CN207915618U - Substrate-free double-sided adhesive intensive punching processing system - Google Patents

Abstract

The utility model discloses a no substrate double faced adhesive tape intensive system of punching a hole. The device includes a material area that constitutes by leaving the type membrane, and the material area is in proper order through a first circular knife machine, a first cover cutter, a second cover cutter and a coiling mechanism, and wherein, be equipped with QDC hardware and metals mould on the first cover cutter, and be equipped with flat sword sculpture mould on the second cover cutter. The utility model provides a no substrate double faced adhesive tape intensive processing system that punches a hole optimizes on traditional manufacturing process, has solved in the course of working to no substrate double faced adhesive tape, especially under the comparatively intensive condition in hole between the product, produces the condition that overflow glue, deformation, burr and size are not right etc. easily to product quality has been improved, and the efficiency of processing and manufacturing has been guaranteed.

Description

Substrate-free double-sided adhesive intensive punching processing system

technical field

The utility model relates to the field of processing equipment, in particular to a substrate-free double-sided adhesive intensive punching processing system.

Background technique

Substrate-free double-sided adhesive is characterized by its excellent bonding effect, excellent anti-shedding and waterproof performance, good processability, good temperature resistance, good dimensional stability, thermal stability, chemical stability, initial tack and stickiness Good, can be applied to wider temperature range and harsh environment and other characteristics, as a component connection material, it has been widely manufactured and applied in precision electronic products such as mobile phones. However, the non-substrate double-sided adhesive has no substrate, soft material, and strong stretchability, making it difficult to process. If the non-substrate adhesive is processed by punching machines and other equipment according to traditional methods, especially When the holes between the products are relatively dense and the gaps are small, it is easy to cause glue overflow and deformation, and it is difficult to control the size of the processing, resulting in reduced product yield and increased cost of die-cutting processing.

Utility model content

In order to solve the above problems, the utility model provides a dense punching processing system for double-sided adhesive without base material.

According to one aspect of the present invention, a substrate-free double-sided adhesive intensive punching processing system is provided, which includes a material belt composed of a release film, and the material belt sequentially passes through a first circular knife machine, a second One set of cutting machine, one second set of cutting machine and one winding device, wherein, the first set of cutting machine is equipped with QDC hardware mold, and the second set of cutting machine is equipped with flat knife engraving mold.

The intensive punching processing system of double-sided adhesive without base material in the utility model is optimized on the traditional processing technology, and solves the problem of denser holes between products during the processing of double-sided adhesive without base material. Under the circumstances, it is easy to produce glue overflow, deformation, burrs and inconsistencies in size, etc., thereby improving product quality and ensuring the efficiency of processing and manufacturing.

In some embodiments, a second circular knife machine is provided between the second set of cutting machines and the winding device. As a result, some trimming work can be performed on the strip after nesting.

In some embodiments, the first circular knife machine is provided with a plurality of knife dies. Thereby, it can be used for processing a strip.

In some embodiments, the die includes high and low knives. Thus, it can be used for hollowing out double-sided adhesive tape without base material.

In some embodiments, the first circular knife machine is provided with multiple composite devices and multiple rotating shafts. Thus, it is possible to combine various materials on the tape and to discharge waste.

In some embodiments, silicone tapes, substrate-less double-sided tapes, release paper, acrylic tapes or protective films are respectively provided on some of the rotating shafts. Thereby, various materials that need to be compounded on the tape can be installed.

In some embodiments, the silicone tape, the double-sided adhesive tape without substrate, the release paper and the acrylic tape are all compounded on the side of the material tape with the release surface, and the protective film is compounded on the back of the material tape facing the release surface. side. The protective film has two layers. In this way, it is possible to set up a specific way of compounding various materials on the tape.

Description of drawings

Fig. 1 is a schematic diagram of a substrate-less double-sided adhesive intensive punching processing system according to an embodiment of the present invention;

Fig. 2 is a schematic diagram of the structure of products at various stages during processing by the dense punching processing system without substrate double-sided adhesive tape shown in Fig. 1 .

Detailed ways

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Fig. 1 schematically shows a substrate-less double-sided adhesive intensive punching processing system according to an embodiment of the present invention. As shown in Figure 1, the system includes a material belt 1, which is composed of a release film, and the material belt 1 passes through a first circular knife machine 2 and a first set of cutting machine from one end to the other end in turn. 3. A second set of cutting machine 4 and a winding device 5. The above-mentioned equipment can be used for multiple times of compounding, knife cutting and waste discharge on the material strip 1 and the material layer compounded thereon.

On the first round knife machine 2, a plurality of cutting dies are arranged, which can be used to cut the material strip 1, and at least one high and low knife is included in each cutting die knife, which is used to compound the material strip in a specific process. 1. The substrate-free double-sided adhesive tape is hollowed out.

The first round knife machine 2 is provided with a plurality of compound devices 21, and a plurality of rotating shafts 22 are arranged on the top and bottom of the first round knife machine 2, and various materials for compounding are respectively installed on some of the rotating shafts 22. Each material layer mainly includes silicone tape, double-sided adhesive tape without substrate, release paper, acrylic tape and protective film. In the specific process of processing, silicone tape, substrate-free double-sided adhesive tape, release paper and acrylic tape are all compounded on the side of the material tape 1 with the release surface. The rotating shaft 22 of each compound device 21 is set on the same side of each compound device 21, such as the top of each compound device 21; and there are two protective films that need to be compounded on the side of the strip 1 facing away from the release surface, thus, the The rotating shaft 22 provided with a protective film is disposed on the other side of each composite device 21 , such as the bottom of each composite device 21 .

Wherein, the first set of cutting machine 3 is provided with a QDC hardware mold, and the second set of cutting machine 4 is provided with a flat knife engraving mold, thus, the two sets of cutting machines can be used for the material belt 1 and the compound on it. Different sets of cutting processes are performed on the upper material layer.

In addition, if necessary, a second circular knife machine 6 can also be set between the second set of cutting machine 4 and the winding device 5, and the second pair of circular knife machines is also provided with multiple compound devices and multiple The rotating shaft can be used to carry out some trimming work on the processed strip 1 .

Figure 2 shows the structure of the product at each stage when the substrate-free double-sided adhesive intensive punching processing system in Figure 1 is being processed. As shown in Figure 2, when using the processing system in the utility model, its processing mainly includes the following multiple steps:

The first step is to pass the material strip 1 composed of release film through the first circular knife machine 2, and compound a silicone strip at the center of its release surface, and then use the knife mold to process the surface of the silicone strip. Half-cut the processed outer frame to the release film, and then drain the outer frame waste of the silicone tape. The structure of the processed part after this step is shown in Figure 2(a).

The second step is to compound two layers of protective film on the non-adhesive surface on the back of the release surface of the material tape 1, and compound a layer of non-substrate as the main body of the product on the outside of the silicone belt on the release surface of the material tape 1. Double-sided adhesive, and then drain the original film of the double-sided adhesive without substrate; then compound a layer of release paper on the adhesive surface, and use the high and low knife die to cut the paper surface of the release paper, on the double-sided adhesive without substrate Hollow out the long holes and round holes on the surface glue, and drain the waste in the hollowed out area, and then drain the outer frame waste of the release paper on the glue surface; then, you can compound an acrylic tape on the surface of the release paper , and then operate to discharge it together with the waste of the outer frame without the double-sided adhesive of the base material; finally, if necessary, a layer of ultra-light release film can be compounded on the outside. The structure of the processed part after this step is shown in Figure 2(b).

The third step is to use the QDC hardware mold on the first set of cutting machine 3 to carry out the pin-hole sleeve cutting of the product, to carry out the through-hole blanking and waste discharge of the small round hole processed on the product, and to cut out the automatic material belt 1 to avoid the position . The structure of the processed part after this step is shown in Figure 2(c).

The fourth step is to use a flat knife engraving mold on the second set of cutting machine 4 to carry out pin-hole sleeve cutting on the product, half-cut all the elongated holes processed on the product to the protective film, and then use the protective film to discharge waste. The structure of the processed part after this step is shown in Figure 2(d).

Finally, the material strip 1 passes through the second round knife machine 6, and the second pair of round knife machines can be used to perform some trimming work on the processed product located on the material strip 1, and then use the winding device 5 to finish the processed product. Receipt.

What have been described above are only some embodiments of the present utility model. For those skilled in the art, without departing from the inventive concept of the present utility model, some modifications and improvements can be made, and these all belong to the protection scope of the present utility model.

Claims (8)

1. without base material double faced adhesive tape dense punching system of processing, it is characterised in that：Including a material strip being made of release film (1), The material strip (1) pass through successively first circular knife machine (2), a first set cut machine (3), one second set cut machine (4) and one A wrap-up (5), wherein the first set cuts machine (3) and is equipped with QDC hardware dies, and described second set is cut and set on machine (4) There is flat cutter engraved die.

2. no base material double faced adhesive tape dense punching system of processing according to claim 1, it is characterised in that：Described second set is cut Second circular knife machine (6) is equipped between machine (4) and the wrap-up (5).

3. no base material double faced adhesive tape dense punching system of processing according to claim 1, it is characterised in that：First dise knife Machine (2) is equipped with multiple cutting dies.

4. no base material double faced adhesive tape dense punching system of processing according to claim 3, it is characterised in that：It is wrapped in the cutting die Height knife is included.

5. no base material double faced adhesive tape dense punching system of processing according to claim 1, it is characterised in that：First dise knife Machine (2) is equipped with more set composites (21) and more shafts (22).

6. no base material double faced adhesive tape dense punching system of processing according to claim 5, it is characterised in that：Described in which part Silicone band is respectively equipped in shaft (22), without base material double faced adhesive tape, release paper, acrylic adhesive tape or protective film.

7. no base material double faced adhesive tape dense punching system of processing according to claim 6, it is characterised in that：The silicone band, The no base material double faced adhesive tape, the release paper and the acrylic adhesive tape be compounded in the material strip (1) with layer upper surface Side, and the protective film is compounded in the side that facing away from layer upper surface of the material strip (1).

8. no base material double faced adhesive tape dense punching system of processing according to claim 6, it is characterised in that：The protective film tool Have two layers.