CN207282528U - LED diodes - Google Patents

Abstract

The utility model belongs to diode technologies field, more particularly to LED diodes, including the substrate with printed circuit, chip, the base plate bottom is equipped with heat sink, heat sink is equipped with groove, the chip is embedded in groove, corresponded on substrate and relief hole is equipped with chip, the size of relief hole is not less than chip, chip is connected by conducting wire with electrical property of substrate, substrate is externally provided with encapsulation, it is packaged in chip top and is equipped with chip chamber, chip intracavitary is equipped with fluorescence coating, fluorescence coating is not contacted with chip chamber, and fluorescence coating forms a closure cavity with chip chamber, inert gas is filled in cavity, fluorescence coating upper lid is equipped with diffuser, chip is avoided junction temperature concentration occur, make LED diodes that there is longer service life.

Description

LED diodes

Technical field

The utility model belongs to diode technologies field, and in particular to LED diodes.

Background technology

LED white light emitting diodes are to belong to Energy -- Saving Illuminating Source of new generation, are to belong to solid-state light emitters, because it has height Effect, the distinguishing feature of energy-saving and environmental protection, are applied to indoor and outdoor lighting, display backlight, bulkhead lamp, Tunnel Lamp, street lamp etc. by light is general Lighting area.LED diodes junction temperature of chip in normal work compares concentration, and higher, production is required to heat conduction and heat dissipation performance Product stability can reduce, and reduce the service life.Therefore, the cooling to chip and it is particularly important that, although existing LED diodes are set There is radiator structure, but radiator structure is not directly connected with chip chamber, heat dissipation path length, radiating efficiency is low.

Utility model content

Technical problem to be solved in the utility model is in view of the foregoing drawbacks, there is provided LED diodes, radiating efficiency is high, Avoid chip from junction temperature concentration occur, make LED diodes that there is longer service life.

The technical solution that the utility model solves the use of its technical problem is as follows：

LED diodes, including the substrate with printed circuit, chip, the base plate bottom are equipped with heat sink, heat sink Groove is equipped with, the chip is embedded in groove, is corresponded on substrate and relief hole is equipped with chip, and the size of relief hole is not small In chip, chip is connected by conducting wire with electrical property of substrate, and substrate is externally provided with encapsulation, is packaged in chip top and is equipped with chip chamber, core Piece intracavitary is equipped with fluorescence coating, and fluorescence coating is not contacted with chip chamber, and fluorescence coating forms a closure cavity with chip chamber, is filled out in cavity Filling with inert gas, fluorescence coating upper lid are equipped with diffuser, and equivalent to directly contacting between chip and heat sink, heat conduction path is small, The heat of chip, which is quickly directly conducted to heat sink, to be scattered and disappeared, and avoids occurring junction temperature concentration at chip, and heat dissipation is efficient, extends LED The service life of diode.

Further, the heat sink is copper coin, passes through heat conduction glue sticking between heat sink and substrate.

Further, the chip is bonded in groove by thermal plastic insulation.

Further, the depth of groove is not more than chip thickness.

Further, the chip chamber section is inverted trapezoidal.

Further, the diffuser is printing opacity sealing.

The beneficial effects of the utility model are：Using the above scheme, directly contacted between chip and heat sink, heat conduction path Small, the heat of chip, which is quickly directly conducted to heat sink, to be scattered and disappeared, and avoids occurring junction temperature concentration at chip, and heat dissipation is efficient, is extended The service life of LED diodes.

Brief description of the drawings

By detailed description below in conjunction with the accompanying drawings, the utility model is foregoing to incite somebody to action with other objects, features and advantages Become apparent.

Fig. 1 is the cross section structure schematic diagram of the utility model.

Fig. 2 is the cross section structure schematic diagram of the utility model embodiment 2.

Wherein：1 is substrate, and 11 be relief hole, and 2 be chip, and 3 be heat sink, and 31 be groove, and 4 be thermal plastic insulation, and 5 are Conducting wire, 6 be encapsulation, and 7 be fluorescence coating, and 8 be cavity, and 9 be printing opacity sealing.

Embodiment

The utility model is described further below in conjunction with the accompanying drawings.

Embodiment 1：With reference to Fig. 1, LED diodes, including the substrate 1 with printed circuit, chip 2, are printed with substrate 1 The circuit connected with chip 2,1 bottom of substrate are bonded with copper heat sink 3 by heat-conducting glue, and heat sink 3 is equipped with groove 31, core Piece 2 is embedded in groove 31, and the depth of groove 31 is done for the one of 2 thickness of chip, and chip 2 is bonded in recessed by thermal plastic insulation 4 In groove 31,4 one side of thermal plastic insulation avoids occurring short circuit between chip 2 and heat sink, on the other hand, the heat of chip is rapid By conduct to heat sink 3, equivalent to directly contacting between chip and heat sink, heat conduction path is small, and the heat of chip is quick Directly conduction is scattered and disappeared to heat sink, avoids occurring junction temperature concentration at chip, and heat dissipation is efficient, and extend LED diodes uses the longevity Order, be equipped with relief hole 11 on substrate at 1 correspondence chip 2, the structure size of relief hole 11 is more than the structure size of chip 2, chip 2 It is electrically connected by conducting wire 5 and substrate 1, substrate 2, which is connected energization with external circuit, makes LED diodes shinny, and the thickness of substrate 1 is The half of 2 thickness of chip, makes 2 surface of chip concordant with 1 upper surface of substrate, avoids chip operation from making, and relief hole folding is in the light, light Line can all shed, while easy to be electrically connected between chip and substrate, and the temperature of chip can also be conducted to substrate, and substrate is again To heat sink transmission, strengthen heat dissipation effect, substrate 1 is externally provided with encapsulation 6, and 6 pairs of substrates 1 of encapsulation, chip 2 are packaged protection, seal Fill and chip chamber 61 is equipped with 6 correspondence chips 2, the section of chip chamber 61 is inverted trapezoidal, and the middle part of chip chamber 61 is equipped with fluorescence coating 7, glimmering Do not contacted between photosphere 7 and chip 2, and a closure cavity 8 is formed between fluorescence coating 7 and chip 2, inert gas is filled in cavity 8, it is glimmering 7 upper lid of photosphere is equipped with printing opacity sealing 9, and two structures of chip chamber 61 promote the light that chip is sent preferably to external diffusion, with light The rule of diverging coordinates, raising light efficiency, and the temperature that the inert gas in cavity 8 and cavity 8 hinders chip to produce is passed to fluorescence coating 7 Pass, avoid fluorescence coating 7 from being affected by temperature generation qualitative change, avoid LED diodes from color occur and decline phenomenon, guarantee has longer use Service life and preferable light efficiency.

Embodiment 2:With reference to Fig. 1, Fig. 2, LED diodes, including 1,3 chip 2 of substrate with printed circuit, substrate 1 On be printed with the circuit connected with chip 2,1 bottom of substrate is bonded with copper heat sink 3 by heat-conducting glue, and heat sink 3 is equipped with 3 A 31,3 chips 2 of groove, which correspond to, to be embedded in groove 31, and the depth of groove 31 is done for the one of 2 thickness of chip, and chip 2 is by exhausted Edge heat-conducting glue 4 is bonded in groove 31, and 4 one side of thermal plastic insulation avoids occurring short circuit, the opposing party between chip 2 and heat sink Face, by the heat of chip rapidly by conduction to heat sink 3, equivalent to directly contacting between chip and heat sink, heat transfer road Footpath is small, and the heat of chip, which is quickly directly conducted to heat sink, to be scattered and disappeared, and avoids occurring junction temperature concentration at chip, and heat dissipation is efficient, prolongs The service life of long LED diodes, is equipped with relief hole 11 on substrate, the structure size of relief hole 11 is more than core at 1 correspondence chip 2 The structure size of piece 2, equally fills between 11 hole wall of relief hole and chip 2 and puts thermal plastic insulation, strengthens heat conduction, while chip is carried out It is fixed, ensure the firm of chip, improve security reliability, chip 2 is electrically connected by conducting wire 5 and substrate 1, substrate 2 and outside Circuit connection energization makes LED diodes shinny, and the thickness of substrate 1 is the half of 2 thickness of chip, is made on 2 surface of chip and substrate 1 End face is concordant, avoids chip operation from making, and relief hole folding is in the light, and light can all shed, while easy to electric between chip and substrate Property connection, and the temperature of chip can also conduct to substrate, and substrate is again to heat sink transmission, reinforcement heat dissipation effect, 1 peripheral hardware of substrate There is encapsulation 6,6 pairs of substrates 1 of encapsulation, chip 2 are packaged protection, chip chamber 61, chip chamber 61 are equipped with the correspondence chip 2 of encapsulation 6 Section be inverted trapezoidal, the middle part of chip chamber 61 is equipped with fluorescence coating 7, is not contacted between fluorescence coating 7 and chip 2, and fluorescence coating 7 and chip A closure cavity 8 is formed between 2, fills inert gas in cavity 8,7 upper lid of fluorescence coating is equipped with printing opacity sealing 9, chip chamber 61 Two structures promote the light that chip is sent to coordinate with the rule of light diverging preferably to external diffusion, improve light efficiency, cavity 8 and cavity 8 In inert gas hinder chip produce temperature transmitted to fluorescence coating 7, avoid fluorescence coating 7 from being affected by temperature generation qualitative change, keep away Exempt from LED diodes and color occur to decline phenomenon, guarantee has longer service life and a preferable light efficiency, and the distance between three grooves is 7mm, formation have three LED diode lights bands, and interval is uniform each other, whole light bar is shone uniformly, is not in hot spot Effect.

The above, is only the preferred embodiment of the utility model, and limit in any form is not done to the utility model System, it is every according to any simple modification made in the technical essence of the utility model to above example, equivalent variations, fall Enter within the scope of protection of the utility model.

Claims (6)

1.LED diodes, including the substrate with printed circuit, chip, it is characterised in that：The base plate bottom is equipped with heat dissipation Plate, heat sink are equipped with groove, and the chip is embedded in groove, are corresponded on substrate and relief hole, relief hole are equipped with chip Size be not less than chip, chip is connected by conducting wire with electrical property of substrate, and substrate is externally provided with encapsulation, is packaged in chip top and is equipped with Chip chamber, chip intracavitary are equipped with fluorescence coating, and fluorescence coating is not contacted with chip chamber, and fluorescence coating forms a closure sky with chip chamber Chamber, fills inert gas in cavity, fluorescence coating upper lid is equipped with diffuser.

2. LED diodes according to claim 1, it is characterised in that：The heat sink is copper coin, heat sink and substrate Between pass through heat conduction glue sticking.

3. LED diodes according to claim 1, it is characterised in that：The chip is bonded in by thermal plastic insulation In groove.

4. LED diodes according to claim 1, it is characterised in that：The depth of groove is not more than chip thickness.

5. LED diodes according to claim 1, it is characterised in that：The chip chamber section is inverted trapezoidal.

6. LED diodes according to claim 1, it is characterised in that：The diffuser is printing opacity sealing.