JP2020101977A - RFID label, looseness detection structure, and looseness detection method - Google Patents

Abstract

To detect even a minor change of state of an adherend.SOLUTION: An RFID label includes: a film substrate 10 with an adhesive layer 50 formed on one surface; an antenna 12 and a state detection wiring 13 formed on the film substrate 10; and an IC chip 11 arranged on the film substrate 10 and connected to the antenna 12 and the state detection wiring 13 so as to detect a conduction state of the state detection wiring 13 and to transmit a detection result in a non-contact manner via the antenna 12. The state detection wiring 13 includes two wiring sections 13a, 13b each having one end connected to the IC chip 11. The other ends of the two wiring sections 13a, 13b are exposed so as to be electrically connected to a conductive surface of an adherend when the RFID label is adhered to the adherend by means of the adhesive layer 50. The state detection wiring 13 becomes conductive when the other ends of the wiring sections 13a, 13b are electrically connected to the conductive surface of the adherend.SELECTED DRAWING: Figure 1

Description

The present invention relates to an RFID label that is attached to an adherend made of a conductor and detects a change in the state of the adherend.

In general, in a vehicle such as a railroad, there is a high possibility that a serious accident will develop if the bolt comes off during traveling. Therefore, conventionally, a skilled worker regularly performs a tapping sound inspection and a visual inspection with a check mark to inspect whether the bolt is loose. However, in such an inspection, there is a possibility that an inspection error may occur due to human factors such as the degree of skill of the operator and the lack of manpower. Therefore, it is conceivable to inspect the bolt for looseness by using a sensor, but it requires a large-scale device, a dedicated bolt, a washer, a jig, and the like.

In recent years, a non-contact communication medium using RFID technology such as a non-contact type IC label or a non-contact type IC tag equipped with an IC chip capable of writing and reading information in a non-contact state is excellent. It is rapidly spreading due to its convenience. Therefore, it is considered to use such RFID technology also when detecting a state such as the loosening of the bolt described above.

For example, in Patent Document 1, an IC tag is attached to a cap portion of a bolt, and a conductor piece made of metal or the like having an opening portion is attached to a ring fixed to a member to which the bolt is fastened, and When slack does not occur, the IC tag faces the opening to enable reading on the IC tag. When slack occurs on the bolt, the bolt rotates to prevent the IC tag from facing the opening. There is disclosed a technique of making the IC tag unreadable and detecting the looseness of the bolt. By using this technique, it becomes possible to detect the looseness of the bolts without requiring a large-scale device, a dedicated bolt, a washer, a jig, or the like.

Japanese Patent No. 5324325

However, in the technique disclosed in Patent Document 1, if the looseness of the bolt is small, a part of the IC tag may continue to face the opening of the conductor piece, and the IC tag may remain readable. In that case, there is a problem that it is determined that the bolt is not loose.

The present invention has been made in view of the problems of the above-described conventional techniques, and provides an RFID label that can detect even a small change in the state of a stuck adherend. With the goal.

In order to achieve the above object, the present invention provides
An RFID label which is made of a conductor and is attached to an adherend having a conductive surface exposed at least in part,
A sheet base material having an adhesive layer laminated on one surface,
An antenna and a state detection wiring formed on the sheet base material,
And an IC chip which is arranged on the sheet base material so as to be connected to the antenna and the state detection wiring, detects the conduction state of the state detection wiring, and transmits the detection result in a non-contact manner via the antenna. Then
The state detection wiring includes first and second wiring portions whose one end is connected to the IC chip,
Each of the other ends of the first and second wiring portions can be electrically connected to a conductive surface of the adherend when the RFID label is adhered to the adherend by the adhesive layer. Expression
The state detecting wiring is brought into a conducting state by electrically connecting the other ends of the first and second wiring portions to the conductive surface of the adherend.

In the present invention configured as described above, in the IC chip, the conduction state of the state detection wiring formed on the sheet base material is detected, and the detection result is non-contact transmitted via the antenna, Although a change in the state of the adherend adhered is detected, the state detection wiring includes first and second wiring portions whose one ends are connected to the IC chip. Each of the other ends of the first and second wiring portions is exposed so as to be electrically connectable to the conductive surface of the adherend when the RFID label is attached to the adherend, and the state detection wiring is Since the other ends of the first and second wiring portions are electrically connected to the conductive surface of the adherend, the conductive state is established, so that the RFID label is adhered to the adherend. If the closed circuit is formed by the first wiring portion, the second wiring portion, and the adherend and the state detection wiring becomes conductive, and then the state of the adherend changes, The electrical connection between at least one of the other ends of the second wiring portion and the conductive surface of the adherend is canceled and the state detection wiring becomes non-conductive, thereby changing the state of the adherend. Will be detected.

In this way, by using the adherend made of a conductor as a part of the state detection wiring, the conduction state of the state detection wiring changes according to the change in the state of the adherend. A small change in the condition of the body will also be detected.

Such an RFID label can be used in a looseness detection structure that detects looseness of a tightening member that is fastened to a tightening target component. In that case, the RFID label is attached to either one of the tightening target component and the tightening member, and the RFID label of the tightening target component and the tightening member to which the RFID label is not adhered is attached by an adhesive means having conductivity. The conductive surface of the body and at least one of the other ends of the first and second wiring portions of the state detection wiring are separable from each other when the tightening member is loosened with respect to the tightening target component. If the tightening member is loosened with respect to the tightening target component, the state detection wiring becomes non-conducting, thereby detecting the looseness of the tightening member fastened to the tightening target component. Become.

In the state detection method using such an RFID label, the IC chip detects the conduction state of the state detection wiring, and the reading means capable of non-contact communication with the IC chip provides the IC chip with the detection result. Is transmitted via an antenna in a non-contact manner, and the processing means connected to the reading means determines the state of the adherend based on the detection result transmitted from the IC chip to the reading means in a non-contact manner. The change in the state of will be detected.

According to the present invention, since the adherend made of a conductor is used as a part of the state detection wiring, the conduction state of the state detection wiring changes according to the change in the state of the adherend. It is also possible to detect small changes in the state of the adherend.

Moreover, it has an RFID label as described above, a tightening target component, and a tightening member tightened on the tightening target component, and the RFID label is adhered to either one of the tightening target component and the tightening member by an adhesive layer. With the connecting means having conductivity, the conductive surface of the adherend to which the RFID label is not adhered among the tightening target component and the tightening member, and the first and second wiring portions of the state detection wiring. According to the looseness detection structure in which at least one of the other ends is detachably attached to the tightening member with respect to the tightening target component, the loosening occurs in the tightening member with respect to the tightening target component. In this case, the state detection wiring is brought into a non-conducting state, whereby it is possible to detect looseness of the fastening member fastened to the fastening target component.

Further, as a state detection method using such an RFID label, the IC chip detects a conduction state of the state detection wiring, and a reading means capable of non-contact communication with the IC chip is provided in the IC chip. The detection result is non-contact transmitted via the antenna, and the processing means connected to the reading means judges the state of the adherend based on the detection result non-contact transmitted from the IC chip to the reading means. It is possible to detect the state of wearing.

It is a figure which shows 1st Embodiment of the RFID label of this invention, (a) is a block diagram seen from the surface direction, (b) is AA' sectional drawing shown in (a), (c). Is a BB' sectional view shown in (a), (d) is a CC' sectional view shown in (a), and (e) is a DD' sectional view shown in (a). It is a figure which shows an example of the adherend to which the looseness detection label shown in FIG. 1 is stuck, (a) is a top view and (b) is a side view. It is a figure which shows the state by which the looseness detection label shown in FIG. 1 was affixed to the adherend shown in FIG. 2, (a) is a top view and (b) is a side view. It is a figure for demonstrating the effect|action when a looseness arises in the bolt in the state which the looseness detection label shown in FIG. 1 was stuck to the bolt as shown in FIG. 3, (a) is a top view, b) is an enlarged view of a part of the side surface. It is a figure which shows an example of the system for detecting the looseness of the bolt with respect to a base using the looseness detection label shown in FIG. 6 is a flowchart for explaining a method of detecting looseness of a bolt with respect to a base using the looseness detection label shown in FIG. 1 in the system shown in FIG. 5. It is a figure which shows the other example of the to-be-adhered body to which the looseness detection label shown in FIG. 1 is stuck, (a) is a top view and (b) is a side view. FIG. 8 is a top view showing a state in which the looseness detection label shown in FIG. 1 is attached to the adherend shown in FIG. 7. FIG. 9 is a top view for explaining the action when the looseness detection label shown in FIG. 1 is attached to the bolt as shown in FIG. 8 when the bolt is loosened. It is a figure which shows 2nd Embodiment of the RFID label of this invention, (a) is a block diagram seen from the surface direction, (b) is AA' sectional drawing shown in (a), (c). Is a cross-sectional view taken along the line BB′ shown in (a), and FIG. FIG. 11 is a side view showing an example of a state in which the looseness detection label shown in FIG. 10 is attached to the adherend shown in FIG. 2. FIG. 12A is a view for explaining the action when the looseness detection label shown in FIG. 10 is attached to the bolt as shown in FIG. 11 when the bolt is loosened, and FIG. b) is an enlarged view of a part of the side surface. It is a figure which shows the other example of the state in which the looseness detection label shown in FIG. 10 was stuck to the to-be-adhered body shown in FIG. 2, (a) is a top view and (b) is a side view. It is a figure for demonstrating the effect|action at the time of loosening occurring in the bolt in the state which the looseness detection label shown in FIG. 10 was stuck on the base as shown in FIG. 13, (a) is a top view, b) is an enlarged view of a part thereof. It is a figure which shows the usage example in 4th Embodiment of the RFID label of this invention, (a) is an external appearance perspective view, (b) is a one part enlarged view of a side surface. It is a figure for demonstrating the effect|action when the box with which the opening detection label was stuck as shown in FIG. 15 is opened, (a) is an external perspective view, (b) is a part of side surface of a lid. FIG.

Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are views showing a first embodiment of an RFID label of the present invention, where FIG. 1A is a configuration diagram viewed from the surface direction, and FIG. 1B is a sectional view taken along the line AA′ shown in FIG. , (C) is a sectional view taken along the line BB' shown in (a), (d) is a sectional view taken along the line CC' shown in (a), and (e) is a sectional view taken along line DD' shown in (a). It is a figure.

As shown in FIG. 1, the RFID label in this embodiment has a protective film 20 laminated on one surface of a film substrate 10 via an adhesive layer 40, and a spacer 30 and an adhesive layer 50 on the other surface of the film substrate 10. Is a looseness detection label 1 which is laminated in this order to form a label.

The film substrate 10 serves as a sheet base material in the present invention, and is made of, for example, a PET film having a thickness of 50 μm. The film substrate 10 is composed of a regular hexagonal region 10a having a regular hexagonal shape and a projecting region 10b projecting from one edge of the regular hexagonal region 10a. The antenna 12 and the state detection wiring 13 are formed, and the IC chip 11 is mounted.

Each of the two antennas 12 has a thickness of, for example, 18 μm of copper in a regular hexagonal region 10a on the surface of the film substrate 10 laminated with the protective film 20 so as to draw an arc along the edge of the regular hexagonal region 10a. It is made of foil.

The state detection wiring 13 is formed on the surface of the film substrate 10 laminated with the protective film 20 by a copper foil having a thickness of 18 μm, for example. The state detection wiring 13 is composed of a first wiring portion 13a and a second wiring portion 13b extending in parallel with each other from the regular hexagonal region 10a to the protruding region 10b.

The IC chip 11 is provided with two antenna terminals (not shown) and two state detection terminals (not shown), and the surface provided with these antenna terminals and state detection terminals is the mounting surface. Then, the film substrate 10 is mounted on the regular hexagonal region 10 a of the surface of the film substrate 10 laminated with the protective film 20. The antenna terminals of the IC chip 11 are each connected to one end of the antenna 12, and the state detection terminal of the IC chip 11 is one end of each of the two wiring portions 13a and 13b forming the state detection wiring 13. Connected to the department. The IC chip 11 detects the resistance value of the state detection wiring 13 by causing a current generated by electric power obtained by the non-contact communication via the antenna 12 to flow in the state detection wiring 13, and detects the state based on the resistance value. The conduction state of the wiring 13 is detected, the detection result is converted into digital information, and contactless transmission is performed via the antenna 12. Examples of the IC chip 11 include UCODE G2iM+ manufactured by NXP.

The protective film 20 is made of, for example, the same material as the film substrate 10, and on the surface of the film substrate 10 on which the antenna 12 and the state detection wiring 13 are laminated, the entire surface of the regular hexagonal region 10a and the regular hexagonal region 10b. An adhesive layer 40 is laminated on a region except a part on the side opposite to the rectangular region 10a. As a result, the two wiring portions 13a and 13b forming the state detection wiring 13 are exposed in a state where one end portion is connected to the IC chip 11 and the other end portion is disconnected from each other. There is.

The spacer 30 is stacked on the regular hexagonal region 10a on the surface of the film substrate 10 opposite to the surface on which the antenna 12 and the state detection wiring 13 are stacked. The spacer 30 is made of a non-metal and is made of a soft material such as foamable acrylic resin.

The adhesive layer 50 serves as an adhesive layer in the present invention, and for example, by applying an adhesive of TL-85 series manufactured by Lintec Co., Ltd. on the entire surface of the film substrate 10 on which the spacers 30 are laminated. It is stacked.

Hereinafter, a method of using the looseness detection label 1 having the above-described configuration and an operation thereof will be described.

2A and 2B are diagrams showing an example of an adherend to which the looseness detection label 1 shown in FIG. 1 is attached. FIG. 2A is a top view and FIG. 2B is a side view.

The looseness detection label 1 shown in FIG. 1 includes, for example, as shown in FIG. 2, a metal base 3 that is a tightening target component, and a metal bolt 2 that is a tightening member that is tightened to the base 3. Used by being attached to an adherend. In this adherend, a bolt 2 composed of a regular hexagonal head portion 2a and a screw portion 2b extending from one surface of the head portion 2a is screwed into a screw hole formed in a base 3 by screwing the screw portion 2b. As a result, the bolt 2 is fastened to the base 3. At that time, the bolt 2 may be loosened by vibration applied from the outside, and the looseness detection label 1 shown in FIG. 1 is used to detect the looseness.

FIG. 3 is a view showing a state in which the looseness detection label 1 shown in FIG. 1 is attached to the adherend shown in FIG. 2, (a) is a top view, and (b) is a side view. It should be noted that the detailed structure such as the laminated structure of the looseness detection label 1 is not shown so as not to obscure the description.

When the looseness detection label 1 shown in FIG. 1 is attached to the adherend shown in FIG. 2 and used to detect the looseness of the bolt 2, as shown in FIG. The looseness detection label 1 is attached to the bolt 2 by the adhesive layer 50 so that the regular hexagonal region 10a of the film substrate 10 faces and the protruding region 10b of the film substrate 10 faces one side surface of the head portion 2a. At this time, the two antennas 12 of the looseness detection label 1 are respectively formed in the regular hexagonal region 10a of the film substrate 10 so as to draw an arc along the end sides of the regular hexagonal region 10a. The head portion 2a has an arc shape along a regular hexagonal inscribed circle. As a result, when the looseness detection label 1 is attached to the head portion 2a of the bolt 2, the antenna 12 does not protrude from the head portion 2a of the bolt 2 and the length of the antenna 12 can be secured, and longer communication is possible. The distance can be secured.

In the looseness detection label 1 attached to the bolt 2 in this way, the ends of the two wiring portions 13 a and 13 b forming the state detection wiring 13 on the side not connected to the IC chip 11 are the base 3 And is exposed without being covered by the protective film 20.

Therefore, the ends of the two wiring portions 13a and 13b on the side not connected to the IC chip 11 are adhered to the base 3 via the conductive ink 4 serving as a connecting means having conductivity. As a result, the ends of the two wiring portions 13a and 13b on the side not connected to the IC chip 11 are electrically connected to the base 3 via the conductive ink 4, and the base 3 is made of metal. Due to this, the state detection wiring 13 becomes conductive.

FIG. 4 is a diagram for explaining the operation when the looseness detection label 1 shown in FIG. 1 is attached to the bolt 2 as shown in FIG. (a) is a top view, (b) is a partial enlarged view of a side surface. It should be noted that the detailed structure such as the laminated structure of the looseness detection label 1 is not shown so as not to obscure the description.

When the looseness detection label 1 shown in FIG. 1 is attached to the bolt 2 as shown in FIG. 3, the bolt 2 is rotated counterclockwise as shown in FIG. When the base 3 is loosened, the conductive ink 4 is peeled off from the base 3 and the conductive ink 4 and the base 3 are in a non-adhesive state as shown in FIG. The ends of the wiring portions 13a and 13b forming the wiring 13 on the side not connected to the IC chip 11 are separated from the base 3. As a result, the electrically connected state between these wiring portions 13a and 13b and the base 3 is canceled, and the state detection wiring 13 becomes non-conductive. Even if the end portions of the wiring portions 13a and 13b that are not connected to the IC chip 11 are not separated from the base 3, respectively, the end portions of the wiring portions 13a and 13b that are not connected to the IC chip 11 are When one side is separated from the base 3, the state detection wiring 13 becomes non-conductive.

As described above, in the configuration in which the looseness detection label 1 shown in FIG. 1 is attached to the adherend composed of the bolt 2 and the base 3 shown in FIG. 2, the two wiring portions 13a of the looseness detection label 1 are 13b of the end portion on the side that is open because it is not connected to the IC chip 11 and the base 3 of the bolt 2 and the base 3 to which the looseness detection label 1 is not attached, by the conductive ink 4. When the bolt 2 is loosened to the base 3, the bolt 2 is adhered to the base 3 so as to be separated from each other, whereby a looseness detection structure for detecting the looseness of the bolt 2 to the base 3 is configured.

Hereinafter, a specific method of detecting the looseness of the bolt 2 with respect to the base 3 by using the above-described operation will be described.

FIG. 5: is a figure which shows an example of the system for detecting the looseness of the bolt 2 with respect to the base 3 using the looseness detection label 1 shown in FIG.

As a system for detecting the looseness of the bolt 2 with respect to the base 3 using the looseness detection label 1 shown in FIG. 1, as shown in FIG. 5, a reading means capable of non-contact communication with the looseness detection label 1. A system that includes a reader/writer 5 that serves as the above and a management personal computer 6 that serves as a processing unit that is connected to the reader/writer 5 via a wire or wirelessly is conceivable. It is also possible to use a handy terminal having not only reading means but also processing means as a reader/writer, and in that case, a management personal computer becomes unnecessary.

FIG. 6 is a flow chart for explaining a method of detecting looseness of the bolt 2 with respect to the base 3 using the looseness detection label 1 shown in FIG. 1 in the system shown in FIG.

In the looseness detection label 1 shown in FIG. 1, when the reader/writer 5 is brought close to the looseness detection label 1 and the looseness detection label 1 is detected by the reader/writer 5 (step 1), first, the reader/writer 5 Power is supplied to the looseness detection label 1, and an instruction to detect the conduction state of the state detection wiring 13 and to transmit the detection result is transmitted to the looseness detection label 1 (step 2). At this time, since the non-metal spacer 30 is laminated on the surface of the film substrate 10 where the antenna 12 is formed and which is attached to the bolt 2 of the regular hexagonal region 10a, the looseness detection label 1 is made of metal. Even when it is attached to the bolt 2, the reader/writer 5 can perform non-contact communication with the looseness detection label 1 without being significantly affected by metal.

When the power supplied from the reader/writer 5 is obtained by the looseness detection label 1, and the command transmitted from the reader/writer 5 is received by the IC chip 11 via the antenna 12 of the looseness detection label 1 (step 3 ), current is supplied to the state detection wiring 13 by the power supplied from the reader/writer 5.

In the IC chip 11, the resistance value of the state detection wiring 13 is detected using the supplied current, so that the conduction state of the state detection wiring 13 is detected (step 4). Here, when the looseness detection label 1 is attached to the bolt 2 and the bolt 2 is not loosened as shown in FIG. 3, the IC chips 11 of the two wiring portions 13 a and 13 b forming the state detection wiring 13 are formed. Since the state detection wiring 13 is in a conductive state by electrically connecting the ends on the side not connected to the base 3 through the conductive ink 4, the state detection wiring 13 is in a conductive state. The resistance value composed of the detection wiring 13, the conductive ink 4, and the base 3 is detected.

In the IC chip 11, when the detected resistance value is the resistance value including the state detection wiring 13, the conductive ink 4, and the base 3, it is determined that the state detection wiring 13 is in the conductive state. The determination result is converted into digital information as a detection result of the conduction state of the state detection wiring 13 and is transmitted to the reader/writer 5 via the antenna 12 in a contactless manner (step 5). Since the resistance value detected by the IC chip 11 when the state detection wiring 13 is in a non-conducting state is almost infinite as described later, the state detection wiring is As a resistance value for determining that 13 is in a conductive state, a resistance value not higher than a certain threshold value may be used instead of the resistance value composed of the state detection wiring 13, the conductive ink 4, and the base 3.

On the other hand, when the looseness detection label 1 is attached to the bolt 2 and the bolt 2 is loosened as shown in FIG. 4, the conductive ink 4 is peeled off from the base 3, and the conductive ink 4 and the base 3 are separated from each other. Becomes a non-adhesive state, the electrical connection state between the open end of the wiring portions 13a and 13b forming the state detection wiring 13 on the side not connected to the IC chip 11 and the base 3 is eliminated. Therefore, the state detection wiring 13 is in a non-conductive state. In this state, even if a current is supplied to the state detection wiring 13 by the power supplied from the reader/writer 5, the state detection wiring 13 is in a non-conducting state, so that the state detection wiring 13 has a current. Does not flow, so that the resistance value detected in the IC chip 11 becomes almost infinite.

In the IC chip 11, when the detected resistance value is almost infinite, it is determined that the state detection wiring 13 is in the non-conduction state, and the determination result is the detection of the conduction state of the state detection wiring 13. As a result, it is converted into digital information and transmitted to the reader/writer 5 via the antenna 12 in a contactless manner. Since the resistance value detected by the IC chip 11 is almost infinite when the state detection wiring 13 is non-conductive, the state detection wiring 13 is non-conductive in the IC chip 11. The resistance value for determining that the resistance value is not substantially infinite, and may be a certain threshold value or more that is larger than the resistance value of the state detection wiring 13, the conductive ink 4, and the base 3.

In this way, in the reader/writer 5, the conduction state of the state detection wiring 13 detected by the looseness detection label 1 is transmitted in a contactless manner via the antenna 12.

When the detection result transmitted from the looseness detection label 1 to the reader/writer 5 in a non-contact manner as described above is received by the reader/writer 5 (step 6), the detection result received by the reader/writer 5 is the management personal computer. 6 (step 7).

When the detection result transferred from the reader/writer 5 is received by the management personal computer 6 (step 8), the looseness detection label 1 in the management personal computer 6 is transmitted to the reader/writer 5 in a non-contact manner, and the management personal computer 6 On the basis of the detection result transferred to, it is judged whether or not the bolt 2 which is the state of the adherend is loosened (step 9). Specifically, in the detection result transferred from the reader/writer 5 to the management personal computer 6, when the state detection wiring 13 is in the conductive state, it is determined that the bolt 2 is not loosened, and the state detection wiring When 13 is in a non-conducting state, it is determined that the bolt 2 is loose.

As described above, in the present embodiment, the looseness detection label 1 is attached to the bolt 2 that is fastened to the base 3, and one end of the two wiring portions 13a and 13b forming the state detection wiring 13 and the base 3 are connected to each other. The base 3 is used as a part of the state detection wiring 13 by being electrically connected through the conductive ink 4. When the bolt 2 is loosened by using such a configuration, the conductive ink 4 is peeled off from the base 3, and the conductive ink 4 and the base 3 are not adhered to each other, and the wiring portions 13a and 13b are not connected to each other. It is detected whether or not the bolt 2 is loosened by utilizing the effect that the electrical connection state with the base 3 is canceled and the state detection wiring 13 is brought into a non-conducting state, so that the bolt 2 and the base 3 are disconnected. It is also possible to detect a small looseness of the bolt 2, which changes the state of the adherend consisting of.

In addition, since the base 3 is coated with a non-conductive paint except for the regions connected to the wiring portions 13a and 13b through the conductive ink 4, only a part of the base 3 is covered. When the conductive surface is exposed, the bolt 2 loosens and rotates, so that the area of the base 3 facing the conductive ink 4 becomes a painted area. The electrical connection state with the base 3 is eliminated, and the state detection wiring 13 becomes non-conductive.

The looseness detection label 1 configured in this way can be used, for example, in a bogie of the Shinkansen or the like to detect looseness of a bolt for fixing the bogie. In that case, if the spacer 30 is made of a soft material such as foamable acrylic resin, even if the looseness detection label 1 is blown by the wind or dropped due to vibration, the looseness detection label 1 It is possible to reduce the damage caused by 1 hitting the human body or the like.

7: is a figure which shows the other example of the to-be-adhered body to which the looseness detection label 1 shown in FIG. 1 is stuck, (a) is a top view, (b) is a side view.

As shown in FIG. 7, the adherend in this example has a conductive surface of the base 103 which is the same as that shown in FIG. 2 because the surface of the base 103 is entirely coated with a non-conductive paint. Is not exposed, and when the looseness detection label 1 shown in FIG. 1 is attached to the head portion 2a of the bolt 2, the wiring portion 13a and the wiring portion 13b of the base 103 face each other. , 13b are different in that a half-loop-shaped half-loop wiring 103a for connecting the ends on the opposite side of the IC chip 11 is formed of conductive ink.

FIG. 8 is a top view showing a state in which the looseness detection label 1 shown in FIG. 1 is attached to the adherend shown in FIG. 7.

When the looseness detection label 1 shown in FIG. 1 is attached to the adherend shown in FIG. 7 and used to detect the looseness of the bolt 2, as shown in FIG. The looseness detection label 1 is attached to the bolt 2 by the adhesive layer 50 so that the regular hexagonal region 10a of the film substrate 10 faces and the protruding region 10b of the film substrate 10 faces one side surface of the head portion 2a.

In the looseness detection label 1 attached to the bolt 2 in this way, the ends of the two wiring portions 13 a and 13 b forming the state detection wiring 13 on the side not connected to the IC chip 11 are the base 103. It faces the half-loop wiring 103a formed in the above and is exposed without being covered by the protective film 20.

Therefore, the end portions of the two wiring portions 13a and 13b on the side not connected to the IC chip 11 are adhered to the half-loop wiring 103a via the conductive ink 4 serving as a connecting means having conductivity. As a result, the end portions of the two wiring portions 13a and 13b on the side not connected to the IC chip 11 are electrically connected via the half-loop wiring 103a, whereby the state detection wiring 13 becomes conductive. ..

FIG. 9 is a top view for explaining the operation when the looseness detection label 1 shown in FIG. 1 is attached to the bolt 2 as shown in FIG. 8 and the bolt 2 is loosened.

In the state where the looseness detection label 1 shown in FIG. 1 is attached to the bolt 2 as shown in FIG. 8, the bolt 2 is rotated counterclockwise as shown in FIG. When the looseness occurs, the end portions of the two wiring portions 13a and 13b on the side not connected to the IC chip 11 do not face the half-loop wiring 103a formed on the base 103, thereby detecting the state. The wiring 13 is turned off.

As described above, in the surface of the base 103, the half-loop wiring 103a is formed in a region where the wiring portions 13a and 13b of the base 103 face each other when the looseness detection label 1 is attached to the head portion 2a of the bolt 2. By using the configuration in which the conductive ink is formed, even if the surface of the base 103 is insulated by a coating that does not have conductivity, the state detection wiring 13 is formed by using the half-loop wiring 103a. Can be made conductive, and the looseness of the bolt 2 can be detected.

(Second embodiment)
10A and 10B are views showing a second embodiment of the RFID label of the present invention, where FIG. 10A is a configuration diagram viewed from the surface direction, and FIG. 10B is a sectional view taken along the line AA′ shown in FIG. , (C) is a BB' sectional view shown in (a), and (d) is a CC' sectional view shown in (a).

In this embodiment, as shown in FIG. 10, the looseness detection label 101 is different from that shown in FIG. 1 in the outer shape and the shapes of the antenna 112 and the state detection wiring 113.

The film substrate 110 in this embodiment includes a rectangular area 110a having a rectangular shape and a protruding portion 110b protruding from one long side of the rectangular area 110a.

Each of the two antennas 112 has an isosceles triangular shape in the rectangular region 110a of the film substrate 110, and the vertices are formed so as to face each other in the longitudinal direction of the rectangular region 110a with a gap therebetween. Serves as a power supply point and is connected to the IC chip 111.

The state detection wiring 113 is composed of a first wiring portion 113a and a second wiring portion 113b extending from the rectangular area 110a to the protruding area 110b such that the distance between them gradually increases.

The protective film 120 is laminated on the entire surface of the rectangular area 110a of the film substrate 110 and the area of the protruding area 110b except a part of the protruding area 110b opposite to the rectangular area 110a. As a result, the two wiring portions 113a and 113b forming the state detection wiring 113 are exposed in a state where one end is connected to the IC chip 111 and the other end is disconnected from each other. There is.

The spacer 130 is laminated on the rectangular region 110 a of the film substrate 110.

Hereinafter, a method of using the looseness detection label 101 having the above-described configuration and an operation thereof will be described.

11 is a side view showing an example of a state in which the looseness detection label 101 shown in FIG. 10 is attached to the adherend shown in FIG. It should be noted that the detailed structure of the looseness detection label 101, such as the laminated structure, is not shown for the sake of clarity.

When the looseness detection label 101 shown in FIG. 10 is attached to the adherend shown in FIG. 2 and used to detect the looseness of the bolt 2, one of the head portions 2a of the bolt 2 is used as shown in FIG. The looseness detection label 101 is attached to the side surface by the adhesive layer 150 so that the ends of the wiring portions 113a and 113b on the side not connected to the IC chip 111 face the base 3.

In the looseness detection label 101 attached to the bolt 2 in this way, the ends of the two wiring portions 113a and 113b forming the state detection wiring 113 on the side not connected to the IC chip 111 are the base 3 And is exposed without being covered by the protective film 120.

Therefore, the ends of the two wiring portions 113a and 113b on the side not connected to the IC chip 111 are adhered to the base 3 via the conductive ink 4 serving as a connecting means having conductivity. As a result, the ends of the two wiring portions 113a and 113b on the side not connected to the IC chip 111 are electrically connected to the base 3 through the conductive ink 4, and the base 3 is made of metal. As a result, the state detection wiring 113 becomes conductive.

FIG. 12 is a view for explaining the action when the looseness detection label 101 shown in FIG. 10 is attached to the bolt 2 as shown in FIG. 11 and the bolt 2 is loosened, (a) is a top view, (b) is a partial enlarged view of a side surface. It should be noted that the detailed structure of the looseness detection label 101, such as the laminated structure, is not shown for the sake of clarity.

With the looseness detection label 101 shown in FIG. 10 attached to the bolt 2 as shown in FIG. 11, the bolt 2 is rotated counterclockwise as shown in FIG. When the base 3 is loosened, the conductive ink 4 is peeled off from the base 3 as shown in FIG. 12B, and the conductive ink 4 and the base 3 are in a non-adhesive state. The bases 3 are separated from the ends of the wiring portions 113a and 113b forming the wiring 113 on the side not connected to the IC chip 111. As a result, the electrically connected state between these wiring portions 113a and 113b and the base 3 is canceled, and the state detection wiring 113 becomes non-conductive.

Thus, in the configuration in which the looseness detection label 101 shown in FIG. 10 is attached to the adherend composed of the bolt 2 and the base 3 shown in FIG. 2, the two wiring portions 113a of the looseness detection label 101, The end of the 113b that is open because it is not connected to the IC chip 111, and the base 3 of the bolt 2 and the base 3 to which the looseness detection label 101 is not attached are separated by the conductive ink 4. When the bolt 2 is loosened to the base 3, the bolt 2 is adhered so that it can be separated from the base 3 to form a looseness detection structure that detects looseness of the bolt 2 to the base 3.

Also in this embodiment, in the system shown in FIG. 5, the conduction state of the state detection wiring 113 of the looseness detection tag 101 attached to the bolt 2 is read by the reader/writer 5 and the state is detected by the management personal computer 6. The looseness of the bolt 2 is detected by determining whether or not the bolt 2 is loosened based on the conduction state of the wiring 113.

(Third Embodiment)
The looseness detection label 101 shown in FIG. 10 may be used by being attached to the base 3 instead of being attached to one side surface of the bolt 2 as shown in FIG.

13: is a figure which shows the other example of the state in which the looseness detection label 101 shown in FIG. 10 was stuck to the to-be-adhered body shown in FIG. 2, (a) is a top view, (b) is a side view. It is a figure. It should be noted that the detailed structure such as the laminated structure of the looseness detection label 1 is not shown so as not to obscure the description.

When the looseness detection label 101 shown in FIG. 10 is attached to the adherend shown in FIG. 2 and used to detect the looseness of the bolt 2, the looseness detection label 101 is adhered to the base 3 as shown in FIG. It is also conceivable to apply by means of layer 150.

In the looseness detection label 101 attached to the base 3 in this manner, the end portions of the two wiring portions 113a and 113b forming the state detection wiring 113 on the side not connected to the IC chip 111 are the bolts 2 And is exposed without being covered by the protective film 120.

Therefore, the ends of the two wiring portions 113a and 113b on the side not connected to the IC chip 111 are adhered to the side surface of the bolt 2 via the conductive ink 4 serving as a connecting means having conductivity. As a result, the ends of the two wiring portions 113a and 113b on the side not connected to the IC chip 111 are electrically connected to the bolt 2 via the conductive ink 4, and the bolt 2 is made of metal. As a result, the state detection wiring 113 becomes conductive.

FIG. 14 is a diagram for explaining the action when the bolt 2 is loosened when the looseness detection label 101 shown in FIG. 10 is attached to the base 3 as shown in FIG. (a) is a top view and (b) is an enlarged view of a part thereof. It should be noted that the detailed structure of the looseness detection label 101, such as the laminated structure, is not shown for the sake of clarity.

While the looseness detection label 101 shown in FIG. 10 is attached to the bolt 2 as shown in FIG. 13, the bolt 2 is rotated counterclockwise as shown in FIG. When the base 3 is loosened, the conductive ink 4 is peeled off from the side surface of the bolt 2 and the conductive ink 4 and the bolt 2 are brought into a non-adhesive state as shown in FIG. The ends of the wiring portions 113a and 113b forming the detection wiring 113, which are not connected to the IC chip 111, are separated from the bolt 2. As a result, the electrical connection state between the wiring portions 113a and 113b and the bolt 2 is canceled, and the state detection wiring 113 becomes non-conductive.

Thus, in the configuration in which the looseness detection label 101 shown in FIG. 10 is attached to the adherend composed of the bolt 2 and the base 3 shown in FIG. 2, the two wiring portions 113a of the looseness detection label 101, The end of the 113b that is open because it is not connected to the IC chip 111 and the bolt 2 of the bolt 2 and the base 3 to which the looseness detection label 101 is not attached are separated by the conductive ink 4. When the bolt 2 is loosened to the base 3, the bolt 2 is adhered to the base 3 so as to be separated from each other, whereby a looseness detection structure for detecting the looseness of the bolt 2 to the base 3 is configured.

Also in this embodiment, in the system shown in FIG. 5, the conduction state of the state detection wiring 113 of the looseness detection tag 101 attached to the base 3 is read by the reader/writer 5, and the state is detected by the management personal computer 6. The looseness of the bolt 2 is detected by determining whether or not the bolt 2 is loosened based on the conduction state of the wiring 113.

(Fourth Embodiment)
The RFID label of the present invention can also be used as an opening detection label for detecting unauthorized opening of a box as an adherend.

FIG. 15 is a diagram showing an example of use of the RFID label according to the fourth embodiment of the present invention, in which (a) is an external perspective view and (b) is a partially enlarged view of a side surface. The opening detection label 201 in this embodiment has the same structure as the looseness detection label 101 shown in FIG. 10, but the detailed structure such as the laminated structure of the opening detection label 201 is provided so as not to obscure the description. Are not shown. Further, since the unsealing detection label 201 has the same configuration as the looseness detection label 101 shown in FIG. 10, the components of the looseness detection label 101 shown in FIG. 10 will be described below.

As shown in FIG. 15A, the unsealing detection label 201 according to the present embodiment can also be used for unsealing detection of a metal box 202 in which a metal body 202b has a metal lid 202a openably attached. it can. At that time, the unsealing detection label 201 is attached to the lid 202a, but is not connected to the IC chip 111 of the two wiring portions 113a and 113b forming the state detection wiring 113 of the unsealing detection label 201. The side end is on the main body 202b side and is not covered with the protective film 120 and is exposed.

Therefore, as shown in FIG. 15B, the end portions of the two wiring portions 113a and 113b on the side not connected to the IC chip 111 are respectively provided with conductive ink 4 serving as a connecting means having conductivity. And adhere to the side surface of the main body 202b. As a result, the end portions of the two wiring portions 113a and 113b on the side not connected to the IC chip 111 are electrically connected to the main body 202b of the box 202 via the conductive ink 4, and the state detection wiring 113 is formed. Becomes conductive.

16A and 16B are views for explaining the operation when the box 202 to which the unsealing detection label 201 is attached as shown in FIG. 15 is unsealed, FIG. 16A is an external perspective view, and FIG. It is a partially enlarged view of the side surface of the lid 202a. It should be noted that a detailed configuration such as a laminated structure of the unsealing detection label 201 is omitted in order not to obscure the description.

When the opening detection label 201 is attached to the lid 202a of the box 202 as shown in FIG. 15 and the lid 202a is lifted to open the box 202 as shown in FIG. As shown in (b), the conductive ink 4 is peeled off from the side surface of the main body 202b and the conductive ink 4 and the main body 202b are in a non-adhesive state, whereby the wiring portions 113a and 113b forming the state detection wiring 113 are formed. The end portion not connected to the IC chip 111 and the main body 202b of the box 202 are separated from each other. As a result, the electrically connected state between these wiring portions 113a and 113b and the main body 202b is canceled, and the state detection wiring 113 becomes non-conductive.

In this way, when the box 202 to which the unsealing detection label 201 is attached is not unsealed, the two wiring portions 113a and 113b forming the state detection wiring 113 are electrically connected to the main body 202b of the box 202. As a result, the state detection wiring 113 becomes conductive, and when the box 202 is opened, the two wiring portions 113a and 113b forming the state detection wiring 113 are electrically connected to the main body 202b of the box 202. Since the state detection wiring 113 becomes non-conducting when the connection is released, the state detection wiring 113 of the unsealing detection tag 201 attached to the box 202 in the system shown in FIG. The open state of the box 202 is detected by reading the conduction state of the box 202 with the reader/writer 5 and determining whether or not the box 202 is opened based on the conduction state of the state detection wiring 113 by the management personal computer 6. become.

In addition, in the above-described embodiment, the configuration in which the two antennas 12 and 112 are connected to the IC chips 11 and 111 has been described as an example, but a configuration in which one loop-shaped antenna is connected to the IC chip is described. May be

1,101 Looseness detection label 2 Bolt 2a Head part 2b Screw part 3,103 Base 3a Screw hole 4 Conductive ink 5 Reader/writer 6 Management personal computer 10,110 Film substrate 10a Regular hexagonal area 10b, 110b Projection area 11, 111 IC Chip 12,112 Antenna 13,113 State detection wiring 13a, 13b, 113a, 113b Wiring part 20,120 Protective film 30,130 Spacer 40,50,140,150 Adhesive layer 103a Half loop wiring 110a Rectangular area 201 Open detection label 202 box 202a lid 202b main body

Claims (3)

An RFID label which is made of a conductor and is attached to an adherend having a conductive surface exposed at least in part,
A sheet base material having an adhesive layer laminated on one surface,
An antenna and a state detection wiring formed on the sheet base material,
And an IC chip which is arranged on the sheet base material so as to be connected to the antenna and the state detection wiring, detects the conduction state of the state detection wiring, and transmits the detection result in a non-contact manner via the antenna. Then
The state detection wiring includes first and second wiring portions whose one end is connected to the IC chip,
Each of the other ends of the first and second wiring portions can be electrically connected to a conductive surface of the adherend when the RFID label is adhered to the adherend by the adhesive layer. Expression
An RFID label in which the state detection wiring is in a conductive state by electrically connecting the other ends of the first and second wiring portions to the conductive surface of the adherend. The RFID label according to claim 1,
Parts to be tightened constituting the adherend,
Comprising the adherend, having a tightening member tightened to the tightening target component,
The RFID label is attached to either one of the tightening target component and the tightening member by the adhesive layer,
At least the conductive surface of the adherend that is electrically conductive and to which the RFID label is not attached among the tightening target component and the tightening member, and the other end of the first and second wiring parts. A looseness detecting structure having a connecting means for adhering one and the other so as to be separable from each other when the fastening member is loosened with respect to the fastening target component. A state detecting method using the RFID label according to claim 1,
The IC chip detecting a conduction state of the state detection wiring;
A reading unit capable of non-contact communication with the IC chip, causing the IC chip to non-contactly transmit the detection result via the antenna;
A processing unit connected to the reading unit determines a state of the adherend based on a detection result transmitted from the IC chip to the reading unit in a non-contact manner.

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