CN104411123A - Quick press molding process for multilayer flexible plates - Google Patents
Quick press molding process for multilayer flexible plates Download PDFInfo
- Publication number
- CN104411123A CN104411123A CN201410702318.4A CN201410702318A CN104411123A CN 104411123 A CN104411123 A CN 104411123A CN 201410702318 A CN201410702318 A CN 201410702318A CN 104411123 A CN104411123 A CN 104411123A
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- CN
- China
- Prior art keywords
- plate
- glued membrane
- molded
- multilayer flexible
- flexible board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the field of manufacturing and processing technologies for printed circuit boards, and provides a quick press molding process for multilayer flexible plates. The quick press molding process includes steps of cutting processing, drilling machining, film adhering pre-processing, single-layer flexible plate quick press molding, multilayer flexible plate quick press molding and the like. Exhaust holes are formed in non-molded regions of flexible plates to form bubble passing discharging channels, so that bubbles among layers of the multilayer flexible plates can be effectively removed by means of step-by-step exhaust pre-press molding and quick press molding. The quick press molding process for the multilayer flexible plates has the advantages of good bubble removing effects, convenience and speediness in operation, low cost and wide universality.
Description
Technical field
The present invention relates to printed circuit board (PCB) processing technique field, particularly the fast molded technique of a kind of Multilayer Flexible Board.
Background technology
The making of Multilayer Flexible Board general is only cooked flow process and is: sawing sheet → circuit making → pure glued membrane, flex plate contraposition pressing → rear operation, wherein, bonding processes effectively must remove the bubble of flex plate interlayer, performance impact for Multilayer Flexible Board is particularly crucial, and pressing technology conventional at present comprises fast pressure and traditional vacuum pressure transmission.Traditional vacuum pressure transmission can provide and vacuumize environment, effectively can avoid the generation of bubble in bonding processes, but the HTHP of traditional vacuum pressure transmission easily causes flex plate harmomegathus to change greatly, and length consuming time, complex operation, general not in printed circuit board industry application, by contrast, the advantages such as simple to operate with it, the quick and environmental requirement of fast pressure is low have more industrial application prospect.
Fast baric flow journey is specially: pure glued membrane sawing sheet → brill location hole → pre-pure glued membrane → pre-contraposition → Multilayer Flexible Board of pure glued membrane precompressed → flex plate of pasting is pressed soon.Undertaken by existing fast compression technology, easily cause in the process of fast moulding film and flex plate contraposition pressing, in plate, gas cannot effectively be discharged, and forms bubble.The existence of bubble, not only affects product appearance greatly, and follow-up easy formation layering plate bursting causes scrapping; If catch up with bubble to do over again to flex plate, Multilayer Flexible Board, through multiple high temp pressing, easily causes the change of flex plate harmomegathus large and inconsistent, flex plate interlayer alignment precision is caused to decline, follow-up drilling hole is inclined, and causes scrappage virtual height accordingly, increases making the risk and cost of enterprise.
Summary of the invention
thisinvent the bubble existed for existing fast pressure technology cannot thoroughly remove, the problem of serious restriction Multilayer Flexible Board pressing quality and scrappage virtual height, form the fast molded technique of a kind of Multilayer Flexible Board, have that bubble removal is effective, simple operation, the feature that with low cost and versatility is wide.
Content of the present invention is:
The fast molded technique of a kind of Multilayer Flexible Board, comprises the following steps:
The first step, sawing sheet process, carry out flex plate according to process, pure glued membrane cut;
Second step, Drilling operation, select the non-forming region in flex plate figure, and carry out catching up with pore locate according to being interposed between in flex plate between certain, and catching up with the position location of pore to carry out Drilling operation, pore is caught up with in formation;
3rd step, the pre-treatment of rubberizing film, carry out circuit making the flex plate completing second step Drilling operation, AOI detect, brown makes, and completes pad pasting pre-treatment;
4th step, single layer flexible plate glued membrane are molded soon, what the 3rd step was completed the flex plate of pad pasting pre-treatment above sticks glued membrane respectively in advance, crossed by laminator and mould, cross that to mould the glued membrane that the rear rapid pressing glued membrane be attached in advance on flex plate completes single layer flexible plate molded soon, its concrete steps can three steps below atmosphere:
Step one, glued membrane paste in advance, prepare fixing backing plate, first flex plate is inserted on backing plate, tear glued membrane release liners, outwardly, glued membrane face is towards flex plate for diaphragm, non-dust cloth is used tentatively to catch up with gas after being inserted in glued membrane, after glued membrane face is fully contacted with flex plate face, re-use electric iron and its technique edges is suitably fixed, complete glued membrane and paste in advance;
Step 2, mistake mould precompressed: use special mistake to mould accessory plate and clamped up and down by the flex plate of pre-rubberizing film, opened molding machine, adjustment temperature is 100-150 DEG C, pressure reel speed 0.5-1.0m/min, pressure is certain, puts into machine and moulds, moulded until whole plate is crossed after first mistake being moulded plate one end compression;
Step 3, glued membrane are pressed soon, carrying out molded soon rapidly, obtaining final single layer flexible plate molded soon to completing the single layer flexible plate moulding precompressed under the state of heating pressurization.
5th step, Multilayer Flexible Board are molded soon, single layer flexible plate after 4th step glued membrane is molded soon carries out pre-contraposition according to certain level, mould plate holder and live in row high-temperature pressurizing by crossing and cross and mould, cross the single layer flexible plate moulding rear rapid compression different levels, the glued membrane completing Multilayer Flexible Board is molded soon.Its concrete steps can be divided into following three steps:
The pre-contraposition of step one, Multilayer Flexible Board, the diaphragm completing the single layer flexible plate surface of moulding precompressed is torn off, successively fixing backing plate is inserted in respectively according to level, use non-dust cloth to carry out secondary and catch up with gas, after glued membrane face is fully contacted, use electric iron suitably to fix its technique edges, complete pre-contraposition;
Step 2, Multilayer Flexible Board precompressed, use special mistake to mould plate and clamped by flex plate, opened molding machine, make its temperature reach 100-150 DEG C, cross and mould speed 0.5-1.0m/min, pressure is certain, put into machine after first being compressed one end to mould, moulded until whole plate is crossed;
Step 3, Multilayer Flexible Board are molded soon, carry out molded soon rapidly, obtain final Multilayer Flexible Board molded soon to the Multilayer Flexible Board completing precompressed under the state of heating pressurization.
Preferably, the quantity of pore of catching up with described in the 3rd step Drilling operation is arranged on the non-forming region of flex plate according to increase by one hole in 30mm × 30mm ~ 50mm × 50mm.Setting can not be overstocked, and crossing secret meeting increases difficulty of processing, also can increase the hidden danger of quality after Multilayer Flexible Board laminating; Can not be excessively thin, cross the effect of dredging and can have a strong impact on removal of bubbles.
The invention has the beneficial effects as follows:
The first, bubble removal is effective, catches up with stomatal limiting value air bubble discharging passages by increasing in the non-forming region of single layer flexible plate, by substep exhaust pre-molding and fast molded removal bubble, effectively reduces residual between Multilayer Flexible Board of bubble;
The second, easy to operate, each operation is normal process steps, and process operations is simple, the step effectively simplified the operation while ensureing bubble removal effect;
Three, with low cost, effectively reduce equipment and Environmental costs without the need to special operational environment and Special Equipment, easy to operate effective reduction cost of labor, use material effectively to save material cost for conventional material;
4th.Versatility is wide, for the number of plies needing the Multilayer Flexible Board of processing.Sizes etc. are restriction not, and the popularization being suitable for all Multilayer Flexible Board makes.
Accompanying drawing explanation
Accompanying drawing 1 is the process chart of the fast molded technique of a kind of Multilayer Flexible Board of the present invention.
Embodiment
In order to understand content of the present invention further, be specifically described with regard to summary of the invention and specific embodiment below:
As shown in Figure 1, the fast molded technique of a kind of Multilayer Flexible Board, comprises the following steps:
The first step, sawing sheet process, carry out flex plate according to process, pure glued membrane cut;
Second step, Drilling operation, select the non-forming region in flex plate figure, and carry out catching up with pore locate according to being interposed between in flex plate between certain, and catching up with the position location of pore to carry out Drilling operation, pore is caught up with in formation;
3rd step, pad pasting pre-treatment, carry out circuit making the flex plate completing second step Drilling operation, AOI detect, brown makes, and completes pad pasting pre-treatment;
4th step, single layer flexible plate glued membrane are molded soon, what the 3rd step was completed the flex plate of pad pasting pre-treatment above sticks glued membrane respectively in advance, crossed by laminator and mould, cross that to mould the glued membrane that the rear rapid pressing glued membrane be attached in advance on flex plate completes single layer flexible plate molded soon, its concrete steps can three steps below atmosphere:
Step one, glued membrane paste in advance, prepare fixing backing plate, first flex plate is inserted on backing plate, tear glued membrane release liners, outwardly, glued membrane face is towards flex plate for diaphragm, non-dust cloth is used tentatively to catch up with gas after being inserted in glued membrane, after glued membrane face is fully contacted with flex plate face, re-use electric iron and its technique edges is suitably fixed, complete glued membrane and paste in advance;
Step 2, mistake mould precompressed: use special mistake to mould accessory plate and clamped up and down by the flex plate of pre-rubberizing film, opened molding machine, adjustment temperature is 100-150 DEG C, pressure reel speed 0.5-1.0m/min, pressure is certain, puts into machine and moulds, moulded until whole plate is crossed after first mistake being moulded plate one end compression;
Step 3, glued membrane are pressed soon, carrying out molded soon rapidly, obtaining final single layer flexible plate molded soon to completing the single layer flexible plate moulding precompressed under the state of heating pressurization.
5th step, Multilayer Flexible Board are molded soon, single layer flexible plate after 4th step glued membrane is molded soon carries out pre-contraposition according to certain level, mould plate holder and live in row high-temperature pressurizing by crossing and cross and mould, cross the single layer flexible plate moulding rear rapid compression different levels, the glued membrane completing Multilayer Flexible Board is molded soon.Its concrete steps can be divided into following three steps:
The pre-contraposition of step one, Multilayer Flexible Board, the diaphragm completing the single layer flexible plate surface of moulding precompressed is torn off, successively fixing backing plate is inserted in respectively according to level, use non-dust cloth to carry out secondary and catch up with gas, after glued membrane face is fully contacted, use electric iron suitably to fix its technique edges, complete pre-contraposition;
Step 2, Multilayer Flexible Board precompressed, use special mistake to mould plate and clamped by flex plate, opened molding machine, make its temperature reach 100-150 DEG C, cross and mould speed 0.5-1.0m/min, pressure is certain, put into machine after first being compressed one end to mould, moulded until whole plate is crossed;
Step 3, Multilayer Flexible Board are molded soon, carry out molded soon rapidly, obtain final Multilayer Flexible Board molded soon to the Multilayer Flexible Board completing precompressed under the state of heating pressurization.
Preferably, the quantity of pore of catching up with described in the 3rd step Drilling operation is arranged on the non-forming region of flex plate according to increase by one hole in 30mm × 30mm ~ 50mm × 50mm.
The above, be only preferred embodiment of the present invention, not does any pro forma restriction to the present invention; The those of ordinary skill of all industry all can shown in by specification accompanying drawing and the above and implement the present invention swimmingly; But all those skilled in the art are not departing within the scope of technical solution of the present invention, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present invention; Meanwhile, all according to substantial technological of the present invention to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection range all still belonging to technical scheme of the present invention.
Claims (4)
1. the fast molded technique of Multilayer Flexible Board, is characterized in that comprising the following steps:
The first step, sawing sheet process, carry out flex plate according to process, pure glued membrane cut;
Second step, Drilling operation, select the non-forming region in flex plate figure, and carry out catching up with pore locate according to being interposed between in flex plate between certain, and catching up with the position location of pore to carry out Drilling operation, pore is caught up with in formation;
3rd step, the pre-treatment of rubberizing film, carry out circuit making the flex plate completing second step Drilling operation, AOI detect, brown makes, and completes pad pasting pre-treatment;
4th step, single layer flexible plate glued membrane are molded soon, what the 3rd step was completed the flex plate of pad pasting pre-treatment above sticks glued membrane respectively in advance, crossed by laminator and mould, cross that to mould the glued membrane that the rear rapid pressing glued membrane be attached in advance on flex plate completes single layer flexible plate molded soon;
5th step, Multilayer Flexible Board are molded soon, single layer flexible plate after 4th step glued membrane is molded soon carries out pre-contraposition according to certain level, mould plate holder and live in row high-temperature pressurizing by crossing and cross and mould, cross the single layer flexible plate moulding rear rapid compression different levels, the glued membrane completing Multilayer Flexible Board is molded soon.
2. the fast molded technique of Multilayer Flexible Board according to claim 1, is characterized in that: described single layer flexible plate is molded soon to be comprised the following steps:
Step one, glued membrane paste in advance, prepare fixing backing plate, first flex plate is inserted on backing plate, tear glued membrane release liners, outwardly, glued membrane face is towards flex plate for diaphragm, non-dust cloth is used tentatively to catch up with gas after being inserted in glued membrane, after glued membrane face is fully contacted with flex plate face, re-use electric iron and its technique edges is suitably fixed, complete glued membrane and paste in advance;
Step 2, mistake mould precompressed, use special mistake to mould accessory plate and are clamped up and down by the flex plate of pre-rubberizing film, opened molding machine, adjustment temperature is 100-150 DEG C, pressure reel speed 0.5-1.0m/min, and pressure is certain, put into machine after first mistake being moulded plate one end compression to mould, moulded until whole plate is crossed;
Step 3, glued membrane are pressed soon, carrying out molded soon rapidly, obtaining final single layer flexible plate molded soon to completing the single layer flexible plate moulding precompressed under the state of heating pressurization.
3. the fast molded technique of Multilayer Flexible Board according to claim 1, is characterized in that: described single layer flexible plate is molded soon to be comprised the following steps: described Multilayer Flexible Board is molded soon to be comprised the following steps:
The pre-contraposition of step one, Multilayer Flexible Board, the diaphragm completing the single layer flexible plate surface of moulding precompressed is torn off, successively fixing backing plate is inserted in respectively according to level, use non-dust cloth to carry out secondary and catch up with gas, after glued membrane face is fully contacted, use electric iron suitably to fix its technique edges, complete pre-contraposition;
Step 2, Multilayer Flexible Board precompressed, use special mistake to mould plate and clamped by flex plate, opened molding machine, make its temperature reach 100-150 DEG C, cross and mould speed 0.5-1.0m/min, pressure is certain, put into machine after first being compressed one end to mould, moulded until whole plate is crossed;
Step 3, Multilayer Flexible Board are molded soon, carry out molded soon rapidly, obtain final Multilayer Flexible Board molded soon to the Multilayer Flexible Board completing precompressed under the state of heating pressurization.
4. the fast molded technique of the Multilayer Flexible Board according to Claims 2 or 3, is characterized in that: the quantity of pore of catching up with described in the 3rd step Drilling operation is arranged on the non-forming region of flex plate according to increase by one hole in 30mm × 30mm ~ 50mm × 50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410702318.4A CN104411123B (en) | 2014-11-29 | 2014-11-29 | Quick press molding process for multilayer flexible plates |
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| CN201410702318.4A CN104411123B (en) | 2014-11-29 | 2014-11-29 | Quick press molding process for multilayer flexible plates |
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| CN104411123B CN104411123B (en) | 2017-05-03 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916314A (en) * | 2016-06-03 | 2016-08-31 | 深圳市景旺电子股份有限公司 | Multilayer soft plate manufacturing method capable of avoiding interlayer dislocation and multilayer soft plate |
| CN106851975A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN116782523A (en) * | 2023-08-21 | 2023-09-19 | 四川英创力电子科技股份有限公司 | Device and method for efficiently and precisely sticking adhesive tape on gold-plated layer of circuit board |
| CN118382215A (en) * | 2024-06-24 | 2024-07-23 | 南京克锐斯自动化科技有限公司 | Multilayer PP cuts drilling system |
| CN118382215B (en) * | 2024-06-24 | 2024-10-22 | 南京克锐斯自动化科技有限公司 | Multilayer PP cuts drilling system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105916314A (en) * | 2016-06-03 | 2016-08-31 | 深圳市景旺电子股份有限公司 | Multilayer soft plate manufacturing method capable of avoiding interlayer dislocation and multilayer soft plate |
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| CN106851975A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN116782523A (en) * | 2023-08-21 | 2023-09-19 | 四川英创力电子科技股份有限公司 | Device and method for efficiently and precisely sticking adhesive tape on gold-plated layer of circuit board |
| CN116782523B (en) * | 2023-08-21 | 2023-10-20 | 四川英创力电子科技股份有限公司 | Device and method for efficiently and precisely sticking adhesive tape on gold-plated layer of circuit board |
| CN118382215A (en) * | 2024-06-24 | 2024-07-23 | 南京克锐斯自动化科技有限公司 | Multilayer PP cuts drilling system |
| CN118382215B (en) * | 2024-06-24 | 2024-10-22 | 南京克锐斯自动化科技有限公司 | Multilayer PP cuts drilling system |
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