CN207487173U - A kind of semiconductor cooling hot type temperature control device - Google Patents
A kind of semiconductor cooling hot type temperature control device Download PDFInfo
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- CN207487173U CN207487173U CN201721483998.0U CN201721483998U CN207487173U CN 207487173 U CN207487173 U CN 207487173U CN 201721483998 U CN201721483998 U CN 201721483998U CN 207487173 U CN207487173 U CN 207487173U
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- temperature control
- control device
- support plate
- syringe
- hot type
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Abstract
The utility model discloses a kind of semiconductor cooling hot type temperature control device, the temperature control box being connect including supporting rack and with supporting rack；Syringe set is equipped in the temperature control box, syringe set both sides are located in the temperature control box and are respectively arranged with the first support plate and the second support plate, first support plate, the second support plate and syringe, which are sleeved in temperature control box, forms temperature control cavity；Cold wind mouth is offered on first support plate, conduction cooling fan is embedded in the cold wind mouth, the conduction cooling fan is connected with semiconductor chilling plate；Hot-air mouth is offered on second support plate, heat conduction fan is embedded in the hot-air mouth, the heat conduction fan is connected with resistance heating piece.The utility model has the advantage that can adjust syringe temperature.
Description
Technical field
The utility model is related to a kind of semiconductor cooling hot type temperature control devices.
Background technology
Conductive silver glue is combined together conducting particles by the bonding effect of matrix resin, forms conductive path, realizes
By being conductively connected for viscous material.
The glue-injection machine that present market generally uses including minitype high voltage as shown in Figure 1, pump 1, tracheae 11 and syringe 12, conduction
Elargol is poured in syringe 12.
But the glue-injection machine is in use, the conductive silver glue temperature in syringe 12 can change, conductive silver as room temperature changes
The change of glue temperature can influence its using effect, this problems demand solves.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of semiconductor cooling hot type temperature control dresses
It puts, there is the advantage that can adjust syringe temperature.
To achieve the above object, the utility model provides following technical solution：
A kind of semiconductor cooling hot type temperature control device, the temperature control box being connect including supporting rack and with supporting rack；The temperature control
Syringe set is equipped in case, syringe set both sides are located in the temperature control box and are respectively arranged with the first support plate and the second support plate, it is described
First support plate, the second support plate and syringe, which are sleeved in temperature control box, forms temperature control cavity；Cold wind mouth is offered on first support plate, it is described
Conduction cooling fan is embedded in cold wind mouth, the conduction cooling fan is connected with semiconductor chilling plate；Heat is offered on second support plate
Air port, heat conduction fan is embedded in the hot-air mouth, and the heat conduction fan is connected with resistance heating piece.
By using above-mentioned technical proposal, semiconductor chilling plate utilizes the peltier effect of semi-conducting material, works as direct current
During the galvanic couple being connected by two kinds of different semi-conducting materials, heat can be absorbed respectively at the both ends of galvanic couple and release heat,
It can realize the purpose of refrigeration, then be coordinated using semiconductor chilling plate and conduction cooling fan, cold air can be injected into temperature control cavity,
And then the temperature of syringe set can be reduced；Resistance heating piece can generate heat, coordinate with heat conduction fan, can be into temperature control cavity
Hot-air is injected, and then the temperature of syringe set can be improved；The temperature covered by reducing and improving syringe, then can adjust syringe
The temperature of interior conductive silver glue, into the using effect without influencing conductive silver glue.
Further, it is provided with cool guiding block between the conduction cooling fan and semiconductor chilling plate；The heat conduction fan and electricity
Heat-conducting block is provided between resistance heating piece.
By using above-mentioned technical proposal, on the one hand cool guiding block plays transmission transitional function, can be blown into conduction cooling fan
Cold air in temperature control cavity is more uniform, and then facilitates adjusting temperature, and on the other hand, cool guiding block is by conduction cooling fan and semiconductor system
Cold isolation can play conduction cooling fan certain protective effect, and then extend the service life of conduction cooling fan；Heat-conducting block one
Aspect plays transmission transitional function, heat conduction fan can be made to be blown into the hot-air in temperature control cavity more uniform, and then facilitate adjusting
Heat conduction fan is isolated with resistance heating piece for temperature, on the other hand, heat-conducting block, and certain protection can be played to heat conduction fan and is made
With, and then extend the service life of heat conduction fan
Further, the temperature control box side wall opposite with semiconductor chilling plate offers thermovent.
By using above-mentioned technical proposal, in principle, semiconductor chilling plate is the tool that a heat is transmitted, as one piece of N
Have in the thermocouple pair that type semi-conducting material and one piece of p-type semiconductor material are coupled to electric current by when, will produce between both ends
Heat amount shifts, and heat will be transferred to the other end from one end, hot and cold side is formed so as to generate the temperature difference, when hot and cold side reaches certain
The temperature difference when amount that the two heat is transmitted is equal, will reach an equalization point, and just reverse heat, which is transmitted, cancels out each other, cold and hot at this time
The temperature at end would not continue to change, and in order to reach lower temperature, may be used reduces the temperature in hot junction to realize；Then
The setting of thermovent can promote the air flowing of semiconductor chilling plate hot junction, reduce the temperature in hot junction, and then can improve and partly lead
The cooling-down effect of body cooling piece.
Further, the one end of the semiconductor chilling plate far from cool guiding block is connected with heat dissipation grid.
By using above-mentioned technical proposal, heat dissipation grid can increase the contact surface of semiconductor chilling plate hot junction and air
Product, promotes the reduction of hot-side temperature, and then can improve the cooling-down effect of semiconductor chilling plate.
Further, it is embedded with radiator fan in the thermovent.
By using above-mentioned technical proposal, radiator fan can increase the air flowing at heat dissipation grid, further promote
The reduction of hot-side temperature, and then the cooling-down effect of semiconductor chilling plate can be improved.
Further, support frame as described above includes pedestal and the strut being set on the base；The temperature control box lateral wall is set
The fixing sleeve being set on strut is equipped with, the first bolt contacted with strut is equipped on the fixing sleeve.
By using above-mentioned technical proposal, fixing sleeve can adjust the height of temperature control box with strut cooperation, and then conveniently make
Viscose glue operation is carried out with syringe.
Further, the fixing sleeve inner wall is provided with antislip ring.
By using above-mentioned technical proposal, antislip ring can increase the frictional force between fixing sleeve and strut, and then can
Improve the stability of temperature control box.
Further, the antislip ring is set as being detachably connected with fixing sleeve.
By using above-mentioned technical proposal, antislip ring is set as being detachably connected with fixing sleeve, can facilitate to antislip ring
Carry out installation and replacement.
Further, the syringe set top is provided with guide ring.
By using above-mentioned technical proposal, guide ring, which can facilitate, is fitted into syringe in syringe set.
Further, the syringe, which is put on, is equipped with the second bolt.
By using above-mentioned technical proposal, the second bolt is contacted with syringe, can be fastened syringe and syringe set, be improved needle
The stability of cylinder, and then syringe easy to use carries out viscose glue operation.
In conclusion the utility model has the advantages that：
1st, coordinated using semiconductor chilling plate and conduction cooling fan, cold air can be injected into temperature control cavity, and then can drop
The temperature of low syringe set；Resistance heating piece can generate heat, coordinate with heat conduction fan, and hot sky can be injected into temperature control cavity
Gas, and then the temperature of syringe set can be improved；The temperature covered by reducing and improving syringe, then can adjust conductive silver in syringe
The temperature of glue, into the using effect without influencing conductive silver glue；
2nd, thermovent, heat dissipation grid and radiator fan are employed, promotes semiconductor chilling plate hot-side temperature so as to generate
It reduces, and then the effect of semiconductor chilling plate temperature reduction performance can be improved.
Description of the drawings
Fig. 1 is the structure diagram that present market generally uses glue-injection machine；
Fig. 2 is the overall structure diagram of semiconductor cooling hot type temperature control device in embodiment；
Fig. 3 is the exploded perspective view of temperature control box in embodiment；
Fig. 4 is the enlarged diagram of part B in Fig. 3；
Fig. 5 is the enlarged diagram of part A in Fig. 2.
In figure：1st, minitype high voltage pumps；11st, tracheae；12nd, syringe；2nd, controller；21st, electric wire；3rd, supporting rack；31st, pedestal；
32nd, strut；4th, temperature control box；41st, syringe set；411st, the second bolt；412nd, guide ring；42nd, the first support plate；421st, cold wind mouth；
422nd, conduction cooling fan；423rd, cool guiding block；43rd, the second support plate；431st, hot-air mouth；432nd, heat conduction fan；433rd, heat-conducting block；44th, it is warm
Control chamber；45th, thermovent；46th, heat dissipation grid；47th, radiator fan；5th, semiconductor chilling plate；6th, resistance heating piece；61st, resistance wire；
62nd, the first insulation board；63rd, the second insulation board；7th, fixing sleeve；71st, antislip ring；72nd, third bolt；73rd, the first bolt.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
This specific embodiment is only explanation to the utility model, is not the limitation to the utility model, ability
Field technique personnel can as needed make the present embodiment the modification of no creative contribution after this specification is read, but
As long as it is all protected in the right of the utility model by Patent Law.
Embodiment：
A kind of semiconductor cooling hot type temperature control device, as shown in Fig. 2, including supporting rack 3, supporting rack 3 includes pedestal 31 and branch
Bar 32, strut 32 are plugged on pedestal 31；Strut 32 is connected with temperature control box 4, and syringe set 41, syringe set are equipped in temperature control box 4
41 bottom ends pass through 4 bottom wall of temperature control box and protrude from temperature control box 4；Syringe 12 equipped with conductive silver glue is inserted into syringe set 41, this reality
The shape for applying syringe set 41 in example is matched with syringe 12, and syringe covers 41 preferred aluminum alloy materials；Syringe 12 is connected with tracheae
11 and minitype high voltage pump 1, by minitype high voltage pump 1 can by the conductive silver glue in syringe 12 extrude carry out viscose glue operation；This
Temperature control box 4 connects live wire 21 and controller 2 in embodiment, and temperature transducer can also be set in temperature control box 4（This attached drawing
In be not shown）.
The first support plate 42 and the second support plate 43 are respectively arranged with as shown in figure 3, being located at syringe in temperature control box 4 and covering 41 both sides,
First support plate 42, the second support plate 43 and syringe set 41 form temperature control cavity 44 in temperature control box 4；41 top of syringe set is provided with guiding
Ring 412, guide ring 412 can facilitate syringe 12 to be inserted into syringe set 41；Syringe, which covers, is equipped with the second bolt 411 on 41, and second
Bolt 411 can be contacted with the syringe 12 being inserted into syringe set 41.
As shown in figure 3, offering cold wind mouth 421 on the first support plate 42, conduction cooling fan 422 is embedded in cold wind mouth 421, is led
Cooling fan 422 is connected with cool guiding block 423,423 preferred aluminum alloy materials of cool guiding block in the present embodiment；Cool guiding block 423 is far from conduction cooling
One end of fan 422 is connected with semiconductor chilling plate 5, and semiconductor chilling plate 5 includes two pieces of insulating ceramic films in the present embodiment, and two
Several N-type semiconductors and P-type semiconductor are provided between block insulating ceramic film, passes through gold between N-type semiconductor and P-type semiconductor
Belong to conductor connection, and one end that the present embodiment semiconductor chilling plate 5 is connect with cool guiding block 423 is cold end, the other end is hot junction.
As shown in figure 3, the one end of semiconductor chilling plate 5 far from cool guiding block 423 is connected with heat dissipation grid 46, in the present embodiment
46 preferred aluminum alloy materials of heat dissipation grid；The one end of heat dissipation grid 46 far from semiconductor chilling plate 5 is connected with radiator fan 47, temperature
Control 4 side wall of case offers the thermovent 45 for inlay card radiator fan 47.
As shown in figure 4, offering hot-air mouth 431 on the second support plate 43, heat conduction fan 432 is embedded in hot-air mouth 431；It leads
Hot-air fan 432 is connected with heat-conducting block 433,433 preferred aluminum alloy materials of heat-conducting block in the present embodiment；Heat-conducting block 433 is far from heat conduction
One end of fan 432 is connected with resistance heating piece 6, and resistance heating piece 6 includes the first insulation board 62, resistance wire 61 in the present embodiment
With the second insulation board 63, resistance wire 61 is between the first insulation board 62 and the second insulation board 63, the first insulation board 62 and heat conduction
Block 433 connects, and the second insulation board 63 is connect with 4 madial wall of temperature control box.
As shown in figure 5,4 side wall of temperature control box is provided with the fixing sleeve 7 being set on strut 32,7 inner wall of fixing sleeve is provided with
Antislip ring 71,71 preferred rubber circle of antislip ring, antislip ring 71 is connect with fixing sleeve 7 by two third bolts 72 in the present embodiment
（It is one only visible in this attached drawing）；The first bolt 73 is equipped on fixing sleeve 7, the first bolt 73 can be contacted with strut 32.
Operation principle is as follows：
Coordinated using semiconductor chilling plate 5 and conduction cooling fan 422, cold air, Jin Erneng can be injected into temperature control cavity 44
Enough reduce the temperature of syringe set 41；Resistance heating piece 6 can generate heat, coordinate with heat conduction fan 432, can be to temperature control cavity 44
Interior injection hot-air, and then the temperature of syringe set 41 can be improved；By reducing and improving the temperature of syringe set 41, then can adjust
The temperature of conductive silver glue in markingoff pin cylinder 12, into the using effect without influencing conductive silver glue.
Claims (10)
1. a kind of semiconductor cooling hot type temperature control device, it is characterised in that：Including supporting rack（3）And and supporting rack（3）Connection
Temperature control box（4）；The temperature control box（4）Inside it is equipped with syringe set（41）, the temperature control box（4）It is interior to be located at syringe set（41）Both sides point
It is not provided with the first support plate（42）With the second support plate（43）, first support plate（42）, the second support plate（43）With syringe set（41）
In temperature control box（4）Interior formation temperature control cavity（44）；First support plate（42）On offer cold wind mouth（421）, the cold wind mouth
（421）Inside it is embedded with conduction cooling fan（422）, the conduction cooling fan（422）It is connected with semiconductor chilling plate（5）；Described second
Plate（43）On offer hot-air mouth（431）, the hot-air mouth（431）Inside it is embedded with heat conduction fan（432）, the heat conduction fan
（432）It is connected with resistance heating piece（6）.
2. semiconductor cooling hot type temperature control device according to claim 1, it is characterised in that：The conduction cooling fan（422）With
Semiconductor chilling plate（5）Between be provided with cool guiding block（423）；The heat conduction fan（432）Piece is heated with resistance（6）Between set
There is heat-conducting block（433）.
3. semiconductor cooling hot type temperature control device according to claim 2, it is characterised in that：The temperature control box（4）With partly leading
Body cooling piece（5）Opposite side wall offers thermovent（45）.
4. semiconductor cooling hot type temperature control device according to claim 3, it is characterised in that：The semiconductor chilling plate（5）
Far from cool guiding block（423）One end be connected with heat dissipation grid（46）.
5. semiconductor cooling hot type temperature control device according to claim 4, it is characterised in that：The thermovent（45）Inside it is embedded
There is radiator fan（47）.
6. the semiconductor cooling hot type temperature control device according to any claim in claim 1-5, it is characterised in that：It is described
Supporting rack（3）Including pedestal（31）And it is arranged on pedestal（31）On strut（32）；The temperature control box（4）Lateral wall is provided with
It is set in strut（32）On fixing sleeve（7）, the fixing sleeve（7）On be equipped with and strut（32）First bolt of contact
（73）.
7. semiconductor cooling hot type temperature control device according to claim 6, it is characterised in that：The fixing sleeve（7）Inner wall is set
It is equipped with antislip ring（71）.
8. semiconductor cooling hot type temperature control device according to claim 7, it is characterised in that：The antislip ring（71）With fixation
Set（7）It is set as being detachably connected.
9. the semiconductor cooling hot type temperature control device according to any claim in claim 1-5, it is characterised in that：It is described
Syringe set（41）Top is provided with guide ring（412）.
10. the semiconductor cooling hot type temperature control device according to any claim in claim 1-5, it is characterised in that：Institute
State syringe set（41）On be equipped with the second bolt（411）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721483998.0U CN207487173U (en) | 2017-11-09 | 2017-11-09 | A kind of semiconductor cooling hot type temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721483998.0U CN207487173U (en) | 2017-11-09 | 2017-11-09 | A kind of semiconductor cooling hot type temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207487173U true CN207487173U (en) | 2018-06-12 |
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ID=62476111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721483998.0U Active CN207487173U (en) | 2017-11-09 | 2017-11-09 | A kind of semiconductor cooling hot type temperature control device |
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| Country | Link |
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| CN (1) | CN207487173U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109747976A (en) * | 2018-12-29 | 2019-05-14 | 华侨大学 | A kind of portable semiconductor temperature control cold chain turnover box |
| CN113790933A (en) * | 2021-08-16 | 2021-12-14 | 天津大学 | Temperature-controlled windproof and light-resistant static box and gas in-situ collection method |
-
2017
- 2017-11-09 CN CN201721483998.0U patent/CN207487173U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109747976A (en) * | 2018-12-29 | 2019-05-14 | 华侨大学 | A kind of portable semiconductor temperature control cold chain turnover box |
| CN113790933A (en) * | 2021-08-16 | 2021-12-14 | 天津大学 | Temperature-controlled windproof and light-resistant static box and gas in-situ collection method |
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