CN207915618U - Without base material double faced adhesive tape dense punching system of processing - Google Patents
Without base material double faced adhesive tape dense punching system of processing Download PDFInfo
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- CN207915618U CN207915618U CN201820289370.5U CN201820289370U CN207915618U CN 207915618 U CN207915618 U CN 207915618U CN 201820289370 U CN201820289370 U CN 201820289370U CN 207915618 U CN207915618 U CN 207915618U
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- adhesive tape
- base material
- double faced
- faced adhesive
- machine
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model discloses a kind of no base material double faced adhesive tape dense punching systems of processing.The device includes a material strip being made of release film, material strip pass through successively first circular knife machine, a first set cut machine, one second set cut machine and a wrap-up, wherein, first set cuts machine and is equipped with QDC hardware dies, and second set is cut machine and be equipped with flat cutter engraved die.Being optimized in traditional processing technology without base material double faced adhesive tape dense punching system of processing in the utility model, it solves in the process to no base material double faced adhesive tape, in the case that hole especially between product is more intensive, easy to produce excessive glue, deformation, burr and off size etc. situation, to improve product quality, and it ensure that the efficiency of processing and manufacture.
Description
Technical field
The utility model is related to processing equipment field, more particularly to a kind of no base material double faced adhesive tape dense punching system of processing.
Background technology
Without base material double faced adhesive tape is with its excellent bonding effect, excellent anti-dropout and water resistance, processability be good, heatproof
Property it is good, dimensional stability, thermal stability, chemical stability are good, tack and hold viscosity it is good, can be suitably used for broader temperature range
With the characteristics such as adverse circumstances, is manufactured and applied extensively in the precise electronic products such as mobile phone as component connecting material.But
It is that no base material double faced adhesive tape is not due to having base material, and material is soft, and draftability is very strong, makes it have unmanageable characteristic, if pressed
No base material glue is processed using equipment such as bickers according to traditional method, the hole especially between product is more intensive,
In the case that gap is smaller, it is easy to generate excessive glue and metaboly, it is difficult to which the size for controlling processing causes to reduce product good
Rate improves the cost of cross cutting processing.
Utility model content
To solve the above problems, the utility model provides a kind of no base material double faced adhesive tape dense punching system of processing.
One side according to the present utility model provides a kind of no base material double faced adhesive tape dense punching system of processing, including
One material strip being made of release film, material strip pass through successively first circular knife machine, a first set cut machine, one second set cut
Machine and a wrap-up, wherein first set cuts machine and is equipped with QDC hardware dies, and second set is cut machine and carved equipped with flat cutter
Mold.
Being optimized in traditional processing technology without base material double faced adhesive tape dense punching system of processing in the utility model,
It solves in the process to no base material double faced adhesive tape, in the case that the hole especially between product is more intensive, is easy production
Raw excessive glue, deformation, burr and off size etc. situation to improve product quality, and ensure that processing and manufacture
Efficiency.
In some embodiments, it cuts between machine and wrap-up equipped with second circular knife machine for second set.Thereby, it is possible to
Some reconditions are carried out to material strip after set is cut.
In some embodiments, the first circular knife machine is equipped with multiple cutting dies.Thereby, it is possible to be used to add material strip
Work.
In some embodiments, in cutting die include height knife.Thereby, it is possible to be used to engrave no base material double faced adhesive tape
Sky processing.
In some embodiments, the first circular knife machine is equipped with multiple set composites and Duo Gen shafts.Thereby, it is possible to expect
Take compound multiple material and waste discharge.
In some embodiments, silicone band is respectively equipped in which part shaft, without base material double faced adhesive tape, release paper, Asia
Gram force adhesive tape or protective film.Thereby, it is possible to be arranged to need to carry out compound a variety of materials on material strip.
In some embodiments, silicone band, without base material double faced adhesive tape, release paper and acrylic adhesive tape be compounded in material strip
Side with layer upper surface, and protective film is compounded in the side that facing away from layer upper surface of material strip.Protective film has two layers.As a result,
A variety of materials can be set and carry out compound concrete mode on material strip.
Description of the drawings
Fig. 1 is the schematic diagram without base material double faced adhesive tape dense punching system of processing of one embodiment of the utility model；
Fig. 2 is the knot of each work-in-process without base material double faced adhesive tape dense punching system of processing during processing shown in Fig. 1
Structure schematic diagram.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 schematically shows a kind of adding without base material double faced adhesive tape dense punching for embodiment according to the present utility model
Work system.As shown in Figure 1, the system includes a material strip 1, which is made of release film, and material strip 1 is from one end to another
End cuts 3, one second set of machine by 2, first sets of the first circular knife machine of platform successively and cuts machine 4 and a wrap-up 5, above-mentioned each
Equipment can be used for cutting material strip 1 and the compound multiple compound, knife of material layer progress on it and the work such as waste discharge.
It is equipped with multiple cutting dies on the first circular knife machine 2, can be used for cutting material strip 1, and includes in each cutting die knife
Have at least one height knife, for carrying out hollow out processing without base material double faced adhesive tape to being compounded on material strip 1 in certain working procedure.
First circular knife machine 2 is equipped with more set composites 21, and is arranged in the top and bottom of the first circular knife machine 2
Have more shafts 22, be separately installed in part shaft 22 it is various be used for compound material layer, wherein each material layer includes mainly
Silicone band, without base material double faced adhesive tape, release paper, acrylic adhesive tape and protective film etc..And during specific be processed, silicon
Adhesive tape, the side with layer upper surface that material strip 1 is compounded in without base material double faced adhesive tape, release paper and acrylic adhesive tape can incite somebody to action as a result,
The shaft 22 for being provided with these material layers is arranged in the same side of each set composite 21, such as the top of each set composite 21；And
Also two protective films need the side that facing away from layer upper surface for being compounded in material strip 1, can will be provided with the shaft of protective film as a result,
22 are arranged in the other side of each set composite 21, such as the bottom of each set composite 21.
Wherein, it is cut in first set and is provided with QDC hardware dies on machine 3, and cut at second set and be provided that flat cutter is carved on machine 4
Die sinking has, and two sets, which cut machine and can carry out different sets to material strip 1 and compound material layer on it, as a result, cuts processing.
In addition, in case of need, can also be cut at second set and one second circle is arranged between machine 4 and wrap-up 5
Knife machine 6 is again provided with more set composites and Duo Gen shafts on second pair of circular knife machine, can be used for carrying out the material strip 1 after processing
Some reconditions.
Fig. 2 shows each work-in-process without base material double faced adhesive tape dense punching system of processing during processing in Fig. 1
Structure.As shown in Fig. 2, in the system of processing in using the utility model, process includes mainly following multiple steps
Suddenly：
The first step makes to pass through the first circular knife machine 2 by the material strip 1 that release film forms, and in its layer upper surface centered position
A upper compound silicone band, is then processed the surface of silicone band using cutting die, the outline border processed be partly switched to from
On type film, the outline border waste material of silicone band is then exhausted.Shown in structure such as Fig. 2 (a) by step processing post-processing position.
Second step, compound two layers of protective film in the non-glue surface at the back side of the layer upper surface of material strip 1, and in the release of material strip 1
The outside of the silicone band in face again compound one layer as product main body without base material double faced adhesive tape, then exhaust the original of no base material double faced adhesive tape
Film；Compound one layer of release paper in its glue surface again, and the paper of release paper is cut using height cutting die, it is double in no base material
The strip hole and circular hole that hollow out processes on the glue of face, and the waste material of void region is exhausted, then exhaust the release paper in glue surface
Outline border waste material；It is then possible in one acrylic adhesive tape of surface recombination of release paper, then operate it is two-sided together with no base material
The outline border waste material of glue exhausts together；Finally, it is necessary in the case of, can also compound one layer of ultralight release film on the outside again.
Shown in structure such as Fig. 2 (b) by step processing post-processing position.
Third walks, and cuts in first set and is cut to product progress pin hole set using QDC hardware dies on machine 3, to being processed on product
The small sircle hole gone out carries out through-hole blanking waste discharge, and cuts out automatic material band 1 and keep away position.By the knot at step processing post-processing position
Shown in structure such as Fig. 2 (c).
4th step is cut at second set and is cut to product progress pin hole set using flat cutter engraved die on machine 4, will processed on product
The strip hole gone out all partly switches to protective film, then carries out lower waste discharge material using protective film.By step processing post-processing portion
Shown in structure such as Fig. 2 (d) of position.
Finally, by material strip 1 pass through the second circular knife machine 6, can use second pair of circular knife machine to the processing on material strip 1 after
Product carry out some reconditions, reuse wrap-up 5 and rewinding carried out to the product that machines.
Above-described is only some embodiments of the utility model.For those of ordinary skill in the art,
Without departing from the concept of the present invention, various modifications and improvements can be made, these belong to this practicality
Novel protection domain.
Claims (8)
1. without base material double faced adhesive tape dense punching system of processing, it is characterised in that：Including a material strip being made of release film (1),
The material strip (1) pass through successively first circular knife machine (2), a first set cut machine (3), one second set cut machine (4) and one
A wrap-up (5), wherein the first set cuts machine (3) and is equipped with QDC hardware dies, and described second set is cut and set on machine (4)
There is flat cutter engraved die.
2. no base material double faced adhesive tape dense punching system of processing according to claim 1, it is characterised in that：Described second set is cut
Second circular knife machine (6) is equipped between machine (4) and the wrap-up (5).
3. no base material double faced adhesive tape dense punching system of processing according to claim 1, it is characterised in that：First dise knife
Machine (2) is equipped with multiple cutting dies.
4. no base material double faced adhesive tape dense punching system of processing according to claim 3, it is characterised in that：It is wrapped in the cutting die
Height knife is included.
5. no base material double faced adhesive tape dense punching system of processing according to claim 1, it is characterised in that：First dise knife
Machine (2) is equipped with more set composites (21) and more shafts (22).
6. no base material double faced adhesive tape dense punching system of processing according to claim 5, it is characterised in that：Described in which part
Silicone band is respectively equipped in shaft (22), without base material double faced adhesive tape, release paper, acrylic adhesive tape or protective film.
7. no base material double faced adhesive tape dense punching system of processing according to claim 6, it is characterised in that：The silicone band,
The no base material double faced adhesive tape, the release paper and the acrylic adhesive tape be compounded in the material strip (1) with layer upper surface
Side, and the protective film is compounded in the side that facing away from layer upper surface of the material strip (1).
8. no base material double faced adhesive tape dense punching system of processing according to claim 6, it is characterised in that：The protective film tool
Have two layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820289370.5U CN207915618U (en) | 2018-03-01 | 2018-03-01 | Without base material double faced adhesive tape dense punching system of processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820289370.5U CN207915618U (en) | 2018-03-01 | 2018-03-01 | Without base material double faced adhesive tape dense punching system of processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207915618U true CN207915618U (en) | 2018-09-28 |
Family
ID=63601163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820289370.5U Active CN207915618U (en) | 2018-03-01 | 2018-03-01 | Without base material double faced adhesive tape dense punching system of processing |
Country Status (1)
| Country | Link |
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| CN (1) | CN207915618U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111070318A (en) * | 2019-12-31 | 2020-04-28 | 东莞领益精密制造科技有限公司 | Method for cutting ultra-small-size double faced adhesive tape |
| CN111113497A (en) * | 2019-12-30 | 2020-05-08 | 东莞领益精密制造科技有限公司 | Cutting method of double-sided adhesive tape without base material |
| CN111349403A (en) * | 2020-03-27 | 2020-06-30 | 深圳市伟业鑫精密科技有限公司 | Composite sheet for electronic device and method of manufacturing the same |
-
2018
- 2018-03-01 CN CN201820289370.5U patent/CN207915618U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113497A (en) * | 2019-12-30 | 2020-05-08 | 东莞领益精密制造科技有限公司 | Cutting method of double-sided adhesive tape without base material |
| CN111070318A (en) * | 2019-12-31 | 2020-04-28 | 东莞领益精密制造科技有限公司 | Method for cutting ultra-small-size double faced adhesive tape |
| CN111070318B (en) * | 2019-12-31 | 2021-09-28 | 东莞领益精密制造科技有限公司 | Method for cutting ultra-small-size double faced adhesive tape |
| CN111349403A (en) * | 2020-03-27 | 2020-06-30 | 深圳市伟业鑫精密科技有限公司 | Composite sheet for electronic device and method of manufacturing the same |
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