CN207398111U - Element peeling device - Google Patents
Element peeling device Download PDFInfo
- Publication number
- CN207398111U CN207398111U CN201720967632.4U CN201720967632U CN207398111U CN 207398111 U CN207398111 U CN 207398111U CN 201720967632 U CN201720967632 U CN 201720967632U CN 207398111 U CN207398111 U CN 207398111U
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- China
- Prior art keywords
- thimble
- movable
- movable platform
- stripping
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 63
- 230000000630 rising effect Effects 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 210000001364 upper extremity Anatomy 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000013598 vector Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 235000002566 Capsicum Nutrition 0.000 description 1
- 239000006002 Pepper Substances 0.000 description 1
- 235000016761 Piper aduncum Nutrition 0.000 description 1
- 235000017804 Piper guineense Nutrition 0.000 description 1
- 244000203593 Piper nigrum Species 0.000 description 1
- 235000008184 Piper nigrum Nutrition 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical group C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An element stripping device comprises a base, a first movable platform and a plurality of first movable thimbles. The base comprises a base opening and a plurality of first thimble openings located on the outer periphery of the base opening, the first movable platform is arranged in the base opening in a liftable mode, and the first movable thimbles are arranged in the first thimble openings in a liftable mode.
Description
Technical field
The utility model is related to a kind of element stripping off device, more particularly to a kind of element using contact mode removes dress
It puts.
Background technology
In semiconductor applications, when chip is after the completion of wiring, can first be attached in one layer of patch, then cleaved step with
Form multiple chips.Then, each chip from patch need to be removed respectively and (that is, chip is removed from patch).However, work as core
The thickness of piece reduces, and the active force between chip and patch easily when chip is removed, causes to collapse brilliant, chip breakage or chip because inclining
It tiltedly deforms and is not easy to remove from patch.
Utility model content
In one or more embodiments, a kind of element stripping off device includes pedestal, the first movable platform and multiple first work
Dynamic thimble.The pedestal includes base openings and multiple first thimble openings at the outside of the base openings, institute
It states the first movable platform to be liftably located in the base openings, the multiple first movable thimble is liftably located at described
In first thimble opening.
Description of the drawings
Fig. 1 describes the sectional perspective signal of the example of the element stripping off device of some embodiments according to the present utility model
Figure.
Fig. 2 describes according to schematic cross-sectional view of the element stripping off device of Fig. 1 along line 1-1.
Fig. 3 describes the sectional perspective schematic diagram at another visual angle of the element stripping off device according to Fig. 1.
Fig. 4 describes according to schematic cross-sectional view of the element stripping off device of Fig. 3 along line 4-4.
Fig. 5 describes the illustrative view of the element stripping off device according to Fig. 3.
Fig. 6 describes according to schematic cross-sectional view of the element stripping off device of Fig. 5 along line 6-6.
Fig. 7 to 16 describes the element stripping means of some embodiments according to the present utility model.
Figure 17 describes the broken section signal of the example of the element stripping off device of some embodiments according to the present utility model
Figure.
Figure 18 to 20 describes the element stripping means of some embodiments according to the present utility model.
Figure 21 describes the broken section signal of the example of the element stripping off device of some embodiments according to the present utility model
Figure.
Figure 22 to 24 describes the element stripping means of some embodiments according to the present utility model.
Specific embodiment
In semiconductor applications, whole piece need to have been connected up the wafer back of completion by one chip (and bare die) to be obtained
Last layer patch is first pasted in face, allows chip when being cut into chip independent one by one, still will through the viscosity of patch upper surface
Each chip is Methodistic to be temporarily affixed to above patch, chip is not caused to be scattered.Afterwards, after the completion of cutting process, pass through
Vacuum slot removes chip from patch one by one, (chip is sticked to lead frame or substrate to carry out subsequent encapsulation procedure
On).But because patch surface has certain adhesion strength so that chip can not be only sucked away from by vacuum slot easily.
To solve the above problems, the liftable movable platform that a solution is first less than chip with an area is upward
The lower section of ejection chip, the power of pullling directed downwardly (screen resilience) can be generated by being now placed in the patch block immediately below the chip, and
The beneath chips periphery is hanging.Then, cooperation is located at the pull of vacuum that the suction nozzle directly over the chip is provided, the two
Under interaction, just can the chip be successfully moved away from (stripping) described patch.
Thickness such as fruit chip is more than 100 μm, is taken with enough structural strengths, therefore using above-mentioned way from patch
Lower chip, can't run into any technical problem.But as the thickness of fruit chip is thinned to less than 100 μm (such as 3 mils
(mil) below when), during using above-mentioned way, it can often find easily to have and collapse brilliant, chip breakage or chip because of inclination and distortion
And it is not easy to happen from what patch was removed.
Element stripping off device discussed below and element stripping means using multistage contact mode, with reduce collapse it is brilliant,
The problems such as chip breakage or chip deform.
Fig. 1 describes the sectional perspective signal of the example of the element stripping off device 1 of some embodiments according to the present utility model
Figure.Pepper pot form is generally presented in the element stripping off device 1, including shell 10 and pedestal 12.The shell 10 is substantially
It is upper that cylindrical shape is presented, and the pedestal 12 is located at one end of the shell 10.In one embodiment, the shell 10 and the bottom
Seat 12 is metal material.In another embodiment, the top of the pedestal 12 is ceramic material, and the ceramic material is with more
A pore.
Fig. 2 describes according to schematic cross-sectional view of the element stripping off device 1 of Fig. 1 along line 1-1.Fig. 3 describes the member according to Fig. 1
The sectional perspective schematic diagram at another visual angle of part stripping off device 1.Fig. 4 describes according to the element stripping off device 1 of Fig. 3 along line 4-4
Schematic cross-sectional view.The element stripping off device 1 include the shell 10, supporting part in the pedestal 12, first (such as：The
One movable platform 14), at least one first outer supporting part (such as：At least one first movable thimble 16), supporting part in second
(such as：Second movable platform 18), at least one second outer supporting part (such as：Multiple second movable thimbles 20), top in the 3rd
Support (such as：3rd movable platform 22) and at least one 3rd outer supporting part (such as：Multiple 3rd movable thimbles 24).
The pedestal 12 generally present it is discoid, it includes first surface 121, second surface 122, inner opening (such as：
Base openings 123), at least one outward opening (such as：Multiple first thimble openings 124), multiple horizontal grooves 125 and multiple suctions
Attached hole 126.The relatively described first surface 121 of the second surface 122.The inner opening (such as：The base openings 123) with
The outward opening (such as：The first thimble opening 124) through the pedestal 12, and the outward opening (such as：Described first
Thimble opening 124) be located at the inner opening (such as：The base openings 123) outside at.The horizontal groove 125 from
The first surface 121 is recessed, and the adsorption hole 126 runs through the pedestal 12.The horizontal groove 125 and the adsorption hole
126 be located at the inner opening (such as：The base openings 123) and the outward opening (such as：The first thimble opening 124)
Outside at, the part adsorption hole 126 is located in the horizontal groove 125, and another part adsorption hole 126 be located at it is described
Outside horizontal groove 125.
Supporting part in described first (such as：First movable platform 14) the adjacent first surface for being located at the pedestal 12
121, and can be lifted compared with the first surface 121 of the pedestal 12.In one embodiment, supporting part is described in described first
First movable platform 14 is metallic monolith body, and positioned at the inner opening (such as：The base openings 123)；In other words
It says, first movable platform 14 is liftably located in the base openings 123；Alternatively, first movable platform 14 can
It is slided up and down in the base openings 123.
As shown in Fig. 2 to 4, supporting part in described first (such as：First movable platform 14) there is first surface
141st, at least one horizontal groove 142, the first inner opening (such as：143) and at least one first outward opening (example first opening
Such as：Multiple second thimble openings 144).First inner opening (such as：143) and first outward opening first opening
(such as：The second thimble opening 144) in described first supporting part (such as：First movable platform 14), and institute
State the first outward opening (such as：The second thimble opening 144) be located at first inner opening (such as：First opening
143) at outside.The horizontal groove 142 is recessed from the first surface 141.It is described in the state of shown in Fig. 2 to 4
Supporting part in first (such as：First movable platform 14) first surface 141 and the pedestal 12 first surface 121 it is big
Copline in cause.
In one embodiment, first movable platform 14 is connected to the first noumenon 15.The first noumenon 15 has the
One surface 151 and second surface 152, the relatively described first surface 151 of the second surface 152.The first noumenon 15 is located at
12 lower section of pedestal, and have between the first surface 151 of the first noumenon 15 and the second surface 122 of the pedestal 12 suitably
Distance, and form first gas passage 153.It is not located at positioned at the horizontal groove 125 or the suction of the horizontal groove 125
Attached hole 126 is communicated to the first gas passage 153.It is understood that the peripheral side wall of first movable platform 14 with
Gap between the madial wall of the base openings 123 can also form gas passage, and (that is, described gas passage is located at the pedestal
In 12) so that the horizontal groove 142 can also be communicated to the first gas passage 153.In addition, the first noumenon 15
Peripheral side wall and the shell 10 madial wall between gap can also form gas passage.
The first outer supporting part (such as：First movable thimble 16) the adjacent first surface for being located at the pedestal 12
121, and can be lifted compared with the first surface 121 of the pedestal 12, supporting part in described first (such as：First activity
Platform 14) and the first outer supporting part (such as：First movable thimble 16) substantially load is arrived on top simultaneously in action step
Body (such as：Patch) surface.On this point, can hereinafter be described in detail.
In one embodiment, the described first outer supporting part be at least one first movable thimble 16 (such as：Multiple first live
Dynamic thimble 16), be metal solid post, and positioned at the outward opening (such as：The first thimble opening 124)；In other words,
First movable thimble 16 is liftably located in the first thimble opening 124；Alternatively, first movable thimble 16 can
It is slided up and down in the first thimble opening 124.As shown in Fig. 2 to 4, first movable thimble 16 has first surface
161, and in this case, the first surface 121 of the first surface 161 of first movable thimble 16 and the pedestal 12 is substantially
Upper copline.In addition, the lower end of first movable thimble 16 is located at the recess of the first noumenon 15 so that described first lives
Dynamic thimble 16 can together be moved up and down with the first noumenon 15 and first movable platform 14 or moved respectively.
In one embodiment, the upper limb of first movable thimble 16 is in smooth arc-shaped；Alternatively, first activity
The upper limb of thimble 16 coats one layer of rubber.
Supporting part in described second (such as：Second movable platform 18) the adjacent first surface for being located at the pedestal 12
121, and can be lifted compared with the first surface 121 of the pedestal 12.In one embodiment, supporting part is described in described second
Second movable platform 18 is metallic monolith body, and positioned at first inner opening (such as：143) described first is open in；It changes
Sentence is talked about, and second movable platform 18 can be located at first inner opening with rising compared with first movable platform 14
(such as：143) described first is open in；Alternatively, second movable platform 18 can described first opening 143 on glide
It is dynamic.
As shown in Fig. 2 to 4, supporting part in described second (such as：Second movable platform 18) there is first surface
181st, at least one horizontal groove 182, the second inner opening (such as：183) and at least one second outward opening (example second opening
Such as：Multiple 3rd thimble openings 184).Second inner opening (such as：183) and second outward opening second opening
(such as：The 3rd thimble opening 184) in described second supporting part (such as：Second movable platform 18), and institute
State the second outward opening (such as：The 3rd thimble opening 184) be located at second inner opening (such as：Second opening
183) at outside.The horizontal groove 182 is recessed from the first surface 181.It is described in the state of shown in Fig. 2 to 4
Supporting part in second (such as：Second movable platform 18) first surface 181 and the pedestal 12 first surface 121 it is big
Copline in cause.
In one embodiment, second movable platform 18 is connected to the second body 19.Second body 19 has the
One surface 191 and second surface 192, the relatively described first surface 191 of the second surface 192.Second body 19 is located at
15 lower section of the first noumenon, and the second surface 152 of the first surface 191 of second body 19 and the first noumenon 15
Between have suitable distance, and form second gas passage 193.It is understood that the peripheral side wall of second movable platform 18
Gap between the madial wall of the described first opening 143 can also form gas passage so that the horizontal groove 182 can also
It is communicated to the second gas passage 193.In addition, the peripheral side wall of second body 19 and the inside of the first noumenon 15
Gap between wall can also form gas passage, and the second gas passage 193 connects with the first gas passage 153
It is logical.
The second outer supporting part (such as：Second movable thimble 20) the adjacent first surface for being located at the pedestal 12
121, and can be lifted compared with the first surface 121 of the pedestal 12, supporting part in described second (such as：Second activity
Platform 18) and the second outer supporting part (such as：Second movable thimble 20) substantially load is arrived on top simultaneously in action step
The surface of body.On this point, can hereinafter be described in detail.
In one embodiment, the described second outer supporting part be at least one second movable thimble 20 (such as：Multiple second live
Dynamic thimble 20), be metal solid post, and positioned at first outward opening (such as：The second thimble opening 144)；Change sentence
It talks about, second movable thimble 20 can be located at the second thimble opening with rising compared with first movable platform 14
In 144；Alternatively, second movable thimble 20 can slide up and down in the second thimble opening 144.As shown in Fig. 2 to 4,
Second movable thimble 20 has first surface 201, and in this case, the first surface of second movable thimble 20
201 with the generally copline of first surface 121 of the pedestal 12.In addition, the lower end of second movable thimble 20 is described
The recess of second body 19 so that second movable thimble 20 can be flat with second body 19 and second activity
Platform 18 is moved up and down or moved respectively together.
In one embodiment, the upper limb of second movable thimble 20 is in smooth arc-shaped；Alternatively, second activity
The upper limb of thimble 20 coats one layer of rubber.
Supporting part in described 3rd (such as：3rd movable platform 22) the adjacent first surface for being located at the pedestal 12
121, and can be lifted compared with the first surface 121 of the pedestal 12.In one embodiment, supporting part is described in the described 3rd
3rd movable platform 22 is metallic monolith body, and positioned at second inner opening (such as：183) described second is open in；It changes
Sentence is talked about, and the 3rd movable platform 22 can be located at second inner opening with rising compared with second movable platform 18
(such as：183) described second is open in；Alternatively, the 3rd movable platform 22 can described second opening 183 on glide
It is dynamic.
As shown in Fig. 2 to 4, supporting part in the described 3rd (such as：3rd movable platform 22) there is first surface 221
And at least one horizontal groove 222.The horizontal groove 222 is recessed from the first surface 221.In the state shown in Fig. 2 to 4
Under, supporting part in the described 3rd (such as：3rd movable platform 22) first surface 221 and the pedestal 12 the first table
The generally copline of face 121.
In one embodiment, the 3rd movable platform 22 is connected to the 3rd body 23.3rd body 23 has the
One surface 231 and second surface 232, the relatively described first surface 231 of the second surface 232.3rd body 23 is located at
Second body, 19 lower section, and the second surface 192 of the first surface 231 of the 3rd body 23 and second body 19
Between have suitable distance, and form third gas passage 233.It is understood that the peripheral side wall of the 3rd movable platform 22
Gap between the madial wall of the described second opening 183 can also form gas passage so that the horizontal groove 222 can also
It is communicated to the third gas passage 233.In addition, the peripheral side wall of the 3rd body 23 and the inside of second body 19
Gap between wall can also form gas passage, and the third gas passage 233 connects with the second gas passage 193
It is logical.In one embodiment, if the top of the pedestal 12 is ceramic material, and the ceramic material has multiple pores,
The then first gas passage 153, the second gas passage 193 and the third gas passage 233 and the pore phase
Connection.
The 3rd outer supporting part (such as：3rd movable thimble 24) the adjacent first surface for being located at the pedestal 12
121, and can be lifted compared with the first surface 121 of the pedestal 12, supporting part in the described 3rd (such as：3rd activity
Platform 22) and the 3rd outer supporting part (such as：3rd movable thimble 24) substantially load is arrived on top simultaneously in action step
The surface of body.On this point, can hereinafter be described in detail.
In one embodiment, the 3rd outer supporting part be at least one 3rd movable thimble 24 (such as：Multiple three live
Dynamic thimble 24), be metal solid post, and positioned at second outward opening (such as：The 3rd thimble opening 184)；Change sentence
It talks about, the 3rd movable thimble 24 can be located at the 3rd thimble opening with rising compared with second movable platform 18
In 184；Alternatively, the 3rd movable thimble 24 can slide up and down in the 3rd thimble opening 184.As shown in Fig. 2 to 4,
3rd movable thimble 24 has first surface 241, and in this case, the first surface of the 3rd movable thimble 24
241 with the generally copline of first surface 121 of the pedestal 12.In addition, the lower end of the 3rd movable thimble 24 is described
The recess of 3rd body 23 so that the 3rd movable thimble 24 can be flat with the 3rd body 23 and the 3rd activity
Platform 22 is moved up and down or moved respectively together.
In one embodiment, the upper limb of the 3rd movable thimble 24 is in smooth arc-shaped；Alternatively, the 3rd activity
The upper limb of thimble 24 coats one layer of rubber.
In one embodiment, the element stripping off device 1 further comprises suction element (not shown), described in connection
Gas passage is (including the first gas passage 153, the second gas passage 193 and/or the third gas passage
233), providing the gas in the gas passage pumping power or air blowing power so that the carrier (such as：Patch)
Lower surface can be attracted to the first surface 121 of the pedestal 12；Or the carrier (such as：Patch) the lower surface can
It is blown off from the first surface 121 of the pedestal 12.In one embodiment, the suction element is air side Pu.
Fig. 5 describes the illustrative view of the element stripping off device 1 according to Fig. 3.Fig. 6, which describes to be removed according to the element of Fig. 5, to be filled
Put 1 along line 6-6 schematic cross-sectional view.In one embodiment, the element stripping off device 1 further includes the first actuation element
(not shown), start is in first movable platform 14, the first noumenon 15 and first movable thimble 16 so that
First movable platform 14, the first noumenon 15 and first movable thimble 16 can lift simultaneously.In one embodiment,
The element stripping off device 1 further include two the first actuation elements (it include in first actuation element (not shown) and
First outer actuation element (not shown)), actuation element start is in first movable platform 14 and described in described first
One body 15, the first outer actuation element start is in first movable thimble 16 so that first movable platform 14 with
The first noumenon 15 and first movable thimble 16 lift respectively.(start is first in described first for first actuation element
Part and the first outer actuation element) it is electric power motor, oil pressure pump or air compressor machine.
In one embodiment, the element stripping off device 1 further includes the second actuation element (not shown), start
In second movable platform 18, second body 19 and second movable thimble 20 so that second movable platform
18th, second body 19 and second movable thimble 20 can lift simultaneously.In one embodiment, the element stripping off device
1 further includes two the second actuation elements, and (it includes actuation element (not shown) and the second outer actuation element (figure in second
In do not show)), actuation element start is in second movable platform 18 and second body 19 in described second, described second
Outer actuation element start is in second movable thimble 20 so that second movable platform 18 and second body 19 and institute
The second movable thimble 20 is stated to lift respectively.Second actuation element (actuation element and the second outer start in described second
Element) it is electric power motor, oil pressure pump or air compressor machine.
In one embodiment, the element stripping off device 1 further includes the 3rd actuation element (not shown), start
In the 3rd movable platform 22, the 3rd body 23 and the 3rd movable thimble 24 so that the 3rd movable platform
22nd, the 3rd body 23 and the 3rd movable thimble 24 can lift simultaneously.In one embodiment, the element stripping off device
1 further includes two the 3rd actuation elements, and (it includes actuation element (not shown) and the 3rd outer actuation element (figure in the 3rd
In do not show)), actuation element start is in the 3rd movable platform 22 and the 3rd body 23 in the described 3rd, the described 3rd
Outer actuation element start is in the 3rd movable thimble 24 so that the 3rd movable platform 22 and the 3rd body 23 and institute
The 3rd movable thimble 24 is stated to lift respectively.3rd actuation element (actuation element and the 3rd outer start in the described 3rd
Element) it is electric power motor, oil pressure pump or air compressor machine.
Fig. 7 to 16 describes the element stripping means of some embodiments according to the present utility model.Referring to Fig. 7, provide and paste
There is the carrier 32 of at least one element 30.In one embodiment, the element 30 is the core formed after being cut by chip
Piece (bare die), the carrier 32 is patch, and the element 30 is attached to the upper surface of the carrier 32.Meanwhile provide element
Stripping off device.In one embodiment, the element stripping off device is Fig. 1 extremely to the element stripping off device 1 shown in 6, bag
Include the pedestal 12, supporting part in described first (such as：First movable platform 14), the first outer supporting part (such as：
First movable thimble 16), supporting part in described second (such as：Second movable platform 18), the second outer contact
Portion (such as：Second movable thimble 20), supporting part in the described 3rd (such as：3rd movable platform 22) and described
Three outer supporting parts (such as：3rd movable thimble 24).As shown in fig. 7, supporting part in described first (such as：Described first
Movable platform 14) and the first outer supporting part (such as：First movable thimble 16) it is directed at the load of 30 lower section of element
Body 32.In one implements, the first outer supporting part (such as：First movable thimble 16) quantity be no less than the element
30 number of endpoint or corner number, and the first outer supporting part (such as：First movable thimble 16) set up separately in the element
Below 30 endpoint or corner.The element 30 has outer circumferential surface, supporting part in described first (such as：First activity is flat
Platform 14) and the first outer supporting part (such as：First movable thimble 16) be located at the element 30 outer circumferential surface project
In the hypothetical world of 12 first surface 121 of pedestal.
Referring to Fig. 8, start suction element, 32 lower surface of carrier absorption is (that is, described at 12 top of pedestal
First surface 121).In one embodiment, multiple adsorption holes on the pedestal 12 are siphoned away and are located at through the suction element
126 gas passages being connected are (including the first gas passage 153, the second gas passage 193 and/or the described 3rd
Gas passage 233) in gas, and the carrier 32 is adsorbed at 12 top (that is, described first surface 121) of the pedestal.
As shown in figure 8, supporting part in described first (such as：First movable platform 14) it is more than with the contact area of the carrier 32
The first outer supporting part (such as：First movable thimble 16) with the contact area of the carrier 32.
Referring to Fig. 9, at the same rise supporting part in described first (such as：First movable platform 14) and described first outside
Supporting part (such as：First movable thimble 16), with substantially top to 32 lower surface of carrier, and elapse part upwards simultaneously
30 a distance of the carrier 32 and the element.At this point, the first surface 161 of first movable thimble 16 and described first
The first surface 141 of movable platform 14 be higher than/protrudes from the first surface 121 of the pedestal 12.
In one embodiment, supporting part in described second (such as：Second movable platform 18), the second outer contact
Portion (such as：Second movable thimble 20), supporting part in the described 3rd (such as：3rd movable platform 22) and described
Three outer supporting parts (such as：3rd movable thimble 24) with described first in supporting part (such as：First movable platform
14) and the first outer supporting part (such as：First movable thimble 16) rise simultaneously.
Referring to Figure 10, by the described first outer supporting part (such as：First movable thimble 16) fall below described first
Interior supporting part (such as：First movable platform 14) top.At this point, the first surface 161 of first movable thimble 16 is low
In the first surface 141 of first movable platform 14, and the Component Vectors 32 directly over first movable thimble 16
It is separated with the element 30.Alternatively, in another embodiment, by supporting part in described first (such as：First movable platform
14) it is further up with exceed the described first outer supporting part (such as：First movable thimble 16) top.At this point, described
The first surface 141 of one movable platform 14 is higher than the first surface 161 of first movable thimble 16.
Referring to Figure 11, at the same rise supporting part in described second (such as：Second movable platform 18) and described second
Outer supporting part (such as：Second movable thimble 20), with substantially top to 32 lower surface of carrier, and further up simultaneously
Elapse the part carrier 32 and 30 a distance of the element.At this point, the first surface 201 of second movable thimble 20 with
The first surface 181 of second movable platform 18 be higher than/protrude from supporting part in described first (such as：First activity
Platform 14) first surface 141.
In one embodiment, supporting part in the described 3rd (such as：3rd movable platform 22) and the described 3rd outside push up
Support (such as：3rd movable thimble 24) with described second in supporting part (such as：Second movable platform 18) and institute
State the second outer supporting part (such as：Second movable thimble 20) rise simultaneously.
Referring to Figure 12, by the described second outer supporting part (such as：Second movable thimble 20) fall below described second
Interior supporting part (such as：Second movable platform 18) top.At this point, the first surface 201 of second movable thimble 20 is low
In the first surface 181 of second movable platform 18, and the Component Vectors 32 directly over second movable thimble 20
It is separated with the element 30.Alternatively, in another embodiment, by supporting part in described second (such as：Second movable platform
18) it is further up with exceed the described second outer supporting part (such as：Second movable thimble 20) top.At this point, described
The first surface 181 of two movable platforms 18 is higher than the first surface 201 of second movable thimble 20.
Referring to Figure 13, at the same rise supporting part in the described 3rd (such as：3rd movable platform 22) and the described 3rd
Outer supporting part (such as：3rd movable thimble 24), with substantially top to 32 lower surface of carrier, and further up simultaneously
Elapse the part carrier 32 and 30 a distance of the element.At this point, the first surface 241 of the 3rd movable thimble 24 with
The first surface 221 of 3rd movable platform 22 be higher than/protrude from supporting part in described second (such as：Second activity
Platform 18) first surface 181.
Referring to Figure 14, by the described 3rd outer supporting part (such as：3rd movable thimble 24) fall below the described 3rd
Interior supporting part (such as：3rd movable platform 22) top.At this point, the first surface 241 of the 3rd movable thimble 24 is low
In the first surface 221 of the 3rd movable platform 22, and the Component Vectors 32 directly over the 3rd movable thimble 24
It is separated with the element 30.Alternatively, in another embodiment, by supporting part in the described 3rd (such as：3rd movable platform
22) it is further up with exceed the described second outer supporting part (such as：3rd movable thimble 24) top.At this point, the institute
The first surface 221 for stating the 3rd movable platform 22 is higher than the first surface 241 of the 3rd movable thimble 24.
At this point, absorption heads 34 are provided in the surface of the element 30.The absorption heads 34 can vertically decline.
Referring to Figure 15, the absorption heads 34, which drop to, touches the element 30.
Referring to Figure 16, the absorption heads 34 move upwardly together again after holding the element 30 so that the absorption heads 34
The carrier 32 can be moved away from or removed to the element 30 directly over the element 30.
In the present embodiment, said elements stripping off device 1 and element stripping means are using multistage contact mode, with progressive
Ground is removed by the part carrier 32 around the element 30.Therefore, the element 30 and the load can be gradually reduced
Adhesion strength between body 32, and when element 30 is avoided to be removed from the carrier 32, crumbles, is damaged or during because inclination and distortion
It is not easily detachable to happen.Furthermore even if the thickness of the element 30 be thinned to less than 100 μm (such as 3 mils (mil) with
Under) when, it is not easy to crumble, is damaged or because inclination and distortion is without easily detachable situation.
The broken section that Figure 17 describes the example of the element stripping off device 1a of some embodiments according to the present utility model shows
It is intended to.The element stripping off device 1a includes pedestal 12a, supporting part 14a in first, at least one first outer supporting part 16a, the
Magnetic force portion 40 in one, pars contractilis 44 and at least one first external extension portion 46 at least one first outer magnetic force portion 42, first.
Supporting part 14a is top flat in such as one in described first, and neighbour is located at the first surface 121 of the pedestal 12, and
It can be lifted compared with the first surface 121 of the pedestal 12a.Supporting part 14a is located at pars contractilis in described first in described first
44 first end (upper end).The first outer supporting part 16a is for example multiple outer top flats, and neighbour is located at the of the pedestal 12a
One surface 121, and can be lifted compared with the first surface 121 of the pedestal 12a.The first outer supporting part 16a is located at described
The first end (upper end) in the first external extension portion 46.The first outer supporting part 16a surrounds supporting part 14a in described first, and institute
The supporting part 14a and first outer supporting part 16a is stated in first in action step substantially while top is under the carrier 32
Surface.
Pars contractilis 44 is spring or resin-elastomer in described first, and neighbour is located at the first surface of the pedestal 12a
121.In one embodiment, the second end (lower end) of pars contractilis 44 is attached to the first surface of the pedestal 12a in described first
121 or it is attached directly to magnetic force portion 40 in described first.The first external extension portion 46 is spring or resin-elastomer, and adjacent
It is located at the first surface 121 of the pedestal 12a.In one embodiment, the second end (lower end) in the first external extension portion 46 is attached
It the first surface 121 of the pedestal 12a or is attached directly to the described first outer magnetic force portion 42.
40 neighbour of magnetic force portion is located at the first surface 121 of the pedestal 12a in described first, to attract or repel described
Supporting part 14a in one.First outer 42 neighbour of magnetic force portion is located at the first surface 121 of the pedestal 12a, to attract or repel
The first outer supporting part 16a.
As shown in figure 17, magnetic force portion 40 holds supporting part 14a in described first, the first outer magnetic force portion in described first
42 hold the described first outer supporting part 16a so that supporting part 14a and the described first outer supporting part 16a is located at same in described first
One level height, and top to the lower surface of the carrier 32 simultaneously.
Figure 18 to 20 describes the element stripping means of some embodiments according to the present utility model.Referring to Figure 18, institute is discharged
State the magnetic force in magnetic force portion 40 and the first outer magnetic force portion 42 in first so that supporting part 14a and described first in described first
Outer supporting part 16a elapses the part carrier 32 and 30 a distance of the element upwards.
Referring to Figure 19, the first outer magnetic force portion 42 applies magnetic force, and the described first outer supporting part 16a is fallen below institute
It states in first at the top of supporting part 14a.At this point, Component Vectors 32 and the member directly over the described first outer supporting part 16a
Part 30 separates.Alternatively, in another embodiment, magnetic force portion in described first is applied into repulsion, so that supporting part in described first
14a is further up to exceed at the top of the described first outer supporting part 16a.At this point, the absorption heads 34 are provided in the element
30 surface.The absorption heads 34 can vertically decline.
Referring to Figure 20, the absorption heads 34, which drop to, touches the element 30.Afterwards, the absorption heads 34 hold described
It is moved upwardly together again after element 30 so that the absorption heads 34 can move away from the element 30 directly over the element 30
Or remove the carrier 32.
The broken section that Figure 21 describes the example of the element stripping off device 1b of some embodiments according to the present utility model shows
It is intended to.The element stripping off device 1b includes pedestal 12b, elastic film 48 and pneumatic control device (not shown).The bottom
Seat 12b includes inner opening 127 and at least one outward opening 128 at the outside of the inner opening 127.The inner opening
127 and the outward opening 128 run through the pedestal 12b.48 neighbour of elastic film is located at the second surface of the pedestal 12b
122, and with first portion 481 and second portion 482, the first portion 481 corresponds to the inner opening 127, and described second
Part 482 corresponds to the outward opening 128.
The pneumatic control device is drying to the elastic film 48 or exhausting.In one embodiment, such as Figure 22 institutes
Show, the air 49 that the pneumatic control device generates includes the first air 491 and the second air 492, and first air 491
And second air 492 is each independent.First air 491 blows to the first portion 481 so that the first portion
481 protrude from the first surface 121 of the pedestal 12b via the inner opening 127 and form supporting part 14b in first.Institute
It states the second air 492 and blows to the second portion 482 so that the second portion 482 is protruded from via the outward opening 128
The first surface 121 of the pedestal 12b and form the first outer supporting part 16b.Therefore, supporting part 14b and described in described first
First outer supporting part 16b neighbour is located at the first surface 121 of the pedestal 12b, and can be compared with the first surface of the pedestal 12b
121 liftings.
Figure 22 to 24 describes the element stripping means of some embodiments according to the present utility model.Referring to Figure 22, by institute
State the effect of first air 491 and second air 492 of pneumatic control device generation, supporting part in described first
14b and the described first outer supporting part 16b is located at same level height, and top to the lower surface of the carrier 32, and described simultaneously
In first supporting part 14b and the described first outer supporting part 16b elapse upwards 30 1 sections of the part carrier 32 and the element away from
From.
Referring to Figure 23, cancel partly or entirely second air 492, the described first outer supporting part 16b is dropped to low
In described first at the top of supporting part 14b.At this point, Component Vectors 32 and institute directly over the described first outer supporting part 16b
Element 30 is stated to separate.Alternatively, in another embodiment, the air quantity or intensity of first air 491 are further added by, so that described
Supporting part 14b is further up to exceed at the top of the described first outer supporting part 16b in one.At this point, the absorption heads 34 are provided
In the surface of the element 30.The absorption heads 34 can vertically decline.
Referring to Figure 24, the absorption heads 34, which drop to, touches the element 30.Afterwards, the absorption heads 34 hold described
It is moved upwardly together again after element 30 so that the absorption heads 34 can move away from the element 30 directly over the element 30
Or remove the carrier 32.
Unless specified otherwise herein, otherwise such as " top ", " lower section ", " upward ", " left side ", " the right ", " downward ", " top
The spatial descriptions such as portion ", " bottom ", " vertical ", " level ", " side ", " higher ", " lower part ", " top ", " top ", " following " relate to
And the orientation shown in figure is indicated.It is to be understood that spatial description used herein is for illustration purposes only, and this
The actual implementation scheme of structure described in text can by it is any orientation or in a manner of spatially configure, restrictive condition be this reality
It is not therefore configured with the advantages of new embodiment and has deviation.
As used herein, term " substantially ", " substantial ", " substantive " and " about " is describing and consider small change
Change.When being used in combination with event or situation, term can refer to the situation that event or situation clearly occur and event or situation pole
It is similar to situation about occurring.For example, when with reference to numerical value in use, the term can refer to less than or equal to that numerical value ±
10% excursion, all such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, be less than or equal to
± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1% or less than or equal to ±
0.05%.For example, if difference between two values be less than or equal to the average value of described value it is ± 10% (such as, small
In or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ±
1%th, less than or equal to ± 0.5%, less than or equal to ± 0.1% or less than or equal to ± 0.05%), then it is believed that two
Numerical value " substantial " is identical.Term " substantially coplanar " can refer to along same plane be in several microns (μm) it is interior (such as, along
Same plane is in 40 μm, in 30 μm, in 20 μm, in 10 μm or in 1 μm) two surfaces.
In addition, press range format presentation amount, ratio and other numerical value herein sometimes.It is to be understood that such range format
It is to be convenient and uses for purpose of brevity, and should be interpreted flexibly to not only include being expressly specified as the numerical value that scope limits, and
All individual numbers or the subrange covered in the range of that are further included, as clearly specified each numerical value and subrange one
As.
In the description to some embodiments, provide " " another component " on " a component can to cover previous component direct
On latter component the situation of (for example, with latter assemblies physical contact) and one or more intervention packages be located at previous component with
Situation between latter component.
Although being described referring to the specific embodiment of the utility model and illustrating the utility model, these descriptions and explanation
It is not intended to limit the utility model.Those skilled in the art will appreciate that it is not departing from as defined by the appended claims
The utility model true spirit and scope in the case of, can be variously modified and alternative equivalent.Illustrating can need not
It is drawn to scale.It is attributed to fabrication schedule and tolerance limit, area may be present between the art recurring and physical device in the utility model
Not.The other embodiment of the utility model not clearly stated may be present.This specification and schema should be considered as it is illustrative and
Nonrestrictive.It can modify, so that particular condition, material, material composition, method or processing procedure are adapted to the utility model
Target, spirit and scope.All such modifications are intended in the range of claims appended hereto book.Although referring to
The specific operation being performed in a specific order describes method disclosed herein, it should be appreciated that is not departing from the utility model
These operations in the case of teaching, be can be combined, subdivide or re-sequenced to form equivalent method.Therefore, it is unless bright herein
Really instruction, the order otherwise operated and grouping are not the limitation of the utility model.
Symbol description
1 element stripping off device
1a element stripping off devices
1b element stripping off devices
10 shells
12 pedestals
12a pedestals
12b pedestals
14 first movable platforms
Supporting part in 14a first
Supporting part in 14b first
15 the first noumenons
16 first movable thimbles
The first outer supporting parts of 16a
The first outer supporting parts of 16b
18 second movable platforms
19 second bodies
20 second movable thimbles
22 the 3rd movable platforms
23 the 3rd bodies
24 the 3rd movable thimbles
30 elements
32 carriers
Magnetic force portion in 40 first
42 first outer magnetic force portions
Pars contractilis in 44 first
46 first external extension portions
48 elastic films
49 air
121 first surfaces
122 second surfaces
123 base openings
124 first thimble openings
125 horizontal grooves
126 adsorption holes
127 inner openings
128 outward openings
141 first surfaces
142 horizontal grooves
143 first openings
144 second thimble openings
151 first surfaces
152 second surfaces
153 first gas passages
161 first surfaces
181 first surfaces
182 horizontal grooves
183 second openings
184 the 3rd thimble openings
191 first surfaces
192 second surfaces
193 second gas passages
201 first surfaces
221 first surfaces
222 horizontal grooves
231 first surfaces
232 second surfaces
233 third gas passages
241 first surfaces
481 first portions
482 second portions
491 first air
492 second air
Claims (20)
1. a kind of element stripping off device, it is characterised in that include：
Pedestal, multiple first thimble openings comprising base openings and at the outside of the base openings；
First movable platform is liftably located in the base openings；And
Multiple first movable thimbles are liftably located in the first thimble opening.
2. element stripping off device according to claim 1, it is characterised in that wherein described first movable platform is further wrapped
Containing the first opening, the element stripping off device further includes the second movable platform, and second movable platform can be compared with institute
The first movable platform is stated to be located at rising in first opening.
3. element stripping off device according to claim 2, it is characterised in that wherein described second movable platform is further wrapped
Containing the second opening, the element stripping off device further includes the 3rd movable platform, and the 3rd movable platform can be compared with institute
The second movable platform is stated to be located at rising in second opening.
4. element stripping off device according to claim 2, it is characterised in that wherein described first movable platform, which includes, to be located at
Multiple second thimble openings at the outside of first opening, the element stripping off device further include multiple second and live
Dynamic thimble, and second movable thimble can be located at the second thimble opening with rising compared with first movable platform
In.
5. element stripping off device according to claim 4, it is characterised in that wherein described second movable platform is further wrapped
Containing the second opening, the element stripping off device further includes the 3rd movable platform, and the 3rd movable platform can be compared with institute
It states the second movable platform to be located at rising in second opening, second movable platform, which includes, is located at the described second opening
Multiple 3rd thimble openings at outside, the element stripping off device further include multiple 3rd movable thimbles, and described
3rd movable thimble can be located in the 3rd thimble opening with rising compared with second movable platform.
6. element stripping off device according to claim 1, it is characterised in that wherein described pedestal, which includes, is located at the pedestal
Multiple adsorption holes at the outside of opening.
7. element stripping off device according to claim 1, it is characterised in that it is ceramic material at the top of wherein described pedestal,
And the ceramic material has multiple pores.
8. element stripping off device according to claim 7, it is characterised in that further include gas passage, be located at the bottom
It is connected in seat and with the pore.
9. element stripping off device according to claim 6, it is characterised in that further include gas passage, be located at the bottom
It is connected in seat and with the adsorption hole.
10. element stripping off device according to claim 8 or claim 9, it is characterised in that further include suction element, connect institute
Gas passage is stated, to provide pumping power or air blowing power to the gas in the gas passage.
11. element stripping off device according to claim 10, it is characterised in that wherein described suction element is air side Pu.
12. element stripping off device according to claim 5, it is characterised in that wherein described first movable thimble, second live
The upper limb of dynamic thimble and/or the 3rd movable thimble coats one layer of rubber.
13. element stripping off device according to claim 5, it is characterised in that wherein described first movable thimble, second live
The upper limb of dynamic thimble and/or the 3rd movable thimble is in smooth arc-shaped.
14. element stripping off device according to claim 3, it is characterised in that wherein described pedestal, the first movable platform,
Two movable platforms and/or the 3rd movable platform include at least one horizontal groove.
15. element stripping off device according to claim 14, it is characterised in that further include gas passage, the gas
Channel is located in the pedestal, and at least one end of the horizontal groove connects the gas passage.
16. element stripping off device according to claim 15, it is characterised in that suction element is further included, described in connection
Gas passage, to provide pumping power or air blowing power to the gas in the gas passage.
17. element stripping off device according to claim 16, it is characterised in that the suction element is air side Pu.
18. element stripping off device according to claim 1, it is characterised in that further include actuation element, start is in institute
State the first movable platform and first movable thimble.
19. element stripping off device according to claim 1, it is characterised in that further include two actuation elements, respectively
Start is in the first movable platform and the first movable thimble.
20. the element stripping off device according to claim 18 or 19, it is characterised in that the actuation element is electric drive
Motor, oil pressure pump or air compressor machine.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106111256A TWI674639B (en) | 2017-03-31 | 2017-03-31 | Apparatus and method for stripping an element |
| TW106204641 | 2017-03-31 | ||
| TW106111256 | 2017-03-31 | ||
| TW106204641U TWM556401U (en) | 2017-03-31 | 2017-03-31 | Apparatus for stripping an element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398111U true CN207398111U (en) | 2018-05-22 |
Family
ID=62417974
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720967632.4U Active CN207398111U (en) | 2017-03-31 | 2017-08-04 | Element peeling device |
| CN201710659634.1A Active CN108666257B (en) | 2017-03-31 | 2017-08-04 | Device and method for peeling component |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710659634.1A Active CN108666257B (en) | 2017-03-31 | 2017-08-04 | Device and method for peeling component |
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| Country | Link |
|---|---|
| CN (2) | CN207398111U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295475A (en) * | 2022-09-28 | 2022-11-04 | 江苏卓胜微电子股份有限公司 | Jacking-off device and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4574251B2 (en) * | 2003-09-17 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| JP5054933B2 (en) * | 2006-05-23 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| JP4864816B2 (en) * | 2007-06-19 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor integrated circuit device |
| CN104217984B (en) * | 2013-06-05 | 2018-02-06 | 上海华虹宏力半导体制造有限公司 | Prevent the thimble method of die crack |
| SG10201403372SA (en) * | 2014-06-18 | 2016-01-28 | Mfg Integration Technology Ltd | System and method for peeling a semiconductor chip from a tape using a multistage ejector |
-
2017
- 2017-08-04 CN CN201720967632.4U patent/CN207398111U/en active Active
- 2017-08-04 CN CN201710659634.1A patent/CN108666257B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108666257A (en) | 2018-10-16 |
| CN108666257B (en) | 2021-03-09 |
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