WO2019041674A1

WO2019041674A1 - Mobile terminal, and chip encapsulation structure for same

Info

Publication number: WO2019041674A1
Application number: PCT/CN2017/117756
Authority: WO
Inventors: 吴方
Original assignee: 深圳市江波龙电子有限公司
Priority date: 2017-08-31
Filing date: 2017-12-21
Publication date: 2019-03-07
Also published as: CN207134353U

Abstract

A mobile terminal, and chip encapsulation structure for the same. The chip encapsulation structure comprises a substrate (10), a chip (20), and an encapsulating member (30). The substrate (10) comprises an upper surface (11) and a lower surface (12) oppositely located. The lower surface (12) of the substrate (10) is provided with a ball grid array (40). The chip (20) is provided on the upper surface (11) of the substrate (10), and is electrically connected to the ball grid array (40) via the substrate (10). The encapsulating member (30) covers and surrounds the chip (20) and encapsulates and fixes the chip (20) to the upper surface (11) of the substrate (10). By configuring the substrate to electrically connect the chip encapsulated on the upper surface of the substrate and the ball grid array provided at the lower surface of the substrate, the ball grid array enables chip adaptation without re-designing a printed circuit board, thus reducing design time cost, avoiding re-design of circuit wiring, without affecting signal transmission, and accordingly ensuring stable and reliable product performance.

Description

Mobile terminal and chip package structure thereof

Technical field

The present application belongs to the field of chip packaging technologies, and in particular, to a mobile terminal and a chip package structure thereof.

Background technique

There are some special ball-packaged chips on the market, such as the 426ball LPDDR3 chip in the DRAM chip. Since the average LPDDR3 chip is 168ball, if you want to replace the 426ball LPDDR3 chip with the 168ball LPDDR3 chip, you need to redesign the printed circuit board to fit the special ball position of the 426ball. The disadvantage of this is that the redesign of the printed circuit board requires a certain time cost, which makes it impossible to quickly adapt to the market demand; and because the printed circuit board needs to be redesigned, the circuit traces need to be redesigned to affect the signal. Transmission, which in turn affects the performance of the product. Therefore, for the supplier of special ball-packaged chips, the need to redesign the printed circuit board to adapt to the special ball-packaged chip greatly increases the difficulty and threshold of product promotion.

Summary of the invention

The purpose of the present application is to provide a chip package structure, which aims to solve the technical problem that the prior art chip for a special ball position needs to redesign a suitable printed circuit board, which cannot quickly adapt to market demands and affect chip performance.

In order to achieve the above object, the technical solution adopted in the present application is: a chip package structure including a substrate, a chip, and an encapsulant, wherein the substrate includes upper and lower surfaces disposed opposite to each other, and a lower surface of the substrate is provided with a ball a gate array, the chip is disposed on an upper surface of the substrate and electrically connected to the ball grid array through the substrate, the encapsulant is coated on the chip and the chip package is fixed on the chip The upper surface of the substrate.

Preferably, the chip is a DRAM chip.

Preferably, the DRAM chip is a 366 ball LPDDR4 chip, and the ball grid array is a 200 ball ball grid array.

Preferably, the DRAM chip is a 426 ball LPDDR3 chip, and the ball grid array is a 168 ball ball grid array.

Preferably, the DRAM chip is a 426 ball LPDDR3 chip, and the ball grid array is a 178 ball ball grid array.

Preferably, the DRAM chip is a 456 ball LPDDR3 chip, and the ball grid array is a 168 ball ball grid array.

Preferably, the ball grid array comprises a plurality of spheres, each of which is soldered to a lower surface of the substrate.

Preferably, the side end surface of the encapsulant is flush with the side end surface of the substrate.

Preferably, the encapsulant is an epoxy resin.

The beneficial effects of the present application are as follows: the chip package structure of the present application electrically connects the chip packaged on the upper surface of the substrate and the ball grid array disposed on the lower surface of the substrate through the arrangement of the substrate, and the ball grid array thus disposed can realize the pair The conversion of the chip does not require redesigning the original printed circuit board, reducing the design time cost, quickly adapting to the market demand, and eliminating the need to redesign the circuit traces, thereby not affecting the signal transmission, thereby ensuring stable product performance. reliable.

Another technical solution adopted by the present application is: a mobile terminal including the above chip package structure.

In the mobile terminal of the present application, since the above-mentioned chip package structure is used, the mobile terminal does not need to redesign a new printed circuit board to match the installation of different chips, thereby achieving a reduction in manufacturing cost of the product.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are only the present application. For some embodiments, other drawings may be obtained from those of ordinary skill in the art without departing from the drawings.

FIG. 1 is a schematic structural diagram of a chip package structure according to an embodiment of the present application.

Among them, the various reference numerals in the figure:

10—substrate; 11—upper surface; 12—lower surface;

20-chip; 30-package colloid; 40-ball grid array;

41—The sphere.

Detailed ways

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", The orientation or positional relationship of the indications such as "horizontal", "top", "bottom", "inside", "outside" and the like is based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, rather than It is to be understood that the device or elements referred to have a particular orientation, are constructed and operated in a particular orientation and are therefore not to be construed as limiting.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or integrated; can be mechanical connection, or can be electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction of two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

As shown in FIG. 1 , an embodiment of the present application provides a chip package structure including a substrate 10 , a chip 20 , and an encapsulant 30 . The substrate 10 includes an upper surface 11 and a lower surface 12 disposed opposite to each other. The lower surface 12 is provided with a ball grid array 40. The chip 20 is disposed on the upper surface 11 of the substrate 10 and electrically connected to the ball grid array 40 through the substrate 10, and the encapsulant 30 is coated on The chip 20 is externally mounted and the chip 20 is packaged and fixed to the upper surface 11 of the substrate 10. Specifically, the chip package structure of the embodiment of the present invention electrically connects the chip 20 packaged on the upper surface 11 of the substrate 10 and the ball grid array 40 disposed on the lower surface 12 of the substrate 10 through the arrangement of the substrate 10, and thus is disposed. The ball grid array 40 can realize the conversion of the chip 20, thus eliminating the need to redesign the original printed circuit board, reducing the design time cost, quickly adapting to the market demand, and eliminating the need to redesign the circuit traces so as not to affect the signal. Transmission, which in turn ensures stable and reliable product performance.

In this embodiment, preferably, the chip 20 is a DRAM chip. Among them, the DRAM chip has a special ball position, then the above package structure can ensure that the printed circuit board does not need to be redesigned, the flexibility of product application is improved, and the introduction cost of the customer product is reduced.

In the first embodiment of the present embodiment, the DRAM chip is a 366 ball LPDDR4 chip, and the ball grid array 40 is a 200 ball ball grid array. Specifically, the 366 ball LPDDR4 chip with a special ball position is converted into a 200 Ball LPDDR4 chip through the substrate 10. In the case where the corresponding mobile phone and tablet market separate LPDDR4 is 200 ball, the supplier of the 366 ball LPDDR4 chip can Directly supply 200 Ball's LPDDR4 chip for customers to import, improve product application flexibility and reduce customer product introduction costs.

In the second embodiment of the present embodiment, the DRAM chip is a 426 ball LPDDR3 chip, and the ball grid array 40 is a 168 ball ball grid array. Specifically, the 426 ball LPDDR3 chip with a special ball position is converted into a 168 Ball LPDDR3 chip through the substrate 10. In the case where the corresponding mobile phone and tablet market separated LPDDR3 is mainly 168 ball, the supplier of the 426 ball LPDDR3 chip can Direct supply of 168 Ball's LPDDR3 chip allows customers to import, increase product application flexibility and reduce customer product introduction costs.

In a third embodiment of the present embodiment, the DRAM chip is a 426 ball LPDDR3 chip, and the ball grid array 40 is a 178 ball ball grid array. Specifically, the 426 ball LPDDR3 chip with a special ball position is converted into a 178 Ball LPDDR3 chip through the substrate 10. In the case where the corresponding mobile phone and tablet market separate LPDDR3 is mainly 178 ball, the supplier of the 426 ball LPDDR3 chip can Direct supply of 178 Ball's LPDDR3 chip allows customers to import, increase product application flexibility and reduce customer product introduction costs.

In a fourth embodiment of the present embodiment, the DRAM chip is a 456 ball LPDDR3 chip, and the ball grid array is a 168 ball ball grid array. Specifically, the 456 ball LPDDR3 chip with a special ball position is converted into a 168 Ball LPDDR3 chip through the substrate 10. In the case where the corresponding mobile phone and tablet market separated LPDDR3 is mainly 168 ball, the supplier of the 456 ball LPDDR3 chip can Direct supply of 168 Ball's LPDDR3 chip allows customers to import, increase product application flexibility and reduce customer product introduction costs.

In this embodiment, the ball grid array 40 includes a plurality of balls 41 , and each of the balls 41 is electrically connected to the lower surface 12 of the substrate 10 . Specifically, each of the spheres 41 of the ball grid array 40 is a solder ball, and can be electrically connected to the pads of the lower surface 12 of the substrate 10 by solder paste or solder paste, so that the respective spheres 41 and the substrate of the ball grid array 40 can be ensured. 10 connection stability, and can be electrically connected by solder.

Preferably, the substrate 10 is a printed circuit board, and further, the printed circuit board is a hard printed circuit board.

In this embodiment, the side end surface of the encapsulant 30 is flush with the side end surface of the substrate 10. Specifically, the design can make the entire chip package structure flat and regular, which is more advantageous for the installation of the chip package structure, and can save space occupied by the installation.

In this embodiment, the encapsulant 30 is an epoxy resin. The chip 20 is covered by the encapsulant 30, which improves the long-term stability and safety of the chip package structure provided by the embodiment of the present invention.

The embodiment of the present application provides a mobile terminal, which includes the chip package structure described above. Specifically, in the mobile terminal of the embodiment of the present application, since the above-mentioned chip package structure is used, the mobile terminal does not need to redesign a new printed circuit board to match the installation of different chips 20, thereby achieving a reduction in manufacturing cost of the product.

The mobile terminal can be a mobile phone or a tablet or other mobile electronic product.

The above is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection of the present application. Within the scope.

Claims

A chip package structure comprising: a substrate, a chip and an encapsulant, wherein the substrate comprises upper and lower surfaces disposed opposite to each other, and a lower surface of the substrate is provided with a ball grid array, and the chip is disposed at the The upper surface of the substrate is electrically connected to the ball grid array through the substrate, the encapsulant is coated on the outside of the chip, and the chip package is fixed on the upper surface of the substrate.
The chip package structure according to claim 1, wherein the chip is a DRAM chip.
The chip package structure according to claim 2, wherein the DRAM chip is a 366 ball LPDDR4 chip, and the ball grid array is a 200 ball ball grid array.
The chip package structure according to claim 2, wherein the DRAM chip is a 426 ball LPDDR3 chip, and the ball grid array is a 168 ball ball grid array.
The chip package structure according to claim 2, wherein the DRAM chip is a 426 ball LPDDR3 chip, and the ball grid array is a 178 ball ball grid array.
The chip package structure according to claim 2, wherein the DRAM chip is a 456 ball LPDDR3 chip, and the ball grid array is a 168 ball ball grid array.
The chip package structure according to any one of claims 1 to 6, wherein the ball grid array comprises a plurality of spheres, each of the spheres being soldered to a lower surface of the substrate.
The chip package structure according to any one of claims 1 to 6, wherein a side end surface of the encapsulant is flush with a side end surface of the substrate.
The chip package structure according to any one of claims 1 to 6, wherein the encapsulant is an epoxy resin.
A mobile terminal comprising the chip package structure according to any one of claims 1 to 9.