CN207134353U - Mobile terminal and its chip-packaging structure - Google Patents
Mobile terminal and its chip-packaging structure Download PDFInfo
- Publication number
- CN207134353U CN207134353U CN201721111120.4U CN201721111120U CN207134353U CN 207134353 U CN207134353 U CN 207134353U CN 201721111120 U CN201721111120 U CN 201721111120U CN 207134353 U CN207134353 U CN 207134353U
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- ball grid
- packaging structure
- grid array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model belongs to chip encapsulation technology field, more particularly to a kind of mobile terminal and its chip-packaging structure, chip-packaging structure includes substrate, chip and packing colloid, substrate includes the upper and lower surface that position is oppositely arranged, the lower surface of substrate is provided with ball grid array, chip is electrically connected with located at the upper surface of substrate and by substrate and ball grid array, and packing colloid is coated on outside chip and chip package is fixed on to the upper surface of substrate.Chip-packaging structure of the present utility model, the chip for the upper surface for being encapsulated in substrate and the ball grid array for the lower surface for being arranged on substrate are electrically connected with by the setting of substrate, the ball grid array being arranged such can realize the conversion to chip, original printed circuit board (PCB) need not so be redesigned, design time cost is reduced, rapidly adapts to the market demand, and the cabling of circuit need not be redesigned, so as to not interfere with the transmission of signal, and then ensure the stable and reliable for performance of product.
Description
Technical field
The utility model belongs to chip encapsulation technology field, more particularly to a kind of mobile terminal and its chip-packaging structure.
Background technology
There are the chip that some special balls positions encapsulate, such as the LPDDR3 of the 426ball in dram chip on Vehicles Collected from Market
Chip.Because in general LPDDR3 chips are 168ball, if 426ball LPDDR3 chips are substituted into 168ball's
LPDDR3 chips use, then need to redesign the special balls position that printed circuit board (PCB) is used for being adapted to 426ball.And that so does lacks
Point is to redesign printed circuit board (PCB) to need to pay regular hour cost, causes quickly to meet the market requirement；And
Since it is desired that redesigning printed circuit board (PCB), then cabling of circuit etc. needs to redesign, so as to influence the transmission of signal, and then
Influence the performance of product.Therefore, for the supplier of special balls position encapsulation chip, due to needing custom redesign to print
Circuit board encapsulates chip to be adapted to special balls position, greatly improves the popularization difficulty and threshold of product.
Utility model content
The purpose of this utility model is to provide a kind of chip-packaging structure, it is intended to which solution is directed to special balls in the prior art
The chip of position needs to redesign adaptable printed substrate and lead to not rapidly adapt to the market demand and influence chip
The technical problem of performance.
To achieve the above object, the technical solution adopted in the utility model is：A kind of chip-packaging structure, including substrate,
Chip and packing colloid, the substrate include the upper and lower surface that position is oppositely arranged, and the lower surface of the substrate is set
There is ball grid array, the chip is electrically connected with located at the upper surface of the substrate and by the substrate and the ball grid array,
The packing colloid is coated on outside the chip and the chip package is fixed on to the upper surface of the substrate.
Preferably, the chip is dram chip.
Preferably, the dram chip is 366ball LPDDR4 chips, and the ball grid array is 200ball ball bar battle arrays
Row.
Preferably, the dram chip is 426ball LPDDR3 chips, and the ball grid array is 168ball ball bar battle arrays
Row.
Preferably, the dram chip is 426ball LPDDR3 chips, and the ball grid array is 178ball ball bar battle arrays
Row.
Preferably, the dram chip is 456ball LPDDR3 chips, and the ball grid array is 168ball ball bar battle arrays
Row.
Preferably, the ball grid array includes several spheroids, and each spheroid is welded in the lower surface of the substrate.
Preferably, the side end face of the packing colloid flushes with the side end face of the substrate.
Preferably, the packing colloid is epoxy resin.
The beneficial effects of the utility model：Chip-packaging structure of the present utility model, it will be encapsulated in by the setting of substrate
The ball grid array of lower surface of the chip of the upper surface of substrate with being arranged on substrate is electrically connected with, and the ball grid array being arranged such can
To realize the conversion to chip, original printed circuit board (PCB) need not be so redesigned, reduces design time cost, it is quick suitable
In response to the market demand, and the cabling of circuit need not be redesigned, so as to not interfere with the transmission of signal, and then ensures product
It is stable and reliable for performance.
The utility model use another technical scheme be：A kind of mobile terminal, it includes above-mentioned chip-packaging structure.
Mobile terminal of the present utility model, due to using above-mentioned chip-packaging structure, then mobile terminal need not weigh
Newly design new printed circuit board (PCB) and match the installation of different chips, and then the manufacturing cost for reducing product can be realized.
Brief description of the drawings
, below will be to embodiment or prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the chip-packaging structure that the utility model embodiment provides.
Wherein, each reference in figure：
10-substrate, 11-upper surface, 12-lower surface
20-chip, 30-packing colloid, 40-ball grid array
41-spheroid.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, it is intended to for explaining the utility model, and it is not intended that to the utility model
Limitation.
In description of the present utility model, it is to be understood that term " length ", " width ", " on ", " under ", " preceding ",
The orientation or position relationship of the instruction such as " rear ", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " are based on attached
Orientation or position relationship shown in figure, it is for only for ease of and describes the utility model and simplify to describe, rather than instruction or hint
Signified device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The limitation of utility model.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In description of the present utility model, " multiple " are meant that two or two
More than, unless otherwise specifically defined.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be
Mechanically connect or electrically connect；Can be joined directly together, can also be indirectly connected by intermediary, can be two
The connection of element internal or the interaction relationship of two elements.For the ordinary skill in the art, can basis
Concrete condition understands concrete meaning of the above-mentioned term in the utility model.
As shown in figure 1, the utility model embodiment provides a kind of chip-packaging structure, including substrate 10, the and of chip 20
Packing colloid 30, the substrate 10 include the upper surface 11 and lower surface 12 that position is oppositely arranged, the lower surface of the substrate 10
12 are provided with ball grid array 40, and the chip 20 is located at the upper surface 11 of the substrate 10 and passes through the substrate 10 and the ball
Grid array 40 is electrically connected with, and the packing colloid 30 is coated on outside the chip 20 and is fixed on the chip 20 encapsulation described
The upper surface 11 of substrate 10.Specifically, the chip-packaging structure of the utility model embodiment, will be encapsulated by the setting of substrate 10
Ball grid array 40 in lower surface 12 of the chip 20 with being arranged on substrate 10 of the upper surface 11 of substrate 10 is electrically connected with, and is so set
The ball grid array 40 put can realize the conversion to chip 20, need not so redesign original printed circuit board (PCB), reduce
Design time cost, the market demand is rapidly adapted to, and the cabling of circuit need not be redesigned, so as to not interfere with signal
Transmission, and then ensure the stable and reliable for performance of product.
In the present embodiment, it is preferable that the chip 20 is dram chip.Wherein, dram chip has special ball position, that
It using above-mentioned encapsulating structure may insure that printed circuit board (PCB) need not be redesigned, improve the flexibility of products application, drop
Low consumer product imports cost.
The first embodiment in the present embodiment is, the dram chip is 366ball LPDDR4 chips, the ball
Grid array 40 is 200ball ball grid arrays.Specifically, by substrate 10 by the 366ball LPDDR4 chips with special balls position
200Ball LPDDR4 chips are converted to, in the feelings of corresponding mobile phone and flat board market separate type LPDDR4 based on 200ball
Under condition, the LPDDR4 chips that the suppliers of 366ball LPDDR4 chips can directly supply 200Ball allow client to be imported,
The flexibility of products application is improved, consumer product is reduced and imports cost.
Second of embodiment in the present embodiment be, the dram chip is 426ball LPDDR3 chips, the ball
Grid array 40 is 168ball ball grid arrays.Specifically, by substrate 10 by the 426ball LPDDR3 chips with special balls position
168Ball LPDDR3 chips are converted to, in the feelings of corresponding mobile phone and flat board market separate type LPDDR3 based on 168ball
Under condition, the LPDDR3 chips that the suppliers of 426ball LPDDR3 chips can directly supply 168Ball allow client to be imported,
The flexibility of products application is improved, consumer product is reduced and imports cost.
The third embodiment in the present embodiment is, the dram chip is 426ball LPDDR3 chips, the ball
Grid array 40 is 178ball ball grid arrays.Specifically, by substrate 10 by the 426ball LPDDR3 chips with special balls position
178Ball LPDDR3 chips are converted to, in the feelings of corresponding mobile phone and flat board market separate type LPDDR3 based on 178ball
Under condition, the LPDDR3 chips that the suppliers of 426ball LPDDR3 chips can directly supply 178Ball allow client to be imported,
The flexibility of products application is improved, consumer product is reduced and imports cost.
The 4th kind of embodiment in the present embodiment be, the dram chip is 456ball LPDDR3 chips, the ball
Grating array is classified as 168ball ball grid arrays.Specifically, the 456ball LPDDR3 chips with special balls position are turned by substrate 10
168Ball LPDDR3 chips are changed to, in the situation of corresponding mobile phone and flat board market separate type LPDDR3 based on 168ball
Under, the LPDDR3 chips that the suppliers of 456ball LPDDR3 chips can directly supply 168Ball allow client to be imported, and carry
The flexibility of high product application, reduce consumer product and import cost.
In the present embodiment, the ball grid array 40 includes several spheroids 41, and each spheroid 41 is electrically connected to described
The lower surface 12 of substrate 10.Specifically, each spheroid 41 of ball grid array 40 is tin ball, can pass through tin cream or weld-aiding cream electricity
It is connected on the pad of lower surface 12 of substrate 10, so may insure that each spheroid 41 of ball grid array 40 is connected with substrate 10
Stability, and can pass through scolding tin realize be electrically connected with.
Preferably, the substrate 10 is printed circuit board (PCB), and further, the printed circuit board (PCB) is hard printed circuit
Plate.
In the present embodiment, the side end face of the packing colloid 30 flushes with the side end face of the substrate 10.Specifically, so
Whole chip-packaging structure flat side down rule is can be designed so that, so advantageously in the installation of chip-packaging structure, and
The space for occupying installation can be saved.
In the present embodiment, the packing colloid 30 is epoxy resin.Wherein, chip 20 is coated by packing colloid 30,
So just improve the long-term use of stability and security of chip-packaging structure provided in an embodiment of the present invention.
The utility model embodiment provides a kind of mobile terminal, and it includes above-mentioned chip-packaging structure.Specifically, originally
The mobile terminal of utility model embodiment, due to using above-mentioned chip-packaging structure, then mobile terminal need not be set again
Count new printed circuit board (PCB) and match the installation of different chips 20, and then the manufacturing cost for reducing product can be realized.
Wherein, mobile terminal can be mobile phone either flat board or other mobile electronic products.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
- A kind of 1. chip-packaging structure, it is characterised in that：Including substrate, chip and packing colloid, the substrate includes position phase To the upper and lower surface of setting, the lower surface of the substrate is provided with ball grid array, and the chip is located at the substrate Upper surface is simultaneously electrically connected with by the substrate and the ball grid array, and it is outer and by institute that the packing colloid is coated on the chip State the upper surface that chip package is fixed on the substrate.
- 2. chip-packaging structure according to claim 1, it is characterised in that：The chip is dram chip.
- 3. chip-packaging structure according to claim 2, it is characterised in that：The dram chip is 366ball LPDDR4 Chip, the ball grid array are 200ball ball grid arrays.
- 4. chip-packaging structure according to claim 2, it is characterised in that：The dram chip is 426ball LPDDR3 Chip, the ball grid array are 168ball ball grid arrays.
- 5. chip-packaging structure according to claim 2, it is characterised in that：The dram chip is 426ball LPDDR3 Chip, the ball grid array are 178ball ball grid arrays.
- 6. chip-packaging structure according to claim 2, it is characterised in that：The dram chip is 456ball LPDDR3 Chip, the ball grid array are 168ball ball grid arrays.
- 7. according to the chip-packaging structure described in any one of claim 1~6, it is characterised in that：If the ball grid array includes Dry spheroid, each spheroid are welded in the lower surface of the substrate.
- 8. according to the chip-packaging structure described in any one of claim 1~6, it is characterised in that：The side of the packing colloid Face flushes with the side end face of the substrate.
- 9. according to the chip-packaging structure described in any one of claim 1~6, it is characterised in that：The packing colloid is epoxy Resin.
- A kind of 10. mobile terminal, it is characterised in that：Including the chip-packaging structure described in any one of claim 1~9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721111120.4U CN207134353U (en) | 2017-08-31 | 2017-08-31 | Mobile terminal and its chip-packaging structure |
| PCT/CN2017/117756 WO2019041674A1 (en) | 2017-08-31 | 2017-12-21 | Mobile terminal, and chip encapsulation structure for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721111120.4U CN207134353U (en) | 2017-08-31 | 2017-08-31 | Mobile terminal and its chip-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207134353U true CN207134353U (en) | 2018-03-23 |
Family
ID=61637090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721111120.4U Active CN207134353U (en) | 2017-08-31 | 2017-08-31 | Mobile terminal and its chip-packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207134353U (en) |
| WO (1) | WO2019041674A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9355951B2 (en) * | 2009-08-28 | 2016-05-31 | Marvell World Trade Ltd. | Interconnect layouts for electronic assemblies |
| CN102376666B (en) * | 2010-08-06 | 2016-04-13 | 三星半导体(中国)研究开发有限公司 | A kind of ball grid array package structure and manufacture method thereof |
| JP6032070B2 (en) * | 2013-03-13 | 2016-11-24 | ソニー株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| US9779940B2 (en) * | 2015-07-01 | 2017-10-03 | Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Chip package |
| KR101672967B1 (en) * | 2015-07-31 | 2016-11-04 | 송영희 | Semiconductor stack package having side pad on the edge thereof, high density memory module, electronic circuit device |
-
2017
- 2017-08-31 CN CN201721111120.4U patent/CN207134353U/en active Active
- 2017-12-21 WO PCT/CN2017/117756 patent/WO2019041674A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019041674A1 (en) | 2019-03-07 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518057 A, B, C, D, E, F1, 8 Building, Financial Services Technology Innovation Base, No. 8 Kefa Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen jiangbolong electronic Limited by Share Ltd Address before: 518000 8 building, 1 finance base, 8 KFA Road, Nanshan District, Shenzhen, Guangdong. Patentee before: Shenzhen jiangbolong Electronic Co., Ltd. |