CN104441045B - A kind of cutting process of adhesive tape - Google Patents
A kind of cutting process of adhesive tape Download PDFInfo
- Publication number
- CN104441045B CN104441045B CN201410482180.1A CN201410482180A CN104441045B CN 104441045 B CN104441045 B CN 104441045B CN 201410482180 A CN201410482180 A CN 201410482180A CN 104441045 B CN104441045 B CN 104441045B
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- release layer
- cut
- die
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
- B26F1/3813—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
Abstract
<b>the invention discloses</b><b>a kind of cutting process of adhesive tape, material layer that adhesive tape includes fitting successively, glue-line, the first release layer, cutting process is evenly spaced after material layer and glue-line being cut is pasted onto the second release layer, in production process, the adhesive tape of uniform motion and the second release layer of uniform motion are crossed by machine at the die-cut adhesive tape place of cutting knife, and cutting knife will thrust material layer and glue-line and be pasted onto along die-cut direction on the second release layer and form product adhesive tape. Present invention process is by using the material layer thrusting adhesive tape of cutting knife discontinuity and glue-line and evenly spaced being pasted onto on another release layer by it, save the expense of mould of operating on, avoid the waste material produced when using cutting die die-cut, improve work efficiency, save the production cost of enterprise.</b>
Description
Technical field
The present invention relates to the cutting process of a kind of adhesive tape.
Background technology
Production and processing in the market is various during the adhesive tape of discontinuity distribution, to be generally adopted cross cutting proof press and cuts or operate on the technique of mould cross cutting on release layer. What cross cutting proof press was mainly used in that drawing a design before solving high-volume cross cutting determine version and exempt from cutting die small lot cuts demand. For the adhesive tape to produce in enormous quantities, generally adopt the method for mould cross cutting of operating on. Adopting cutting die cross cutting obviously to improve production efficiency, but every money product will offer different moulds, die cost is higher; And more leftover pieces during cutting die cross cutting, can be produced, leftover pieces can only scrap process, causes bigger waste of material, adds the production cost of enterprise.
Summary of the invention
It is an object of the invention to provide a kind of without using cutting die, substantially do not produce the cutting process of the adhesive tape of waste material.
For reaching above-mentioned purpose, the technical solution used in the present invention is:
A kind of cutting process of adhesive tape, material layer that described adhesive tape includes fitting successively, glue-line, the first release layer, described cutting process is evenly spaced second release layer that is pasted onto after described material layer and described glue-line being cut, and described cutting process comprises the following steps:
(1) get the raw materials ready: described adhesive tape, described second release layer needed for preparatory technology are some;
(2) cut: make described adhesive tape extend along a length thereof direction uniform motion, with the die-cut described adhesive tape of cutting knife discontinuity, described cutting knife thrusts described material layer and described glue-line simultaneously and does not thrust described first release layer, will be located in described first release layer at the die-cut place of described cutting knife simultaneously and peels off from described adhesive tape;
(3) paste: make described second release layer extend along a length thereof direction uniform motion, described second release layer in motor process near described adhesive tape by the die-cut position of described cutting knife, the described material layer being thrust and described glue-line are pushed against and are pasted onto along die-cut direction on described second release layer while die-cut described adhesive tape by described cutting knife.
Preferably, described adhesive tape is the one that wheat draws in adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape.
Preferably, described cutting knife is by driven by servomotor.
Utilization due to technique scheme, the present invention compared with prior art has the advantage that the cutting process of a kind of adhesive tape of the present invention, by using the material layer thrusting adhesive tape of cutting knife discontinuity and glue-line and it evenly spaced being pasted onto on another release layer, save the expense of mould of operating on, avoid the waste material produced when using cutting die die-cut, improve work efficiency, save the production cost of enterprise.
Accompanying drawing explanation
Accompanying drawing 1 is the production process schematic diagram of present invention process.
Wherein: 1, adhesive tape; 11, material layer; 12, glue-line; 13, the first release layer; 2, the second release layer; 3, cutting knife.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme is further elaborated.
Shown in Figure 1, the cutting process of above-mentioned a kind of adhesive tape 1, this adhesive tape 1 includes material layer 11, glue-line the 12, first release layer 13 fitted successively, this cutting process is pasted onto on the second release layer 2 forms product adhesive tape for evenly spaced after material layer 11 and glue-line 12 being cut, and cutting process comprises the following steps:
(1) get the raw materials ready: adhesive tape the 1, second release layer 2 needed for preparatory technology is some, this adhesive tape 1 be wheat draw adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape, electricity conductive cloth tape office the back of the body conducting foam in any one;
(2) cut: adhesive tape 1 is placed on machine so as to extend along a length thereof direction uniform motion, by this adhesive tape 1 die-cut of driven by servomotor cutting knife 3 discontinuity on machine, the die-cut direction of cutting knife 3 is perpendicular to the direction of motion of adhesive tape 1, by this setting, cutting knife 3 thrusts material layer 11 and glue-line 12 simultaneously and does not thrust the first release layer 13, while material layer 11 that first release layer 13 relevant position is pasted and glue-line 12 are thrust, first release layer 13 at this place is peeled off by machine;
(3) paste: the second release layer 2 is placed on machine so as to extend along a length thereof direction uniform motion, this second release layer 2 position that a certain section of close adhesive tape 1 cropped cutter 3 is die-cut in motor process, the material layer 11 being thrust and glue-line 12 are pushed against and are pasted onto on the second release layer 2 along die-cut direction by cutting knife 3 while die-cut adhesive tape 1, due to the second release layer 2 uniform motion, the material layer 11 being thrust and glue-line 12 are constantly pasted onto on the second release layer 2 by cutting knife 3, form product adhesive tape, obviously, multiple material layers 11 and glue-line 12 is evenly spaced is distributed on the second release layer 2.
In practical operation, it is necessary to the movement velocity regulating adhesive tape 1 and the second release layer 2 regulates on adhesive tape product spaced apart between material layer 11. When the length needing adjustment material layer 11 and the cropped cutter 3 of glue-line 12 to cut, it is only necessary to regulate servomotor.
Above-described embodiment is only for illustrating technology design and the feature of the present invention; its object is to allow person skilled in the art will appreciate that present disclosure and to be carried out; can not limit the scope of the invention with this; all equivalences made according to spirit of the invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (3)
1. the cutting process of an adhesive tape, material layer that described adhesive tape includes fitting successively, glue-line, the first release layer, it is characterized in that: described cutting process is evenly spaced second release layer that is pasted onto after described material layer and described glue-line being cut, and described cutting process comprises the following steps:
(1) get the raw materials ready: described adhesive tape, described second release layer needed for preparatory technology are some;
(2) cut: make described adhesive tape extend along a length thereof direction uniform motion, with the die-cut described adhesive tape of cutting knife discontinuity, described cutting knife thrusts described material layer and described glue-line simultaneously and does not thrust described first release layer, will be located in described first release layer at the die-cut place of described cutting knife simultaneously and peels off from described adhesive tape;
(3) paste: make described second release layer extend along a length thereof direction uniform motion, described second release layer in motor process near described adhesive tape by the die-cut position of described cutting knife, the described material layer being thrust and described glue-line are pushed against and are pasted onto along die-cut direction on described second release layer while die-cut described adhesive tape by described cutting knife.
2. the cutting process of a kind of adhesive tape according to claim 1, it is characterised in that: described adhesive tape is the one that wheat draws in adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape.
3. the cutting process of a kind of adhesive tape according to claim 1, it is characterised in that: described cutting knife is by driven by servomotor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410482180.1A CN104441045B (en) | 2014-09-19 | 2014-09-19 | A kind of cutting process of adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410482180.1A CN104441045B (en) | 2014-09-19 | 2014-09-19 | A kind of cutting process of adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104441045A CN104441045A (en) | 2015-03-25 |
| CN104441045B true CN104441045B (en) | 2016-06-08 |
Family
ID=52888181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410482180.1A Active CN104441045B (en) | 2014-09-19 | 2014-09-19 | A kind of cutting process of adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104441045B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172318B (en) * | 2015-10-23 | 2017-06-20 | 苏州达翔新材料有限公司 | A kind of die-cutting process of adhesive article |
| CN108656703B (en) * | 2017-03-30 | 2023-08-11 | 昊佰电子科技（上海）有限公司 | Die cutting method and device for conductive cloth with ultrathin single-sided adhesive layer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5598866B2 (en) * | 2011-12-16 | 2014-10-01 | 古河電気工業株式会社 | Wafer processing tape, wafer processing tape manufacturing method and punching blade |
| JP6122311B2 (en) * | 2013-02-28 | 2017-04-26 | 日東電工株式会社 | Adhesive tape cutting method and adhesive tape piece cutting apparatus |
| CN103586938B (en) * | 2013-11-27 | 2015-08-19 | 南京冠佳科技有限公司 | There is the production method of gap adhesive tape |
| CN203622559U (en) * | 2013-11-27 | 2014-06-04 | 南京冠佳科技有限公司 | Production device with interval adhesive tape |
| CN103709950B (en) * | 2013-12-20 | 2015-05-27 | 意力(广州)电子科技有限公司 | Double-sided adhesive tape profile and production method thereof |
-
2014
- 2014-09-19 CN CN201410482180.1A patent/CN104441045B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104441045A (en) | 2015-03-25 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Longyang Electronics (Kunshan) Co.,Ltd. Address before: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: LONG YOUNG ELECTRONICS (KUNSHAN) Co.,Ltd. |