CN202713772U - Gold-plated finger printed circuit board - Google Patents
Gold-plated finger printed circuit board Download PDFInfo
- Publication number
- CN202713772U CN202713772U CN 201220282029 CN201220282029U CN202713772U CN 202713772 U CN202713772 U CN 202713772U CN 201220282029 CN201220282029 CN 201220282029 CN 201220282029 U CN201220282029 U CN 201220282029U CN 202713772 U CN202713772 U CN 202713772U
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- CN
- China
- Prior art keywords
- gold
- plated
- ink layer
- area
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a gold-plated finger printed circuit board. The gold-plated finger printed circuit board comprises a PCB substrate, wherein the PCB substrate is provided with at least one gold finger gold plating area in the horizontal direction; an area between the gold finger gold plating area and the PCB substrate edge is provided with an electronic element plugging area; the electronic element plugging area extends along the length direction of the gold finger gold plating area; a photosensitive ink layer is laid on the electronic element plugging area; the inner side end of the photosensitive ink layer coincides with the inner side end of the electronic element plugging area; the thickness of the photosensitive ink layer is larger than or equal to 0.0254 mm; the width of the photosensitive ink layer is 20 mm; and the distance between the photosensitive ink layer and the gold finger gold plating area is 0 to 0.635 mm. According to the gold-plated finger printed circuit board, through laying the photosensitive ink layer on the electronic element plugging area, the problem that the electronic element plugging area is scratched due to window opening when a window is opened in an anti-gold-plated blue tape.
Description
Technical field
The utility model relates to the printed wiring board technical field, relates in particular to a kind of gold-plated finger printed wiring board.
Background technology
At present, in traditional gold-plated finger plate printed wiring board manufacture craft, need to carry out gold-plated to the gold-plated district of golden finger.And in order to prevent in gold-plated process, the liquid medicine etching electronic element inserted area of gold-plated usefulness, people generally paste the simultaneously anti-gold-plated blue adhesive tape in overlay electronic element inserted area and the gold-plated district of golden finger of lastblock at the PCB substrate, and then cut off over against the anti-gold-plated blue adhesive tape (namely windowing) of the part in the gold-plated district of golden finger with blade, the golden finger district is immersed in carry out in the liquid medicine gold-plated, and has prevented that liquid medicine from corroding the electronic component inserted area.But, adopt anti-gold-plated blue adhesive tape to exist following shortcoming:
Anti-gold-plated blue adhesive tape itself is thinner, and the dynamics of windowing of blade is difficult to hold, so scratch easily anti-gold-plated blue adhesive tape in the process of windowing, causes scratching the electronic component inserted area.
The utility model content
Technical problem to be solved in the utility model provides a kind of gold-plated finger printed wiring board, and it can avoid blade to scratch the electronic component inserted area when using blade to resist gold-plated blue adhesive tape to window.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model content is specific as follows:
A kind of gold-plated finger printed wiring board, it comprises the PCB substrate, along continuous straight runs is provided with the gold-plated district of at least one golden finger on the described PCB substrate; Zone between the gold-plated district of described golden finger and the PCB substrate edges is provided with the electronic component inserted area; Described electronic component inserted area is extended along the length direction in the gold-plated district of golden finger; Be equipped with photosensitive printing ink layer on the described electronic component inserted area; The medial extremity of described photosensitive printing ink layer overlaps with the medial extremity of electronic component inserted area; The thickness of described photosensitive printing ink layer is more than or equal to 0.0254mm; The width of described photosensitive printing ink layer is 20mm; Distance between the gold-plated district of described photosensitive printing ink layer and golden finger is 0-0.635mm.
Compared with prior art, the utility model has produced following beneficial effect:
Gold-plated finger printed wiring board of the present utility model is by laying photosensitive printing ink layer in the electronic component inserted area, when anti-gold-plated blue adhesive tape is windowed, can effectively avoid the problem of the scuffing electronic component inserted area that causes because windowing.
Description of drawings
The utility model will be further described below in conjunction with the drawings and specific embodiments:
Fig. 1 is the more preferably structural representation of embodiment of gold-plated finger printed wiring board of the present utility model.
Fig. 2 is the structural representation of photosensitive printing ink layer of the present utility model.
Embodiment
As depicted in figs. 1 and 2, gold-plated finger printed wiring board of the present utility model, it comprises PCB substrate 1, along continuous straight runs is provided with the gold-plated district 2 of at least one golden finger on the described PCB substrate 1; Zone between the gold-plated district 2 of described golden finger and PCB substrate 1 edge is provided with electronic component inserted area 3; Described electronic component inserted area 3 is extended along the length direction in the gold-plated district 2 of golden finger; Be equipped with photosensitive printing ink layer 4 on the described electronic component inserted area 3; The medial extremity 41 of described photosensitive printing ink layer overlaps with the medial extremity 31 of electronic component inserted area; The thickness H of described photosensitive printing ink layer is more than or equal to 0.0254mm; The width W of described photosensitive printing ink layer is 20mm; Distance B between the gold-plated district of described photosensitive printing ink layer and golden finger is 0-0.635mm.
Claims (1)
1. gold-plated finger printed wiring board, it comprises the PCB substrate, along continuous straight runs is provided with the gold-plated district of at least one golden finger on the described PCB substrate; Zone between the gold-plated district of described golden finger and the PCB substrate edges is provided with the electronic component inserted area; Described electronic component inserted area is extended along the length direction in the gold-plated district of golden finger; It is characterized in that: be equipped with photosensitive printing ink layer on the described electronic component inserted area; The medial extremity of described photosensitive printing ink layer overlaps with the medial extremity of electronic component inserted area; The thickness of described photosensitive printing ink layer is more than or equal to 0.0254mm; The width of described photosensitive printing ink layer is 20mm; Distance between the gold-plated district of described photosensitive printing ink layer and golden finger is 0-0.635mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220282029 CN202713772U (en) | 2012-06-14 | 2012-06-14 | Gold-plated finger printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220282029 CN202713772U (en) | 2012-06-14 | 2012-06-14 | Gold-plated finger printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202713772U true CN202713772U (en) | 2013-01-30 |
Family
ID=47594023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220282029 Expired - Lifetime CN202713772U (en) | 2012-06-14 | 2012-06-14 | Gold-plated finger printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202713772U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078081A (en) * | 2013-03-29 | 2014-10-01 | 晟碟信息科技（上海）有限公司 | Method and device for testing semiconductor device without scratching interface contact fingers |
| CN110290647A (en) * | 2019-06-24 | 2019-09-27 | 大连崇达电路有限公司 | A kind of repair method of immersion Ni/Au plating leakage plate |
-
2012
- 2012-06-14 CN CN 201220282029 patent/CN202713772U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078081A (en) * | 2013-03-29 | 2014-10-01 | 晟碟信息科技（上海）有限公司 | Method and device for testing semiconductor device without scratching interface contact fingers |
| CN110290647A (en) * | 2019-06-24 | 2019-09-27 | 大连崇达电路有限公司 | A kind of repair method of immersion Ni/Au plating leakage plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130130 |