CN202487652U - Novel aluminum substrate - Google Patents
Novel aluminum substrate Download PDFInfo
- Publication number
- CN202487652U CN202487652U CN201220075585XU CN201220075585U CN202487652U CN 202487652 U CN202487652 U CN 202487652U CN 201220075585X U CN201220075585X U CN 201220075585XU CN 201220075585 U CN201220075585 U CN 201220075585U CN 202487652 U CN202487652 U CN 202487652U
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- cup
- novel aluminum
- aluminum substrate
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201220075585XU CN202487652U (en) | 2012-03-02 | 2012-03-02 | Novel aluminum substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201220075585XU CN202487652U (en) | 2012-03-02 | 2012-03-02 | Novel aluminum substrate |
Publications (1)
Publication Number | Publication Date |
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CN202487652U true CN202487652U (en) | 2012-10-10 |
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CN201220075585XU Expired - Lifetime CN202487652U (en) | 2012-03-02 | 2012-03-02 | Novel aluminum substrate |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103068168A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Manufacture method for mirror surface blind trough aluminum substrate |
CN103515369A (en) * | 2013-10-09 | 2014-01-15 | 电子科技大学 | LED module substrate |
CN109392237A (en) * | 2017-08-14 | 2019-02-26 | 广东合通建业科技股份有限公司 | A kind of high heat dissipation multilayer copper base and its manufacturing process |
-
2012
- 2012-03-02 CN CN201220075585XU patent/CN202487652U/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103068168A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Manufacture method for mirror surface blind trough aluminum substrate |
CN103515369A (en) * | 2013-10-09 | 2014-01-15 | 电子科技大学 | LED module substrate |
CN109392237A (en) * | 2017-08-14 | 2019-02-26 | 广东合通建业科技股份有限公司 | A kind of high heat dissipation multilayer copper base and its manufacturing process |
CN109392237B (en) * | 2017-08-14 | 2024-05-07 | 广东合通建业科技股份有限公司 | High-heat-dissipation multilayer copper substrate and manufacturing process thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: MEIZHAO (SHANGHAI) ENERGY - SAVING TECHNOLOGY CO., Free format text: FORMER OWNER: WUXI KEXINWEI ELECTRONICS CO., LTD. Effective date: 20150227 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 214072 WUXI, JIANGSU PROVINCE TO: 200032 XUHUI, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20150227 Address after: 200032 Shanghai Xuhui District Xietu Road No. 1221 building Chun vice floor 1002 Patentee after: According to the United States (Shanghai) energy-saving technology Co., Ltd. Address before: 214072 Jiangsu province Wuxi City Liyuan Development Zone, Road No. 100 (Creative Park) 10 standard factory building 3 floor 301 Patentee before: Wuxi Kexinwei Electronics Co.,Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20121010 |
|
CX01 | Expiry of patent term |