JP7084269B2 - Non-contact communication medium - Google Patents

Description

The present invention relates to a non-contact communication medium having wiring for detecting disconnection and transmitting to that effect in a non-contact manner when the wiring for detecting disconnection is disconnected.

In recent years, with the development of the information-oriented society, information is recorded on labels and tags attached to products and the like, and the products and the like are managed using these labels and tags. In information management using such labels and tags, non-contact IC labels and non-contact IC labels equipped with IC chips capable of writing and reading information in a non-contact state with respect to the labels and tags are used. Non-contact communication media using RFID technology such as type IC tags are rapidly becoming widespread due to their excellent convenience.

In such a non-contact communication medium, when the antenna is attached to an article made of metal, the antenna is affected by the metal and the communication distance is shortened. Therefore, in order to avoid the influence of metal, a non-contact communication medium is attached to an article made of metal by using a three-dimensional structure having a ground, but the structure is complicated and expensive. Will be.

Here, it is an RFID label in which RFID is attached to a label substrate, and the label substrate is composed of three foldable regions, and of the three regions, the region to which RFID is attached is separated from the adherend. Patent Document 1 discloses an RFID label that mitigates the influence of metal when the adherend is made of metal by folding it so as to hold it on the adherend.

Further, by folding a part of the base material provided with the antenna and the IC chip, the antenna and the IC chip are separated from the metal surface of the article, thereby mitigating the influence of the metal. Is disclosed in Patent Document 2.

Further, Patent Document 3 discloses a wireless IC device in which one end of an antenna is capacitively coupled to a radiation plate serving as a metal surface and the other end of the antenna is separated from the radiation plate to mitigate the influence of metal. ..

By the way, in recent years, in order to detect that the adherend has been opened by attaching a label to the adherend provided with the opened portion and detecting when the label is peeled off or broken. Various mechanisms are being considered. As one of them, a technique for detecting the opening of an adherend using an IC chip has been considered, and is disclosed in, for example, Patent Document 4.

FIG. 12 is a diagram showing an example of an IC tag that detects the opening of an adherend using an IC chip.

In this example, as shown in FIG. 12, antennas 630a and 630b for non-contact communication are formed on the substrate 610, and an IC chip 620 connected to the antennas 630a and 630b are mounted and further connected to the IC chip 620. A loop-shaped disconnection detection wiring 640 is formed and configured on the substrate 610.

A perforation 613 connecting two opposing sides is formed on the substrate 610, and the perforation 613 makes it possible to separate the two regions 611 and 612. The antennas 630a and 630b and the IC chip 620 are provided in one of the regions 611, and the disconnection detection wiring 640 is formed so as to straddle the perforation 613.

In the IC label 601 configured as described above, when the article is opened with the perforation 613 facing the opened portion of the article, the perforation 613 is broken and the substrate 610 is broken. It is separated into two regions 611 and 612, and the disconnection detection wiring 640 is disconnected accordingly. Then, the fact that the disconnection detection wiring 640 is disconnected is detected by the IC chip 620, and the fact is transmitted non-contactly via the antennas 630a and 630b, so that the article to which the IC label 601 is attached is opened. Will be recognized.

In the non-contact communication medium having the above-mentioned wiring for detecting disconnection, by detecting that the wiring for detecting disconnection is disconnected, it can be used not only for detecting the opening of the article but also for quality control of the attached article. The mechanism is disclosed in Patent Document 5.

Japanese Patent No. 4799243 Japanese Patent No. 4916841 Japanese Patent No. 6137362 Japanese Unexamined Patent Publication No. 2012-198589 Japanese Unexamined Patent Publication No. 2018-13944

Even in a non-contact communication medium having the wiring for detecting disconnection as described above, when it is used by being attached to an article to be an adherend having a metal surface, it is necessary to mitigate the influence of the metal on the non-contact communication. ..

13 is a diagram for explaining the influence of the IC label 601 shown in FIG. 12 on the IC chip 620, where (a) is a diagram showing terminals possessed by the IC chip 620, and (b) is shown in (a). It is a figure which shows the equivalent circuit between the shown terminals 621a to 621d.

As shown in FIG. 13A, the IC chip 620 in the IC label 601 shown in FIG. 12 is provided with four terminals 621a to 621d. Of these four terminals 621a to 621d, the terminal 621a is connected to the antenna 630a, the terminal 621b is connected to the antenna 630b, the terminal 621c is connected to one end of the disconnection detection wiring 640, and the terminal 621d is the disconnection detection wiring 640. It is connected to the other end of the. In the IC chip 620, the presence or absence of disconnection of the disconnection detection wiring 640 is determined by detecting the change in the resistance value between the two terminals 621c and 621d.

Here, when the IC label 601 shown in FIG. 12 is attached to an article having a metal surface, the terminals 621a, 621b and the antennas 630a, 630b of the IC chip 620 are separated from the metal surface to enable non-contact communication. The influence of metal can be mitigated. Therefore, the regions provided with the terminals 621c and 621d of the IC chip 620 and the wiring for detecting disconnection 640 are attached so as to face the metal surface, but the terminals 621a and 621b connected to the antennas 630a and 630b are attached. Although it is physically independent of the terminals 621c and 621d connected to the disconnection detection wiring 640, the resistance components R1 and R2 and the capacitance in the IC chip 620 are as shown in FIG. 13 (b). It is not completely independent because it is electrically connected via the components C1 and C2. Therefore, when the disconnection detection wiring 640 is disconnected, there is a problem that the non-contact communication characteristics via the antennas 630a and 630b are significantly changed and the communication distance is shortened.

The present invention has been made in view of the problems of the conventional technique as described above, and has a wiring for detecting disconnection, and when a disconnection occurs in the wiring for detecting disconnection, non-contact transmission to that effect is made. It is an object of the present invention to provide a non-contact communication medium capable of mitigating the influence of metal on non-contact communication when the wire for detecting disconnection is disconnected while attached to metal. ..

In order to achieve the above object, the present invention
Sheet base material with easy-to-break lines and
An antenna formed in one region of the sheet substrate via the breakable line,
The wiring for detecting disconnection formed on the sheet base material across the easily broken wire, and the wiring for detecting disconnection,
An IC chip that is arranged in the one area of the sheet base material, is connected to the antenna and the wiring for detecting disconnection, detects the disconnection of the wiring for detecting disconnection, and transmits the detection result in a non-contact manner via the antenna. When,
A loop wiring formed in the one region of the sheet base material and connecting an antenna terminal to which the antenna of the IC chip is connected and a wiring detection terminal to which the disconnection detection wiring of the IC chip is connected. Has.

In the present invention configured as described above, the IC chip detects whether or not the disconnection detection wiring has a disconnection, and the detection result is non-contact transmitted via the antenna. Here, when the antenna is attached to an article made of metal, the influence of the metal on the non-contact communication is mitigated by attaching the antenna away from the metal. When the disconnection detection wiring is not disconnected, a capacitive coupling has occurred between the disconnection detection wiring and the metal. If the disconnection detection wiring is disconnected due to the breakage of the easily broken wire from that state, the loop wiring that connects the antenna terminal to which the antenna of the IC chip is connected and the disconnection detection terminal to which the disconnection detection wiring of the IC chip is connected. This maintains the capacitive coupling with the metal, whereby the non-contact communication characteristics via the antenna are not significantly changed, and the influence of the metal on the non-contact communication is mitigated.

In this way, when the disconnection detection wiring is not disconnected, the disconnection detection wiring is capacitively coupled to the metal, and when the disconnection detection wiring is disconnected, it is connected to the antenna terminal to which the IC chip antenna is connected. The loop wiring that connects to the disconnection detection terminal to which the disconnection detection wiring of the IC chip is connected is capacitively coupled to the metal, and the capacitive coupling with the metal is maintained regardless of whether or not the disconnection detection wiring is disconnected. By doing so, it is possible to mitigate the influence of the metal on the non-contact communication when the wire for detecting the disconnection is disconnected while it is attached to the metal.

Further, if the spacer base material made of non-metal is laminated on at least the region where the antenna is formed on the surface of the sheet base material opposite to the surface on which the antenna is formed, it can be attached to an article made of metal. If this is the case, it will be easier to separate the antenna from the metal.

According to the present invention, when the disconnection detection wiring is not disconnected, the disconnection detection wiring is capacitively coupled to the metal, and when the disconnection detection wiring is disconnected, the antenna to which the IC chip antenna is connected is connected. The loop wiring that connects the terminal and the disconnection detection terminal to which the disconnection detection wiring of the IC chip is connected is capacitively coupled to the metal, and the capacitance coupling to the metal regardless of whether or not the disconnection detection wiring is disconnected. By maintaining the above, it is possible to mitigate the influence of the metal on the non-contact communication when the wire for detecting the disconnection is disconnected while it is attached to the metal.

Further, among the surfaces of the sheet base material opposite to the surface on which the antenna is formed, in the case where the spacer base material made of non-metal is laminated at least in the region where the antenna is formed, the article made of metal. It makes it easier to separate the antenna from the metal when attached to.

It is a figure which shows one embodiment of the non-contact communication medium of this invention, (a) is a surface view, (b) is a side view seen from the arrow A direction shown in (a), (c) is an IC chip. It is a figure which shows the terminal which has. It is a figure which shows an example of the adherend to which the IC label shown in FIG. 1 is attached, (a) is an external perspective view, and (b) is an external perspective view in a state where an IC label is attached. It is a figure for demonstrating the operation when the box is opened in the state which the IC label shown in FIG. 1 is attached to the box 2 shown in FIG. It is a figure which shows the result of having measured the communication distance of the IC label in the state which the IC label shown in FIG. 1 was attached to the box shown in FIG. It is a front view which shows the other embodiment of the non-contact communication medium of this invention. It is a figure which shows the result of having measured the communication distance of the IC label in the state which the IC label shown in FIG. 5 was attached to the box shown in FIG. It is a front view which shows the other embodiment of the non-contact communication medium of this invention. It is a front view which shows the other embodiment of the non-contact communication medium of this invention. It is a front view which shows the other embodiment of the non-contact communication medium of this invention. It is a figure which shows the other embodiment of the non-contact communication medium of this invention, (a) is a surface view, (b) is the cross-sectional view of AA'shown in (a). It is a figure which shows the other example of the adherend to which the IC label is attached shown in FIG. 1, (a) is an external perspective view, (b) is an external perspective view in a state where an IC label is attached. be. It is a figure which shows an example of the IC tag which detects the opening of an adherend using an IC chip. It is a figure for demonstrating the influence on the IC chip in the IC label shown in FIG. 12, (a) is the figure which shows the terminal which an IC chip has, (b) is the equivalent circuit between the terminal shown in (a). It is a figure which shows.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1A and 1B are views showing an embodiment of the non-contact communication medium of the present invention, in which FIG. 1A is a surface view, FIG. 1B is a side view taken from the direction of arrow A shown in FIG. ) Is a diagram showing terminals included in the IC chip 20.

As shown in FIG. 1, the non-contact communication medium in this embodiment is an IC label 1 in which a film substrate 10, a spacer base material 60, and an adhesive layer 70 are laminated in this order to form a label. The film substrate 10 and the spacer base material 60 have the same rectangular shape, and the pressure-sensitive adhesive layer 70 is laminated on the entire surface of the spacer base material 60 on the opposite side of the laminated surface with the film base material 10. The film substrate 10, the spacer substrate 60, and the pressure-sensitive adhesive layer 70 are formed with perforations 13 that form easy-to-break lines connecting two opposite sides, thereby separating the two regions 11 and 12. It is possible.

The film substrate 10 is a sheet base material in the present invention, and is made of, for example, a PET film having a thickness of 70 μm. Antennas 30a and 30b, disconnection detection wiring 40 and loop wiring 50 are formed on the surface of the film substrate 10 opposite to the laminated surface with the spacer base material 60, and the IC chip 20 is mounted. ..

The antennas 30a and 30b are formed in one of the two regions 11 and 12 of the film substrate 10 by, for example, a copper foil having a thickness of 18 μm.

The disconnection detection wiring 40 has one end in one of the two regions 11 and 12 of the film substrate 10, extends from there to the other region 12, and is folded back to the other region 11. It has a loop shape having a portion, whereby it is formed so as to straddle the perforations 13 of the film base material 10. Examples of the wiring for detecting disconnection 40 include a wiring made of a copper foil having a thickness of 18 μm.

The IC chip 20 is provided with two antenna terminals 21a and 21b and two disconnection detection terminals 21c and 21d on one surface, and these antenna terminals 21a and 21b and disconnection detection terminals 21c and 21d are provided. The surface serves as a mounting surface and is mounted on one of the two regions 11 and 12 of the film substrate 10. The antenna terminals 21a and 21b of the IC chip 20 are connected to one ends of the antennas 30a and 30b, respectively, and the disconnection detection terminals 21c and 21d of the IC chip 20 are connected to both ends of the loop of the disconnection detection wiring 40, respectively. Has been done. The IC chip 20 detects the resistance value of the disconnection detection wiring 40 by passing a current due to electric power obtained by non-contact communication via the antennas 30a and 30b to the disconnection detection wiring 40, and disconnects the wire based on the resistance value. The disconnection of the detection wiring 40 is detected, the detection result is converted into digital information, and non-contact transmission is performed via the antennas 30a and 30b. Examples of the IC chip 20 include NXP's UCODE G2iM +.

The loop wiring 50 is formed in one of the two regions 11 and 12 of the film substrate 10, and is formed in the vicinity of the connection end portion of the antenna 30b with the antenna terminal 21b of the IC chip 20 and for detecting disconnection. The antenna terminal 21b of the IC chip 20 and the wiring detection terminal 21d of the IC chip 20 are connected by being connected to the vicinity of the connection end portion of the IC chip 20 of the wiring 40 with the wiring detection terminal 21d. The loop wiring 50 has a shape such that a part of the antenna 30b and a part of the wire for detecting disconnection 40 form a rectangle, and is made of, for example, a copper foil having a thickness of 18 μm.

The spacer base material 60 is made of a non-metal, and for example, PORON manufactured by Rogers Inoac can be used.

The pressure-sensitive adhesive layer 70 is laminated by applying, for example, a TL-85 series adhesive manufactured by Lintec Corporation on the surface of the spacer base material 60 opposite to the surface on which the film substrate 10 is laminated.

The method of using the IC label 1 configured as described above and the operation at that time will be described below.

2A and 2B are views showing an example of an adherend to which the IC label 1 shown in FIG. 1 is attached. FIG. 2A is an external perspective view, and FIG. 2B is a state in which the IC label 1 is attached. It is an external perspective view.

The IC label 1 shown in FIG. 1 is used, for example, for detecting the opening of a metal box 2 having a metal lid 2a attached to a metal main body 2b so as to be openable and closable, as shown in FIG. 2A. Will be done.

When the IC label 1 shown in FIG. 1 is used for detecting the opening of the metal box 2, as shown in FIG. 2B, the lid 2a and the main body 2b, which are the opening portions of the box 2, are used. The IC label 1 is attached to the box 2 so that the perforation 13 overlaps the boundary portion. At that time, since the height of the lid 2a from the boundary portion with the main body 2b is lower than the width of the region 11 in the connecting direction of the regions 11 and 12 of the IC label 1, the antennas 30a and 30b face the box 2. It is preferable that the antennas 30a and 30b are separated from the lid 2a and the main body 2b.

FIG. 3 is a diagram for explaining the operation when the box 2 is opened while the IC label 1 shown in FIG. 1 is attached to the box 2 shown in FIG.

When the IC label 1 shown in FIG. 1 is attached to the box 2 as shown in FIG. 2 and the box 2 is not opened, the perforation 13 is broken as shown in FIG. 3 (a). As a result, the disconnection detection wiring 40 is not disconnected. In that state, if an external device that performs non-contact communication with the IC label 1 is held over the IC label 1, a current is supplied to the disconnection detection wiring 40 by the power supplied from the external device. Since the disconnection detection wiring 40 is not disconnected, the resistance value of the disconnection detection wiring 40 itself is detected in the IC chip 20.

In the IC chip 20, when the detected resistance value is the resistance value of the disconnection detection wiring 40 itself, it is determined that the disconnection detection wiring 40 has not been disconnected, and the determination result is the disconnection detection wiring 40. As a result of detecting the disconnection, it is converted into digital information and transmitted non-contactly to an external device via the antennas 30a and 30b. When the disconnection detection wiring 40 is disconnected, the resistance value detected by the IC chip 20 becomes almost infinite as described later. Therefore, in the IC chip 20, the disconnection detection wiring 40 is disconnected. As the resistance value for determining that the above is not generated, not the resistance value of the disconnection detection wiring 40 itself but the one having a certain threshold value or less may be used.

On the other hand, when the box 2 is opened while the IC label 1 shown in FIG. 1 is attached to the box 2 as shown in FIG. 2, the perforations 13 are formed as shown in FIG. 3 (b). It breaks, which causes the disconnection detection wiring 40 to disconnect. In that state, an external device that performs non-contact communication with the IC label 1 is placed over the IC label 1, so that even if a current is supplied to the disconnection detection wiring 40 by the power supplied from the external device, Since the disconnection detection wiring 40 is disconnected, no current flows through the disconnection detection wiring 40, so that the resistance value detected by the IC chip 20 becomes almost infinite.

In the IC chip 20, when the detected resistance value is almost infinite, it is determined that the wiring for disconnection detection 40 has a disconnection, and the determination result is the detection result of the disconnection of the wiring for disconnection detection 40. It is converted into digital information and transmitted non-contactly to an external device via the antennas 30a and 30b. Since the resistance value detected by the IC chip 20 becomes almost infinite when the disconnection detection wiring 40 is disconnected, it is said that the disconnection detection wiring 40 is disconnected in the IC chip 20. The resistance value for determination is not almost infinite, and a wire having a certain threshold value or more larger than the resistance value of the disconnection detection wiring 40 itself may be used.

In this way, whether or not the disconnection detection wiring 40 is disconnected is transmitted from the IC label 1 to the external device, and in the external device, if the disconnection detection wiring 40 is not disconnected, the box 2 is used. It can be determined that the box 2 has not been opened, and if the wiring for detecting disconnection 40 is disconnected, it can be determined that the box 2 has been opened.

Here, the operation due to the provision of the loop wiring 50 will be described.

FIG. 4 is a diagram showing the results of measuring the communication distance of the IC label 1 in a state where the IC label 1 shown in FIG. 1 is attached to the box 2 shown in FIG. In the measurement of the communication distance of the IC label 1, a handy reader / writer of AT880 manufactured by ATiD is used as an external device, a frequency of the 920 MHz band is used, and the output of 1.0 W is non-contact with the IC label 1. Communicated.

As a result of measuring the communication distance when the distance d between the antennas 30a and 30b of the IC label 1 shown in FIG. 3 and the lid 2a serving as the metal end face is 5.0 mm, as shown in FIG. 4, the wiring for detecting disconnection is detected. The communication distance was 560 mm when the 40 was not disconnected, whereas when the disconnection detection wiring 40 was disconnected, the communication distance was extremely 250 mm if the loop wiring 50 was not provided. It will be shortened. This is because, as described above, in the terminals provided on the IC chip 20, the terminals connected to the antennas 30a and 30b and the terminals connected to the disconnection detection wiring 40 are connected via a resistance component and a capacitance component. Since the wiring is electrically connected and not completely independent, the non-contact communication characteristics via the antennas 30a and 30b change significantly when the disconnection detection wiring 40 is disconnected. It is due to the fact that it ends up.

On the other hand, when the loop wiring 50 is provided as in the IC label 1 shown in FIG. 1, even if the disconnection detection wiring 40 is disconnected, the communication distance is 1040 mm as shown in FIG. 4, and the disconnection detection is detected. The communication distance will not be extremely short compared to the state where the wiring 40 is not broken. This is because the loop wiring 50 connecting the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 causes capacitive coupling with the lid 2a and the main body 2b, whereby the antennas 30a and 30b are connected. This is because the non-contact communication characteristics via the metal do not change significantly, and the influence of the metal on the non-contact communication is alleviated.

Further, even when the distance d between the antennas 30a and 30b of the IC label 1 shown in FIG. 3 and the lid 2a serving as the metal end face is 10.0 mm, the disconnection detection wiring 40 is disconnected as shown in FIG. In the state where the communication distance was 560 mm, the communication distance was 560 mm, but in the state where the disconnection detection wiring 40 was disconnected, the communication distance became extremely short to 240 mm if the loop wiring 50 was not provided. However, if the loop wiring 50 is provided, the communication distance becomes 900 mm, and the communication distance does not become extremely short compared to the state where the disconnection detection wiring 40 is not disconnected.

Further, even when the distance d between the antennas 30a and 30b of the IC label 1 shown in FIG. 3 and the lid 2a serving as the metal end face is 20.0 mm, the disconnection detection wiring 40 is disconnected as shown in FIG. In the state where the communication distance was 580 mm, the communication distance was 580 mm, but in the state where the disconnection detection wiring 40 was disconnected, the communication distance became extremely short to 220 mm if the loop wiring 50 was not provided. However, if the loop wiring 50 is provided, the communication distance becomes 900 mm, and the communication distance does not become extremely short compared to the state where the disconnection detection wiring 40 is not disconnected.

In this way, when the disconnection detection wiring 40 is not disconnected, the disconnection detection wiring 40 is capacitively coupled to the metal lid 2a or the main body 2b, and when the disconnection detection wiring 40 is disconnected, the IC The loop wiring 50 connecting the antenna terminal 21b of the chip 20 and the disconnection detection terminal 21d of the IC chip 20 is capacitively coupled to the lid 2a and the main body 2b, regardless of whether or not the disconnection detection wiring 40 is disconnected. By maintaining the capacitive coupling with the lid 2a and the main body 2b, the wiring 40 for disconnection detection is broken while the IC label 1 is attached to the metal box 2 shown in FIG. The effect on non-contact communication can be mitigated.

(Other embodiments)
FIG. 5 is a surface view showing another embodiment of the non-contact communication medium of the present invention.

As shown in FIG. 5, the non-contact communication medium in the present embodiment has the loop wiring 150 as an antenna in one of the two regions 11 and 12 of the film substrate 10 with respect to the one shown in FIG. It is connected to the end of the IC chip 20 of 30b on the side opposite to the connection end of the IC chip 20 with the antenna terminal 21b and the vicinity of the connection end of the IC chip 20 of the disconnection detection wiring 40 with the wiring detection terminal 21d. The IC label 101 is different in that the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 are connected.

The IC label 101 configured as described above can also be used by being attached to the box 2 as shown in FIG. Even in that case, when the box 2 is opened, the perforation 13 is broken and the disconnection detection wiring 40 is disconnected, and the presence or absence of this disconnection is detected to determine that the box 2 has been opened. can do.

FIG. 6 is a diagram showing the results of measuring the communication distance of the IC label 101 in a state where the IC label 101 shown in FIG. 5 is attached to the box 2 shown in FIG. Also in this embodiment, in the measurement of the communication distance of the IC label 101, a handy reader / writer of AT880 manufactured by ATiD is used as an external device, the frequency of the 920 MHz band is used, and the output of the IC label 101 is 1.0 W. Contactless communication was performed with.

Also in the IC label 101 shown in FIG. 5, as a result of measuring the communication distance when the distance between the antennas 30a and 30b and the lid 2a which is the metal end face is 5.0 mm, as shown in FIG. 6, for detecting disconnection. The communication distance was 560 mm when the wiring 40 was not broken, whereas the communication distance was 250 mm when the loop wiring 150 was not provided when the wire break detection wiring 40 was broken. It will be shortened to.

On the other hand, when the loop wiring 50 is provided as in the IC label 101 shown in FIG. 6, even if the disconnection detection wiring 40 is disconnected, the communication distance is 1140 mm as shown in FIG. 6, and the disconnection detection is detected. The communication distance will not be extremely short compared to the state where the wiring 40 is not broken.

Further, even when the distance between the antennas 30a and 30b of the IC label 101 shown in FIG. 5 and the lid 2a serving as the metal end face is 10.0 mm, the wiring for disconnection detection 40 is disconnected as shown in FIG. In the state where the communication distance was 560 mm in the non-existing state, in the state where the disconnection detection wiring 40 was disconnected, the communication distance became extremely short to 240 mm if the loop wiring 150 was not provided. However, if the loop wiring 150 is provided, the communication distance becomes 960 mm, and the communication distance is not extremely shortened with respect to the state where the disconnection detection wiring 40 is not disconnected.

Further, even when the distance between the antennas 30a and 30b of the IC label 101 shown in FIG. 5 and the lid 2a serving as the metal end face is 20.0 mm, the wiring for disconnection detection 40 is disconnected as shown in FIG. The communication distance was 580 mm in the non-disconnected state, whereas in the disconnected state, the communication distance becomes 220 mm and the communication distance becomes extremely short if the loop wiring 150 is not provided. However, if the loop wiring 150 is provided, the communication distance becomes 780 mm, and the communication distance is not extremely shortened with respect to the state where the disconnection detection wiring 40 is not disconnected.

As described above, even in the IC label 101 shown in FIG. 5, when the disconnection detection wiring 40 is not disconnected, the disconnection detection wiring 40 is capacitively coupled to the metal lid 2a and the main body 2b to detect the disconnection. When the wiring 40 is disconnected, the loop wiring 150 connecting the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 is capacitively coupled to the lid 2a and the main body 2b, and the wiring 40 for disconnection detection is formed. By maintaining the capacitive coupling with the lid 2a and the main body 2b regardless of whether or not the wire is broken, the IC label 101 is attached to the metal box 2 shown in FIG. 2 for detecting the disconnection. The influence of the box 2 on the non-contact communication when the wiring 40 is broken can be mitigated.

FIG. 7 is a surface view showing another embodiment of the non-contact communication medium of the present invention.

As shown in FIG. 7, the non-contact communication medium in the present embodiment has the loop wiring 250 as an antenna in one of the two regions 11 and 12 of the film substrate 10 with respect to the one shown in FIG. By connecting to the vicinity of the center of 30b and the vicinity of the connection end between the wiring detection terminal 21d of the IC chip 20 of the wire disconnection detection wiring 40, the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal of the IC chip 20 are connected. The IC label 201 is different in that it is connected to the 21d.

The IC label 201 configured as described above can also be used by being attached to the box 2 as shown in FIG. Even in that case, when the box 2 is opened, the perforation 13 is broken and the disconnection detection wiring 40 is disconnected, and the presence or absence of this disconnection is detected to determine that the box 2 has been opened. can do.

At that time, when the disconnection detection wiring 40 is not disconnected, the disconnection detection wiring 40 is capacitively coupled to the metal lid 2a or the main body 2b, and the disconnection detection wiring 40 is disconnected. The loop wiring 250 connecting the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 is capacitively coupled to the lid 2a and the main body 2b, regardless of whether or not the disconnection detection wiring 40 is disconnected. By maintaining the capacitive coupling with the lid 2a and the main body 2b, the wiring 40 for disconnection detection is broken while the IC label 201 is attached to the metal box 2 shown in FIG. The effect on non-contact communication can be mitigated.

FIG. 8 is a surface view showing another embodiment of the non-contact communication medium of the present invention.

As shown in FIG. 8, the non-contact communication medium in this embodiment has a loop wiring 350 forming a substantially triangle with a part of the antenna 30b and a part of the disconnection detection wiring 40 with respect to the one shown in FIG. The IC label 301 is different in that it has such a shape and that instead of the perforation 13, each of the regions to be both ends of the perforation 13 is provided with tapered notches 314. In the present embodiment, the line connecting the two notches 314 is the easily broken line in the present invention.

The IC label 301 configured as described above can also be used by being attached to the box 2 as shown in FIG. Even in that case, when the box 2 is opened, the notch 314 triggers a break and separates the area 11 and the area 12, so that the disconnection detection wiring 40 is disconnected and the presence or absence of this disconnection is detected. By doing so, it can be determined that the box 2 has been opened.

At that time, when the disconnection detection wiring 40 is not disconnected, the disconnection detection wiring 40 is capacitively coupled to the metal lid 2a or the main body 2b, and the disconnection detection wiring 40 is disconnected. The loop wiring 350 connecting the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 is capacitively coupled to the lid 2a and the main body 2b, regardless of whether or not the disconnection detection wiring 40 is disconnected. By maintaining the capacitive coupling with the lid 2a and the main body 2b, the wiring 40 for disconnection detection is broken while the IC label 301 is attached to the metal box 2 shown in FIG. The effect on non-contact communication can be mitigated.

FIG. 9 is a surface view showing another embodiment of the non-contact communication medium of the present invention.

As shown in FIG. 9, the non-contact communication medium in this embodiment has a shape such that the loop wiring 450 forms a substantially elliptical shape with respect to the one shown in FIG. 1, and the perforation 13 has a shape. Instead, the IC label 301 differs in that tapered notches 314 are provided in each of the regions at both ends of the perforation 13. Also in this embodiment, the line connecting the two notches 314 is the easily broken line in the present invention.

The IC label 401 configured as described above can also be used by being attached to the box 2 as shown in FIG. Even in that case, when the box 2 is opened, the notch 314 triggers a break and the region 11 and the region 12 are separated from each other, so that the disconnection detection wiring 40 is disconnected, and the presence or absence of this disconnection is detected. By doing so, it can be determined that the box 2 has been opened.

At that time, when the disconnection detection wiring 40 is not disconnected, the disconnection detection wiring 40 is capacitively coupled to the metal lid 2a or the main body 2b, and the disconnection detection wiring 40 is disconnected. The loop wiring 450 connecting the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 is capacitively coupled to the lid 2a and the main body 2b, regardless of whether or not the disconnection detection wiring 40 is disconnected. By maintaining the capacitive coupling with the lid 2a and the main body 2b, the wiring 40 for disconnection detection is broken while the IC label 401 is attached to the metal box 2 shown in FIG. The effect on non-contact communication can be mitigated.

10A and 10B are views showing another embodiment of the non-contact communication medium of the present invention, where FIG. 10A is a surface view and FIG. 10B is a cross-sectional view taken along the line AA'shown in FIG. 10A.

As shown in FIG. 10, in the non-contact communication medium in this embodiment, the loop wiring 550 is formed on the laminated surface of the film substrate 10 with the spacer base material 60, and the antenna 30b and the disconnection are formed. The IC label 501 is different in that the detection wiring 40 and the loop wiring 550 are connected to each other via a through hole 580 formed in the film substrate 10.

The IC label 501 configured as described above can also be used by being attached to the box 2 as shown in FIG. Even in that case, when the box 2 is opened, the perforation 13 is broken and the disconnection detection wiring 40 is disconnected, and the presence or absence of this disconnection is detected to determine that the box 2 has been opened. can do.

At that time, when the disconnection detection wiring 40 is not disconnected, the disconnection detection wiring 40 is capacitively coupled to the metal lid 2a or the main body 2b, and the disconnection detection wiring 40 is disconnected. The loop wiring 550 connecting the antenna terminal 21b of the IC chip 20 and the disconnection detection terminal 21d of the IC chip 20 is capacitively coupled to the lid 2a and the main body 2b, regardless of whether or not the disconnection detection wiring 40 is disconnected. By maintaining the capacitive coupling with the lid 2a and the main body 2b, the wiring 40 for disconnection detection is broken while the IC label 501 is attached to the metal box 2 shown in FIG. The effect on non-contact communication can be mitigated.

11A and 11B are views showing another example of the adherend to which the IC label 1 shown in FIG. 1 is attached, in which FIG. 11A is an external perspective view and FIG. 11B is an IC label 1 attached. It is an external perspective view in a state.

As shown in FIG. 11, the adherend to which the IC label 1 shown in FIG. 1 is attached is configured such that a metal lid 102a is openably and closably attached to a metal main body 102b, and the lid 102a is configured. The box 102 may have a height from the boundary portion with the main body 102b higher than the width of the region 11 in the connecting direction of the regions 11 and 12 of the IC label 1 shown in FIG.

When the IC label 1 shown in FIG. 1 is attached to the box 102 configured in this way, the IC label 1 overlaps the perforation 13 at the boundary between the lid 2a and the main body 2b, which is the opening portion of the box 2. Is attached to the box 2 so that the antennas 30a and 30b face the front surface of the metal lid 102a, and a spacer base material made of non-metal is sandwiched between the antennas 30a and 30b and the lid 102a. By interposing the 60, the antennas 30a and 30b can be separated from the metal lid 102a.

As described above, in the IC label 1 shown in FIG. 1, the spacer base material 60 made of non-metal is laminated on the entire surface of the film substrate 10 opposite to the surface on which the antennas 30a and 30b are formed. Therefore, when the antennas 30a and 30b are attached to an article made of metal, the antennas 30a and 30b can be separated from the metal even if they face the metal, and the antennas 30a and 30b can be easily separated from the metal. However, as shown in FIG. 2, when the IC label can be attached to the adherend so that the antennas 30a and 30b do not face the metal, the IC is used so that the antennas 30a and 30b do not face the metal. It is preferable to attach a label.

As described above, the spacer base material 60 separates the antennas 30a and 30b from the metal adherend to which the IC label 1 is attached, so that the antennas 30a and 30b of the film base material 10 are used. Of the surfaces opposite to the formed surface, at least the antennas 30a and 30b may be laminated on the formed region 11.

Further, in the above-described embodiment, the configuration in which the loop wirings 50, 150, 250, 350, 450, 550 are connected to only one of the antennas 30a and 30b is described as an example. It may be configured to be connected to any of the antennas 30a and 30b.

Further, in the above-described embodiment, the perforation 13 and the notch 314 form an easy-to-break line, but the adherend is in a state where the non-contact communication medium of the present invention is attached to the adherend. It is not limited to these as long as it makes it easy for the film substrate 10 as the sheet base material to break in a specific region when it is opened or the like.

Further, in the above-described embodiment, as a method of using the IC label shown in FIG. 1 and the like, an example of using the IC label to detect the opening of the boxes 2 and 102 shown in FIGS. 2 and 11 is given as an example. As described above, if the IC label is broken and the disconnection detection wiring is disconnected when the adherend is damaged, it may be used for quality control of the adherend.

Further, as the above-described embodiment, the one in the form of a label that can be attached to the adherend by laminating the pressure-sensitive adhesive layer 70 on one surface has been described as an example, but the pressure-sensitive adhesive layer 70 has been described. Instead of using it, it may be fixed to the adherend with a resin such as epoxy in a state of being in contact with the adherend.

1,101,201,301,401,501 IC label 2,102 Box 2a, 102a Lid 2b, 102b Main body 10 Film substrate 11,12 Area 13 Perforation 20 IC chip 21a, 21b Antenna terminal 21c, 21d Disconnection detection terminal 30a , 30b Antenna 40 Wire for disconnection detection 50, 150, 250, 350, 450, 550 Loop wiring 60 Spacer base material 70 Adhesive layer 314 Notch 580 Through hole

Claims (2)

Sheet base material with easy-to-break lines and
An antenna formed in one region of the sheet substrate via the breakable line,
The wiring for detecting disconnection formed on the sheet base material across the easily broken wire, and the wiring for detecting disconnection,
An IC chip that is arranged in the one area of the sheet base material, is connected to the antenna and the wiring for detecting disconnection, detects the disconnection of the wiring for detecting disconnection, and transmits the detection result in a non-contact manner via the antenna. When,
A loop wiring formed in the one region of the sheet base material and connecting the antenna terminal to which the antenna of the IC chip is connected and the disconnection detection terminal to which the disconnection detection wiring of the IC chip is connected. A non-contact communication medium having. In the non-contact communication medium according to claim 1,
A non-contact communication medium in which a spacer base material made of a non-metal is laminated on at least a region of the surface of the sheet base material opposite to the surface on which the antenna is formed.

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