CN104217984B - Prevent the thimble method of die crack - Google Patents
Prevent the thimble method of die crack Download PDFInfo
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- CN104217984B CN104217984B CN201310222517.0A CN201310222517A CN104217984B CN 104217984 B CN104217984 B CN 104217984B CN 201310222517 A CN201310222517 A CN 201310222517A CN 104217984 B CN104217984 B CN 104217984B
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- thimble
- chip
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- primary
- control module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The invention discloses a kind of thimble method for preventing die crack, including：1）A kind of push pin device is designed, the push pin device includes：Secondary thimble, main thimble and primary and secondary thimble control module, secondary thimble and main thimble are in primary and secondary thimble control module；Wherein, secondary thimble, for being partially stripped chip, to mitigate the load of main thimble；Main thimble, for making the secondary stripping of chip；Primary and secondary thimble control module, for controlling the operation of time thimble and main thimble；2）Adjustment primary and secondary thimble is in dormant state, and controls push pin device to rise；3）First time stripping is carried out using secondary thimble, segment chip is mutually peeled off with blue film；4）Second is carried out using main thimble to peel off, then chip is mutually peeled off with blue film；5）Through pick-up head, chip is taken and picked up away.The present invention can effectively avoid the chip back thimble crackle caused by the collocation of thimble/blue film.
Description
Technical field
The present invention relates to a kind of thimble method in integrated antenna package field, die crack is prevented more particularly to one kind
Thimble method.
Background technology
In integrated antenna package flow, it is the highly important processing step of a step that chip, which is peeled off,.The chip is peeled off can be with
It is divided into two steps, the i.e. ascent stage of stage moment of thimble contact and chip stripping, as shown in Figure 1-2, chip thimble top
Chip is played, chip is separated with blue film, then, pick-up head picks up chip by vacuum action.In the wink of thimble contact
When the stage, if thimble speed is too high, can cause thimble to chip impact increase, it is possible to cause stripping process chips
Fragmentation；If thimble speed is too low, the viscous force of glue can not be effectively requested, makes chip and blue UF membrane；Peeled off in chip
Ascent stage, if the adhesion of glue is excessive, the phenomenon that can may do not picked up, it is necessary to impacted by increasing thimble
Power can be just effectively peeled off, and the fragmentation problem that is crooked and causing chip edge of chip easily occurs, as shown in Figure 3.
Can be bigger than normal with the more and more thinner and segment chip of chip, thimble technique can be increasingly difficult to.Therefore, one need to be researched and developed
The new thimble method of kind, to solve the problems, such as die crack.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of thimble method for preventing die crack.With it, energy
The chip back thimble crackle caused by the collocation of thimble/blue film is avoided, is solved present in existing chip stripping because of top
The excessive velocities of pin or the absorption affinity of film are too strong etc. causes thimble to puncture blue film to scratch chip, can cause to split under serious conditions
The problem of piece.
In order to solve the above technical problems, the thimble method for preventing die crack of the present invention, including step：
1）A kind of new push pin device is designed, the push pin device includes：Secondary thimble, main thimble and primary and secondary thimble control mould
Block；
Wherein, secondary thimble, for being first partially stripped chip, to mitigate the load of main thimble；
Main thimble, for making the secondary stripping of chip, i.e., after secondary thimble is partially stripped, carry out final stripping；
Primary and secondary thimble control module, for controlling the operation of time thimble and main thimble；
The secondary thimble and main thimble are in primary and secondary thimble control module；
2）By primary and secondary thimble control module, adjustment primary and secondary thimble is in dormant state, and controls push pin device to rise；
3）By primary and secondary thimble control module, first time stripping is carried out using secondary thimble, segment chip is mutually shelled with blue film
From；
4）By primary and secondary thimble control module, carry out second using main thimble and peel off, then chip is mutually peeled off with blue film；
5）Through pick-up head, chip is taken and picked up away.
Methods described, it may also include：6）Primary and secondary thimble control module is drawn back, main thimble return simultaneously returns dormant state, so
Afterwards, repeat step 2）~5）.Can be that the mode peeled off three times carries out chip stripping for example, preventing the thimble method of die crack,
And a time thimble is made interior circle time thimble and outer circle time thimble, carry out first time stripping using outer circle time thimble, make 30% chip with
Blue film is mutually peeled off, and carrying out second using interior circle time thimble peels off, then 60% chip is mutually peeled off with blue film, and finally, main thimble is real
Existing 90% or 100% peels off.
The step 1）In, this thimble, it is uniformly distributed centered on main thimble, to be limited no more than chip boundary, and
Using chip uniform force as standard；The needle point of secondary thimble is circular or flat-top shape；The number of secondary thimble can be more than 2,
It such as can be 2~32；
Step 1）In, main thimble is located at the center of chip；The number of main thimble can be 1 or more.
Step 1）In, primary and secondary thimble control module includes：Pedestal and control device；Wherein, pedestal is used to set time thimble
With main thimble；Control device is used for operation order and the position for controlling primary and secondary thimble, and when secondary thimble plays a role, main top
Pin is stood by；When main thimble plays a role, secondary thimble is stood by, and waits one-stop operation to finish, primary and secondary thimble
It is in dormant state.
The step 3）In, segment chip is 20%~40% chip；When secondary thimble peel off for the first time, main thimble
In stand-by or dormant state.
The step 4）In, the chip and blue film that make 70%~100% are mutually peeled off；When main thimble carries out second of stripping,
Secondary thimble returns dormant state.
Above-mentioned dormant state, including：Thimble（Main thimble, secondary thimble）Draw back or thimble original place is motionless.
The present invention, by using two-step process method, first buffer, make chip and blue film initial gross separation；Then, chip is jacked up,
In the case of making stamping press less, chip is jacked up.This mode is it is possible to prevente effectively from core caused by the collocation of thimble/blue film
Piece back side thimble crackle.
Brief description of the drawings
The present invention is further detailed explanation with embodiment below in conjunction with the accompanying drawings：
Fig. 1 is traditional thimble operation structure schematic diagram（Before thimble contact）；
Fig. 2 is traditional thimble operation structure schematic diagram（After thimble jacks up）；
Fig. 3 is the excessive microscope inspection mapping for causing chip back crackle of thimble stress；
Fig. 4 is the secondary thimble operation schematic diagram of the present invention；
Fig. 5 is the main thimble operation schematic diagram of the present invention.
Description of reference numerals is as follows in figure：
1 is thimble, and 2 be blue film, and 3 be glue, and 4 be chip, and 5 be pick-up head, and 11 be time thimble, and 12 be main thimble, and 13 are
Control device, 14 be pedestal.
Embodiment
The thimble method for preventing die crack of the present invention, including step：
1）A kind of new push pin device is designed, the push pin device contains time thimble 11, main thimble 12 and the control of primary and secondary thimble
Module, the secondary thimble 11 and main thimble 12 are in primary and secondary thimble control module；；
Wherein, secondary thimble 11, for being first partially stripped chip 4, to mitigate the load of main thimble 12；This thimble 11,
It is uniformly distributed centered on main thimble 12, to be limited no more than the border of chip 4, and using the uniform force of chip 4 as standard；Secondary thimble
11 needle point is circular or flat-top shape；The number of secondary thimble 11, to allow the uniform stressed of chip 4 to consider to be main, according to reality
Border is applied, and can be more than 2, such as can be 2~32；
Main thimble 12, for making 4 two strippings of chip, i.e., after secondary thimble 11 is partially stripped, carry out final stripping
From；Main thimble 12 is located at the center of chip 4；The number of main thimble 12 is traditionally arranged to be 1, as the area of fruit chip 4 is larger,
More than 1 can be set, i.e., the number of main thimble 12 can be 1 or more；
Primary and secondary thimble control module, for controlling the operation of time thimble 11 and main thimble 12；The primary and secondary thimble control module
Including：Pedestal 14 and control device 13；Wherein, pedestal 14 is used to set time thimble 11 and main thimble 12；Control device 13 is used for
Operation order and the position of primary and secondary thimble are controlled, and when secondary thimble 11 plays a role, main thimble 12 is stood by；
When main thimble 12 plays a role, secondary thimble 11 is stood by, and waits one-stop operation to finish, and primary and secondary thimble is in stand-by shape
State；
2）By primary and secondary thimble control module, adjustment primary and secondary thimble is in dormant state, and controls push pin device to rise；
3）By primary and secondary thimble control module, first time stripping is carried out using secondary thimble 11, makes segment chip 4 and blue film 2
Mutually peel off（Such as the chip 4 that segment chip 4 is 20%~40%）（As shown in Figure 4）；
Wherein, when secondary thimble 11 peel off for the first time, main thimble 12 is in stand-by or dormant state；
4）By primary and secondary thimble control module, carry out second using main thimble 12 and peel off, then make chip 4 and the blue phase of film 2
Peel off（Chip 4 such as 70%~100% is peeled off with the blue phase of film 2）（As shown in Figure 5）；
Wherein, when main thimble 12 carries out second of stripping, secondary thimble 11 returns dormant state.
5）Through pick-up head 5, chip 4 is taken and picked up away.
In addition, the above method, may also include：6）Primary and secondary thimble control module is drawn back, the main return of thimble 12 simultaneously returns stand-by
State, then, repeat step 2）~5）.For example, when chip 4 is bigger or thinner, such a method can also be extended, done
Into the mode peeled off three times, that is, the thimble method of die crack is prevented, the mode to peel off three times carries out chip 4 and peeled off, and handle
Secondary thimble 11 makes interior circle time thimble and outer circle time thimble, and first time stripping is carried out using outer circle time thimble, make 30% chip 4 with
The blue phase of film 2 is peeled off, and carrying out second using interior circle time thimble peels off, then 60% chip 4 is peeled off with the blue phase of film 2, finally, main top
Pin 12 realizes 90% or 100% stripping.
Described dormant state, it is not contact as criterion with blue film 2, such as may include in the above method：Thimble
（Main thimble 12, secondary thimble 11）Draw back or thimble original place is motionless.
Carrying out operation according to the method described above can effectively avoid the chip back thimble caused by the collocation of thimble/blue film from splitting
Line, and the push pin device design of the present invention is simple, strong operability, is with a wide range of applications.
Claims (8)
- A kind of 1. thimble method for preventing die crack, it is characterised in that including step：1) a kind of push pin device is designed, the push pin device includes：Secondary thimble, main thimble and primary and secondary thimble control module；Wherein, secondary thimble, for being partially stripped chip, to mitigate the load of main thimble；Main thimble, for making the secondary stripping of chip；Primary and secondary thimble control module, for controlling the operation of time thimble and main thimble；The secondary thimble and main thimble are in primary and secondary thimble control module；Secondary thimble, it is uniformly distributed centered on main thimble, to be limited no more than chip boundary, and using chip uniform force as mark It is accurate；The needle point of secondary thimble is circular or flat-top shape；Main thimble, positioned at the center of chip；Primary and secondary thimble control module, including：Pedestal and control device；Wherein, pedestal is used to set time thimble and main thimble；Control Device is used for operation order and the position for controlling primary and secondary thimble, and when secondary thimble plays a role, main thimble is in stand-by shape State；When main thimble plays a role, secondary thimble is stood by, and waits one-stop operation to finish, and primary and secondary thimble is in stand-by shape State；2) by primary and secondary thimble control module, adjustment primary and secondary thimble is in dormant state, and controls push pin device to rise；3) by primary and secondary thimble control module, first time stripping is carried out using secondary thimble, segment chip is mutually peeled off with blue film； When secondary thimble peel off for the first time, main thimble is stood by, and the primary and secondary thimble control module makes the secondary thimble list Solely realize and peel off for the first time；4) by primary and secondary thimble control module, carry out second using main thimble and peel off, then chip is mutually peeled off with blue film；In master When thimble carries out second of stripping, secondary thimble returns dormant state, and the primary and secondary thimble control module makes the main thimble independent Realize second and peel off；5) through pick-up head, chip is taken and picked up away.
- 2. the method as described in claim 1, it is characterised in that：Methods described, in addition to：6) primary and secondary thimble control mould is drawn back Block, main thimble return simultaneously return dormant state, then, repeat step 2)~5).
- 3. method as claimed in claim 2, it is characterised in that：The thimble method for preventing die crack, to peel off three times Mode carry out chip stripping, and a time thimble is made interior circle time thimble and outer circle time thimble, the is carried out using outer circle time thimble Once peel off, 30% chip is mutually peeled off with blue film, carrying out second using interior circle time thimble peels off, then makes 60% chip and indigo plant Film is mutually peeled off, and finally, main thimble realizes 90% or 100% stripping.
- 4. the method as described in claim 1, it is characterised in that：The number of the secondary thimble is more than 2；The number of main thimble is 1 or more.
- 5. method as claimed in claim 4, it is characterised in that：The number of the secondary thimble is 2~32.
- 6. the method as described in claim 1, it is characterised in that：In the step 3), segment chip is 20%~40% core Piece.
- 7. the method as described in claim 1, it is characterised in that：In the step 4), make 70%~100% chip and blue film Mutually peel off.
- 8. method as claimed in claims 6 or 7, it is characterised in that：The dormant state, judged with not contacted with blue film Standard, including：Thimble is drawn back or thimble original place is motionless.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310222517.0A CN104217984B (en) | 2013-06-05 | 2013-06-05 | Prevent the thimble method of die crack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310222517.0A CN104217984B (en) | 2013-06-05 | 2013-06-05 | Prevent the thimble method of die crack |
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| Publication Number | Publication Date |
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| CN104217984A CN104217984A (en) | 2014-12-17 |
| CN104217984B true CN104217984B (en) | 2018-02-06 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140156B (en) * | 2015-08-26 | 2017-10-27 | 华中科技大学 | A kind of many thimble stripping off devices and stripping means towards flexible chip |
| CN106601662B (en) * | 2017-02-17 | 2023-05-09 | 深圳市锐博自动化设备有限公司 | Special thimble device of chip |
| CN207398111U (en) * | 2017-03-31 | 2018-05-22 | 日月光半导体制造股份有限公司 | Element peeling device |
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
| CN110339873B (en) * | 2019-06-05 | 2021-08-24 | 深圳先进技术研究院 | Digital microfluidic platform |
| CN111312650B (en) * | 2020-02-27 | 2021-07-02 | 上海世禹精密机械有限公司 | Comb type chip on-film separation device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266920A (en) * | 2007-03-16 | 2008-09-17 | 株式会社东芝 | Semiconductor device manufacturing device and semiconductor-device manufacturing method |
| CN102254792A (en) * | 2011-07-08 | 2011-11-23 | 华中科技大学 | Die peeling device with safety push-up pin |
-
2013
- 2013-06-05 CN CN201310222517.0A patent/CN104217984B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266920A (en) * | 2007-03-16 | 2008-09-17 | 株式会社东芝 | Semiconductor device manufacturing device and semiconductor-device manufacturing method |
| CN102254792A (en) * | 2011-07-08 | 2011-11-23 | 华中科技大学 | Die peeling device with safety push-up pin |
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| CN104217984A (en) | 2014-12-17 |
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