CN109392237A - A kind of high heat dissipation multilayer copper base and its manufacturing process - Google Patents
A kind of high heat dissipation multilayer copper base and its manufacturing process Download PDFInfo
- Publication number
- CN109392237A CN109392237A CN201710689496.1A CN201710689496A CN109392237A CN 109392237 A CN109392237 A CN 109392237A CN 201710689496 A CN201710689496 A CN 201710689496A CN 109392237 A CN109392237 A CN 109392237A
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- Prior art keywords
- lower section
- layer
- copper base
- substrate
- heat dissipation
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 239000010949 copper Substances 0.000 title claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 64
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000002131 composite material Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 13
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 239000004332 silver Substances 0.000 claims abstract description 13
- 229920002799 BoPET Polymers 0.000 claims abstract description 11
- 239000005041 Mylar™ Substances 0.000 claims abstract description 11
- 241001282110 Pagrus major Species 0.000 claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 10
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 239000000835 fiber Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims description 15
- 230000003064 anti-oxidating effect Effects 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 230000035939 shock Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000007774 longterm Effects 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000010422 painting Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 86
- 238000000034 method Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of high heat dissipation multilayer copper base and its manufacturing process, including circuit layer, ink layer and refrigerator pipes, the outer surface of the circuit layer is equipped with waterproof layer, the lower section of the cable hole is equipped with screw hole, the side of the screw is fixedly installed with through-hole, the lower section of the carbon-based composite fibre layer is equipped with pressing plate, the lower section of the hot boundary layer is equipped with substrate of resinizing, the lower section of the substrate of resinizing is equipped with copperclad plate, the lower section of the non-woven fabrics substrate is equipped with metal core substrate, the lower section of the mylar is equipped with barricade, the lower section of the silica gel piece is equipped with substrate, the lower section of the heat-conducting glue layer is equipped with buffer layer, the lower section of the copper base is equipped with the red tail that radiates, the refrigerator pipes are fixedly connected with the red tail that radiates.Height heat dissipation multilayer copper base and its manufacturing process, are equipped with refrigerator pipes, silver lustre coating and screw, strengthen cooling effect, and improve the utilization rate of light, solve the problems, such as that existing copper base is not easy to disassembly.
Description
Technical field
The present invention relates to copper base technical field, specially a kind of high heat dissipation multilayer copper base and its manufacturing process.
Background technique
Copper base is one kind most expensive in metal substrate, and heat-conducting effect is many times all better than aluminum substrate and iron substrate, is applicable in
In high-frequency circuit, the heat dissipation of the regional and accurate communication equipment of high/low temperature variation greatly and architectural decoration, generally there is turmeric copper
Substrate, silver-plated copper base, spray tin copper base, anti-oxidant copper base etc..
Copper base copper base circuit layer requires very big current-carrying capability, so that thicker copper foil, thermally conductive insulating layer should be used
It is the place of the core technology of copper base, the thermally conductive ingredient of core is that aluminum oxide and silicon powder composition gather with what epoxy resin was filled
It closes object to constitute, thermal resistance is small, and viscoelastic property is excellent, and the ability with resistant to thermal aging is able to bear mechanical and thermal stress.Copper-based sheet metal
Belong to the supporting member that base is copper base, it is desirable that there is high-termal conductivity, usually copper sheet, be suitable for drilling, punching and cutting etc.
Conventional mechanical processing.Advantage: 1, copper-based thermal coefficient is twice of aluminium base, and thermal coefficient is higher, then heat conduction efficiency is higher,
Heat dissipation performance is better.2, copper-based to be processed into plated through-hole, and aluminium base cannot, the network of plated through-hole is necessary for same net
Network, so that signal has good ground connection performance, secondly copper itself has weldability energy, so that the structural member later period of design is most
Welding may be selected in installation eventually.3, since the elasticity modulus difference of copper and aluminium, the corresponding angularity of copper base and harmomegathus can compare aluminium base
Plate it is small, overall performance is more stable.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of high heat dissipation multilayer copper base and its manufacturing process, solve
Existing copper base is not easy to the problem of disassembly.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of high heat dissipation multilayer copper base and
Its manufacturing process, including circuit layer, ink layer and refrigerator pipes, the outer surface of the circuit layer are equipped with waterproof layer, and waterproof layer
Outer surface is equipped with cable hole, and the lower section of the cable hole is equipped with screw hole, and the outer surface of screw hole is equipped with screw, and the one of the screw
Side is fixedly installed with through-hole, and the lower section of through-hole is equipped with air hole, and the lower section of the air hole is equipped with groove cup, and groove cup
Outer surface is equipped with silver lustre coating, and the lower section of the circuit layer is equipped with insulating layer, and insulating layer is fixedly connected with ink layer, the oil
The lower section of layer of ink is equipped with copper foil layer, and the lower section of copper foil layer is equipped with anti oxidation layer, and the lower section of the anti oxidation layer is equipped with composite base
Plate, and the lower section of composite substrate is equipped with carbon-based composite fibre layer, the lower section of the carbon-based composite fibre layer is equipped with pressing plate, and pressing plate
Lower section be equipped with hot boundary layer, the lower section of the hot boundary layer is equipped with substrate of resinizing, and the lower section of the substrate of resinizing is equipped with
Copperclad plate, and the lower section of copperclad plate is equipped with non-woven fabrics substrate, the lower section of the non-woven fabrics substrate is equipped with metal core substrate, and metal
The lower section of core substrate is equipped with mylar, and the lower section of the mylar is equipped with barricade, and the lower section of barricade is equipped with silica gel
Piece；
The lower section of the silica gel piece is equipped with substrate, and the lower section of substrate is equipped with heat-conducting glue layer, the lower section of the heat-conducting glue layer
Equipped with buffer layer, and the lower section of buffer layer is equipped with copper base, and the lower section of the copper base is equipped with the red tail that radiates, the refrigerator pipes and
The red tail that radiates is fixedly connected.
Preferably, the quantity of the silver lustre coating and groove cup is three groups, and silver lustre coating and groove cup are put down respectively
Row is placed.
Preferably, the circuit layer is fixedly connected by insulating layer with ink layer.
Preferably, the quantity of the screw and screw hole is four groups, and screw and screw hole are placed in parallel respectively.
Preferably, the copper foil layer is fixedly connected by anti oxidation layer with composite substrate.
Preferably, the carbon-based composite fibre layer is fixedly connected by pressing plate with hot boundary layer.
Preferably, the quantity of the refrigerator pipes is two groups, and refrigerator pipes are placed in parallel respectively.
Preferably, the substrate of resinizing is fixedly connected by copperclad plate with non-woven fabrics substrate.
Preferably, the metal core substrate is fixedly connected by mylar with barricade.
Preferably, the screw is fixedly connected with screw hole, is facilitated and is removed circuit layer from insulating layer, easy-maintaining and tear open
It unloads, by being fixedly connected for buffer layer and copper base, has the function of bumper and absorbing shock, the impact of components can be mitigated, protect
The service life of component has water-proof function by being fixedly connected for circuit layer and waterproof layer, prevents water stain to seeping in components
Thoroughly, normal use is influenced, by being fixedly connected for groove cup and silver lustre coating, flash ranging bottom is reflected away, light is improved and utilizes
Rate has electroplating gold processing by copper foil layer and through-hole, to realize that light source integral heat sink is high-efficient, light source is able to bear for a long time
High current and carry out stable work.
(3) beneficial effect
The present invention provides a kind of high heat dissipation multilayer copper base and its manufacturing process, have it is following the utility model has the advantages that
(1), height heat dissipation multilayer copper base and its manufacturing process, are fixedly connected with screw hole by screw, are facilitated circuit
Layer is removed from insulating layer, easy-maintaining and disassembly, by being fixedly connected for buffer layer and copper base, the work with bumper and absorbing shock
With the impact of components can be mitigated, the service life of guard block has by being fixedly connected for circuit layer and waterproof layer
Water-proof function, prevent it is water stain influence normal use to permeating in components, by being fixedly connected for groove cup and silver lustre coating,
Light is thoroughly reflected away, light utilization is improved.
(2), height heat dissipation multilayer copper base and its manufacturing process are fixedly connected with the red tail that radiates by refrigerator pipes, make machine
The heat of body is directly transmitted to the lower object of the temperature contacted and radiates, and reliable performance, safety, installation, disassembly
It is convenient, easy maintenance, the chemical agents such as no freon, compact-sized, light weight, partial cooling, no electromagnetic interference, product expense
Low, noise is small, and the lower section of copper foil layer is equipped with anti oxidation layer, can work under the environmental condition of high mild oxidation, prevent its with
The raising of temperature lead to the quick oxidation of copper base, strengthen intensity, avoid initiation accident, density is low, mould intensive properties are high,
Thermal stability is high, and high heat-conductivity conducting ability is strong, and the advantages of resistance to ablation, corrosion-resistant and stable friction factor, surface roughness
Height, lines is uniform, and the binding force of all directions and prepreg can be enhanced, and can effectively facilitate the close of copper base and prepreg
In conjunction with to improve quality.
(3), height heat dissipation multilayer copper base and its manufacturing process, have electroplating gold processing by copper foil layer and through-hole, from
And guarantee that light source integral heat sink is high-efficient, light source is able to bear long-term high current and carries out stable work.
(4), height heat dissipation multilayer copper base and its manufacturing process are equipped with mylar by the lower section of metal core substrate,
Function admirable, rigidity, hardness and toughness are high, puncture-resistant, rub resistance, high temperature resistant and low temperature, chemical resistance, oil resistivity, gas
Close property and freshness good, is one of common barrier laminated film substrate, and the lower section of barricade is equipped with silica gel piece, exclusively for
Produced using the design scheme of gap transmitting heat, can blind, the heat for completing heating position and radiating part interdigit transmits,
The effects of also acting as insulation, damping and sealing simultaneously, can satisfy the design requirement of device miniaturization and ultrathin, is great work
Skill and usability, and thickness is applied widely, is a kind of splendid conductive filler material.
, height heat dissipation multilayer copper base and its manufacturing process, heat-conducting glue layer is equipped with by the lower section of substrate, is had brilliant
Cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulation capability.And there is excellent moisture-proof, antidetonation, Inverter fed motor, anti-electric creepage performance
And chemical mediator-resitant property, can at -60~280 DEG C persistently use and retention property.It is non-swelling and to most metals and
Nonmetallic materials have good cementability.
Detailed description of the invention
Fig. 1 is structure of the invention front view；
Fig. 2 is structure of the invention top view；
Fig. 3 is figure bottom of the present invention enlarged drawing；
In figure: 1 circuit layer, 2 insulating layers, 3 ink layers, 4 copper foil layers, 5 anti oxidation layers, 6 composite substrates, 7 carbon-based compound fibres
Dimension layer, 8 pressing plates, 9 hot boundary layers, 10 are resinized substrate, 11 copperclad plates, 12 non-woven fabrics substrates, 13 metal core substrates, 14 polyesters
Film, 15 barricades, 16 silica gel pieces, 17 substrates, 18 heat-conducting glue layers, 19 buffer layers, 20 copper bases, the 21 red tails of heat dissipation, 22 refrigerator pipes,
23 cable holes, 24 screw holes, 25 screws, 26 through-holes, 27 waterproof layers, 28 air holes, 29 groove cups, 30 silver lustre coating.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Whole description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of high heat dissipation multilayer copper base and its manufacturing process,
Including circuit layer (1), ink layer (3) and refrigerator pipes (22), the outer surface of circuit layer (1) is equipped with waterproof layer (27), waterproof layer
(27) outer surface is equipped with cable hole (23), and the lower section of cable hole (23) is equipped with screw hole (24), and the outer surface of screw hole (24) is equipped with
Screw (25), the side of screw (25) are fixedly installed with through-hole (26), and the lower section of through-hole (26) is equipped with air hole (28), air hole
(28) lower section is equipped with groove cup (29), and the outer surface of groove cup (29) is equipped with silver lustre coating (30), and circuit layer is set below (1)
Have insulating layer (2), insulating layer (2) is fixedly connected with ink layer (3), and the lower section of ink layer (3) is equipped with copper foil layer (4), copper foil layer
(4) lower section is equipped with anti oxidation layer (5), and the lower section of anti oxidation layer (5) is equipped with composite substrate (6), and composite substrate is set below (6)
Have carbon-based composite fibre layer (7), the lower section of carbon-based composite fibre layer (7) is equipped with pressing plate (8), and the lower section of pressing plate (8) is equipped with hot boundary
Surface layer (9), the lower section of hot boundary layer (9), which is equipped with, resinizes substrate (10), and the lower section of substrate of resinizing (10) is equipped with copperclad plate
(11), the lower section of copperclad plate (11) is equipped with non-woven fabrics substrate (12), and the lower section of non-woven fabrics substrate (12) is equipped with metal core substrate
(13), the lower section of metal core substrate (13) is equipped with mylar (14), and the lower section of mylar (14) is equipped with barricade (15), screen
The lower section of shield plate (15) is equipped with silica gel piece (16)；
The lower section of silica gel piece (16) is equipped with substrate (17), and the lower section of substrate (17) is equipped with heat-conducting glue layer (18), heat-conducting glue layer
(18) lower section is equipped with buffer layer (19), and the lower section of buffer layer (19) is equipped with copper base (20), and the lower section of copper base (20) is equipped with
It radiates red tail (21), refrigerator pipes (22) are fixedly connected with red tail (21) of radiating.
In conclusion height heat dissipation multilayer copper base and its manufacturing process, connect by the way that screw (25) and screw hole (24) are fixed
It connects, facilitates and remove circuit layer (1) from insulating layer (2), easy-maintaining and disassembly passes through buffer layer (19) and copper base (20)
It is fixedly connected, has the function of bumper and absorbing shock, the impact that components are subject to can be mitigated, the service life of elongate member passes through
Circuit layer (1) is fixedly connected with waterproof layer (27), has water-proof function, prevents water stain to permeating in components, is influenced normal
It uses, by being fixedly connected for groove cup (29) and silver lustre coating (30), light is thoroughly reflected away, raising light utilization.
Height heat dissipation multilayer copper base and its manufacturing process are fixedly connected by refrigerator pipes (22) with red tail (21) of radiating,
Make the heat of body be directly transmitted to the lower object of the temperature contacted to radiate, and performance safety is reliable, installation and
Convenient disassembly, easy maintenance, the chemical agents such as no freon, compact-sized, light weight, partial cooling, no electromagnetic interference, product take
With low, noise is small, and the lower section of copper foil layer (4) is equipped with anti oxidation layer (5), can work under the environmental condition of high mild oxidation,
Preventing it as the temperature rises leads to the quick oxidation of copper base, strengthens intensity, avoids initiation accident, and density is low, mould
Intensive properties are high and thermal stability is high, and high heat-conductivity conducting ability is strong, and have resistance to ablation, corrosion-resistant and stable friction factor
Advantage, surface roughness is high, and lines is uniform, and the binding force of all directions and prepreg can be enhanced, and can effectively facilitate copper-based
Plate and prepreg are combined closely, to improve quality.
Height heat dissipation multilayer copper base and its manufacturing process, have electroplating gold processing by copper foil layer (4) and through-hole (26),
To realize that light source integral heat sink is high-efficient, light source is able to bear long-term high current and carries out stable work.
Height heat dissipation multilayer copper base and its manufacturing process are equipped with mylar by the lower section of metal core substrate (13)
(14), function admirable, rigidity, hardness and toughness are high, puncture-resistant, rub resistance, high temperature resistant and low temperature, chemical resistance, oil resistant
Property, air-tightness and freshness good is one of common barrier laminated film substrate, the lower section of barricade (15) is equipped with silica gel
Piece (16), the special design scheme production using gap transmitting heat being capable of blind, completion heating position and heat dissipation position
Between heat transmitting, while also act as insulation, damping and sealing the effects of, the design that can satisfy device miniaturization and ultrathin is wanted
It asks, is great craftsmanship and usability, and thickness is applied widely, be a kind of splendid conductive filler material.
Height heat dissipation multilayer copper base and its manufacturing process are equipped with heat-conducting glue layer (18) by the lower section of substrate (17), tool
There are brilliant cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulation capability.And with excellent moisture-proof, antidetonation, Inverter fed motor, anti-
Leak electricity performance and chemical mediator-resitant property, can -60~280 DEG C at a temperature of persistently use and retention property.It is non-swelling and
There is good cementability to most metals and nonmetallic materials.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ", the electricity occurred in this article
Device element is electrically connected with extraneous main controller and 220V alternating current, and main controller can play the routine of control for computer etc.
Know equipment.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of high heat dissipation multilayer copper base and its manufacturing process, including circuit layer (1), ink layer (3) and refrigerator pipes (22), institute
The outer surface for stating circuit layer (1) is equipped with waterproof layer (27), and the outer surface of waterproof layer (27) is equipped with cable hole (23), the cabling
The lower section in hole (23) is equipped with screw hole (24), and the outer surface of screw hole (24) is equipped with screw (25), and the side of the screw (25) is solid
Dingan County is equipped with through-hole (26), and the lower section of through-hole (26) is equipped with air hole (28), and the lower section of the air hole (28) is equipped with groove
Cup (29), and the outer surface of groove cup (29) is equipped with silver lustre coating (30), the lower section of the circuit layer (1) is equipped with insulating layer (2),
And insulating layer (2) is fixedly connected with ink layer (3), the lower section of the ink layer (3) is equipped with copper foil layer (4), and copper foil layer (4)
Lower section is equipped with anti oxidation layer (5), and the lower section of the anti oxidation layer (5) is equipped with composite substrate (6), and the lower section of composite substrate (6)
Equipped with carbon-based composite fibre layer (7), the lower section of the carbon-based composite fibre layer (7) is equipped with pressing plate (8), and the lower section of pressing plate (8)
Equipped with hot boundary layer (9), the lower section of the hot boundary layer (9), which is equipped with, resinizes substrate (10), the substrate of resinizing (10)
Lower section is equipped with copperclad plate (11), and the lower section of copperclad plate (11) is equipped with non-woven fabrics substrate (12), the non-woven fabrics substrate (12)
Lower section is equipped with metal core substrate (13), and the lower section of metal core substrate (13) is equipped with mylar (14), the mylar
(14) lower section is equipped with barricade (15), and the lower section of barricade (15) is equipped with silica gel piece (16)；
The lower section of the silica gel piece (16) is equipped with substrate (17), and the lower section of substrate (17) is equipped with heat-conducting glue layer (18), described to lead
The lower section of hot glue layer (18) is equipped with buffer layer (19), and the lower section of buffer layer (19) is equipped with copper base (20), the copper base
(20) lower section is equipped with red tail (21) of radiating, and the refrigerator pipes (22) are fixedly connected with red tail (21) of radiating.
2. a kind of high heat dissipation multilayer copper base according to claim 1 and its manufacturing process, it is characterised in that: the silver lustre
The quantity of coating (30) and groove cup (29) is three groups, and silver lustre coating (30) and groove cup (29) are placed in parallel respectively.
3. a kind of high heat dissipation multilayer copper base according to claim 1 and its manufacturing process, it is characterised in that: the circuit
Layer (1) is fixedly connected by insulating layer (2) with ink layer (3).
4. a kind of high heat dissipation multilayer copper base according to claim 1 and its manufacturing process, it is characterised in that: the screw
(25) and the quantity of screw hole (24) is four groups, and screw (25) and screw hole (24) are placed in parallel respectively.
5. a kind of high heat dissipation multilayer copper base and its manufacturing process described in -4 according to claim 1, it is characterised in that: the copper
Layers of foil (4) is fixedly connected by anti oxidation layer (5) with composite substrate (6).
6. a kind of high heat dissipation multilayer copper base and its manufacturing process described in -5 according to claim 1, it is characterised in that: the carbon
Based composite fibre layer (7) is fixedly connected by pressing plate (8) with hot boundary layer (9).
7. a kind of high heat dissipation multilayer copper base and its manufacturing process described in -6 according to claim 1, it is characterised in that: the system
The quantity of cold pipe (22) is two groups, and refrigerator pipes (22) are placed in parallel respectively.
8. a kind of high heat dissipation multilayer copper base and its manufacturing process described in -7 according to claim 1, it is characterised in that: the painting
Resin substrate (10) is fixedly connected by copperclad plate (11) with non-woven fabrics substrate (12).
9. a kind of high heat dissipation multilayer copper base and its manufacturing process described in -8 according to claim 1, it is characterised in that: the gold
Belong to core substrate (13) to be fixedly connected by mylar (14) with barricade (15).
10. a kind of high heat dissipation multilayer copper base and its manufacturing process described in -9 according to claim 1, it is characterised in that: described
Screw (25) is fixedly connected with screw hole (24), is facilitated and is removed circuit layer (1) from insulating layer (2), and easy-maintaining and disassembly passes through
Buffer layer (19) is fixedly connected with copper base (20), has the function of bumper and absorbing shock, can be mitigated foreign object and be rushed to components
It hits, the service life of elongate member, by being fixedly connected for circuit layer (1) and waterproof layer (27), there is water-proof function, prevent water
Stain influences its normal use to permeating in components, by being fixedly connected for groove cup (29) and silver lustre coating (30), light is thorough
Bottom reflects away, and improves light utilization, has electroplating gold processing by copper foil layer (4) and through-hole (26), to guarantee light source
Whole radiating efficiency is high, light source is able to bear long-term high current and carries out stable work.
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| CN201710689496.1A CN109392237B (en) | 2017-08-14 | 2017-08-14 | High-heat-dissipation multilayer copper substrate and manufacturing process thereof |
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| CN201710689496.1A CN109392237B (en) | 2017-08-14 | 2017-08-14 | High-heat-dissipation multilayer copper substrate and manufacturing process thereof |
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| WO1997003544A1 (en) * | 1995-07-07 | 1997-01-30 | Optiprint Ag | Conductive connection and process for producing it |
| US20080118762A1 (en) * | 2005-07-07 | 2008-05-22 | Asahi Glass Company, Limited | Electromagnetic wave shielding film and protective plate for plasma display panel |
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| CN109392237B (en) | 2024-05-07 |
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