quick Response Code.
Further, first heat conducting pipe extends to the both ends of the plate body.
Further, the inside of first heat conducting pipe and second heat conducting pipe is filled with graphite powder.
Compared with prior art, the utility model has the beneficial effects that：This kind of novel double-layer wiring board passes through card slot and peace
The design for filling hole, considerably increases the stability of wiring board, and guide hole inside copper facing makes layers of copper and lower layers of copper be connected, conveniently connects
Line will not intersect mixed.One end of plate body is equipped with barcode scanning area, and barcode scanning area is sprayed with Quick Response Code, technique stream is recorded using Quick Response Code
Journey, to make wiring board that there is trackability.First heat conducting pipe extends to the both ends of plate body, and heat is sent out, and improves and dissipates
Hot property.The inside of first heat conducting pipe and the second heat conducting pipe is filled with graphite powder, is improved using the high-termal conductivity of graphite powder
Radiating efficiency, so having a wide range of applications.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the inner side structural schematic diagram of the utility model；
In figure：1- plate bodys；The upper layers of copper of 2-；Layers of copper under 3-；4- buried layers；The first heat conducting pipes of 5-；The second heat conducting pipes of 6-；7- pacifies
Fill hole；8- guide holes；9- card slots；10- barcode scannings area；The first buried layers of 11-；The second buried layers of 12-.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of novel double-layer wiring board, including plate body 1,
Upper layers of copper 2 and lower layers of copper 3, the upper layers of copper 2 and the lower layers of copper 3 are respectively embedded into the upper and lower both sides for being set to the plate body 1,
Four apex angles of the plate body 1 are equipped with mounting hole 7, and the top of the plate body 1, which is run through, is equipped with several guide holes 8, the plate body 1
Both sides are equipped with card slot 9, and one end insertion of the plate body 1 is provided with buried layer 4, and the buried layer 4 is by the first buried layer 11 and the
Two buried layers 12 are constituted, and the plate body 1 is internally provided with the first heat conducting pipe 5 and the second heat conducting pipe 6, and first heat conducting pipe 5 is specific
It equipped with " 2 " root, and is set between first buried layer 11 and second buried layer 12, second heat conducting pipe 6 runs through " 2 " root
First heat conducting pipe 5, and both ends insertion is set to the both sides of the plate body 1.
Further, 8 inside copper facing of the guide hole makes the upper layers of copper 2 and the lower layers of copper 3 be connected, facilitates wiring not
It can intersect mixed.
Further, one end of the plate body 1 is equipped with barcode scanning area 10, and the barcode scanning area 10 is sprayed with Quick Response Code, utilizes two dimension
Code records technological process, to make wiring board have trackability.
Further, first heat conducting pipe 5 extends to the both ends of the plate body 1, and heat is sent out, and improves heat dissipation
Performance enhances service life.
Further, the inside of first heat conducting pipe 5 and second heat conducting pipe 6 is filled with graphite powder, utilizes stone
The high-termal conductivity of ink powder improves radiating efficiency.
Operation principle：First, upper layers of copper 2 and lower layers of copper 3 are respectively embedded into the upper and lower both sides for being set to plate body 1, plate body 1
Top, which is run through, is equipped with several guide holes 8, and 8 inside copper facing of guide hole makes layers of copper 2 and lower layers of copper 3 be connected, takes two sides structure, utilizes
Guide hole 8 carrys out cabling, and the intersection for avoiding circuit is mixed, and four apex angles of plate body 1 are equipped with mounting hole 7, and the both sides of plate body 1 are all provided with
There is card slot 9, mounting hole 7 and card slot 9 are matched, improve the mounting stability of wiring board, in one end insertion of plate body 1 is provided with
Buried layer 4, buried layer 4 are made of the first buried layer 11 and the second buried layer 12, and the application of buried layer, the cloth for increasing electronic component empties
Between, the first heat conducting pipe 5 and the second heat conducting pipe 6, the first heat conducting pipe 5 are specifically equipped with " 2 " root, and are set to the first buried layer 11 and second
Between buried layer 12, the second heat conducting pipe 6 runs through the first heat conducting pipe of " 2 " root 5, and both ends insertion is set to the both sides of plate body 1, using leading
While heat pipe radiates to surface element, radiating treatment is carried out to buried layer, one end of plate body 1 is equipped with barcode scanning area 10, sweeps
Code area 10 is sprayed with Quick Response Code, and technological process is recorded using Quick Response Code, when quality problems occurs in wiring board, by scanning two dimension
Where code can easily inquire the quality technological process of wiring board, to make wiring board that there is trackability.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of novel double-layer wiring board, including plate body（1）, upper layers of copper（2）With lower layers of copper（3）, it is characterised in that：The upper copper
Layer（2）With the lower layers of copper（3）It is respectively embedded into and is set to the plate body（1）Upper and lower both sides, the plate body（1）Four top
Angle is equipped with mounting hole（7）, the plate body（1）Top run through be equipped with several guide holes（8）, the plate body（1）Both sides be all provided with
There is card slot（9）, the plate body（1）One end insertion be provided with buried layer（4）, the buried layer（4）By the first buried layer（11）With
Second buried layer（12）It constitutes, the plate body（1）Be internally provided with the first heat conducting pipe（5）With the second heat conducting pipe（6）, described first leads
Heat pipe（5）It is specifically equipped with " 2 " root, and is set to first buried layer（11）With second buried layer（12）Between, described second
Heat conducting pipe（6）Through the first heat conducting pipe described in " 2 " root（5）, and both ends insertion is set to the plate body（1）Both sides.
2. a kind of novel double-layer wiring board according to claim 1, it is characterised in that：The guide hole（8）Internal copper facing.
3. a kind of novel double-layer wiring board according to claim 1, it is characterised in that：The plate body（1）One end be equipped with
Barcode scanning area（10）, the barcode scanning area（10）It is sprayed with Quick Response Code.
4. a kind of novel double-layer wiring board according to claim 1, it is characterised in that：First heat conducting pipe（5）Extend
To the plate body（1）Both ends.
5. a kind of novel double-layer wiring board according to claim 1, it is characterised in that：First heat conducting pipe（5）And institute
State the second heat conducting pipe（6）Inside be filled with graphite powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721851242.7U CN207625873U (en) | 2017-12-26 | 2017-12-26 | A kind of novel double-layer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721851242.7U CN207625873U (en) | 2017-12-26 | 2017-12-26 | A kind of novel double-layer wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207625873U true CN207625873U (en) | 2018-07-17 |
Family
ID=62830013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721851242.7U Active CN207625873U (en) | 2017-12-26 | 2017-12-26 | A kind of novel double-layer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207625873U (en) |
-
2017
- 2017-12-26 CN CN201721851242.7U patent/CN207625873U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343600 No. 281, Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
|
| CP03 | Change of name, title or address |