CN109392237B - High-heat-dissipation multilayer copper substrate and manufacturing process thereof - Google Patents
High-heat-dissipation multilayer copper substrate and manufacturing process thereof Download PDFInfo
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- CN109392237B CN109392237B CN201710689496.1A CN201710689496A CN109392237B CN 109392237 B CN109392237 B CN 109392237B CN 201710689496 A CN201710689496 A CN 201710689496A CN 109392237 B CN109392237 B CN 109392237B
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- 239000000758 substrate Substances 0.000 title claims abstract description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 72
- 239000010949 copper Substances 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 117
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 239000002131 composite material Substances 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 239000004332 silver Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 241001282110 Pagrus major Species 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920006267 polyester film Polymers 0.000 claims abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 238000005057 refrigeration Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000011889 copper foil Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 9
- 230000003064 anti-oxidating effect Effects 0.000 claims description 8
- 239000004745 nonwoven fabric Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000005253 cladding Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003487 anti-permeability effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a high-heat-dissipation multilayer copper substrate and a manufacturing process thereof, wherein the high-heat-dissipation multilayer copper substrate comprises a circuit layer, an ink layer and a refrigerating tube, a waterproof layer is arranged on the outer surface of the circuit layer, a screw hole is arranged below a wiring hole, a through hole is fixedly arranged on one side of a screw, a pressing plate is arranged below a carbon-based composite fiber layer, a resin-coated substrate is arranged below a thermal interface layer, a copper clad plate is arranged below the resin-coated substrate, a metal core substrate is arranged below the non-woven substrate, a shielding plate is arranged below a polyester film, a substrate is arranged below a silica gel sheet, a buffer layer is arranged below a heat-conducting adhesive layer, a heat dissipation red tail is arranged below the copper substrate, and the refrigerating tube is fixedly connected with the heat dissipation red tail. The high-heat-dissipation multilayer copper substrate and the manufacturing process thereof are provided with the refrigeration tube, the bright silver coating and the screw, so that the cooling effect is enhanced, the utilization rate of light is improved, and the problem that the existing copper substrate is inconvenient to detach is solved.
Description
Technical Field
The invention relates to the technical field of copper substrates, in particular to a high-heat-dissipation multilayer copper substrate and a manufacturing process thereof.
Background
The copper substrate is the most expensive one of the metal substrates, has a heat conduction effect which is many times better than that of an aluminum substrate and an iron substrate, is suitable for heat dissipation and architectural decoration industries of high-frequency circuits, areas with large high-low temperature variation and precision communication equipment, and generally comprises a gold-plated copper substrate, a silver-plated copper substrate, a tin-plated copper substrate, an oxidation-resistant copper substrate and the like.
The copper substrate circuit layer is required to have great current carrying capacity, so that thicker copper foil is used, the heat conducting insulating layer is the core technology of the copper substrate, the core heat conducting component is composed of aluminum oxide and silicon powder and polymer filled with epoxy resin, and the heat resistance is small, the viscoelastic performance is excellent, and the heat aging resistance can bear mechanical and thermal stress. The copper substrate metal base layer is a supporting member for a copper substrate, and is required to have high thermal conductivity, typically a copper plate, and is suitable for conventional machining such as drilling, punching shear, cutting and the like. The advantages are that: 1. the copper-based heat conductivity is twice that of the aluminum-based heat conductivity, and the higher the heat conductivity is, the higher the heat conduction efficiency is and the better the heat dissipation performance is. 2. Copper base can be processed into metallized holes, but aluminum base can not, the network of metallized holes must be the same network, so that the signal has good grounding performance, and secondly copper itself has weldability, so that the final installation of the designed structural member can be selectively welded. 3. Because of the difference of elastic modulus of copper and aluminum, the corresponding warping degree and swelling of the copper substrate can be smaller than that of the aluminum substrate, and the overall performance is more stable.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides a high-heat-dissipation multilayer copper substrate and a manufacturing process thereof, and solves the problem that the existing copper substrate is inconvenient to detach.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a high heat dissipation multilayer copper base plate and manufacturing process thereof, includes circuit layer, printing ink layer and refrigeration pipe, the surface of circuit layer is equipped with the waterproof layer, and the surface of waterproof layer is equipped with the wiring hole, the below of wiring hole is equipped with the screw, and the surface of screw is equipped with the screw, one side fixed mounting of screw has the through-hole, and the below of through-hole is equipped with the bleeder vent, the below of bleeder vent is equipped with the recess cup, and the surface of recess cup is equipped with bright silver cladding material, the below of circuit layer is equipped with the insulating layer, and insulating layer and printing ink layer fixed connection, the below of printing ink layer is equipped with the copper foil layer, and the below of copper foil layer is equipped with the antioxidation layer, the below of antioxidation layer is equipped with the compound substrate, and the below of compound substrate is equipped with the carbon-based composite fiber layer, the below of carbon-based composite fiber layer is equipped with the clamp plate, and the below of clamp plate is equipped with the thermal interface layer, the below of thermal interface layer is equipped with the resin substrate, the below of resin substrate is equipped with the copper-coated, the below of bleeder vent is equipped with the recess cup, and the surface is equipped with the bright silver cladding, the below of copper-coated substrate, the below is equipped with the metal core substrate, and is equipped with the film below the polyester plate;
The lower part of silica gel piece is equipped with the base plate, and the below of base plate is equipped with the heat conduction glue film, the below of heat conduction glue film is equipped with the buffer layer, and the below of buffer layer is equipped with the copper base plate, the below of copper base plate is equipped with the red tail of heat dissipation, refrigeration pipe and the red tail fixed connection of heat dissipation.
Preferably, the number of the bright silver plating layers and the number of the groove cups are three, and the bright silver plating layers and the groove cups are respectively arranged in parallel.
Preferably, the circuit layer is fixedly connected with the ink layer through an insulating layer.
Preferably, the number of the screws and the screw holes is four, and the screws and the screw holes are respectively arranged in parallel.
Preferably, the copper foil layer is fixedly connected with the composite substrate through the antioxidation layer.
Preferably, the carbon-based composite fiber layer is fixedly connected with the thermal interface layer through a pressing plate.
Preferably, the number of the refrigerating pipes is two, and the refrigerating pipes are respectively arranged in parallel.
Preferably, the resin-coated substrate is fixedly connected with the non-woven fabric substrate through a copper-clad plate.
Preferably, the metal core substrate is fixedly connected with the shielding plate through the polyester film.
Preferably, screw and screw fixed connection, conveniently take off the circuit layer from the insulating layer, easy maintenance and dismantlement, through buffer layer and copper substrate's fixed connection, have buffering absorbing effect, can alleviate the impact of spare part, protection part's life, through the fixed connection of circuit layer and waterproof layer, waterproof function has, prevent that the water stain from permeating in to the spare part, influence normal use, through the fixed connection of recess cup and bright silver cladding material, reflect away the light bottom, improve light utilization, all have the electrogalvanizing treatment through copper foil layer and through-hole, thereby realize that the whole radiating efficiency of light source is high, the light source can bear long-term heavy current and carry out stable work.
(III) beneficial effects
The invention provides a high-heat-dissipation multilayer copper substrate and a manufacturing process thereof, which have the following beneficial effects:
(1) This high heat dissipation multilayer copper base plate and manufacturing process thereof, through screw and screw fixed connection, the convenience is taken off the circuit layer from the insulating layer, easy maintenance and dismantlement, through buffer layer and copper base plate's fixed connection, have buffering absorbing effect, can alleviate the impact of spare part, protection part's life, through the fixed connection of circuit layer and waterproof layer, have waterproof function, prevent that the water stain from permeating in to spare part, influence normal use, through the fixed connection of recess cup and bright silver cladding material, thoroughly reflect away light, the improvement light utilization ratio.
(2) The high-heat-dissipation multilayer copper substrate and the manufacturing process thereof enable heat of a machine body to be directly transmitted to an object which is in contact with the machine body and has low temperature to dissipate heat through the fixed connection of the cooling pipe and the heat dissipation red tail, and the high-heat-dissipation multilayer copper substrate has the advantages of reliable and safe performance, convenient installation and disassembly, convenient maintenance, no chemical agents such as freon, compact structure, light weight, partial cooling, no electromagnetic interference, low product cost, low noise, capability of working under the environment condition of high temperature and oxidization, capability of preventing the copper substrate from being quickly oxidized along with the rise of the temperature, strength enhancement, accident prevention, low density, high modulus intensity, high heat stability, high heat conductivity, ablation resistance, corrosion resistance and stable friction coefficient, has the advantages of uniform lines, can enhance the binding force between each direction and the prepreg, and can effectively promote the close combination of the copper substrate and the prepreg, thereby improving the quality.
(3) According to the high-heat-dissipation multilayer copper substrate and the manufacturing process thereof, the copper foil layer and the through holes are subjected to gold electroplating treatment, so that the overall heat dissipation efficiency of the light source is high, and the light source can bear long-term large current and stably work.
(4) The high-heat-dissipation multilayer copper substrate and the manufacturing process thereof have the advantages that the polyester film is arranged below the metal core substrate, the performance is excellent, the rigidity, the hardness and the toughness are high, the puncture resistance, the friction resistance, the high temperature resistance, the low temperature resistance, the chemical resistance, the oil resistance, the air tightness and the freshness keeping performance are good, the high-heat-dissipation multilayer copper substrate is one of the common anti-heat-dissipation composite film base materials, the silicon sheet is arranged below the shielding plate, the high-heat-dissipation multilayer copper substrate is specially produced by using the design scheme of heat transfer of gaps, the gaps can be filled, the heat transfer between a heating part and a heat dissipation part is completed, the effects of insulation, shock absorption, sealing and the like are also achieved, the design requirements of equipment miniaturization and ultra-thinning can be met, the high-heat-dissipation multilayer copper substrate is extremely craft and very good in thickness application range, and is an excellent heat-conducting filling material.
The high-heat-dissipation multilayer copper substrate and the manufacturing process thereof have the advantages that the heat conducting adhesive layer is arranged below the substrate, so that the high-heat-dissipation multilayer copper substrate has excellent cold-hot alternating resistance, ageing resistance and electrical insulation performance. The product has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance, and can be used continuously at-60-280 ℃ and maintain the performance. Does not swell and has good adhesion to most metallic and non-metallic materials.
Drawings
FIG. 1 is a front elevational view of the structure of the present invention;
FIG. 2 is a top view of the structure of the present invention;
FIG. 3 is an enlarged view of the bottom of the present invention;
In the figure: the heat-insulating composite material comprises a circuit layer 1, an insulating layer 2, an ink layer 3, a copper foil layer 4, an oxidation-resistant layer 5, a composite substrate 6, a carbon-based composite fiber layer 7, a pressing plate 8, a heat interface layer 9, a resin-coated substrate 10, a copper clad laminate 11, a non-woven fabric substrate 12, a metal core substrate 13, a polyester film 14, a shielding plate 15, a silica gel sheet 16, a substrate 17, a heat-conducting adhesive layer 18, a buffer layer 19, a copper substrate 20, a heat-dissipating red tail 21, a cooling tube 22, a wiring hole 23, a screw hole 24, a screw 25, a through hole 26, a waterproof layer 27, a vent 28, a groove cup 29 and a bright silver coating 30.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a high heat dissipation multilayer copper base plate and manufacturing process thereof, including circuit layer (1), printing ink layer (3) and refrigeration pipe (22), the surface of circuit layer (1) is equipped with waterproof layer (27), the surface of waterproof layer (27) is equipped with walks line hole (23), the below of walking line hole (23) is equipped with screw (24), the surface of screw (24) is equipped with screw (25), one side fixed mounting of screw (25) has through-hole (26), the below of through-hole (26) is equipped with bleeder vent (28), the below of bleeder vent (28) is equipped with recess cup (29), the surface of recess cup (29) is equipped with bright silver plating (30), the below of circuit layer (1) is equipped with insulating layer (2), insulating layer (2) and printing ink layer (3) fixed connection, the below of printing ink layer (3) is equipped with copper foil layer (4), the below of copper foil layer (4) is equipped with antioxidation layer (5), the below of antioxidation layer (5) is equipped with compound base plate (6), the below of compound base plate (6) is equipped with carbon-based compound fiber layer (7), the below of compound fiber layer (7) is equipped with hot interfacial layer (9) below of compound fiber layer (8), a copper clad laminate (11) is arranged below the resin-coated substrate (10), a non-woven fabric substrate (12) is arranged below the copper clad laminate (11), a metal core substrate (13) is arranged below the non-woven fabric substrate (12), a polyester film (14) is arranged below the metal core substrate (13), a shielding plate (15) is arranged below the polyester film (14), and a silica gel sheet (16) is arranged below the shielding plate (15);
the lower part of silica gel piece (16) is equipped with base plate (17), and the below of base plate (17) is equipped with heat conduction glue film (18), and the below of heat conduction glue film (18) is equipped with buffer layer (19), and the below of buffer layer (19) is equipped with copper base plate (20), and the below of copper base plate (20) is equipped with heat dissipation red tail (21), refrigeration pipe (22) and heat dissipation red tail (21) fixed connection.
To sum up, this high heat dissipation multilayer copper base plate and manufacturing process thereof, through screw (25) and screw (24) fixed connection, conveniently take off circuit layer (1) from insulating layer (2), easy maintenance and dismantlement, through the fixed connection of buffer layer (19) and copper base plate (20), have buffering absorbing effect, can alleviate the impact that spare part received, the life of extension part, through the fixed connection of circuit layer (1) and waterproof layer (27), have waterproof function, prevent that the water stain from permeating in to spare part, influence normal use, through the fixed connection of recess cup (29) and bright silver cladding material (30), thoroughly reflect away light, improve light utilization ratio.
According to the high-heat-dissipation multilayer copper substrate and the manufacturing process thereof, the cooling pipe (22) is fixedly connected with the heat dissipation red tail (21), so that heat of a machine body is directly transmitted to an object which is in contact with the machine body and has low temperature for heat dissipation, the machine body has the advantages of safe and reliable performance, convenience in installation and disassembly, simplicity and convenience in maintenance, no chemical agents such as freon and the like, compact structure, light weight, partial cooling, no electromagnetic interference, low product cost and low noise, the oxidation resistance layer (5) is arranged below the copper foil layer (4), the machine body can work under the environment conditions of high temperature and oxidation, the quick oxidation of the copper substrate caused by the rise of the temperature is prevented, the strength is enhanced, accidents are avoided, the density is low, the modulus strength is high, the thermal stability is high, the high heat conduction capacity is strong, the machine body has the advantages of ablation resistance, corrosion resistance and stable friction coefficient, the surface roughness is high, the lines are uniform, the binding force between each direction and the prepreg is enhanced, and the close combination of the copper substrate and the prepreg can be effectively promoted, so that the quality is improved.
According to the high-heat-dissipation multilayer copper substrate and the manufacturing process thereof, the copper foil layer (4) and the through holes (26) are subjected to gold electroplating treatment, so that the overall heat dissipation efficiency of the light source is high, and the light source can bear long-term large current and stably work.
According to the high-heat-dissipation multilayer copper substrate and the manufacturing process thereof, the polyester film (14) is arranged below the metal core substrate (13), so that the high-heat-dissipation multilayer copper substrate has the advantages of excellent performance, high rigidity, high hardness, high toughness, puncture resistance, friction resistance, high temperature resistance, low temperature resistance, chemical resistance, oil resistance, air tightness and freshness preservation, is one of common anti-permeability composite film base materials, the silicon sheet (16) is arranged below the shielding plate (15), is specially produced by adopting a design scheme of heat transfer of gaps, can fill the gaps, can complete heat transfer between a heating part and a heat dissipation part, also has the functions of insulation, shock absorption, sealing and the like, can meet the design requirements of equipment miniaturization and ultrathin, is extremely technological and practical, has wide thickness application range, and is an excellent heat-conducting filling material.
According to the high-heat-dissipation multilayer copper substrate and the manufacturing process thereof, the heat conducting adhesive layer (18) is arranged below the substrate (17), so that the high-heat-dissipation multilayer copper substrate has excellent cold-hot alternating resistance, ageing resistance and electrical insulation performance. The anti-vibration and anti-corona composite material has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance, and can be continuously used at the temperature of between 60 ℃ below zero and 280 ℃ and keep the performance. Does not swell and has good adhesion to most metallic and non-metallic materials.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The inclusion of an element as defined by the statement "comprising one does not exclude the presence of additional identical elements in a process, method, article or apparatus that comprises the element, electrical elements appearing herein are all electrically connected to an external master and 220V mains, and the master may be a conventionally known apparatus that controls a computer or the like.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high heat dissipation multilayer copper base plate, includes circuit layer (1), printing ink layer (3) and refrigeration pipe (22), the surface of circuit layer (1) is equipped with waterproof layer (27), and the surface of waterproof layer (27) is equipped with walks line hole (23), the below of walking line hole (23) is equipped with screw (24), and the surface of screw (24) is equipped with screw (25), one side fixed mounting of screw (25) has through-hole (26), and the below of through-hole (26) is equipped with bleeder vent (28), the below of bleeder vent (28) is equipped with recess cup (29), and the surface of recess cup (29) is equipped with bright silver coating (30), the below of circuit layer (1) is equipped with insulating layer (2), and insulating layer (2) and printing ink layer (3) fixed connection, the below of printing ink layer (3) is equipped with copper foil layer (4), and the below of copper foil layer (4) is equipped with antioxidation layer (5), the below of antioxidation layer (5) is equipped with compound base plate (6), and the below of compound base plate (6) is equipped with carbon-based composite fiber (7), below (8) is equipped with composite laminate (8), a resin-coated substrate (10) is arranged below the thermal interface layer (9), a copper-clad plate (11) is arranged below the resin-coated substrate (10), a non-woven fabric substrate (12) is arranged below the copper-clad plate (11), a metal core substrate (13) is arranged below the non-woven fabric substrate (12), a polyester film (14) is arranged below the metal core substrate (13), a shielding plate (15) is arranged below the polyester film (14), and a silica gel sheet (16) is arranged below the shielding plate (15); a substrate (17) is arranged below the silica gel sheet (16), a heat conducting adhesive layer (18) is arranged below the substrate (17), a buffer layer (19) is arranged below the heat conducting adhesive layer (18), a copper substrate (20) is arranged below the buffer layer (19), a heat dissipation red tail (21) is arranged below the copper substrate (20), and the refrigerating tube (22) is fixedly connected with the heat dissipation red tail (21);
The number of the bright silver coating (30) and the number of the groove cup (29) are three, the bright silver coating (30) and the groove cup (29) are respectively and parallelly arranged, the number of the screw (25) and the screw hole (24) is four, and the screw (25) and the screw hole (24) are respectively and parallelly arranged.
2. The high heat dissipation multi-layer copper substrate according to claim 1, wherein: the circuit layer (1) is fixedly connected with the ink layer (3) through the insulating layer (2).
3. The high heat dissipation multi-layer copper substrate according to claim 1, wherein: the copper foil layer (4) is fixedly connected with the composite substrate (6) through the antioxidation layer (5).
4. The high heat dissipation multi-layer copper substrate according to claim 1, wherein: the carbon-based composite fiber layer (7) is fixedly connected with the thermal interface layer (9) through the pressing plate (8).
5. The high heat dissipation multi-layer copper substrate according to claim 1, wherein: the number of the refrigerating pipes (22) is two, and the refrigerating pipes (22) are respectively arranged in parallel.
6. The high heat dissipation multi-layer copper substrate according to claim 1, wherein: the resin-coated substrate (10) is fixedly connected with the non-woven fabric substrate (12) through the copper-clad plate (11).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710689496.1A CN109392237B (en) | 2017-08-14 | 2017-08-14 | High-heat-dissipation multilayer copper substrate and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710689496.1A CN109392237B (en) | 2017-08-14 | 2017-08-14 | High-heat-dissipation multilayer copper substrate and manufacturing process thereof |
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| CN109392237A CN109392237A (en) | 2019-02-26 |
| CN109392237B true CN109392237B (en) | 2024-05-07 |
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| CN207399601U (en) * | 2017-08-14 | 2018-05-22 | 广东合通建业科技股份有限公司 | A kind of high heat dissipation multilayer copper base |
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| WO2007007622A1 (en) * | 2005-07-07 | 2007-01-18 | Asahi Glass Company, Limited | Electromagnetic wave shielding film and protective plate for plasma display panel |
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| WO1997003544A1 (en) * | 1995-07-07 | 1997-01-30 | Optiprint Ag | Conductive connection and process for producing it |
| CN202049991U (en) * | 2008-12-09 | 2011-11-23 | 楼满娥 | Radiation assembly used for light-emitting diode (LED), as well as LED and LED lamp |
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| CN109392237A (en) | 2019-02-26 |
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