CN203734923U - Back glue sticking device of flexible circuit board - Google Patents
Back glue sticking device of flexible circuit board Download PDFInfo
- Publication number
- CN203734923U CN203734923U CN201420014411.1U CN201420014411U CN203734923U CN 203734923 U CN203734923 U CN 203734923U CN 201420014411 U CN201420014411 U CN 201420014411U CN 203734923 U CN203734923 U CN 203734923U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- gum
- paper
- back glue
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003292 glue Substances 0.000 title abstract description 11
- 238000010030 laminating Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004080 punching Methods 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a back glue sticking device of a flexible circuit board, and belongs to the field of circuit board processing. The device comprises a piece of low adhesion paper and a circuit board to-be-stuck with back glue. The circuit board comprises a board inner portion on the center part and a board edge portion on the periphery, and the board edge portion would be removed after forming. The board edge portion of the circuit board is provided with PIN nails. An adhesion surface of the low adhesion paper is provided with a plurality of pieces of back glue which are formed by one-step punching through a mould. A no-glue surface of the back glue faces the low adhesion paper. The positions of the back glue on the low adhesion paper are corresponding to the positions of the to-be-stuck back glue on the circuit board. The position on the low adhesion paper without the back glue is provided with a plurality of PIN holes corresponding to the positions of the PIN nails on the circuit board. The device can efficiently and reliably adhere the back glue to the flexible circuit board, so that production efficiency and economic benefit are improved.
Description
Technical field
The utility model belongs to wiring board manufacture field, is specially a kind of gum laminating apparatus of flexible circuit board.
Background technology
When the operation of processing station laminating gum, traditional approach is for first cutting into gum single PCS shape, and then personnel aim at one by one its outer shaped position and are labelled to each PCS above, then pass through hot pressing, make its location.But for typesetting comparatively dense, need many PCS to paste, if still pasted one by one, need undoubtedly to expend the longer time, so slow, the consuming time work consuming of output, cause operating efficiency extremely low.
Utility model content
The purpose of this utility model is to provide a kind of gum coating technique that can effectively improve the flexible circuit board of operation production capacity and operating efficiency.
The technical scheme that realizes above-mentioned purpose is: the gum laminating apparatus of flexible circuit board, it is characterized in that: comprise the low wiring board that sticks together paper and gum to be pasted, wiring board comprises that the intralamellar part that is positioned at middle part divides and is positioned at the edges of boards part that can remove after the moulding of periphery, edges of boards on described wiring board are partly provided with PIN nail, the described low face that sticks together that sticks together paper is provided with the multi-disc gum forming by stamp of mould, gum glue-free facing to the low paper that sticks together, low position of sticking together the gum on paper is corresponding with the position of gum to be pasted on wiring board, the described low position that gum is not set on paper of sticking together is provided with a plurality of PINs hole corresponding with the position of PIN nail on wiring board.
Described low at least 3, the PIN hole on paper of sticking together, is triangularly arranged.
During use, on heat dish, directly the low paper that sticks together with gum is fitted with cover PIN mode and corresponding line plate, temperature of heat plate is greatly between 50～60 ℃, gum just thoroughly removes the low paper that sticks together after having fitted, at this moment only remaining gum sticks on plank, notes avoiding single PCS gum is together removed while removing; For gum is sticked on plank more securely, must be through hot pressing, at a certain temperature, the thermmohardening glue of gum film starts fusing is closely bonded on goods gum film, makes gum location.Now just completed and utilized the low paper laminating of the processing on the plank operation by the direct transcription of gum of sticking together.
The utility model can be realized efficiently, reliably gum be fitted in flexible circuit board, has improved production efficiency and economic benefit.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of wiring board.
Embodiment
As Fig. 1, shown in 2, the utility model comprises the low wiring board 1 that sticks together paper 2 and gum to be pasted, wiring board 1 comprises that the intralamellar part that is positioned at middle part divides 6 and be positioned at the edges of boards part 7 that can remove after the moulding of periphery, edges of boards part 7 on described wiring board 1 is provided with PIN nail 3, the described low face that sticks together that sticks together paper 2 is provided with the multi-disc gum 4 forming by stamp of mould, gum 4 glue-free facing to the low paper that sticks together, low position of sticking together the gum 4 on paper 2 is corresponding with the position of gum to be pasted on wiring board 1, the described low position that gum is not set on paper 2 of sticking together is provided with the PIN hole 5 corresponding with the position of PIN nail 3 on wiring board.
Claims (2)
1. the gum laminating apparatus of flexible circuit board, it is characterized in that: comprise the low wiring board that sticks together paper and gum to be pasted, wiring board comprises that the intralamellar part that is positioned at middle part divides and is positioned at the edges of boards part that can remove after the moulding of periphery, edges of boards on described wiring board are partly provided with PIN nail, the described low face that sticks together that sticks together paper is provided with the multi-disc gum forming by stamp of mould, gum glue-free facing to the low paper that sticks together, low position of sticking together the gum on paper is corresponding with the position of gum to be pasted on wiring board, the described low position that gum is not set on paper of sticking together is provided with a plurality of PINs hole corresponding with the position of PIN nail on wiring board.
2. the gum laminating apparatus of flexible circuit board according to claim 1, is characterized in that: described low at least 3, the PIN hole on paper of sticking together, is triangularly arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420014411.1U CN203734923U (en) | 2014-01-10 | 2014-01-10 | Back glue sticking device of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420014411.1U CN203734923U (en) | 2014-01-10 | 2014-01-10 | Back glue sticking device of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203734923U true CN203734923U (en) | 2014-07-23 |
Family
ID=51204959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420014411.1U Expired - Lifetime CN203734923U (en) | 2014-01-10 | 2014-01-10 | Back glue sticking device of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203734923U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249255A (en) * | 2017-06-09 | 2017-10-13 | 上达电子（深圳）股份有限公司 | It is die cut gummed paper applying method |
| WO2021128367A1 (en) * | 2019-12-28 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Flexible circuit board |
-
2014
- 2014-01-10 CN CN201420014411.1U patent/CN203734923U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249255A (en) * | 2017-06-09 | 2017-10-13 | 上达电子（深圳）股份有限公司 | It is die cut gummed paper applying method |
| WO2021128367A1 (en) * | 2019-12-28 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140723 |