CN205385042U - High -power LED collection moulding group light source - Google Patents
High -power LED collection moulding group light source Download PDFInfo
- Publication number
- CN205385042U CN205385042U CN201620034743.5U CN201620034743U CN205385042U CN 205385042 U CN205385042 U CN 205385042U CN 201620034743 U CN201620034743 U CN 201620034743U CN 205385042 U CN205385042 U CN 205385042U
- Authority
- CN
- China
- Prior art keywords
- light source
- pedestal
- power led
- die set
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000465 moulding Methods 0.000 title abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a high -power LED collection moulding group light source, including base, base plate and a plurality of face down chip, the base plate sets up in the base front end, a plurality of face down chip set up on the base plate, the base plate in form with face down chip complex electrode circuit, electrode circuit both sides are equipped with the electrode slice for encapsulate face down chip on base plate electrode circuit, base plate and base between be equipped with a plurality of heat conduction posts. The utility model overcomes prior art's is not enough, reasonable in design, and compact structure adopts the integrated encapsulation with a plurality of face down chip, constitutes ultra -large -power LED encapsulation light source module, improves its range of application greatly.
Description
Technical field
This utility model relates to LED technical field, particularly belongs to a kind of integrated die set light source of great power LED.
Background technology
Flip-chip is one of existing market main flow LED chip, it is mainly derived from a chip product of offshore company's research and development, it is adopt flip-chip fashion carrying out assembling, electrode under, phosphor powder layer is arranged on upper surface, adopts sprayed with fluorescent powder technology, reduces encapsulation fluorescent material, prior art flip-chip is only limited to the light source that single power of encapsulation is little, and it greatly limit the range of application of chip light source.
Utility model content
For the problems referred to above, the purpose of this utility model there is provided a kind of integrated die set light source of great power LED, overcomes the deficiencies in the prior art, reasonable in design, compact conformation, adopt and multiple Flip-chip ICs are encapsulated, constitute super-high-power LED packaged light source module, be greatly improved its range of application.
The technical solution adopted in the utility model is as follows:
A kind of integrated die set light source of great power LED, including pedestal, substrate and multiple flip-chip, substrate is arranged at pedestal front end, described multiple flip-chips are arranged on substrate, the electrode circuit coordinated with flip-chip is formed in described substrate, electrode circuit both sides are provided with electrode slice, for Flip-Chip Using is provided with multiple heating column between electrode of substrate circuit, described substrate and pedestal.
Described heating column is that copper product is made.
Described heating column two ends have along the prone extension of base side.
Described pedestal rear end is also equipped with driving power module, forms an entirety.
Fixed by heat conduction screw between described substrate and pedestal.
It is provided with multiple heat conduction bolt between described heating column and pedestal to be linked and packed.
Multiple described heating columns are arranged in pedestal juxtaposition, and described pedestal is provided with a plurality of hot flow path vertical with heating column.
Described hot flow path bottom surface equals to or less than heating column position on pedestal.
Described pedestal side is provided with multiple equally distributed louvre.
Described flip-chip front end is provided with light-distribution lens, and light-distribution lens is fixed on substrate.
Compared with the prior art, the beneficial effects of the utility model are as follows:
This utility model is arranged at, by substrate, the electrode circuit coordinated with multiple flip-chips, enables multiple flip-chip to be cascaded, and simultaneously in order to ensure the reliability of its heat radiation, is provided with conduction copper post at substrate and pedestal；On pedestal, louvre it is additionally provided with and hot flow path forms three-dimensional heat radiation system for improving radiating effect further, between substrate with pedestal, it is additionally provided with heat conduction screw is connected fixing heat conduction, it is provided with heat conduction bolt between conduction copper post and pedestal and is attached fixing heat conduction, therefore good heat conduction effect, radiator need not be connected in pedestal rear end, driving power supply is set in pedestal rear end, forms photoelectric heat one light source, installation along with watt level increases radiator area with copper pipe reverse graft.This die set light source is widely used, it is possible to suitable in indoor and outdoor lighting utensil, and brightening decorative lamp.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model blast；
Fig. 2 is the structural representation of this utility model assembling.
Detailed description of the invention
nullReferring to accompanying drawing，A kind of integrated die set light source of great power LED，Including pedestal 1、Substrate 2 and multiple flip-chip 3，Substrate 2 is arranged at pedestal 1 front end，Described multiple flip-chips 3 are arranged on substrate 2，Form, in described substrate 2, the electrode circuit 4 coordinated with flip-chip，Electrode circuit both sides are provided with electrode slice 5，For by Flip-Chip Using at electrode of substrate circuit，Multiple conduction copper post 6 it is provided with between described substrate 2 and pedestal 1，Conduction copper post 6 two ends have along the prone extension of base side，Pedestal 1 rear end is also equipped with driving power module 7，Form an entirety，It is connected heat conduction by heat conduction screw 8 is fixing between described substrate 2 and pedestal 1，It is provided with multiple heat conduction bolt 9 between described conduction copper post 6 and pedestal 1 to be linked and packed，Play fixing connection conductive force，Multiple described conduction copper posts 6 are arranged in pedestal 1 juxtaposition，Described pedestal is provided with a plurality of hot flow path 10 vertical with conduction copper post，Hot flow path bottom surface equals to or less than conduction copper post position on pedestal，Described pedestal side is provided with multiple equally distributed louvre 11，Hot flow path、Louvre and conduction copper post form three-dimensional radiator system，Radiating effect，Flip-chip front end is provided with light-distribution lens 12，Light-distribution lens is fixed on substrate，It is easy to secondary light-distribution，Cross and substrate is arranged at the electrode circuit coordinated with multiple flip-chips，Multiple flip-chip is enable to be cascaded，Simultaneously in order to ensure the reliability of its heat radiation，It is greatly expanded its range of application.
Of the present utility model ultimate principle, principal character and of the present utility model advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description is that principle of the present utility model is described; under the premise without departing from this utility model spirit and scope; this utility model also has various changes and modifications, and these changes and improvements both fall within the scope of claimed this utility model.This utility model claims scope and is defined by appending claims and equivalent thereof.
Claims (10)
1. the integrated die set light source of great power LED, including pedestal, substrate and multiple flip-chip, substrate is arranged at pedestal front end, it is characterized in that: described multiple flip-chips are arranged on substrate, the electrode circuit coordinated with flip-chip is formed in described substrate, electrode circuit both sides are provided with electrode slice, for Flip-Chip Using is provided with multiple heating column between electrode of substrate circuit, described substrate and pedestal.
2. a kind of integrated die set light source of great power LED according to claim 1, it is characterised in that: described heating column is that copper product is made.
3. a kind of integrated die set light source of great power LED according to claim 1, it is characterised in that: described heating column two ends have along the prone extension of base side.
4. a kind of integrated die set light source of great power LED according to claim 3, it is characterised in that: described pedestal rear end is also equipped with driving power module, forms an entirety.
5. a kind of integrated die set light source of great power LED according to claim 4, it is characterised in that: fixed by heat conduction screw between described substrate and pedestal.
6. a kind of integrated die set light source of great power LED according to claim 5, it is characterised in that: it is provided with multiple heat conduction bolt between described heating column and pedestal and is linked and packed.
7. a kind of integrated die set light source of great power LED according to claim 6, it is characterised in that: multiple described heating columns are arranged in pedestal juxtaposition, and described pedestal is provided with a plurality of hot flow path vertical with heating column.
8. a kind of integrated die set light source of great power LED according to claim 7, it is characterised in that: described hot flow path bottom surface equals to or less than heating column position on pedestal.
9. a kind of integrated die set light source of great power LED according to claim 8, it is characterised in that: described pedestal side is provided with multiple equally distributed louvre.
10. a kind of integrated die set light source of great power LED according to claim 1, it is characterised in that: described flip-chip front end is provided with light-distribution lens, and light-distribution lens is fixed on substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620034743.5U CN205385042U (en) | 2016-01-13 | 2016-01-13 | High -power LED collection moulding group light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620034743.5U CN205385042U (en) | 2016-01-13 | 2016-01-13 | High -power LED collection moulding group light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205385042U true CN205385042U (en) | 2016-07-13 |
Family
ID=56347799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620034743.5U Expired - Fee Related CN205385042U (en) | 2016-01-13 | 2016-01-13 | High -power LED collection moulding group light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205385042U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514256A (en) * | 2016-01-13 | 2016-04-20 | 吴金香 | Large-power LED (Light Emitting Diode) integrated module light source |
-
2016
- 2016-01-13 CN CN201620034743.5U patent/CN205385042U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514256A (en) * | 2016-01-13 | 2016-04-20 | 吴金香 | Large-power LED (Light Emitting Diode) integrated module light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhou Ning Inventor after: Wu Jinxiang Inventor before: Wu Jinxiang |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170828 Address after: Science road high tech Industrial Development Zone Guangzhou city Guangdong province 510635 No. 231, No. 233 building B1B2 building a layer to four known business valley international intellectual property public record office space Card No. X006 Patentee after: GUANGZHOU JINSHUO TECHNOLOGY Co.,Ltd. Address before: 246500, No. five, room 192, Dadi village, Liu Ping Village, Susong County, Anqing, Anhui Patentee before: Wu Jinxiang |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160713 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |