CN209298100U - Semiconductor element - Google Patents
Semiconductor element Download PDFInfo
- Publication number
- CN209298100U CN209298100U CN201821880805.XU CN201821880805U CN209298100U CN 209298100 U CN209298100 U CN 209298100U CN 201821880805 U CN201821880805 U CN 201821880805U CN 209298100 U CN209298100 U CN 209298100U
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- Prior art keywords
- substrate
- chip
- semiconductor element
- rubber base
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is suitable for technical field of electronic equipment, provide a kind of semiconductor element, several pins and curing molding are equipped at intervals in the rubber base on substrate including substrate, chip, in the periphery of substrate, rubber base is equipped with through-hole, semiconductor element further includes the heat conducting and heat radiating fin on rubber base, heat conduction and heat radiation on piece is equipped with protrusion, and protrusion passes through through-hole and is bonded with chip.The protrusion of heat conducting and heat radiating fin by being passed through the through-hole of rubber base and being fitted with chip by the utility model, a part of heat of chip can be transferred to heat conducting and heat radiating fin and be spread through protrusion, a part of heat of chip can be transferred to substrate and spread, the semiconductor element can be in the two sides of rubber base by the heat diffusion of chip, the good heat dissipation effect of semiconductor element；By the way that several pins are arranged and are electrical connected respectively with chip, the partial heat of chip can be transferred to each pin and be diffused, and can also realize the connection with multiple external devices, and then improve the work service efficiency of semiconductor element.
Description
Technical field
It is more specifically to be related to a kind of semiconductor element that the utility model, which is suitable for technical field of electronic equipment,.
Background technique
Semiconductor devices refers to object of the electric conductivity between conductor and insulator under room temperature, since its electric conductivity can be by
Control, range are widely used in technical field of electronic equipment from insulator between conductor.
Existing semiconductor devices is mainly to transfer heat to the PCB being bonded therewith by the sheet metal that chip carries
On (Printed Circuit Board, printed circuit board), and then circumferential component is transferred heat to realize heat dissipation.Due to
Semiconductor devices is only able to achieve one-side side heat dissipation, and the heat dissipation effect that this allows for semiconductor devices is poor, to will affect
The working performance and efficiency of semiconductor devices, temperature is excessively high or even can burn chip, and seriously affect semiconductor devices uses the longevity
Life.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor elements, to solve semiconductor device existing in the prior art
The problem of the heat dissipation effect difference of part.
In order to achieve the above purposes, the technical solution adopted by the utility model is: provides a kind of semiconductor element, including lining
Bottom, the chip on the substrate, Yu Suoshu substrate periphery be equipped at intervals with it is several for being electrically connected with external devices
In on the substrate and sealing the rubber base of the fixed chip and each pin, each pin is set to for pin and curing molding
On the rubber base, one end and the chip of each pin are electrical connected, and the other end of each pin stretches out the rubber base；
The central region that the rubber base corresponds to the chip offers through-hole, and the semiconductor element further includes being set on the rubber base
Heat conducting and heat radiating fin, the heat conducting and heat radiating fin correspond to the through-hole position and be convexly equipped with towards the direction of the chip convex
Portion, the protrusion pass through the through-hole and fit with the chip.
Further, the cross section ruler of the cross sectional dimensions of the heat conducting and heat radiating fin in the horizontal plane and the rubber base top surface
It is very little consistent.
Further, the substrate include the substrate being square and along the substrate a side towards the heat conduction and heat radiation
The connection strap for being used to support the substrate that the direction of piece extends, the chip are set on the substrate, and the connection strap is fixed
In the rubber base.
Further, the substrate include the substrate being square and along the two sides of the substrate towards the heat conduction and heat radiation
The direction of piece extends and is used to support the connection strap of the substrate, and the chip is set on the substrate, each connection
Item is fixed in the rubber base.
Further, the substrate include the substrate being square and along three sides of the substrate towards the heat conduction and heat radiation
The direction of piece extends and is used to support the connection strap of the substrate, and the chip is set on the substrate, each connection
Item is fixed in the rubber base.
Further, the substrate include the substrate being square and along each side of the substrate towards the heat conduction and heat radiation
The direction of piece extends and is used to support the connection strap of the substrate, and the chip is set on the substrate, each connection
Item is fixed in the rubber base.
Further, each connection strap includes being prolonged by the direction of corresponding end towards the heat conducting and heat radiating fin of the substrate
The first segment stretched and the chip is parallel to by the free end of the first segment and the direction that is directed away from the chip extends
Second segment.
Further, the rubber base is stretched out in the free end of each second segment.
Further, the height of each second segment is higher than the height of the pin.
Further, each pin includes that first section to be electrical connected with the chip, Yu Suoshu first are cut far from institute
State that one end of chip bends towards the direction of the substrate second section and in second section of the free end towards far from the core
The third of the direction bending of piece is cut, described first section perpendicular to described second section, described second section is cut perpendicular to the third, institute
It states first section and is parallel to the third section.
The beneficial effect of semiconductor element provided by the utility model is: compared with prior art, the utility model is logical
It crosses chip setting on substrate, and is fixed substrate, chip and several pin mucilage bindings by rubber base, heat conducting and heat radiating fin setting exists
On rubber base, the protrusion of heat conducting and heat radiating fin may pass through the through-hole of rubber base and fit with chip, therefore a part of heat of chip can
Heat conducting and heat radiating fin is transferred to through protrusion and is spread, and a part of heat of chip can be transferred to substrate and spread, the semiconductor element
It can be in the two sides of rubber base by the heat diffusion of chip, the good heat dissipation effect of semiconductor element；By the way that multiple pins and difference is arranged
It is electrical connected with chip, the partial heat of chip can be transferred to each pin and be diffused, and can also realize and multiple external devices
Connection, and then the work using effect of semiconductor element is improved, it prolongs its service life.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the positive structure schematic of semiconductor element provided by the embodiment of the utility model；
Fig. 2 is the structure schematic diagram of semiconductor element provided by the embodiment of the utility model；
Fig. 3 is the main view of semiconductor element provided by the embodiment of the utility model；
Fig. 4 is the structural schematic diagram of semiconductor element provided by the embodiment of the utility model；
Fig. 5 is the cross-sectional view in the direction A-A in Fig. 3；
Fig. 6 is the structural schematic diagram that chip provided by the embodiment of the utility model is connect with substrate；
Fig. 7 is the structural schematic diagram of pin provided by the embodiment of the utility model；
Fig. 8 is the structural schematic diagram one of rubber base provided by the embodiment of the utility model；
Fig. 9 is the structural schematic diagram two of rubber base provided by the embodiment of the utility model.
Wherein, each attached drawing main mark in figure:
1- chip；
2- substrate；21- substrate；211- slot position；22- extension；23- connection strap；
3- pin；31- first is cut；32- second is cut；33- third is cut；The extension end 34-；35- third chamfering；
4- rubber base；41- through-hole；42- groove；43- card slot；44- locating slot；45- accommodation groove；The first chamfering of 46-；
5- heat conducting and heat radiating fin；The protrusion 51-；The second chamfering of 52-；
6- conductor.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
In addition, term " first ", " second ", " third " are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic." first ", " second ", " third " are defined as a result,
Feature can explicitly or implicitly include one or more of the features.In the description of the present invention, " multiple "
It is meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it should be understood that term " center ", " length ", " width ", " thickness ",
The orientation of the instructions such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" or
Positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description,
Rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, because
This should not be understood as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements or the interaction relationship of two elements.For those of ordinary skill in the art and
Speech, can understand the concrete meaning of above-mentioned term in the present invention as the case may be.
Also referring to Fig. 1 to Fig. 9, now semiconductor element provided by the embodiment of the utility model is illustrated.It should be partly
Conductor element includes several pins 3 of the periphery setting of substrate 2, the chip being set on substrate 21, circular substrate 2 and is solidified into
In simultaneously the rubber base 4 of fixed chip 1 and each pin 3, substrate 2 may be provided on pcb board on substrate 2, each pin 3 is separately positioned on type
On rubber base 4, one end of each pin 3 and chip 1 are to be electrically connected, and the other end stretches out the corresponding end of rubber base 4, so as to external devices
It is connected.Position on the side of 4 object chip 1 of rubber base and corresponding to the chip 1 offers through-hole 41, which also wraps
The heat conducting and heat radiating fin 5 that the heat of the chip 1 is spread for being bonded with chip 1 is included, heat conducting and heat radiating fin 5 is bonded in the table of rubber base 4
Face, heat conducting and heat radiating fin 5 correspond to the position of through-hole 41 and are convexly equipped with protrusion 51 towards the direction of chip 1, which passes through logical
Hole 41, end and the chip 1 of protrusion 51 are fitted.Heat conducting and heat radiating fin 5, rubber base 4, chip 1 and substrate 2 are from top to bottom successively
Setting.The surface of chip 1 can fit with protrusion 51, and a part of heat of chip 1, which can be transmitted, is transferred to thermally conductive dissipate through protrusion 51
Backing 5 is simultaneously spread；The bottom surface of chip 1 can fit with substrate 2, and a part of heat of chip 1 can be transferred to substrate 2 and spread.
Above-mentioned heat conducting and heat radiating fin 5 and substrate 2 can be made of copper product, heat conducting and heat radiating fin 5 and substrate 2 made of copper product
With excellent thermally conductive and electric conductivity.In other embodiments, heat conducting and heat radiating fin 5 can also be made of other materials, herein
It does not limit uniquely.The top surface of heat conducting and heat radiating fin 5 may be integral planar.
The model TDP0405-16 of above-mentioned semiconductor element, wherein (Thermal Design Power, heat dissipation are set TDP
Meter power consumption) refer to encapsulation title；0405 refers to package dimension, and specially wide by 4 long 5, unit value can be adjusted according to actual production, such as
Mm, cm, dm etc.；- 16 guide 3 quantity of foot, and 3 quantity of pin for referring specifically to this semiconductor element is 16.In other embodiments,
The size of semiconductor element and the quantity of pin 3 can be adjusted according to actual production, not limit uniquely herein.
Above-mentioned rubber base 4 can also can be made of epoxide resin material curing molding of other insulating materials, not make herein only
One limits.
The step of assembling mode one of the semiconductor element are as follows:
1, substrate 2 is placed in type chamber, chip 1 is set on substrate 2；
2, each pin 3 is set to the corresponding position of type chamber, and each pin 3 is electrically connected with chip 1；
3, injecting glue sealing and curing forms rubber base 4 in type chamber, supports sealing to fix substrate 2, chip 1 and each pin 3；
4, through-hole 41 is offered in the position that rubber base 4 corresponds to chip 1；
5, by be equipped with protrusion 51 heat conducting and heat radiating fin 5 be adhered on rubber base 4, make protrusion 51 pass through through-hole 41 and with chip 1
Fitting.
Alternatively, the step of assembling mode two of the semiconductor element are as follows:
1, substrate 2 is placed in type chamber, chip 1 is set on substrate 2；
2, each pin 3 is set to the corresponding position of type chamber, and each pin 3 is electrically connected with chip 1；
3, heat conducting and heat radiating fin 5 is set to the corresponding position of type chamber, is bonded the protrusion 51 of heat conducting and heat radiating fin 5 with chip 1；
4, injecting glue sealing and curing forms rubber base 4 in type chamber, by substrate 2, chip 1, each pin 3 and heat conducting and heat radiating fin 5
Support sealing is fixed.
The serial number size of each step of the packaging technology of above-mentioned semiconductor element is not meant that the order of the execution order, each mistake
The execution sequence of journey should be determined by its function and internal logic, and can be adjusted according to actual production, practical without coping with this
The implementation process of new embodiment constitutes any restriction.
For the semiconductor element due to that can radiate from two sides, which can realize that tow sides use,
It does not limit uniquely herein.
Semiconductor element provided by the utility model, compared with prior art, the utility model is by existing the setting of chip 1
On substrate 2, and substrate 2, chip 1 and 3 mucilage binding of several pins to be fixed by rubber base 4, heat conducting and heat radiating fin 5 is arranged on rubber base 4,
The protrusion 51 of heat conducting and heat radiating fin 5 may pass through the through-hole 41 of rubber base 4 and fit with chip 1, therefore a part of heat of chip 1 can
Heat conducting and heat radiating fin 5 is transferred to through protrusion 51 and is spread, and a part of heat of chip 1 can be transferred to substrate 2 and spread, the semiconductor
Element can be in the two sides of rubber base 4 by the heat diffusion of chip 1, the good heat dissipation effect of semiconductor element；By the way that multiple pins 3 are arranged
And be electrical connected respectively with chip 1, the partial heat of chip 1 can be transferred to each pin 3 and be diffused, can also realize with it is multiple outer
The connection of portion's device, and then improve the work service efficiency of semiconductor element.
The utility model can reduce electrical internal resistance simultaneously, increase through electric current, improve electric energy efficiency and power；Reduce element
With the temperature of product.
The semiconductor element of the utility model reduces raw materials for production compared to traditional devices encapsulation, simplifies production technology, thus
Reduce its device cost；The advantages that improving production efficiency.
The semiconductor element of the utility model is encapsulated in production PCBA (Printed Circuit compared to traditional devices
Board Assembly) when, without cumbersome artificial process, 100% production of machinery work；Improve production efficiency；Reduce production
Cost.
Further, also referring to Fig. 3 and Fig. 4, as semiconductor element provided by the embodiment of the utility model one
Kind specific embodiment, the cross sectional dimensions phase one of the cross sectional dimensions of heat conducting and heat radiating fin 5 in the horizontal plane and 4 top surface of rubber base
It causes.This structure, on the one hand, the area of heat conducting and heat radiating fin 5 is accomplished into maximum as far as possible, can effective increasing heat radiation area, Jin Erti
Heat dissipation effect of the height to chip 1；On the other hand, make the configuration design of semiconductor element more beautiful, structure Founder, convenient for filling
Gum forming.In other embodiments, the cross section of heat conducting and heat radiating fin 5 and the cross section of rubber base 4 may be other configurations, herein
It does not limit uniquely.
Optionally, one kind also referring to Fig. 3 and Fig. 4, as semiconductor element provided by the embodiment of the utility model
Specific embodiment, substrate 2 include that the direction for substrate 21 and a side towards the heat conducting and heat radiating fin 5 along substrate 21 being square is prolonged
The connection strap 23 for being used to support substrate 21 stretched, chip 1 are set on substrate 21, and connection strap 23 is fixed in rubber base 4.This structure,
By extending connection strap 23 in a side of substrate 21, which can be fixed in rubber base 4, and then can be effectively by substrate
21 supports.
It is provided with slot position 211 on substrate 21 and positioned at the periphery of chip 1, can be damp proof, anti-gas-leak increases contact area, just
Fixation is sealed in semiconductor element.
Optionally, one kind also referring to Fig. 3 and Fig. 4, as semiconductor element provided by the embodiment of the utility model
Specific embodiment, substrate 2 include the substrate 21 being square and prolong along the direction of the two sides of substrate 21 towards heat conducting and heat radiating fin 5
The connection strap 23 of substrate 21 is stretched and is used to support, chip 1 is set on substrate 21, and each connection strap 23 is fixed in rubber base 4.Specifically
Ground can be respectively set connection strap 23 in two adjacent sides of substrate 21, or connection is arranged on the two opposite sides side of substrate 21
Item 23.This structure can further improve the support fixed effect to substrate 21, two connections by the way that two connection straps 23 are arranged
Item 23 can also play certain conduction thermal effect, further increase the heat dissipation effect to chip 1.
Optionally, one kind also referring to Fig. 3 and Fig. 4, as semiconductor element provided by the embodiment of the utility model
Specific embodiment, substrate 2 include that the direction for substrate 21 and three sides towards the heat conducting and heat radiating fin 5 along substrate 21 being square is prolonged
The connection strap 23 of substrate 21 is stretched and is used to support, chip 1 is set on substrate 21, and each connection strap 23 is fixed in rubber base 4.This knot
Structure can further improve the support fixed effect to substrate 21, three connection straps 23 can also rise by the way that three connection straps 23 are arranged
To certain conduction thermal effect, the heat dissipation effect to chip 1 is further increased.
Preferably, one kind also referring to Fig. 3 and Fig. 4, as semiconductor element provided by the embodiment of the utility model
Specific embodiment, substrate 2 include that the direction for substrate 21 and each side towards the heat conducting and heat radiating fin 5 along substrate 21 being square is prolonged
The connection strap 23 of substrate 21 is stretched and is used to support, chip 1 is set on substrate 21, and each connection strap 23 is fixed in rubber base 4.This knot
Structure can further improve the support fixed effect to substrate 21, four connection straps 23 can also rise by the way that four connection straps 23 are arranged
To certain conduction thermal effect, the heat dissipation effect to chip 1 is further increased.
Extend outward the extension 22 in isosceles trapezoid shape in the middle part of each side of substrate 21, the end of each extension 22 to
On be bent with L-shaped connection strap 23, in the long end insertion corresponding card slot 43 of rubber base 4 of connection strap 23 and stretch out rubber base 4
Corresponding end.
Further, also referring to Fig. 5 and Fig. 6, as semiconductor element provided by the embodiment of the utility model one
Kind specific embodiment, each connection strap 23 include first extended by the corresponding end of substrate 21 towards the direction of heat conducting and heat radiating fin 5
Section and chip 1 is parallel to by the free end of first segment and is directed away from the second segment that the direction of chip 1 extends, each second segment fixes
In rubber base 4.Preferably, each connection strap 23 is separately positioned on the middle position of 21 respective side of substrate, after curing molding
There is the aperture 43 passed through for connection strap 23 on rubber base 4.Connection strap 23 is preferably made of copper product.This structure, on the one hand, each
Connection strap 23 passes through corresponding aperture 43 and is arranged, and can effectively support substrate 2 and chip 1；On the other hand, the heat on substrate 2
Connection strap 23 can be transferred to and be diffused, and then improve heat dissipation effect.
Further, also referring to Fig. 3 and Fig. 5, as semiconductor element provided by the embodiment of the utility model one
Rubber base 4 is stretched out in the free end of kind specific embodiment, the second segment 232 of each connection strap 23.This structure, on the one hand, by with even
The surrounding of substrate 2 can be supported fixation, so that the fixation of substrate 2 and chip 1 by the cooperation of fishplate bar 22；On the other hand, will
Each 23 bending of connection strap is in first segment 231 and second segment 232, can effectively increase heat dissipation area, improves the heat dissipation to chip 1 and imitates
Rate.
Further, also referring to Fig. 3 and Fig. 5, as semiconductor element provided by the embodiment of the utility model one
Kind specific embodiment, the height of each second segment are higher than the height of pin 3.This structure can avoid between each second segment and pin 3
There are electrostatic effects, and then improve the service performance of semiconductor element.In other embodiments, the height of second segment and pin 3
It can also be adjusted according to actual production, not limited uniquely herein.
Further, referring to Figure 7 together, specific as one kind of semiconductor element provided by the embodiment of the utility model
Embodiment, pin 3 include first section 31 to be electrical connected with chip 1, in first section of 31 one end far from chip 1 towards substrate
2 direction bending second section 32 and in second section 32 free end towards far from chip 1 direction bend third cut 33, first
31 are cut perpendicular to second section 32, second section 32 is cut 33 perpendicular to third, and first section 31 is parallel to third and cuts 33.Specifically, first
It cuts 31 to be electrically connected by conductor 6 and chip 1, first section 31 one end is extended with extension end 34, convenient for the first wiring pin
Support is fixed；Third cuts 33 corresponding ends for stretching out rubber base 4, for being connected with external devices.This structure, by bending pin 3
33, and then the direction of adjustable pin 3 and angle are cut at first section 31, second section 32 and third, convenient for fast with external devices
Speed connection.
Each first section 31 one end is extended with extension end 34, each first section 31 of other end along first section 31 of length direction
With third chamfering 35.Specifically, the third chamfering 35 is rectangular.This structure is set respectively by the both ends at first section 31
Extension end 34 and third chamfering 35 are set, so that each pin 3 during curing molding, can be supported effectively and be fixed, made by rubber base 4
Obtain the fixation of each pin 3.
Above-mentioned conductor 6 is chosen as conducting wire or conductive sheet made of copper product, has excellent conduction and heating conduction.
In other embodiments, conductor 6 or the electric conductor made of other materials, do not limit uniquely herein.
Referring to Figure 4 together, rubber base 4 is square, and the quadrangle on 4 thickness direction of rubber base is respectively equipped with the first chamfering 46, leads
The position of corresponding each first chamfering 46 of hot cooling fin 5 is equipped with the second chamfering 52.Specifically, rubber base 4 is chosen as square configuration, glue
Four angles of seat 4 are the first rectangular-shaped chamfering 46；Heat conducting and heat radiating fin 5 has the consistent shape in cross section with rubber base 4, leads
The quadrangle of hot cooling fin 5 is also the second rectangular-shaped chamfering 52, and is located between each first chamfering 46 and corresponding second chamfering 52
On same plane；The thickness of rubber base 4 is greater than the thickness of heat conducting and heat radiating fin 5, and then increases the intensity and hardness of semiconductor element,
Improve the protecting against shock performance of semiconductor element.Above-mentioned first chamfering 46 and the second chamfering 52 may also set up and be arc-shaped chamfering,
This is not limited uniquely.This structure, each angle setting of semiconductor element is chamfered, avoid right angle from causing to scratch to other devices
Or damage.
Referring to Figure 4 together, several pins 3 are divided into four groups, and each group pin 3 is located at the respective side of substrate 2, respectively draw
First section 31 of foot 3 is electrical connected with chip 1, and the third of each pin 3 cuts 33 corresponding ends for stretching out rubber base 4.Specifically, each group is drawn
Foot 3 forms symmetrical.This structure can increase the company with external devices by being respectively provided with multiple pins 3 in the surrounding of substrate 2
Quantity is connect, and then realizes the multi-functional of semiconductor element.In other embodiments, the quantity and installation site of pin 3 can roots
It is adjusted according to actual production, does not limit uniquely herein.
There is the locating slot 44 for being used to support chip 1 also referring to Fig. 8 and Fig. 9, on the rubber base 4 after curing molding and use
In the accommodation groove 45 of supporting substrate 21, locating slot 44 is connected to accommodation groove 45.This structure, the cross section of locating slot 44 and chip 1
Shape is consistent, and substrate 21 is consistent with the cross-sectional shape of accommodation groove 45, convenient for the accurate dismounting and dimension to chip 1 and substrate 21
Shield.
Also referring to Fig. 8 and Fig. 9, there is the groove 42 for being used to support pin 3, pin 3 on the rubber base 4 after curing molding
In groove 42, one end and the chip 1 of pin 3 are electrical connected, and the other end of pin 3 stretches out the corresponding end of rubber base 4.This knot
Structure fixes pin 3 by the way that groove 42 is sustainable, so that the fixation of pin 3, while being convenient for the surface structure of semiconductor element
Design is upright, and overall appearance effect is good, forms convenient for encapsulating.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. semiconductor element, it is characterised in that: including substrate, the chip on the substrate, Yu Suoshu substrate periphery between
Every being equipped with several pins for being electrically connected with external devices and curing molding on the substrate and sealing the fixed core
The rubber base of piece and each pin, each pin are set on the rubber base, and one end of each pin and the chip are electrical
It is connected, the other end of each pin stretches out the rubber base；The central region that the rubber base corresponds to the chip offers logical
Hole, the semiconductor element further include the heat conducting and heat radiating fin on the rubber base, and the heat conducting and heat radiating fin corresponds to described logical
The position in hole is simultaneously convexly equipped with protrusion towards the direction of the chip, and the protrusion passes through the through-hole and is affixed with the chip
It closes.
2. semiconductor element as described in claim 1, it is characterised in that: the cross section of the heat conducting and heat radiating fin in the horizontal plane
Size is consistent with the cross sectional dimensions of the rubber base top surface.
3. semiconductor element as described in claim 1, it is characterised in that: the substrate includes the substrate being square and along described
The connection strap for being used to support the substrate that a side of substrate extends towards the direction of the heat conducting and heat radiating fin, the chip are set
In on the substrate, the connection strap is fixed in the rubber base.
4. semiconductor element as claimed in claim 3, it is characterised in that: the substrate includes the substrate being square and along described
The direction of the two sides of substrate towards the heat conducting and heat radiating fin extends and is used to support the connection strap of the substrate, the core
Piece is set on the substrate, and each connection strap is fixed in the rubber base.
5. semiconductor element as claimed in claim 3, it is characterised in that: the substrate includes the substrate being square and along described
The direction of three sides towards the heat conducting and heat radiating fin of substrate extends and is used to support the connection strap of the substrate, the core
Piece is set on the substrate, and each connection strap is fixed in the rubber base.
6. semiconductor element as claimed in claim 3, it is characterised in that: the substrate includes the substrate being square and along described
The direction of each side towards the heat conducting and heat radiating fin of substrate extends and is used to support the connection strap of the substrate, the core
Piece is set on the substrate, and each connection strap is fixed in the rubber base.
7. such as the described in any item semiconductor elements of claim 3-6, it is characterised in that: each connection strap includes by the base
The corresponding end of plate is parallel to institute towards the first segment of the direction of heat conducting and heat radiating fin extension and by the free end of the first segment
It states chip and is directed away from the second segment that the direction of the chip extends.
8. semiconductor element as claimed in claim 7, it is characterised in that: the glue is stretched out in the free end of each second segment
Seat.
9. semiconductor element as claimed in claim 7, it is characterised in that: the height of each second segment is higher than the pin
Highly.
10. semiconductor element as described in claim 1, it is characterised in that: each pin includes and the chip electrical property phase
First section even, Yu Suoshu first cut one end far from the chip towards second section of the bending of the direction of the substrate and in institute
Second section of free end is stated to cut towards the third that the direction far from the chip is bent, described first section perpendicular to described second section,
Described second section is cut perpendicular to the third, and described first section is parallel to the third and cuts.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411425A (en) * | 2018-11-14 | 2019-03-01 | 深圳市瓦智能科技有限公司 | Semiconductor element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411425A (en) * | 2018-11-14 | 2019-03-01 | 深圳市瓦智能科技有限公司 | Semiconductor element |
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Effective date of registration: 20210617 Address after: 518000 102, No. 40, Xinyi village, chilingtou, Gaofeng community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen YUANTUO hi tech Semiconductor Co.,Ltd. Address before: 518000 904, Jinluan international business building, Heping East Road, Longhua street, Longhua New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN YIWA INTELLIGENT TECHNOLOGY Co.,Ltd. |