CN207375986U - No base material glue processes assembling device - Google Patents
No base material glue processes assembling device Download PDFInfo
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- CN207375986U CN207375986U CN201721205284.3U CN201721205284U CN207375986U CN 207375986 U CN207375986 U CN 207375986U CN 201721205284 U CN201721205284 U CN 201721205284U CN 207375986 U CN207375986 U CN 207375986U
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- glue
- base material
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- layer
- assembling device
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Abstract
The utility model discloses a kind of no base material glue processing assembling devices.The device includes a transmission device, the transmission device includes inferior division and top set, compounding machine and bicker are equipped on the inferior division successively, engraving machine and device for removing waste are equipped in the top set successively, the end of the inferior division and the top set is all connected on a gauge, wherein the transmission device is used for transmission component.Processing assembling device combination product architectural characteristic in the utility model, by no base material glue and need the carry out of rubberizing compound, then it is processed component as base material, realize the automation line production of assembling and the processing of component and glue, solve the problems, such as that no base material glue is difficult to due to easy excessive glue and deformation, manpower and materials are not only saved, also improve the efficiency of processing and manufacture.
Description
Technical field
The utility model is related to material processing field, more particularly to a kind of no base material glue processing assembling device.
Background technology
It is the adhesive tape that a kind of direct acrylate glue coating compacting forms without base material glue, with its excellent bonding effect, excellent
Anti-dropout with water resistance, processability is good, temperature tolerance is good, dimensional stability, thermal stability, chemical stability are good, just viscous
Property and hold viscosity it is good, can be suitably used for the characteristics such as broader temperature range and adverse circumstances, as component connecting material in mobile phone etc.
It is manufactured and is applied extensively in precise electronic product.
But it is more liquid without base material glue due to no base material, while possessing above-mentioned advantage, it may have be difficult to
Characteristic, if be processed according to the conventional method using equipment such as bickers to no base material glue, it is easy to generate excessive glue and
Metaboly causes processing effect bad or even fails.And it is current, no base material glue can be carried out individually by also not occurring
The mode of high quality processing.
Utility model content
To solve the above problems, the utility model provides a kind of no base material glue processing assembling device.
One side according to the present utility model provides a kind of no base material glue processing assembling device, including a transmission
Device, the transmission device include inferior division and top set, are equipped with compounding machine and bicker on the inferior division successively, it is described on
Engraving machine and device for removing waste are equipped in branch successively, the end of the inferior division and the top set is all connected on a gauge,
Wherein described transmission device is used for transmission component.
Processing assembling device combination product architectural characteristic in the utility model, by no base material glue and the component for needing rubberizing
It carries out compound, is then processed component as base material, realize the automation line life of assembling and the processing of component and glue
Production, solve the problems, such as no base material glue because easy excessive glue and deformation due to be difficult to, save manpower and materials, improve processing and
The efficiency of manufacture.
In some embodiments, the component is steel mesh.Thus, it is possible to determine component to be processed, the component
Can be some suitable other parts.
In some embodiments, the compounding machine is used for compound one layer of lower glue layer on the bottom surface of the component, described
Gauge is used to set one layer of upper glue layer on the top surface of the component, and the lower glue layer and/or the upper glue layer are no base material glue.
Thus, it is possible to it is bonded the upper lower glue layer being made of no base material glue respectively on the component.
In some embodiments, one layer of PET film is additionally provided with above the upper glue layer.Thus, it is possible to by cutting PET film
Upper glue layer and steel mesh are combined.
In some embodiments, the overall thickness of the component, the lower glue layer, the upper glue layer and the PET film is
0.46mm.Thus, it is possible to determine the thickness of component and glue after processing, illustrate the original that needs process upper and lower two layers of glue respectively
Cause.
In some embodiments, the engraving machine is equipped with engraved die.Thus, it is possible to by glue used in upper glue layer into
Row is cut.
Description of the drawings
Fig. 1 is the schematic diagram that assembling device is processed without base material glue of one embodiment of the utility model；
Fig. 2 is the structure chart in each stage of component shown in Fig. 1.
Specific embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 schematically show a kind of embodiment according to the present utility model without base material glue process assembling device,
Fig. 2 is the structure in each stage of component, wherein 2 (a) is structure after the compound lower glue layer 21 of component, 2 (b) is the compound upper glue layer of component
Structure after 22.As shown in Figs. 1-2, processing assembling device tool is there are one transmission device 1, for that will be driven the group for needing to process
Part 2 makes component 2 pass through other each equipment, in the compound one layer of lower glue layer 21 in its bottom surface and compound one layer in its top surface
Upper glue layer 22, wherein, component 2 in present embodiment is steel mesh, at least one in lower glue layer 21 and upper glue layer 22 is no base
Material glue, the processing assembling device can also be used for processing the suitable component of other species.
In process, can also the top of upper glue layer 22 set one layer of PET film 23, and component 2, lower glue layer 21, on
The overall thickness that glue-line 22 and PET film 23 are combined has had reached 0.46mm, if carrying out shape again after being combined
Shape is processed, then very possible to be easy to cause excessive glue because thickness is excessive.For this purpose, transmission device 1 can be divided for Liang Ge branches, i.e.,
Inferior division 12 and top set 11 are respectively used to be processed lower glue layer 21 and upper glue layer 22, then be combined on component 2.
The inferior division 12 of transmission device 1 is for the lower glue layer 21 on 2 bottom surface of processing assembly, if using 4 grade machines of bicker
Device is individually processed the glue-line being made of no base material glue, be easy to cause excessive glue and deformation, for this purpose, can be first by lower glue layer 21
It is combined on component 2, then is processed with component 2 for base material.
Therefore, compounding machine 3 and bicker 4 are equipped on inferior division 12, and gauge 7 is connected in end.In processing,
Component 2 is placed on inferior division 12, component 2 can be conveyed on compounding machine 3, compound on the bottom surface of component 2 from compounding machine 3
One layer of lower glue layer 21, then component 2 be transferred on bicker 4, component 2 and lower glue layer 21 be processed into using bicker 4 needed for
Shape, then be transferred on gauge 7 progress blanking processing.Wherein what bicker 4 was processed is the combination of component 2 and lower glue layer 21
Object, not individual glue-line, therefore avoid the problem of no base material glue be easy to cause excessive glue and deformation in processing.
The top set 11 of transmission device 1 is equipped with engraving for the upper glue layer 22 on 2 top surface of processing assembly in top set 11
Machine 5 and device for removing waste 6, and gauge 7 is connected in end.In processing, the glue used in upper glue layer 22 is placed into top set 11
On, engraving machine 5 is provided with engraved die 51, can be used engraving machine 5 that the glue being placed on its engraved die 51 is cut into section；So
Glue is transferred to device for removing waste 6 afterwards, glue processing is formed as 2 required shape of component by operation device for removing waste 6, is upper glue layer 22；
Finally upper glue layer 22 is transferred on gauge 7, gauge 7 is equipped with PET film 23, is arranged on one layer of PET film 23 using gauge 7
Then upper glue layer 22 with PET film 23 is cut the component 2 equipped with lower glue layer 21 fallen on after blanking by the top of glue-line 22
On, as a result, lower glue layer 21 and upper glue layer 22 be processed to respectively required shape and it is compound be assembled on component 2, therefore not
It needs to be processed the component 2 for being equipped with two layers of glue-line, avoiding can be because thickness excessive the problem of be easy to causeing excessive glue.Assembling
After finishing, component 2 can be transferred to and departs from transmission device 1 and be collected.
Assembling device combination product architectural characteristic is processed without base material glue in the utility model, without base material glue and will need to paste
The component of glue carries out compound, is then processed component as base material, realize component and glue assembling and processing it is automatic
Change line production, solve the problems, such as that no base material glue is difficult to due to easy excessive glue and deformation, while also avoid to being equipped with
The component of two layers of glue-line can not only save manpower and materials, also when being processed because of thickness excessive the problem of be easy to causeing excessive glue
Improve the efficiency of processing and manufacture.
Above-described is only some embodiments of the utility model.For those of ordinary skill in the art,
On the premise of not departing from the utility model and creating design, various modifications and improvements can be made, these belong to this practicality
New protection domain.
Claims (8)
1. process assembling device without base material glue, it is characterised in that：Including a transmission device (1), the transmission device (1) includes
Inferior division (11) and top set (12), are equipped with compounding machine (3) and bicker (4) on the inferior division (11) successively, described upper to divide
It props up and is equipped with engraving machine (5) and device for removing waste (6) on (12) successively, the end of the inferior division (11) and the top set (12) connects
It is connected on a gauge (7), wherein the transmission device (1) is used for transmission component (2).
2. no base material glue processing assembling device according to claim 1, it is characterised in that：The component (2) is steel mesh.
3. no base material glue processing assembling device according to claim 2, it is characterised in that：The compounding machine (3) be used for
Compound one layer of lower glue layer (21) on the bottom surface of the component (2).
4. no base material glue processing assembling device according to claim 3, it is characterised in that：The gauge (7) is used for institute
State one layer of upper glue layer (22) of setting on the top surface of component (2).
5. no base material glue processing assembling device according to claim 4, it is characterised in that：The lower glue layer (21) and/or
The upper glue layer (22) is no base material glue.
6. no base material glue processing assembling device according to claim 4, it is characterised in that：The top of the upper glue layer (22)
It is additionally provided with one layer of PET film (23).
7. no base material glue processing assembling device according to claim 6, it is characterised in that：The component (2), the lower glue
The overall thickness of layer (21), the upper glue layer (22) and the PET film (23) is 0.46mm.
8. no base material glue processing assembling device according to claim 1, it is characterised in that：The engraving machine (5) is equipped with
Engraved die (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721205284.3U CN207375986U (en) | 2017-09-20 | 2017-09-20 | No base material glue processes assembling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721205284.3U CN207375986U (en) | 2017-09-20 | 2017-09-20 | No base material glue processes assembling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207375986U true CN207375986U (en) | 2018-05-18 |
Family
ID=62341096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721205284.3U Active CN207375986U (en) | 2017-09-20 | 2017-09-20 | No base material glue processes assembling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207375986U (en) |
-
2017
- 2017-09-20 CN CN201721205284.3U patent/CN207375986U/en active Active
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