CN203205457U

CN203205457U - Direct inset type LED with heat conduction function

Info

Publication number: CN203205457U
Application number: CN 201320153378
Authority: CN
Inventors: 张荣民; 田景明
Original assignee: TIANJIN JINMA PHOTOELECTRIC CO Ltd
Current assignee: TIANJIN JINMA PHOTOELECTRIC CO Ltd
Priority date: 2012-12-20
Filing date: 2013-03-29
Publication date: 2013-09-18
Anticipated expiration: 2023-03-29
Also published as: CN103325917A

Abstract

The utility model discloses a direct inset type LED with a heat conduction function, comprising two conductive supports, an LED chip and a heat-conducting plate arranged between the conductive supports and possessing a top of a planar structure. The LED chip is fixedly arranged on the top of the heat-conducting plate and is in electric connection with the conductive supports on two sides. An upper section of the heat-conducting plate is a planar structure; the planar structure is employed to position the LED chip; meanwhile an open type structure of the upper section and an upper section of the heat-conducting plate are provided with the LED chip, which can effectively prevent silver glue from flowing the LED chip and provide a largest luminous space for the LED chip; four sides of the LED chip are all exposed to obtain the luminous effect similar to a lighthouse, reach a 170 DEG beam angel and effectively improve lighting effect. Meanwhile the heat-conducting plate is performed silvering treatment and can effectively raise heat conduction and heat dissipation performance of the heat-conducting plate for the LED chip; the conductive supports for power supply are arranged on two sides of the heat-conducting plate to perform thermoelectricity separating and minimize heating aging.

Description

Direct insertion LED with the heat conduction function

Technical field

The utility model relates to the LED lighting technical field, particularly relates to a kind of direct insertion LED with the heat conduction function.

Background technology

Figure 1 shows that the direct insertion LED structural representation of prior art; as shown in Figure 1; traditional single LEDs comprises two conducting brackets 20 and the led chip 10 that is fixedly installed on one of them conducting bracket at present; wherein conducting bracket 20 is made by copper coin; be formed with a recessed bowl at conducting bracket center of top position; conducting bracket is being carried out silver-plated protection with after avoiding burning; led chip is fixedly installed on places recessed bowl central authorities, also limit its rising angle when utilizing the optically focused effect of recessed bowl to improve brightness.

This kind straight cutting LED conducting bracket only can be suitable for the device below 0.01 watt, uses electric current as below the 20mA, reckons without the performance of heat conduction and heat radiation, also just is not suitable for making on the illuminating product of large power supply.But there are many illuminations still to use direct insertion LED to manufacture lighting, because there is not direct insertion LED heat-sinking capability, cause the dead lamp problem of illuminating product, quality can not be guaranteed, so the utmost point need to be designed and developed a cover conducting bracket, makes direct insertion LED device can meet the needed high lumen of high-power illumination and heat dispersion.

The utility model content

The purpose of this utility model is for the technological deficiency that exists in the prior art, and a kind of direct insertion LED with the heat conduction function is provided.

For realizing that the technical scheme that the purpose of this utility model adopts is:

A kind of direct insertion LED with the heat conduction function comprises two conducting brackets, led chips and is arranged between the conducting bracket and the top is the heat-conducting plate of planar structure, described led chip be fixedly installed on the heat-conducting plate top and with the conducting bracket electric connection of both sides.

The top of described heat-conducting plate is planar structure, this planar structure can directly adopt the upper section of heat-conducting plate, also can be fixedly installed to carry on heat-conducting plate top the level board of led chip, the mode that certainly also can adopt heat-conducting plate top to thicken increases the area of upper section, adopt planar structure location led chip, realized the application of large scale led chip, simultaneously Open architecture is put led chip on the planar structure of heat-conducting plate in addition and can be guaranteed effectively that elargol does not overflow across led chip, give the emitting space of led chip maximum, four sides of led chip all expose out, the luminous effect of similar beacon is arranged, can reach the rising angle of 170 degree, the Effective Raise light efficiency, it can cover three dimensions to larger area simultaneously, just be equal to have reduced and use more LED device needs, reduced taking up room.Heat-conducting plate is through silver-plated processing simultaneously, and energy Effective Raise heat-conducting plate is to the heat conduction and heat radiation performance of led chip; And the conducting bracket of power supply is accomplished thermoelectric the separation in the heat-conducting plate both sides, reduces heat ageing.

Described heat-conducting plate thickness is at 0.5-1.2mm.

Described conducting bracket and heat-conducting plate are the red metal material, and are formed with antirust silver layer at its skin.

Described heat-conducting plate and conducting bracket are arranged in the same plane.

The flat mouth P utmost point that described two conducting brackets are the left side and the circular arc N utmost point on right side, described led chip is by aluminium wire and its electric connection.

Compared with prior art, the beneficial effects of the utility model are:

The utility model has changed the set-up mode of led chip, cancelled traditional recessed cup structure, increased heat-conducting plate and led chip has been arranged on the upper section of heat-conducting plate, utilize independent heat-conducting plate to play the heat conduction and heat radiation performance of led chip high, namely by changing the structure of device, make and insert the package support that formula LED has the heat conduction and heat radiation performance, be applicable on the illuminating product of large power supply; Has again simultaneously the performance of wide-angle bright dipping, effectively promoted the spectral quality of LED device, it has changed the light width of cloth shape of traditional devices, by the pyramid light width of cloth, change into the three-dimensional ring post light width of cloth, the two produces different light shapes, obtain different light area coverages, light efficiency in unit are significantly promotes again, and the 200mA light efficiency has possessed again heat-sinking capability much larger than the light efficiency of 20mA.

Description of drawings

Figure 1 shows that the direct insertion LED structural representation of prior art;

Figure 2 shows that LED structural representation of the present utility model.

Embodiment

Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.

As shown in Figure 2, a kind of direct insertion LED with the heat conduction function of the present utility model, comprise the led chip 1 of two conducting brackets 2,40mil and be arranged between the conducting bracket and the top is the heat-conducting plate 3 of planar structure, described led chip be fixedly installed on the heat-conducting plate top and with the conducting bracket electric connection of both sides.Wherein said heat-conducting plate and conducting bracket are arranged in the same plane.

Wherein, described heat-conducting plate and conducting bracket are by the thick red metal strip mould punch forming preparation of 0.8mm, then carry out the electrosilvering antirust processing in surface on its surface, form silver-plated antirust coat at conducting bracket and heat-conducting plate surface, can Effective Raise the heat conduction and heat radiation performance, utilize simultaneously the reflection enhancement emitting brightness of silver layer.

Described two conducting brackets comprise the flat mouth P utmost point in left side and the circular arc N utmost point on right side, led chip links to each other with the conducting bracket 2 of both sides by aluminium wire 4 by the ED chip, because can heat effectively be derived by heating panel, can move led chip operation 200mA direct current, effectively promote the spectral quality of LED device, also prolonged the useful life of LED device.

Further, be formed with projection at described conducting bracket top towards the heating panel side, so that conducting bracket is P shape structure, Effective Raise top cross-section area is convenient to being welded and fixed of aluminium wire, improves conductive effect and prevents short circuit.

Direct insertion LED of the present utility model belongs to the encapsulation of LED high-power chip grade, can directly produce in board encapsulation rank preparation, and the encapsulation level is higher.

In use, with conducting bracket and welding circuit board simultaneously, lower end and circuit board or other cooling mechanism of heat-conducting plate are fixed the radiating effect that utilizes the radiator structure expanded and circuit board large tracts of land further to improve led chip by heat-conducting glue.

The above only is preferred implementation of the present utility model; should be noted that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.

Claims

1. direct insertion LED with the heat conduction function, it is characterized in that, comprise two conducting brackets, led chips and be arranged between the conducting bracket and the top is the heat-conducting plate of planar structure, described led chip be fixedly installed on the heat-conducting plate top and with the conducting bracket electric connection of both sides.

2. the direct insertion LED with the heat conduction function as claimed in claim 1 is characterized in that, described heat-conducting plate thickness is at 0.5-1.2mm.

3. the direct insertion LED with the heat conduction function as claimed in claim 1 or 2 is characterized in that, described conducting bracket and heat-conducting plate are the red metal material, and is formed with antirust silver layer at its skin.

4. the direct insertion LED with the heat conduction function as claimed in claim 3 is characterized in that, described heat-conducting plate and conducting bracket are arranged in the same plane.

5. the direct insertion LED with the heat conduction function as claimed in claim 3 is characterized in that, the flat mouth P utmost point that described two conducting brackets are the left side and the circular arc N utmost point on right side, and described led chip is by aluminium wire and its electric connection.