CN104441045A - Cutting technology for adhesive tape - Google Patents
Cutting technology for adhesive tape Download PDFInfo
- Publication number
- CN104441045A CN104441045A CN201410482180.1A CN201410482180A CN104441045A CN 104441045 A CN104441045 A CN 104441045A CN 201410482180 A CN201410482180 A CN 201410482180A CN 104441045 A CN104441045 A CN 104441045A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- release layer
- layer
- cutting
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
- B26F1/3813—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a cutting technology for adhesive tape. The adhesive tape comprises a material layer, an adhesive layer and a first release layer, wherein the material layer, the adhesive layer and the first release layer are sequentially laminated. The cutting technology is used for cutting the material layer and the adhesive layer and then evenly pasting the material layer and the adhesive layer on a second release layer in a spaced mode. In the production process, a machine enables the adhesive tape moving at uniform speed and the second release layer moving at uniform speed to be joined at the position, cutting the adhesive tape, of a cutter, and the cutter enables a cut material layer and the adhesive layer to be pasted on the second release layer in the punching and cutting direction to form the finished adhesive tape. According to the cutting technology for the adhesive tape, the material layer and the adhesive layer of the adhesive tape are discontinuously cut and evenly pasted on the other release layer in a spaced mode through the cutter, the cost for opening a cutter die is omitted, waste generated in the process of punching by the cutter die is avoided, working efficiency is improved, and the production cost of an enterprise is saved.
Description
Technical field
the present invention relates to a kind of cutting process of adhesive tape.
Background technology
during the adhesive tape of the various discontinuity distribution on release layer of production and processing in the market, the general technique adopting cross cutting proof press to cut or operate on mould cross cutting.Cross cutting proof press be mainly used in solving cross cutting in enormous quantities before draw a design determine version and exempt from cutting die small lot cut demand.For the adhesive tape that will produce in enormous quantities, usually adopt the method for mould cross cutting of operating on.Adopt cutting die cross cutting obviously to improve production efficiency, but every money product all will offer different moulds, die cost is higher; And more leftover pieces can be produced during cutting die cross cutting, leftover pieces can only scrap process, cause larger waste of material, add the production cost of enterprise.
Summary of the invention
the object of this invention is to provide a kind of without the need to using cutting die, substantially not producing the cutting process of the adhesive tape of waste material.
for achieving the above object, the technical solution used in the present invention is:
a kind of cutting process of adhesive tape, described adhesive tape comprises material layer, glue-line, first release layer of fitting successively, described cutting process is for being pasted onto the second release layer uniformly by interval after described material layer and the cutting of described glue-line, and described cutting process comprises the following steps:
(1) get the raw materials ready: the described adhesive tape needed for preparatory technology, described second release layer are some;
(2) cut: make described adhesive tape along its length bearing of trend uniform motion, with the die-cut described adhesive tape of cutting knife discontinuity, described cutting knife thrusts described material layer and described glue-line simultaneously and does not thrust described first release layer, is peeled off by described first release layer being positioned at the die-cut place of described cutting knife from described adhesive tape simultaneously;
(3) paste: make described second release layer along its length bearing of trend uniform motion, described second release layer in motion process near described adhesive tape by the die-cut position of described cutting knife, the described material layer be thrust and described glue-line push against along die-cut direction and are pasted onto on described second release layer by described cutting knife while die-cut described adhesive tape.
preferably, described adhesive tape is the one that wheat draws in adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape.
preferably, described cutting knife is by driven by servomotor.
due to the utilization of technique scheme, the present invention compared with prior art has following advantages: the cutting process of a kind of adhesive tape of the present invention, by using the material layer thrusting adhesive tape of cutting knife discontinuity and glue-line and its interval being pasted onto on another release layer uniformly, save the expense of mould of operating on, avoid the waste material produced when using cutting die die-cut, improve operating efficiency, save the production cost of enterprise.
Accompanying drawing explanation
accompanying drawing 1 is the production process schematic diagram of present invention process.
wherein: 1, adhesive tape; 11, material layer; 12, glue-line; 13, the first release layer; 2, the second release layer; 3, cutting knife.
Detailed description of the invention
below in conjunction with accompanying drawing, technical scheme of the present invention is further elaborated.
shown in Figure 1, the cutting process of above-mentioned a kind of adhesive tape 1, this adhesive tape 1 comprises material layer 11, glue-line 12, first release layer 13 of fitting successively, this cutting process is used for material layer 11 and glue-line 12 to cut rear interval and is pasted onto uniformly on the second release layer 2 and forms product adhesive tape, and cutting process comprises the following steps:
(1) get the raw materials ready: adhesive tape 1, second release layer 2 needed for preparatory technology is some, this adhesive tape 1 be wheat draw adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape, electricity conductive cloth tape office the back of the body conducting foam in any one;
(2) cut: adhesive tape 1 is placed on machine and makes it along its length bearing of trend uniform motion, by this adhesive tape 1 die-cut of driven by servomotor cutting knife 3 discontinuity on machine, the die-cut direction of cutting knife 3 is perpendicular to the direction of motion of adhesive tape 1, by this setting, cutting knife 3 thrusts material layer 11 and glue-line 12 simultaneously and does not thrust the first release layer 13, while the material layer 11 that first release layer 13 relevant position is pasted and glue-line 12 are thrust, first release layer 13 at this place is peeled off by machine;
(3) paste: the second release layer 2 is placed on machine and makes it along its length bearing of trend uniform motion, this second release layer 2 position that a certain section of close cropped cutter of adhesive tape 13 is die-cut in motion process, the material layer 11 be thrust and glue-line 12 push against along die-cut direction and are pasted onto on the second release layer 2 by cutting knife 3 while die-cut adhesive tape 1, due to the second release layer 2 uniform motion, the material layer 11 be thrust and glue-line 12 are constantly pasted onto on the second release layer 2 by cutting knife 3, form product adhesive tape, obviously, multiple material layer 11 and glue-line 12 interval are evenly distributed on the second release layer 2.
in practical operation, need to regulate the movement velocity of adhesive tape 1 and the second release layer 2 to regulate the distance at interval between material layer 11 on adhesive tape product.When needing the length regulating material layer 11 and the cropped cutter 3 of glue-line 12 to cut, only need to regulate servomotor.
above-described embodiment is only for illustrating technical conceive of the present invention and feature; its object is to person skilled in the art can be understood content of the present invention and be implemented; can not limit the scope of the invention with this; all equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (3)
1. the cutting process of an adhesive tape, described adhesive tape comprises material layer, glue-line, first release layer of fitting successively, it is characterized in that: described cutting process is for being pasted onto the second release layer uniformly by interval after described material layer and the cutting of described glue-line, and described cutting process comprises the following steps:
(1) get the raw materials ready: the described adhesive tape needed for preparatory technology, described second release layer are some;
(2) cut: make described adhesive tape along its length bearing of trend uniform motion, with the die-cut described adhesive tape of cutting knife discontinuity, described cutting knife thrusts described material layer and described glue-line simultaneously and does not thrust described first release layer, is peeled off by described first release layer being positioned at the die-cut place of described cutting knife from described adhesive tape simultaneously;
(3) paste: make described second release layer along its length bearing of trend uniform motion, described second release layer in motion process near described adhesive tape by the die-cut position of described cutting knife, the described material layer be thrust and described glue-line push against along die-cut direction and are pasted onto on described second release layer by described cutting knife while die-cut described adhesive tape.
2. the cutting process of a kind of adhesive tape according to claim 1, is characterized in that: described adhesive tape is the one that wheat draws in adhesive tape, cotton paper adhesive tape, electricity conductive cloth tape, foam tape, copper aluminum foil and adhesive tape.
3. the cutting process of a kind of adhesive tape according to claim 1, is characterized in that: described cutting knife is by driven by servomotor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410482180.1A CN104441045B (en) | 2014-09-19 | 2014-09-19 | A kind of cutting process of adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410482180.1A CN104441045B (en) | 2014-09-19 | 2014-09-19 | A kind of cutting process of adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104441045A true CN104441045A (en) | 2015-03-25 |
| CN104441045B CN104441045B (en) | 2016-06-08 |
Family
ID=52888181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410482180.1A Active CN104441045B (en) | 2014-09-19 | 2014-09-19 | A kind of cutting process of adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104441045B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172318A (en) * | 2015-10-23 | 2015-12-23 | 苏州达翔新材料有限公司 | Die cutting process for adhesive products |
| CN108656703A (en) * | 2017-03-30 | 2018-10-16 | 昊佰电子科技（上海）有限公司 | A kind of die cutting method and device of the conductive fabric with ultra-thin single side glue-line |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013125925A (en) * | 2011-12-16 | 2013-06-24 | Furukawa Electric Co Ltd:The | Wafer processing tape, wafer processing tape manufacturing method and punching rotation blade |
| CN103586938A (en) * | 2013-11-27 | 2014-02-19 | 南京冠佳科技有限公司 | Method for producing gapped adhesive tape |
| CN103709950A (en) * | 2013-12-20 | 2014-04-09 | 意力(广州)电子科技有限公司 | Double-sided adhesive tape profile and production method thereof |
| CN203622559U (en) * | 2013-11-27 | 2014-06-04 | 南京冠佳科技有限公司 | Production device with interval adhesive tape |
| CN104022012A (en) * | 2013-02-28 | 2014-09-03 | 日东电工株式会社 | Adhesive tape cutting method and adhesive tape cutting apparatus |
-
2014
- 2014-09-19 CN CN201410482180.1A patent/CN104441045B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013125925A (en) * | 2011-12-16 | 2013-06-24 | Furukawa Electric Co Ltd:The | Wafer processing tape, wafer processing tape manufacturing method and punching rotation blade |
| CN104022012A (en) * | 2013-02-28 | 2014-09-03 | 日东电工株式会社 | Adhesive tape cutting method and adhesive tape cutting apparatus |
| CN103586938A (en) * | 2013-11-27 | 2014-02-19 | 南京冠佳科技有限公司 | Method for producing gapped adhesive tape |
| CN203622559U (en) * | 2013-11-27 | 2014-06-04 | 南京冠佳科技有限公司 | Production device with interval adhesive tape |
| CN103709950A (en) * | 2013-12-20 | 2014-04-09 | 意力(广州)电子科技有限公司 | Double-sided adhesive tape profile and production method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172318A (en) * | 2015-10-23 | 2015-12-23 | 苏州达翔新材料有限公司 | Die cutting process for adhesive products |
| CN105172318B (en) * | 2015-10-23 | 2017-06-20 | 苏州达翔新材料有限公司 | A kind of die-cutting process of adhesive article |
| CN108656703A (en) * | 2017-03-30 | 2018-10-16 | 昊佰电子科技（上海）有限公司 | A kind of die cutting method and device of the conductive fabric with ultra-thin single side glue-line |
| CN108656703B (en) * | 2017-03-30 | 2023-08-11 | 昊佰电子科技（上海）有限公司 | Die cutting method and device for conductive cloth with ultrathin single-sided adhesive layer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104441045B (en) | 2016-06-08 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Longyang Electronics (Kunshan) Co.,Ltd. Address before: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: LONG YOUNG ELECTRONICS (KUNSHAN) Co.,Ltd. |