CN104441045A - Cutting technology for adhesive tape - Google Patents

Cutting technology for adhesive tape Download PDF

Info

Publication number
CN104441045A
CN104441045A CN201410482180.1A CN201410482180A CN104441045A CN 104441045 A CN104441045 A CN 104441045A CN 201410482180 A CN201410482180 A CN 201410482180A CN 104441045 A CN104441045 A CN 104441045A
Authority
CN
China
Prior art keywords
adhesive tape
release layer
layer
cutting
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410482180.1A
Other languages
Chinese (zh)
Other versions
CN104441045B (en
Inventor
张东琴
陈先锋
衡先梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Longyang Electronics (Kunshan) Co.,Ltd.
Original Assignee
LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd filed Critical LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd
Priority to CN201410482180.1A priority Critical patent/CN104441045B/en
Publication of CN104441045A publication Critical patent/CN104441045A/en
Application granted granted Critical
Publication of CN104441045B publication Critical patent/CN104441045B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • B26F1/3806Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
    • B26F1/3813Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27Means for performing other operations combined with cutting

Abstract

The invention discloses a cutting technology for adhesive tape. The adhesive tape comprises a material layer, an adhesive layer and a first release layer, wherein the material layer, the adhesive layer and the first release layer are sequentially laminated. The cutting technology is used for cutting the material layer and the adhesive layer and then evenly pasting the material layer and the adhesive layer on a second release layer in a spaced mode. In the production process, a machine enables the adhesive tape moving at uniform speed and the second release layer moving at uniform speed to be joined at the position, cutting the adhesive tape, of a cutter, and the cutter enables a cut material layer and the adhesive layer to be pasted on the second release layer in the punching and cutting direction to form the finished adhesive tape. According to the cutting technology for the adhesive tape, the material layer and the adhesive layer of the adhesive tape are discontinuously cut and evenly pasted on the other release layer in a spaced mode through the cutter, the cost for opening a cutter die is omitted, waste generated in the process of punching by the cutter die is avoided, working efficiency is improved, and the production cost of an enterprise is saved.

Description

A kind of cutting process of adhesive tape
Technical field
the present invention relates to a kind of cutting process of adhesive tape.
Background technology
during the adhesive tape of the various discontinuity distribution on release layer of production and processing in the market, the general technique adopting cross cutting proof press to cut or operate on mould cross cutting.Cross cutting proof press be mainly used in solving cross cutting in enormous quantities before draw a design determine version and exempt from cutting die small lot cut demand.For the adhesive tape that will produce in enormous quantities, usually adopt the method for mould cross cutting of operating on.Adopt cutting die cross cutting obviously to improve production efficiency, but every money product all will offer different moulds, die cost is higher; And more leftover pieces can be produced during cutting die cross cutting, leftover pieces can only scrap process, cause larger waste of material, add the production cost of enterprise.
Summary of the invention
the object of this invention is to provide a kind of without the need to using cutting die, substantially not producing the cutting process of the adhesive tape of waste material.
for achieving the above object, the technical solution used in the present invention is:
a kind of cutting process of adhesive tape, described adhesive tape comprises material layer, glue-line, first release layer of fitting successively, described cutting process is for being pasted onto the second release layer uniformly by interval after described material layer and the cutting of described glue-line, and described cutting process comprises the following steps:
(1) get the raw materials ready: the described adhesive tape needed for preparatory technology, described second release layer are some;
(2) cut: make described adhesive tape along its length bearing of trend uniform motion, with the die-cut described adhesive tape of cutting knife discontinuity, described cutting knife thrusts described material layer and described glue-line simultaneously and does not thrust described first release layer, is peeled off by described first release layer being positioned at the die-cut place of described cutting knife from described adhesive tape simultaneously;
(3) paste: make described second release layer along its length bearing of trend uniform motion, described second release layer in motion process near described adhesive tape by the die-cut position of described cutting knife, the described material layer be thrust and described glue-line push against along die-cut direction and are pasted onto on described second release layer by described cutting knife while die-cut described adhesive tape.
preferably, described adhesive tape is the one that wheat draws in adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape.
preferably, described cutting knife is by driven by servomotor.
due to the utilization of technique scheme, the present invention compared with prior art has following advantages: the cutting process of a kind of adhesive tape of the present invention, by using the material layer thrusting adhesive tape of cutting knife discontinuity and glue-line and its interval being pasted onto on another release layer uniformly, save the expense of mould of operating on, avoid the waste material produced when using cutting die die-cut, improve operating efficiency, save the production cost of enterprise.
Accompanying drawing explanation
accompanying drawing 1 is the production process schematic diagram of present invention process.
wherein: 1, adhesive tape; 11, material layer; 12, glue-line; 13, the first release layer; 2, the second release layer; 3, cutting knife.
Detailed description of the invention
below in conjunction with accompanying drawing, technical scheme of the present invention is further elaborated.
shown in Figure 1, the cutting process of above-mentioned a kind of adhesive tape 1, this adhesive tape 1 comprises material layer 11, glue-line 12, first release layer 13 of fitting successively, this cutting process is used for material layer 11 and glue-line 12 to cut rear interval and is pasted onto uniformly on the second release layer 2 and forms product adhesive tape, and cutting process comprises the following steps:
(1) get the raw materials ready: adhesive tape 1, second release layer 2 needed for preparatory technology is some, this adhesive tape 1 be wheat draw adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape, electricity conductive cloth tape office the back of the body conducting foam in any one;
(2) cut: adhesive tape 1 is placed on machine and makes it along its length bearing of trend uniform motion, by this adhesive tape 1 die-cut of driven by servomotor cutting knife 3 discontinuity on machine, the die-cut direction of cutting knife 3 is perpendicular to the direction of motion of adhesive tape 1, by this setting, cutting knife 3 thrusts material layer 11 and glue-line 12 simultaneously and does not thrust the first release layer 13, while the material layer 11 that first release layer 13 relevant position is pasted and glue-line 12 are thrust, first release layer 13 at this place is peeled off by machine;
(3) paste: the second release layer 2 is placed on machine and makes it along its length bearing of trend uniform motion, this second release layer 2 position that a certain section of close cropped cutter of adhesive tape 13 is die-cut in motion process, the material layer 11 be thrust and glue-line 12 push against along die-cut direction and are pasted onto on the second release layer 2 by cutting knife 3 while die-cut adhesive tape 1, due to the second release layer 2 uniform motion, the material layer 11 be thrust and glue-line 12 are constantly pasted onto on the second release layer 2 by cutting knife 3, form product adhesive tape, obviously, multiple material layer 11 and glue-line 12 interval are evenly distributed on the second release layer 2.
in practical operation, need to regulate the movement velocity of adhesive tape 1 and the second release layer 2 to regulate the distance at interval between material layer 11 on adhesive tape product.When needing the length regulating material layer 11 and the cropped cutter 3 of glue-line 12 to cut, only need to regulate servomotor.
above-described embodiment is only for illustrating technical conceive of the present invention and feature; its object is to person skilled in the art can be understood content of the present invention and be implemented; can not limit the scope of the invention with this; all equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed in protection scope of the present invention.

Claims (3)

1. the cutting process of an adhesive tape, described adhesive tape comprises material layer, glue-line, first release layer of fitting successively, it is characterized in that: described cutting process is for being pasted onto the second release layer uniformly by interval after described material layer and the cutting of described glue-line, and described cutting process comprises the following steps:
(1) get the raw materials ready: the described adhesive tape needed for preparatory technology, described second release layer are some;
(2) cut: make described adhesive tape along its length bearing of trend uniform motion, with the die-cut described adhesive tape of cutting knife discontinuity, described cutting knife thrusts described material layer and described glue-line simultaneously and does not thrust described first release layer, is peeled off by described first release layer being positioned at the die-cut place of described cutting knife from described adhesive tape simultaneously;
(3) paste: make described second release layer along its length bearing of trend uniform motion, described second release layer in motion process near described adhesive tape by the die-cut position of described cutting knife, the described material layer be thrust and described glue-line push against along die-cut direction and are pasted onto on described second release layer by described cutting knife while die-cut described adhesive tape.
2. the cutting process of a kind of adhesive tape according to claim 1, is characterized in that: described adhesive tape is the one that wheat draws in adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape.
3. the cutting process of a kind of adhesive tape according to claim 1, is characterized in that: described cutting knife is by driven by servomotor.
CN201410482180.1A 2014-09-19 2014-09-19 A kind of cutting process of adhesive tape Active CN104441045B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410482180.1A CN104441045B (en) 2014-09-19 2014-09-19 A kind of cutting process of adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410482180.1A CN104441045B (en) 2014-09-19 2014-09-19 A kind of cutting process of adhesive tape

Publications (2)

Publication Number Publication Date
CN104441045A true CN104441045A (en) 2015-03-25
CN104441045B CN104441045B (en) 2016-06-08

Family

ID=52888181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410482180.1A Active CN104441045B (en) 2014-09-19 2014-09-19 A kind of cutting process of adhesive tape

Country Status (1)

Country Link
CN (1) CN104441045B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105172318A (en) * 2015-10-23 2015-12-23 苏州达翔新材料有限公司 Die cutting process for adhesive products
CN108656703A (en) * 2017-03-30 2018-10-16 昊佰电子科技(上海)有限公司 A kind of die cutting method and device of the conductive fabric with ultra-thin single side glue-line

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013125925A (en) * 2011-12-16 2013-06-24 Furukawa Electric Co Ltd:The Wafer processing tape, wafer processing tape manufacturing method and punching rotation blade
CN103586938A (en) * 2013-11-27 2014-02-19 南京冠佳科技有限公司 Method for producing gapped adhesive tape
CN103709950A (en) * 2013-12-20 2014-04-09 意力(广州)电子科技有限公司 Double-sided adhesive tape profile and production method thereof
CN203622559U (en) * 2013-11-27 2014-06-04 南京冠佳科技有限公司 Production device with interval adhesive tape
CN104022012A (en) * 2013-02-28 2014-09-03 日东电工株式会社 Adhesive tape cutting method and adhesive tape cutting apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013125925A (en) * 2011-12-16 2013-06-24 Furukawa Electric Co Ltd:The Wafer processing tape, wafer processing tape manufacturing method and punching rotation blade
CN104022012A (en) * 2013-02-28 2014-09-03 日东电工株式会社 Adhesive tape cutting method and adhesive tape cutting apparatus
CN103586938A (en) * 2013-11-27 2014-02-19 南京冠佳科技有限公司 Method for producing gapped adhesive tape
CN203622559U (en) * 2013-11-27 2014-06-04 南京冠佳科技有限公司 Production device with interval adhesive tape
CN103709950A (en) * 2013-12-20 2014-04-09 意力(广州)电子科技有限公司 Double-sided adhesive tape profile and production method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105172318A (en) * 2015-10-23 2015-12-23 苏州达翔新材料有限公司 Die cutting process for adhesive products
CN105172318B (en) * 2015-10-23 2017-06-20 苏州达翔新材料有限公司 A kind of die-cutting process of adhesive article
CN108656703A (en) * 2017-03-30 2018-10-16 昊佰电子科技(上海)有限公司 A kind of die cutting method and device of the conductive fabric with ultra-thin single side glue-line
CN108656703B (en) * 2017-03-30 2023-08-11 昊佰电子科技(上海)有限公司 Die cutting method and device for conductive cloth with ultrathin single-sided adhesive layer

Also Published As

Publication number Publication date
CN104441045B (en) 2016-06-08

Similar Documents

Publication Publication Date Title
CN105881647B (en) A kind of production method of the foam cutting part with interior handle
CN103921522B (en) A kind of layout back of the body conducting foam production technology of automatically locating of conducting electricity
CN203611305U (en) Continuous punching system
CN104858934A (en) Die cutting technology achieving asynchronous feeding and seamless splicing purposes
CN111331678A (en) Die cutting forming process of double-sided adhesive tape without base material
CN104960033A (en) Continuous asynchronous transfer-paste film cutting technology
CN202318454U (en) Continuous punching device
CN104441045B (en) A kind of cutting process of adhesive tape
CN203973685U (en) A kind of metallic plate setting overlay film processing unit (plant)
CN207387820U (en) Hard material bicker automatic charging device
CN112847650A (en) Combined type die cutting process and die cutting system for volume paper
CN204736268U (en) Split cross cutting precision equipment that asynchronous pay -off is seamless
CN204322188U (en) A kind of bond paper facing cutting knife modular structure
CN203031671U (en) Waste discharge device of cavity of circular cutter
CN209352335U (en) A kind of zero clearance die-cutting apparatus
CN204183642U (en) A kind of material collecting device produced for die-cutting machine dise knife
CN206501179U (en) It is a kind of to be die cut the tool that slitting is molded simultaneously
CN104742470A (en) Structure of two-sided and four-sided arc protective film and preparing process of arc protective film
CN110561550B (en) Novel material die cutting process for heat dissipation paste
CN203734923U (en) Back glue sticking device of flexible circuit board
CN112590250A (en) Method for manufacturing low-curvature parts in batches by adopting automatic tape laying technology
CN203752244U (en) Straight knife die cutting system for processing paper substrate die cutting piece
CN103507141B (en) A kind of combined machining method of graphite
CN207290308U (en) Jump cutting machine
CN202587608U (en) Laminator

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Longyang Electronics (Kunshan) Co.,Ltd.

Address before: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: LONG YOUNG ELECTRONICS (KUNSHAN) Co.,Ltd.