CN207399601U - A kind of high heat dissipation multilayer copper base - Google Patents
A kind of high heat dissipation multilayer copper base Download PDFInfo
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- CN207399601U CN207399601U CN201721007726.3U CN201721007726U CN207399601U CN 207399601 U CN207399601 U CN 207399601U CN 201721007726 U CN201721007726 U CN 201721007726U CN 207399601 U CN207399601 U CN 207399601U
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Abstract
The utility model discloses a kind of high heat dissipation multilayer copper bases, including circuit layer, ink layer and refrigerator pipes, the outer surface of the circuit layer is equipped with waterproof layer, the lower section of the cable hole is equipped with screw hole, the one side of the screw is installed with through hole, the lower section of the carbon-based composite fibre layer is equipped with pressing plate, the lower section of the hot boundary layer is equipped with substrate of resinizing, the lower section of the substrate of resinizing is equipped with copperclad plate, the lower section of the non-woven fabrics substrate is equipped with metal core substrate, the lower section of the mylar is equipped with barricade, the lower section of the silica gel piece is equipped with substrate, the lower section of the heat-conducting glue layer is equipped with buffer layer, the lower section of the copper base is equipped with the red tail that radiates, the refrigerator pipes are fixedly connected with the red tail that radiates.Height heat dissipation multilayer copper base, equipped with refrigerator pipes, silver lustre coating and screw, strengthens cooling-down effect, and improves the utilization rate of light, solves the problems, such as that existing copper base is not easy to dismounting.
Description
Technical field
The utility model is related to copper base technical fields, are specially a kind of high heat dissipation multilayer copper base.
Background technology
Copper base is one kind most expensive in metal substrate, and heat-conducting effect is many times all better than aluminum substrate and iron substrate, is applicable in
In high-frequency circuit, the heat dissipation of the regional and accurate communication equipment of high/low temperature variation greatly and architectural decoration, generally there is turmeric copper
Substrate, silver-plated copper base, spray tin copper base, anti-oxidant copper base etc..Copper base copper base circuit layer requires very big load
Stream ability, so as to use thicker copper foil, thermally conductive insulating layer is the place of the core technology of copper base, and core heat conduction ingredient is
Alundum (Al2O3) and silica flour composition and the polymer of epoxy resin filling are formed, and thermal resistance is small, and viscoelastic property is excellent, old with heat resistanceheat resistant
The ability of change can bear machinery and thermal stress.Copper base metal-based layer is the supporting member of copper base, it is desirable that has high heat conduction
Property, it is usually copper coin, is suitable for the processing of the conventional mechanicals such as drilling, punching and cutting.Advantage：1st, copper-based thermal conductivity factor is aluminium base
Twice, thermal conductivity factor is higher, then heat conduction efficiency is higher, and heat dissipation performance is better.2nd, it is copper-based to be processed into plated through-hole, and
Aluminium base cannot, the network of plated through-hole is necessary for consolidated network so that signal have good ground connection performance, secondly copper in itself
With weldability energy so that the structural member later stage of design, finally welding may be selected in installation.3rd, due to copper and the elasticity modulus of aluminium
Difference, the corresponding angularity of copper base and harmomegathus can be smaller than aluminum substrate, and overall performance is more stable.
Utility model content
（One）The technical issues of solution
Solve the problems, such as that existing copper base is not easy to dismounting.
（Two）Technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs：A kind of high heat dissipation multilayer is copper-based
Plate, including circuit layer, ink layer and refrigerator pipes, the outer surface of the circuit layer is equipped with waterproof layer, and the outer surface of waterproof layer is set
There is cable hole, the lower section of the cable hole is equipped with screw hole, and the outer surface of screw hole is equipped with screw, and peace is fixed in the one side of the screw
Equipped with through hole, and the lower section of through hole is equipped with air hole, and the lower section of the air hole is equipped with groove cup, and the outer surface of groove cup is set
There is silver lustre coating, the lower section of the circuit layer is equipped with insulating layer, and insulating layer is fixedly connected with ink layer, under the ink layer
Side is equipped with copper foil layer, and the lower section of copper foil layer is equipped with anti oxidation layer, and the lower section of the anti oxidation layer is equipped with composite substrate, and compound
The lower section of substrate is equipped with carbon-based composite fibre layer, and the lower section of the carbon-based composite fibre layer is equipped with pressing plate, and is set below pressing plate
There is hot boundary layer, the lower section of the hot boundary layer is equipped with substrate of resinizing, and the lower section of the substrate of resinizing is equipped with copperclad plate, and
The lower section of copperclad plate is equipped with non-woven fabrics substrate, and the lower section of the non-woven fabrics substrate is equipped with metal core substrate, and metal core substrate
Lower section is equipped with mylar, and the lower section of the mylar is equipped with barricade, and the lower section of barricade is equipped with silica gel piece；
The lower section of the silica gel piece is equipped with substrate, and the lower section of substrate is equipped with heat-conducting glue layer, the lower section of the heat-conducting glue layer
Equipped with buffer layer, and the lower section of buffer layer is equipped with copper base, and the lower section of the copper base is equipped with the red tail that radiates, the refrigerator pipes and
The red tail that radiates is fixedly connected.
Preferably, the quantity of the silver lustre coating and groove cup is three groups, and silver lustre coating and groove cup are respectively put down
Row is placed.
Preferably, the circuit layer is fixedly connected by insulating layer with ink layer.
Preferably, the quantity of the screw and screw hole is four groups, and screw and screw hole are respectively placed in parallel.
Preferably, the copper foil layer is fixedly connected by anti oxidation layer with composite substrate.
Preferably, the carbon-based composite fibre layer is fixedly connected by pressing plate with hot boundary layer.
Preferably, the quantity of the refrigerator pipes is two groups, and refrigerator pipes are placed in parallel respectively.
Preferably, the substrate of resinizing is fixedly connected by copperclad plate with non-woven fabrics substrate.
Preferably, the metal core substrate is fixedly connected by mylar with barricade.
Preferably, the screw is fixedly connected with screw hole, is facilitated and is removed circuit layer from insulating layer, easy-maintaining and tear open
It unloads, by being fixedly connected for buffer layer and copper base, there is bumper and absorbing shock, the impact of parts can be mitigated, protect
The service life of component by being fixedly connected for circuit layer and waterproof layer, has water-proof function, prevents from water stain oozing in parts
Thoroughly, normal use is influenced, by being fixedly connected for groove cup and silver lustre coating, flash ranging bottom is reflected away, light is improved and utilizes
Rate has electroplating gold processing by copper foil layer and through hole, so as to fulfill light source integral heat sink is efficient, light source can be born for a long time
High current and carry out stable work.
（Three）Advantageous effect
The utility model provides a kind of high heat dissipation multilayer copper base, possesses following advantageous effect：
, the height heat dissipation multilayer copper base, be fixedly connected by screw with screw hole, facilitate and take circuit layer from insulating layer
Under, easy-maintaining and dismounting by being fixedly connected for buffer layer and copper base, plays an important role of bumper and absorbing shock, can mitigate zero
The impact of part, the service life of guard block by being fixedly connected for circuit layer and waterproof layer, have water-proof function, prevent water
Stain is permeated in parts, influences normal use, and by being fixedly connected for groove cup and silver lustre coating, light is thoroughly reflected
It goes, improves light utilization.
, height heat dissipation multilayer copper base, be fixedly connected by refrigerator pipes and the red tail of heat dissipation, be directly transmitted to the heat of body
The relatively low object of the temperature that contacts radiates, and dependable performance, safety, installation, convenient disassembly, easy maintenance, nothing
The chemical agents such as freon, compact-sized, light weight, local to freeze, no electromagnetic interference, product expense is low, and noise is small, copper foil layer
Lower section is equipped with anti oxidation layer, can work under the environmental condition of high mild oxidation, prevent it from causing copper with the rise of temperature
The Quick Oxidation of substrate, strengthens intensity, avoids initiation accident, and density is low, mould intensive properties is high, and thermal stability is high, high heat conduction
Conductive capability is strong, and the advantages of resistance to ablation, corrosion-resistant and stable friction factor, surface roughness is high, and lines is uniform, Ke Yizeng
The combination power of strong all directions and prepreg can effectively facilitate combining closely for copper base and prepreg, so as to improve quality.
, the height heat dissipation multilayer copper base, have electroplating gold processing by copper foil layer and through hole, so as to ensure that light source integrally dissipates
The thermal efficiency is high, light source can bear long-term high current and carries out stable work.
, height heat dissipation multilayer copper base, mylar is equipped with by the lower section of metal core substrate, function admirable is rigidity, hard
Degree and toughness are high, puncture-resistant, rub resistance, high temperature resistant and low temperature, chemical resistance, oil resistivity, air-tightness and freshness good,
It is one of common barrier laminated film base material, the lower section of barricade is equipped with silica gel piece, and heat is transferred exclusively for using gap
Designing scheme production, can blind, complete the heat transfer of heating position and radiating part interdigit, at the same also act as insulation,
The effects that damping and sealing, it disclosure satisfy that device miniaturization and the design requirement of ultrathin, be great craftsmanship and usability, and
Thickness is applied widely, is a kind of splendid conductive filler material.
, height heat dissipation multilayer copper base, heat-conducting glue layer is equipped with by the lower section of substrate, there is remarkable cold-and-heat resistent alternation
Energy, ageing-resistant performance and electrical insulation capability.And with excellent moisture-proof, antidetonation, Inverter fed motor, anti-electric creepage performance and resistant to chemical media
Performance, can at -60~280 DEG C persistently use and retention property.It is non-swelling and have to most metals and nonmetallic materials
There is good cementability.
Description of the drawings
Fig. 1 is the utility model structure front view；
Fig. 2 is the utility model structure top view；
Fig. 3 is the utility model figure bottom enlarged drawing；
In figure：1 circuit layer, 2 insulating layers, 3 ink layers, 4 copper foil layers, 5 anti oxidation layers, 6 composite substrates, 7 carbon-based compound fibres
Dimension layer, 8 pressing plates, 9 hot boundary layers, 10 are resinized substrate, 11 copperclad plates, 12 non-woven fabrics substrates, 13 metal core substrates, 14 polyesters
Film, 15 barricades, 16 silica gel pieces, 17 substrates, 18 heat-conducting glue layers, 19 buffer layers, 20 copper bases, the 21 red tails of heat dissipation, 22 refrigerator pipes,
23 cable holes, 24 screw holes, 25 screws, 26 through holes, 27 waterproof layers, 28 air holes, 29 groove cups, 30 silver lustre coating.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clear, complete description, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of high heat dissipation multilayer copper base, including circuit
Layer（1）, ink layer（3）And refrigerator pipes（22）, circuit layer（1）Outer surface be equipped with waterproof layer（27）, waterproof layer（27）Appearance
Face is equipped with cable hole（23）, cable hole（23）Lower section be equipped with screw hole（24）, screw hole（24）Outer surface be equipped with screw（25）, spiral shell
Nail（25）One side be installed with through hole（26）, through hole（26）Lower section be equipped with air hole（28）, air hole（28）Lower section
Equipped with groove cup（29）, groove cup（29）Outer surface be equipped with silver lustre coating（30）, circuit layer（1）Lower section be equipped with insulating layer
（2）, insulating layer（2）And ink layer（3）It is fixedly connected, ink layer（3）Lower section be equipped with copper foil layer（4）, copper foil layer（4）Lower section
Equipped with anti oxidation layer（5）, anti oxidation layer（5）Lower section be equipped with composite substrate（6）, composite substrate（6）Lower section be equipped with it is carbon-based multiple
Condensating fiber layer（7）, carbon-based composite fibre layer（7）Lower section be equipped with pressing plate（8）, pressing plate（8）Lower section be equipped with hot boundary layer（9）,
Hot boundary layer（9）Lower section be equipped with and resinize substrate（10）, substrate of resinizing（10）Lower section be equipped with copperclad plate（11）, copperclad plate
（11）Lower section be equipped with non-woven fabrics substrate（12）, non-woven fabrics substrate（12）Lower section be equipped with metal core substrate（13）, metal core base
Plate（13）Lower section be equipped with mylar（14）, mylar（14）Lower section be equipped with barricade（15）, barricade（15）Under
Side is equipped with silica gel piece（16）；
Silica gel piece（16）Lower section be equipped with substrate（17）, substrate（17）Lower section be equipped with heat-conducting glue layer（18）, heat-conducting glue layer
（18）Lower section be equipped with buffer layer（19）, buffer layer（19）Lower section be equipped with copper base（20）, copper base（20）Lower section be equipped with
Radiate red tail（21）, refrigerator pipes（22）With the red tail that radiates（21）It is fixedly connected.
The multilayer copper base in conclusion the height radiates, passes through screw（25）And screw hole（24）It is fixedly connected, facilitates circuit
Layer（1）From insulating layer（2）On remove, it is easy-maintaining and dismounting, pass through buffer layer（19）And copper base（20）Be fixedly connected, have
The effect of bumper and absorbing shock, can mitigate the impact that parts are subject to, and the service life of elongate member passes through circuit layer（1）With it is anti-
Water layer（27）Be fixedly connected, have water-proof function, prevent it is water stain permeated in parts, influence normal use, pass through groove
Cup（29）With silver lustre coating（30）Be fixedly connected, light is thoroughly reflected away, improve light utilization.
Height heat dissipation multilayer copper base, passes through refrigerator pipes（22）With the red tail that radiates（21）It is fixedly connected, makes the heat of body
The relatively low object of the temperature contacted is directly transmitted to radiate, and performance safety is reliable, and installation and removal are convenient, safeguard
The chemical agents such as simplicity, no freon, compact-sized, light weight, local to freeze, no electromagnetic interference, product expense is low, and noise is small,
Copper foil layer（4）Lower section be equipped with anti oxidation layer（5）, can work under the environmental condition of high mild oxidation, prevent it with temperature
The rise of degree causes the Quick Oxidation of copper base, strengthens intensity, avoids initiation accident, density is low, mould intensive properties is high and
Thermal stability is high, and high heat-conductivity conducting ability is strong, and has the advantages that resistance to ablation, corrosion-resistant and stable friction factor, surface
Roughness is high, and lines is uniform, can enhance all directions and the combination power of prepreg, can effectively facilitate copper base and prepreg
Combine closely, so as to improve quality.
Height heat dissipation multilayer copper base, passes through copper foil layer（4）And through hole（26）There is electroplating gold processing, so as to fulfill light source
Integral heat sink is efficient, and light source can bear long-term high current and carry out stable work.
Height heat dissipation multilayer copper base, passes through metal core substrate（13）Lower section be equipped with mylar（14）, function admirable,
Rigidity, hardness and toughness are high, puncture-resistant, rub resistance, high temperature resistant and low temperature, chemical resistance, oil resistivity, air-tightness and fresh-keeping
Property is good, is one of common barrier laminated film base material, barricade（15）Lower section be equipped with silica gel piece（16）, it is special to use
The designing scheme production of heat is transferred in gap, can blind, complete the heat transfer of heating position and radiating part interdigit, simultaneously
The effects that also acting as insulation, damping and sealing, disclosure satisfy that device miniaturization and the design requirement of ultrathin, is great craftsmanship
And usability, and thickness is applied widely, is a kind of splendid conductive filler material.
Height heat dissipation multilayer copper base, passes through substrate（17）Lower section be equipped with heat-conducting glue layer（18）, there is the anti-cold of brilliance
Hot alternation performance, ageing-resistant performance and electrical insulation capability.And with excellent moisture-proof, antidetonation, Inverter fed motor, anti-electric creepage performance and resistance to
Chemical mediator performance, can at a temperature of -60~280 DEG C persistently use and retention property.It is non-swelling and to most metals
There is good cementability with nonmetallic materials.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
Also there are other identical elements in the process, method, article or apparatus that includes the element ", the electricity occurred in this article
Device element is electrically connected with extraneous main controller and 220V alternating currents, and main controller can be that computer etc. has played the routine of control
Know equipment.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that in the case where not departing from the principle of the utility model and spirit can these embodiments be carried out with a variety of variations, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (9)
1. a kind of high heat dissipation multilayer copper base, including circuit layer（1）, ink layer（3）And refrigerator pipes（22）, the circuit layer（1）
Outer surface be equipped with waterproof layer（27）, and waterproof layer（27）Outer surface be equipped with cable hole（23）, the cable hole（23）Under
Side is equipped with screw hole（24）, and screw hole（24）Outer surface be equipped with screw（25）, the screw（25）One side be installed with it is logical
Hole（26）, and through hole（26）Lower section be equipped with air hole（28）, the air hole（28）Lower section be equipped with groove cup（29）, and it is recessed
Slot cup（29）Outer surface be equipped with silver lustre coating（30）, the circuit layer（1）Lower section be equipped with insulating layer（2）, and insulating layer（2）
And ink layer（3）It is fixedly connected, the ink layer（3）Lower section be equipped with copper foil layer（4）, and copper foil layer（4）Lower section be equipped with it is anti-
Oxide layer（5）, the anti oxidation layer（5）Lower section be equipped with composite substrate（6）, and composite substrate（6）Lower section be equipped with it is carbon-based multiple
Condensating fiber layer（7）, the carbon-based composite fibre layer（7）Lower section be equipped with pressing plate（8）, and pressing plate（8）Lower section be equipped with hot interface
Layer（9）, the hot boundary layer（9）Lower section be equipped with and resinize substrate（10）, the substrate of resinizing（10）Lower section be equipped with it is multiple
Copper coin（11）, and copperclad plate（11）Lower section be equipped with non-woven fabrics substrate（12）, the non-woven fabrics substrate（12）Lower section be equipped with gold
Belong to core substrate（13）, and metal core substrate（13）Lower section be equipped with mylar（14）, the mylar（14）Lower section set
There is barricade（15）, and barricade（15）Lower section be equipped with silica gel piece（16）；
The silica gel piece（16）Lower section be equipped with substrate（17）, and substrate（17）Lower section be equipped with heat-conducting glue layer（18）, it is described to lead
Hot glue layer（18）Lower section be equipped with buffer layer（19）, and buffer layer（19）Lower section be equipped with copper base（20）, the copper base
（20）Lower section be equipped with the red tail of radiating（21）, the refrigerator pipes（22）With the red tail that radiates（21）It is fixedly connected.
2. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The silver lustre coating（30）With it is recessed
Slot cup（29）Quantity be three groups, and silver lustre coating（30）With groove cup（29）Respectively it is placed in parallel.
3. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The circuit layer（1）By exhausted
Edge layer（2）And ink layer（3）It is fixedly connected.
4. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The screw（25）And screw hole
（24）Quantity be four groups, and screw（25）And screw hole（24）Respectively it is placed in parallel.
5. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The copper foil layer（4）By anti-
Oxide layer（5）And composite substrate（6）It is fixedly connected.
6. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The carbon-based composite fibre layer
（7）Pass through pressing plate（8）With hot boundary layer（9）It is fixedly connected.
7. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The refrigerator pipes（22）Quantity
For two groups, and refrigerator pipes（22）It is placed in parallel respectively.
8. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The substrate of resinizing（10）It is logical
Cross copperclad plate（11）With non-woven fabrics substrate（12）It is fixedly connected.
9. a kind of high heat dissipation multilayer copper base according to claim 1, it is characterised in that：The metal core substrate（13）It is logical
Cross mylar（14）And barricade（15）It is fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721007726.3U CN207399601U (en) | 2017-08-14 | 2017-08-14 | A kind of high heat dissipation multilayer copper base |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721007726.3U CN207399601U (en) | 2017-08-14 | 2017-08-14 | A kind of high heat dissipation multilayer copper base |
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| Publication Number | Publication Date |
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| CN207399601U true CN207399601U (en) | 2018-05-22 |
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ID=62417964
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| CN201721007726.3U Active CN207399601U (en) | 2017-08-14 | 2017-08-14 | A kind of high heat dissipation multilayer copper base |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109392237A (en) * | 2017-08-14 | 2019-02-26 | 广东合通建业科技股份有限公司 | A kind of high heat dissipation multilayer copper base and its manufacturing process |
-
2017
- 2017-08-14 CN CN201721007726.3U patent/CN207399601U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109392237A (en) * | 2017-08-14 | 2019-02-26 | 广东合通建业科技股份有限公司 | A kind of high heat dissipation multilayer copper base and its manufacturing process |
| CN109392237B (en) * | 2017-08-14 | 2024-05-07 | 广东合通建业科技股份有限公司 | High-heat-dissipation multilayer copper substrate and manufacturing process thereof |
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