CN207219242U - A kind of IPM modules - Google Patents
A kind of IPM modules Download PDFInfo
- Publication number
- CN207219242U CN207219242U CN201721219277.9U CN201721219277U CN207219242U CN 207219242 U CN207219242 U CN 207219242U CN 201721219277 U CN201721219277 U CN 201721219277U CN 207219242 U CN207219242 U CN 207219242U
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- CN
- China
- Prior art keywords
- pcb board
- aluminum
- clad plate
- shell
- based copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
It the utility model is related to semiconductor technology, it is more particularly to a kind of to reduce overall dimensions and production cost and combine the IPM modules that a variety of encapsulation advantages realize a variety of circuit functions, including aluminum-based copper-clad plate, MOS single tubes one are welded with the aluminum-based copper-clad plate, signal terminal, power terminal, electric capacity, resistance, MOS single tubes two, Diode single tubes, also include pcb board, electric capacity two is welded with the pcb board, IC modules, triode, resistance two and row's pin, the pcb board is arranged on aluminum-based copper-clad plate, also include thermal insulation board, the thermal insulation board is connected through signal terminal and with signal terminal, the signal terminal also welds with pcb board.
Description
Technical field
Semiconductor technology is the utility model is related to, more particularly to a kind of IPM modules.
Background technology
At present, existing IPM modules are mainly divided to chip package and single tube to encapsulate two major classes；The power section of chip package uses
For chip, it is necessary to be bonded (wire bonding), a certain chips are bad because being bonded in IPM modules, may result in whole module report
It is useless, therefore yield is not high；
The power section of single tube encapsulation uses single tube, and single tube had been bonded, in the absence of caused by chip bonding is bad
It is bad, but single tube encapsulation often only encapsulates the module of a certain function, and the IPM modules for doing inversion just only have inversion function, do rectification
IPM modules just there was only rectification function, do the just only function of copped wave of copped wave.
Utility model content
The purpose of this utility model is, there is provided one kind can reduce overall dimensions and production cost and a variety of encapsulation of combination are excellent
Point realizes the IPM modules of a variety of circuit functions.
Technical scheme is used by utility model solves its technical problem：A kind of IPM modules, including aluminum-based copper-clad plate,
MOS single tubes one, signal terminal, power terminal, voltage-stabiliser tube, electric capacity, resistance, MOS single tubes two are welded with the aluminum-based copper-clad plate,
Diode single tubes, in addition to pcb board, electric capacity two, IC modules, triode, resistance two and row's pin are welded with the pcb board, it is described
Pcb board is arranged on aluminum-based copper-clad plate, in addition to thermal insulation board, the signal terminal sequentially pass through thermal insulation board and pcb board and then
Welded with pcb board.
Preferably, also including cover plate and shell, the shell sets aluminum-based copper-clad plate and pcb board cover in it, the lid
Plate is located above shell and and cage connection.
Preferably, the shell and cover plate are buckle structure.
Preferably, the shell is connected with aluminum-based copper-clad plate by bushing.
Preferably, it is provided with nut in the cover plate.
The beneficial effect of utility model is：The utility model IPM modular powers part, and will be whole using single tube structure
Stream and chopper circuit are all packaged together, and client is as needed, can be used alone the rectifying part of the module, can also be independent
Using chop section, rectification can be more used together altogether with copped wave, thus equivalent to arriving three IPM are module integrated
In one IPM module, the integrated level of IPM modules is improved, reduces cost and volume of the client using three modules.
Brief description of the drawings
Fig. 1 is the structural representation of aluminum-based copper-clad plate in IPM modules of the present utility model.
Fig. 2 is the structural representation of pcb board in IPM modules of the present utility model.
Fig. 3 is the assembling schematic diagram of pcb board and aluminum-based copper-clad plate in IPM modules of the present utility model.
Fig. 4 is the structural representation of the shell of pcb board in IPM modules of the present utility model.
Brief description of the drawings：1-1, aluminum-based copper-clad plate, 1-2, MOS single tube, 1-3, signal terminal, 1-4, power terminal are 1-5, whole
Current circuit, 1-6, MOS single tube two, 1-7, chopper circuit, 1-8, voltage-stabiliser tube, 1-9, electric capacity, 1-10, Diode single tube, 1-11, electricity
Resistance, 2-1, pcb board, 2-2, electric capacity two, 2-3, IC module, 2-4, triode, 2-5, resistance two, 2-6, row's pin, 3-3, thermal insulation board,
4-1, cover plate, 4-2, shell, 4-3, bushing, 4-4, nut.
Embodiment
Utility model is described in further detail presently in connection with accompanying drawing.These accompanying drawings are simplified schematic diagram, only
Illustrate the basic structure of utility model in a schematic way, therefore it only shows the composition relevant with utility model.
As illustrated, it is mono- to be welded with MOS in a kind of IPM modules, including aluminum-based copper-clad plate 1-1, the aluminum-based copper-clad plate 1-1
The 1-2 of pipe one, signal terminal 1-3, power terminal 1-4, voltage-stabiliser tube 1-8, electric capacity 1-9 and resistance 1-11 collectively form rectification circuit 1-
5, in addition to MOS single tubes two 1-6 and Diode single tubes 1-10,1-6 the and Diode single tubes 1-10 of MOS single tubes two and signal terminal
1-3, power terminal 1-4, electric capacity 1-9, resistance 1-11 and voltage-stabiliser tube 1-8 form chopper circuit 1-7, in addition to pcb board 2-1, institute
State and electric capacity two 2-2, IC module 2-3, triode 2-4, the 2-5 of resistance two and row pin 2-6, the pcb board are welded with pcb board 2-1
2-1 is arranged on aluminum-based copper-clad plate 1-1, in addition to thermal insulation board 3-3, the signal terminal 1-3 sequentially pass through thermal insulation board 3-3 and
Pcb board 2-1 and then with pcb board 2-1 weld；Also include cover plate 4-1 and shell 4-2, the shell 4-2 by aluminum-based copper-clad plate
1-1 and pcb board 2-1 covers are set in it, and the cover plate 4-1 is located above shell 4-2 and is connected with shell 4-2；The shell 4-2 with
Cover plate 4-1 is to snap connection；The shell 4-2 is connected with aluminum-based copper-clad plate 1-1 by bushing 4-3, is provided with the cover plate 4-1
Aluminum-based copper-clad plate and pcb board are packaged into complete IPM modules by nut 4-4, the shell 4-2 and cover plate 4-1.
Using the above-mentioned desirable embodiment according to utility model as enlightenment, pass through above-mentioned description, relevant staff
Various changes and amendments can be carried out in the range of without departing from this item utility model technological thought completely, this item is practical
New technical scope is not limited to the content on specification, it is necessary to determines that its is technical according to right
Scope.
Claims (5)
- A kind of 1. IPM modules, it is characterised in that：Including aluminum-based copper-clad plate (1-1), it is welded with the aluminum-based copper-clad plate (1-1) MOS single tubes one (1-2), signal terminal (1-3), power terminal (1-4), voltage-stabiliser tube (1-8), electric capacity (1-9), resistance (1-11), MOS single tubes two (1-6), Diode single tubes (1-10), in addition to pcb board (2-1), electric capacity two is welded with the pcb board (2-1) (2-2), IC modules (2-3), triode (2-4), resistance two (2-5) and row's pin (2-6), the pcb board (2-1) are arranged on aluminium base In copper-clad plate (1-1), in addition to thermal insulation board (3-3), the signal terminal (1-3) sequentially pass through thermal insulation board (3-3) and pcb board (2-1) and then welded with pcb board (2-1).
- 2. IPM modules according to claim 1, it is characterised in that：Also include cover plate (4-1) and shell (4-2), it is described outer Shell (4-2) sets aluminum-based copper-clad plate (1-1) and pcb board (2-1) cover in it, the cover plate (4-1) be located above shell (4-2) and It is connected with shell (4-2).
- 3. IPM modules according to claim 2, it is characterised in that：The shell (4-2) and cover plate (4-1) are buckle knot Structure.
- 4. IPM modules according to claim 2, it is characterised in that：The shell (4-2) is logical with aluminum-based copper-clad plate (1-1) Cross bushing (4-3) connection.
- 5. IPM modules according to claim 2, it is characterised in that：Nut (4-4) is provided with the cover plate (4-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721219277.9U CN207219242U (en) | 2017-09-22 | 2017-09-22 | A kind of IPM modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721219277.9U CN207219242U (en) | 2017-09-22 | 2017-09-22 | A kind of IPM modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207219242U true CN207219242U (en) | 2018-04-10 |
Family
ID=61822205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721219277.9U Active CN207219242U (en) | 2017-09-22 | 2017-09-22 | A kind of IPM modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207219242U (en) |
-
2017
- 2017-09-22 CN CN201721219277.9U patent/CN207219242U/en active Active
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