CN207118078U - Drilling cover plate - Google Patents
Drilling cover plate Download PDFInfo
- Publication number
- CN207118078U CN207118078U CN201720294122.5U CN201720294122U CN207118078U CN 207118078 U CN207118078 U CN 207118078U CN 201720294122 U CN201720294122 U CN 201720294122U CN 207118078 U CN207118078 U CN 207118078U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- cover plate
- cushion
- drill point
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract 5
- -1 polypropylene Polymers 0.000 description 11
- 239000004698 Polyethylene Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 4
- 241001074085 Scophthalmus aquosus Species 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Abstract
A drilling cover plate comprises a metal substrate, a buffer layer and an adhesive layer. The buffer layer is positioned on the metal substrate. The adhesive layer is positioned between the substrate and the buffer layer and used for adhering the buffer layer to the metal substrate. The metal substrate can provide rigidity and heat conduction functions, the flexible circuit board is prevented from being bent or deformed, heat on the drill point or the flexible circuit board can be brought out, the buffer layer can provide buffer when the drill point drills, the rigid impact between the drill point and the metal substrate can be relieved, the drill point is prevented from being damaged or broken, and dislocation of the drill point or deviation of the metal substrate is also avoided.
Description
Technical field
A kind of circuit board making field is the utility model is related to, especially a kind of drilling cover plate.
Background technology
Development and frivolous trend with 3C commodity, circuit board now develop into thin, flexible flexible circuit board,
With the thickness that reduction is overall, and by the characteristic of deflection and can be in various angle connecting electronic components.However, with now
The reduction in bulk of electronic component, the density of overall circuit storehouse improve, for the positional precision of the drilling on circuit board, aperture,
The roughness of hole wall is all tended to be strict.
On the bore process of circuit board, due to the pliability of flexible printer circuit, some side effects are also brought, due to
Flexible printer circuit may be stressed and produce flexure, deformation, and this can cause hole position to offset and have impact on follow-up mating.Cause
This, often rigidity during providing drilling, is avoided flexible printer circuit using urea (phenolic resin) plate as drilling cover plate now
Plate is deformed in drilling or sliding.
However, in drilling, with high rotating speed, the quick and action that is pierced, exited in large quantities, drill point easily consumes drill point
Damage or fracture.Meanwhile caused heat can be accumulated on drill point in Quick mechanical boring procedure, drill cover plate or circuit board
On, cause the temperature of drill point, drilling cover plate and flexible printed wiring board to rise, may damage and be present in flexible printed wiring board
Circuit and electronic component.Further, since urea belongs to thermosetting material, it is difficult to can produce poison when reclaiming, decompose, and burning
Property, there is bad influence for environment.
Utility model content
In order to solve problem encountered in prior art, a kind of drilling cover plate is provided herein.Drilling cover plate includes metal
Substrate, cushion and adhesive-layer.Cushion is located on metal substrate.Adhesive-layer is between substrate and cushion, to incite somebody to action
Cushion is adhered on metal substrate.
In certain embodiments, the thickness of metal substrate be 50 to 250 μm, it is preferred that the thickness of metal substrate be 60 to
200μm.More it is preferred that the thickness of metal substrate is 70 μm, 100 μm, 140 μm or 180 μm.
In certain embodiments, metal substrate includes at least one of aluminium, tin and aluminium alloy.More it is preferred that metal
Substrate can be pure aluminum plate.
In certain embodiments, the thickness of cushion is 5 to 100 μm.It is preferred that the thickness of cushion is 30 to 70 μm.
More it is preferred that the thickness of cushion is 30 to 50 μm.
In certain embodiments, cushion include polypropylene (Polyproylene, PP), polyethylene (polyethylene,
) and at least one in PET (polyethylene terephthalate, PET) PE.
In certain embodiments, the thickness of adhesive-layer is 5 to 30 μm.
In certain embodiments, adhesive-layer is pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA).
In certain embodiments, adhesive-layer includes at least one in epoxy resin and acryl resin.
In this application, rigidity and the function of heat conduction are provided by metal substrate, is avoided that flexible circuit board flexure, shape
Become, and effectively can go out the torrid zone on drill point or circuit board, cushion can provide buffering when drill point pierces, and can slow down drill point
The problem of with metal substrate rigid shock, drill point being reduced and be damaged, and avoiding drill point dislocation and metal substrate from offseting.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of drilling cover plate first embodiment.
Fig. 2 is the diagrammatic cross-section of drilling cover plate second embodiment.
Wherein, reference
The 1 drilling drilling cover plate of cover plate 2
The cushion of 10 metal substrate 20
The drill point of 30 adhesive-layer 500
The thickness of 600 flexible circuit board D1 metal substrates
The thickness of the thickness D3 adhesive-layers of D2 cushions
Embodiment
Refering to Fig. 1, Fig. 1 is the diagrammatic cross-section of drilling cover plate first embodiment.As shown in figure 1, the brill of first embodiment
Blind patch 1 includes metal substrate 10, cushion 20 and adhesive-layer 30.Cushion 20 is located on metal substrate 10.Adhesive-layer 30
Between substrate 10 and cushion 20, cushion 20 is adhered on metal substrate 10.Brill is provided by cushion 30
Buffering when pin 500 pierces, drill point 500 can be slowed down and impacted with metal substrate 10, can reduce drill point 500 misplace, twine bits and by
Damage, also it is avoided that metal substrate 10 is offset.
Metal substrate 10, which can cover, to be pressed on flexible circuit board 600, there is provided rigidity, then drill point 500 pierce drilling cover plate 1
And during flexible circuit board 600, flexible circuit board 600 can be reduced flexure and deformation by the gravity and rigidity of metal substrate 10.
In certain embodiments, the thickness D1 of metal substrate 10 is 50 to 250 μm.It is preferred that the thickness of metal substrate 10
D1 is 60 to 200 μm.More it is preferred that the thickness D1 of metal substrate 10 is 70 μm, 100 μm, 140 μm, 180 μm or 200 μm.Herein
It is merely illustrative, it is actually not limited to this.
In certain embodiments, the thickness D2 of cushion 20 is 5 to 100 μm.It is preferred that the thickness D2 of cushion 20 is 30
To 70 μm.More it is preferred that the thickness D2 of cushion 20 is 30 to 50 μm.It is merely illustrative herein, it is actually not limited to this.
In certain embodiments, the thickness D3 of adhesive-layer 30 be 5 to 30 μm, it is preferred that the thickness D3 of adhesive-layer 30 be 5 to
10μm.It is merely illustrative herein, it is actually not limited to this.
In the selection of material, metal substrate 10 includes at least one of aluminium, tin and aluminium alloy.More it is preferred that gold
It can be pure aluminum plate to belong to substrate 10.
Cushion 20 includes polypropylene (Polyproylene, PP), polyethylene (polyethylene, PE) and poly- pair
At least one in polyethylene terephthalate (polyethylene terephthalate, PET).
Adhesive-layer 30 is pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA).Further, adhesive-layer 30
Include at least one in epoxy resin and acryl resin.
In making, first adhesive-layer 30 can be coated on the cushion 20 of coil type, then be carried out with metal substrate 10
Hot pressing, then cut.Drilling cover plate it is possible to further be completed for hot pressing is toasted or the mode of photocuring,
So that adhesive-layer 30 fully solidifies, so that cushion 20 is closely arranged on metal substrate 10, will not also be produced in drilling
The problem of raw delamination (peeling).
Refering to Fig. 2, Fig. 2 is the diagrammatic cross-section of drilling cover plate second embodiment.As shown in Fig. 2 the brill of second embodiment
Blind patch 2 includes metal substrate 10, cushion 20 and adhesive-layer 30.Cushion 20 is located at the upper following table on metal substrate 10
Face.Adhesive-layer 30 is between substrate 10 and cushion 20, cushion 20 is adhered on metal substrate 10.
Cushion 20 is both provided with the upper and lower surface of metal substrate 10, in drilling, when drill point 500 penetrates metal substrate
10, into before the flexible circuit board 600 of the lower section of drilling cover plate 2, drill point 500 can be buffered again.In this way, drill point can be reduced
500 with the rigid shock of flexible circuit board 600, the skew or deformation impaired, that reduce flexible circuit board 600 of drill point 500 can be reduced,
To ensure the accuracy of drilling.
Here, the drilling cover plate of above-described embodiment can provide rigidity by metal substrate 10 to flexible circuit board 600, and
And the function of heat conduction is provided, effectively the torrid zone accumulated on drill point 500 or flexible circuit board 600 can be gone out, avoid overheating
Destroy the circuit in flexible circuit board 600.In addition, providing buffering when drill point 500 pierces by cushion 20, brill can be slowed down
The rigid shock of pin 500 and metal substrate 10, can reduce drill point 500 and be damaged, avoid drill point 500 from being broken.In addition, cushion 20
Drill point 500 can be avoided to misplace or cause metal substrate 10 to offset.In addition, metal substrate 10 and cushion 20 for it is recyclable again
The material of system, cost are cheap, can reduce the destruction for environment, also provide the competitiveness of the market price.
Preferred embodiment is disclosed above described, and so it is not limited to the utility model, any phase for being familiar with this area
Technical staff is closed, is not being departed from the scope of the utility model, when can make a little change and retouching, but these change and retouching
It should all be contained in the protection domain of the appended claims for the utility model.
Claims (8)
1. one kind drilling cover plate, it is characterised in that include：
One metal substrate；
One cushion, on the metal substrate；And
One adhesive-layer, between the substrate and the cushion, the cushion is adhered on the metal substrate.
2. drilling cover plate as claimed in claim 1, it is characterised in that the thickness of the metal substrate is 50 to 250 μm.
3. drilling cover plate as claimed in claim 1, it is characterised in that the thickness of the metal substrate is 60 to 200 μm.
4. drilling cover plate as claimed in claim 1, it is characterised in that the metal substrate includes aluminium, tin and aluminium alloy at least
One of them.
5. drilling cover plate as claimed in claim 1, it is characterised in that the thickness of the cushion is 5 to 100 μm.
6. drilling cover plate as claimed in claim 1, it is characterised in that the thickness of the cushion is 30 to 70 μm.
7. drilling cover plate as claimed in claim 1, it is characterised in that the thickness of the adhesive-layer is 5 to 30 μm.
8. drilling cover plate as claimed in claim 1, it is characterised in that the adhesive-layer is a pressure sensitive adhesive.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106203050U TWM543771U (en) | 2017-03-03 | 2017-03-03 | Drilling cover plate |
| TW106203050 | 2017-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207118078U true CN207118078U (en) | 2018-03-16 |
Family
ID=59688677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720294122.5U Active CN207118078U (en) | 2017-03-03 | 2017-03-24 | Drilling cover plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207118078U (en) |
| TW (1) | TWM543771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774353A (en) * | 2019-09-17 | 2020-02-11 | 烟台柳鑫新材料科技有限公司 | Aluminum-based cover plate for PCB drilling and preparation method thereof |
-
2017
- 2017-03-03 TW TW106203050U patent/TWM543771U/en unknown
- 2017-03-24 CN CN201720294122.5U patent/CN207118078U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774353A (en) * | 2019-09-17 | 2020-02-11 | 烟台柳鑫新材料科技有限公司 | Aluminum-based cover plate for PCB drilling and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM543771U (en) | 2017-06-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |