CN110774353A - Aluminum-based cover plate for PCB drilling and preparation method thereof - Google Patents
Aluminum-based cover plate for PCB drilling and preparation method thereof Download PDFInfo
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- CN110774353A CN110774353A CN201910876403.5A CN201910876403A CN110774353A CN 110774353 A CN110774353 A CN 110774353A CN 201910876403 A CN201910876403 A CN 201910876403A CN 110774353 A CN110774353 A CN 110774353A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/24—Perforating by needles or pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses an aluminum-based cover plate for PCB drilling and a preparation method thereof. According to the invention, through reasonable collocation of the structure, the water-soluble lubricating resin layer is used as the outermost layer, the aluminum foil is used as a supporting material, and the bonding heat-conducting resin layer is arranged between the water-soluble lubricating resin layer and the aluminum foil, so that the aluminum-based cover plate for PCB drilling with gradually-changed hardness is prepared, and the technical problems that the surface resin layer of the existing film-coated aluminum-based cover plate for PCB drilling is poor in adhesion with the aluminum foil and a drill needle is wound and holes are not easy to clean in the drilling process are solved.
Description
Technical Field
The invention relates to the field of PCB processing and manufacturing, in particular to an aluminum-based cover plate for PCB drilling and a preparation method thereof.
Background
PCB drilling is with aluminium base cover plate of tectorial membrane is a novel functional material that has risen in recent years, make through adding auxiliaries such as emollient at ordinary aluminium foil surface coating one deck functional polymer resin, the aluminium base cover plate of tectorial membrane for the drilling of PCB of preparation has combined aluminium foil and functional polymer resin's dual advantage, on the one hand, functional resin coating can cushion the drill bit and plays the guide effect to the income of drill bit, thereby improve the hole site precision and reduce the rate of cutting off the needle, on the other hand, the heat conductivity of aluminium foil is better, can play better radiating effect to the drill bit. However, most of the aluminum-based coated cover plate products on the market have strong surface resin layer toughness and poor water solubility, and filament-shaped cuttings are easily formed to be wound on a drill point and attached to the hole wall in the drilling process, so that the problems of high needle breakage rate, difficult hole cleaning and the like are caused.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide an aluminum-based cover plate for PCB drilling and a preparation method thereof, and aims to solve the problems that the surface resin layer of the existing coated aluminum-based cover plate for PCB drilling is poor in adhesion with an aluminum foil, and a drill point is wound and holes are not easy to clean in the drilling process.
The technical scheme of the invention is as follows:
the utility model provides a PCB is aluminium base apron for drilling, wherein, includes aluminium foil, bonding heat conduction resin layer and the water-soluble lubricating resin layer that from supreme range upon range of setting gradually down.
The aluminum-based cover plate for PCB drilling comprises, by weight, 70-90 parts of bonding resin, 10-20 parts of heat conducting compound and 5-10 parts of surfactant.
The aluminum-based cover plate for PCB drilling is characterized in that the bonding resin is one or more of epoxy resin, acrylic resin or urea resin.
The aluminum-based cover plate for PCB drilling is characterized in that the heat conducting compound is one or more of silicon dioxide, zinc oxide, magnesium hydroxide, aluminum oxide and aluminum nitride.
The aluminum-based cover plate for PCB drilling comprises, by weight, 25-30 parts of lubricating resin, 30-40 parts of bonding resin, 1-3 parts of surfactant and 1-2 parts of defoaming agent.
The aluminum-based cover plate for PCB drilling is characterized in that the lubricating resin is one or more of polyacrylamide, sodium polyacrylate, polyethylene glycol, polyvinyl alcohol, polymethacrylic acid, polyvinylpyrrolidone, sodium alginate, sodium carboxymethyl cellulose and carboxyethyl cellulose.
The aluminum-based cover plate for PCB drilling is characterized in that the thickness of the bonding heat-conducting resin layer is 5-10 um.
The aluminum-based cover plate for PCB drilling is characterized in that the thickness of the water-soluble lubricating resin layer is 30-40 um.
The aluminum-based cover plate for PCB drilling is characterized in that the thickness of the aluminum foil is 80-140 um.
A method for preparing an aluminum-based cover plate for PCB drilling comprises the following steps:
preparing a bonding heat-conducting resin layer on the surface of the aluminum foil;
and preparing a water-soluble lubricating resin layer on the surface of the bonding heat-conducting resin layer.
Has the advantages that: according to the invention, the structure is reasonably matched, the water-soluble lubricating resin layer is used as the outermost layer, the aluminum foil is used as a supporting material, the bonding heat-conducting resin layer is arranged between the water-soluble lubricating resin layer and the aluminum foil, the aluminum-based cover plate for PCB drilling with gradually-changed hardness is prepared, the bonding performance between the water-soluble lubricating resin layer and the aluminum foil is improved by using the bonding heat-conducting resin layer, meanwhile, the water-soluble lubricating resin layer is in a molten state at high temperature, filamentous cuttings are not easy to form, and part of resin attached to the inside of a hole while drilling needle is easy to remove due to good water solubility of the resin. Furthermore, the hardness of the prepared aluminum-based cover plate for PCB drilling is in a gradual change trend, so that the aluminum-based cover plate can play a role in guiding the drilling of the drill point, the rate of broken pins is effectively reduced, and the drilling precision is improved.
Drawings
Fig. 1 is a schematic structural diagram of an aluminum-based cover plate for PCB drilling according to a preferred embodiment of the present invention.
FIG. 2 is a flow chart of a method for manufacturing an aluminum-based cover plate for PCB drilling according to a preferred embodiment of the present invention.
Detailed Description
The invention provides an aluminum-based cover plate for PCB drilling and a preparation method thereof, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and more clear. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a schematic structural view of an aluminum-based cover plate for PCB drilling according to a preferred embodiment of the present invention, which includes an aluminum foil 10, an adhesive heat-conducting resin layer 20, and a water-soluble lubricating resin layer 30, which are sequentially stacked from bottom to top.
Particularly, the surface resin layer of the existing film-coated aluminum-based cover plate for PCB drilling is strong in toughness and poor in water solubility, the problems that the needle breakage rate is high, holes are not easy to clean and the like are easily caused in the drilling process, if a high polymer material with good water solubility is selected for the surface resin layer of the cover plate, the adhesion of the resin layer and an aluminum foil is insufficient, and the phenomenon of layering occurs when demoulding or drilling occurs, so that the overall performance of the film-coated aluminum-based cover plate is influenced.
Based on the problems in the prior art, in the embodiment, the surface of the aluminum foil is coated with the bonding heat-conducting resin layer, and the surface of the bonding heat-conducting resin layer is coated with the water-soluble lubricating resin layer, wherein the water-soluble lubricating resin layer has a slightly soft hardness and can lubricate and buffer the drill point, so that the guide effect on the drilling of the drill point can be realized, the technical problem that the needle breakage rate is higher due to the fact that the toughness of surface layer resin is too strong in the coated aluminum sheet in the prior art is solved, meanwhile, the water-soluble lubricating resin layer has good water solubility and a low melting point, when the temperature of a drill bit reaches more than 80 ℃, the water-soluble lubricating resin layer is in a molten state, long-thread cuttings are not easy to form in the hole rotating process, and part of resin attached to the hole wall of.
Further, still be provided with the one deck heat conduction resin layer that bonds between aluminium foil and water-soluble lubricating resin layer, the heat conduction resin layer that bonds has increased the bonding strength of water-soluble lubricating resin layer and aluminium foil for the aluminium base apron is resistant to save, difficult drawing of patterns for the drilling of PCB of preparation, simultaneously, because the hardness of bonding heat conduction resin layer is higher than water-soluble lubricating resin layer can play transition, heat conduction and stable effect to the drill point. In addition, the aluminum foil used as the supporting material has good heat-conducting property and proper hardness, and can play a better heat-radiating role for a drill bit and be beneficial to inhibiting the generation of burrs on the surface of the PCB during the drilling process of the PCB cover plate.
Through rationally arranging the structure in this embodiment, regard water-soluble lubricating resin layer as outmost, the aluminium foil is as support material water-soluble lubricating resin layer with set up the bonding heat conduction resin layer between the aluminium foil, prepared the aluminium base apron for PCB drilling that hardness is gradual change trend, the adhesion of the surface resin layer of solving current PCB drilling for the aluminium base apron of tectorial membrane is poor with the aluminium foil and the drilling in-process drill point kinks, the difficult abluent technical problem of hole, simultaneously, because the hardness of the aluminium base apron for PCB drilling of preparation is gradual change trend, play the guide effect to the income of drill point and realize reducing the broken needle rate.
In some embodiments, the binding thermal conductive resin includes, by weight, 70 to 90 parts of a binding resin, 10 to 20 parts of a thermal conductive compound, and 5 to 10 parts of a surfactant. In the embodiment, 70-90 parts by weight of bonding resin, 10-20 parts by weight of heat conducting compound and 5-10 parts by weight of surfactant are uniformly stirred, and the bonding heat conducting resin is prepared after standing and defoaming, wherein the heat conducting compound is one or more of silicon dioxide, zinc oxide, magnesium hydroxide, aluminum oxide and aluminum nitride, and the surfactant is one or more of sodium dodecyl benzene sulfonate, sodium methylene dinaphthalene sulfonate and polyoxyethylene fatty acid ester.
In some embodiments, the binder resin is one or more of an epoxy resin, an acrylic resin, and a urea resin.
In some embodiments, the water-soluble lubricating resin comprises, by weight components, 25 to 30 parts of lubricating resin, 30 to 40 parts of binding resin, 1 to 3 parts of surfactant, and 1 to 2 parts of defoamer. In the embodiment, the water-soluble lubricating resin is prepared by uniformly stirring 25-30 parts by weight of lubricating resin, 30-40 parts by weight of bonding resin, 1-3 parts by weight of surfactant and 1-2 parts by weight of defoaming agent, wherein the surfactant is fatty acid polyoxyethylene ester or fatty alcohol polyoxyethylene ether, and the defoaming agent is a water-soluble polyurethane defoaming agent.
In some embodiments, the lubricating resin is one or more of polyacrylamide, sodium polyacrylate, polyethylene glycol, polyvinyl alcohol, polymethacrylic acid, polyvinylpyrrolidone, sodium alginate, sodium carboxymethyl cellulose, and carboxyethyl cellulose.
In some embodiments, the binding resin is an aqueous polyurethane resin.
In some embodiments, the thickness of the adhesive thermal conductive resin layer is 5 to 10 um. In this embodiment, the thickness of the bonding heat-conducting resin layer is 5 to 10um, and if the thickness of the bonding resin layer is too large, the resistance to the drill bit increases, and the pin is easily broken, while if the thickness is too small, the bonding property between the water-soluble lubricating resin layer and the copper foil is poor, and the mold is easily released in the using process.
In some embodiments, the water-soluble lubricating resin layer has a thickness of 30-40 um. In the embodiment, if the thickness of the water-soluble lubricating resin layer is too small, the guiding and positioning capabilities of the drill point are poor, the drilling precision is low, the drill point is easy to break in the drilling process, and meanwhile, the prepared aluminum-based cover plate for PCB drilling is poor in heat dissipation performance; if the thickness of the water-soluble lubricating resin layer is too large, resistance to the drill bit is large, and the drill bit is likely to be broken during drilling.
In some embodiments, the aluminum foil has a thickness of 80-140 um. In this embodiment, if the thickness of the aluminum foil is less than 80um, the upper burrs are easily generated during the drilling process of the PCB, and if the thickness of the aluminum foil is greater than 140um, the resistance to the drill bit is increased, and the pin is easily broken, so that the thickness of the aluminum foil is more suitable within the range of 80-140 um.
In some embodiments, there is also provided a method for preparing an aluminum-based cover plate for PCB drilling, wherein as shown in fig. 2, the method comprises the steps of:
s10, coating a layer of bonding heat-conducting resin layer on the surface of the aluminum foil;
s20, coating a water-soluble lubricating resin layer on the surface of the bonding heat-conducting resin layer.
In the embodiment, the bonding heat-conducting resin layer is arranged between the water-soluble lubricating resin layer and the aluminum foil, so that the aluminum-based cover plate for PCB drilling with the hardness in a gradual change trend is prepared, the bonding performance between the water-soluble lubricating resin layer and the aluminum foil is improved by using the bonding heat-conducting resin layer, meanwhile, the water-soluble lubricating resin layer is in a molten state at high temperature, filamentous cuttings are not easy to form, part of resin is attached to the resin in the hole while drilling, and the resin is good in water solubility and easy to remove. Furthermore, the hardness of the prepared aluminum-based cover plate for PCB drilling is in a gradual change trend, so that the aluminum-based cover plate can play a role in guiding the drilling of the drill point, the rate of broken pins is effectively reduced, and the drilling precision is improved.
The aluminum-based cover plate for drilling the PCB and the preparation method thereof are further explained by the following specific embodiments:
example 1:
preparation of water-soluble lubricating resin: adding 5 parts of polyacrylamide, 2 parts of sodium polyacrylate, 10 parts of polyethylene glycol, 7 parts of polymethacrylic acid and 3 parts of sodium alginate into 40 parts of distilled water in sequence, stirring at a high speed at room temperature to fully dissolve the components, adding 30 parts of waterborne polyurethane resin, 1 part of fatty acid polyoxyethylene ester, 1 part of waterborne polyurethane defoaming agent and 1 part of fatty alcohol polyoxyethylene ether, stirring uniformly, filtering, standing and defoaming for later use.
Preparing the adhesive heat-conducting resin: mixing 25 parts of epoxy resin, 45 parts of acrylic resin and 10 parts of urea-formaldehyde resin, stirring at room temperature to fully mix the epoxy resin, the acrylic resin and the urea-formaldehyde resin, sequentially adding 2 parts of silicon dioxide, 8 parts of zinc oxide, 5 parts of aluminum oxide, 2 parts of sodium dodecyl benzene sulfonate, 2 parts of sodium methylene dinaphthalene sulfonate and 1 part of polyoxyethylene fatty acid into the mixture, stirring at high speed at room temperature to uniformly disperse the mixture, and standing for defoaming for later use.
Coating: coating the bonding heat-conducting resin on the surface of an aluminum foil with the thickness of 140um through a roller coating machine, drying and curing the bonding heat-conducting resin to form a bonding heat-conducting resin layer with the thickness of 5um, coating a layer of water-soluble lubricating resin on the surface of the bonding heat-conducting resin layer through the roller coating machine, drying and curing the water-soluble lubricating resin layer to form a water-soluble lubricating resin layer with the thickness of 35um, and thus obtaining the aluminum-based cover plate for PCB drilling. In the coating process, two groups of coating, drying and curing equipment can be connected in series, so that the working efficiency is improved.
Example 2
Preparation of water-soluble lubricating resin: sequentially adding 2 parts of sodium polyacrylate, 5 parts of polyethylene glycol, 5 parts of polyvinyl alcohol, 8 parts of polymethacrylic acid, 4 parts of polyvinylpyrrolidone and 3 parts of sodium carboxymethyl cellulose into 40 parts of distilled water, stirring at a high speed at room temperature to fully dissolve the sodium polyacrylate, and then adding 30 parts of waterborne polyurethane resin, 1 part of fatty acid polyoxyethylene ester, 1 part of waterborne polyurethane defoaming agent and 1 part of fatty alcohol polyoxyethylene ether, stirring uniformly, filtering, standing and defoaming for later use.
Preparing the adhesive heat-conducting resin: mixing 25 parts of epoxy resin, 45 parts of acrylic resin and 10 parts of urea-formaldehyde resin, stirring at room temperature to fully mix the epoxy resin, the acrylic resin and the urea-formaldehyde resin, sequentially adding 7 parts of zinc oxide, 5 parts of magnesium oxide, 3 parts of aluminum nitride, 2 parts of sodium dodecyl benzene sulfonate, 2 parts of sodium methylene dinaphthalene sulfonate and 1 part of polyoxyethylene fatty acid into the mixture, stirring at high speed at room temperature to uniformly disperse the mixture, and standing for defoaming for later use.
Coating: coating the bonding heat-conducting resin on the surface of an aluminum foil with the thickness of 140um through a roller coating machine, drying and curing the bonding heat-conducting resin to form a bonding heat-conducting resin layer with the thickness of 5um, coating a layer of water-soluble lubricating resin on the surface of the bonding heat-conducting resin layer through the roller coating machine, drying and curing the water-soluble lubricating resin layer to form a water-soluble lubricating resin layer with the thickness of 35um, and thus obtaining the aluminum-based cover plate for PCB drilling. In the coating process, two groups of coating, drying and curing equipment can be connected in series, so that the working efficiency is improved.
Example 3
Preparation of water-soluble lubricating resin: sequentially adding 3 parts of polyacrylamide, 2 parts of sodium polyacrylate, 7 parts of polymethacrylic acid, 5 parts of polyvinylpyrrolidone and 3 parts of carboxyethyl cellulose into 40 parts of distilled water, stirring at a high speed at room temperature to fully dissolve the polyacrylamide, adding 30 parts of waterborne polyurethane resin, 1 part of fatty acid polyoxyethylene ester, 1 part of waterborne polyurethane defoamer and 1 part of fatty alcohol polyoxyethylene ether, stirring uniformly, filtering, standing and defoaming for later use.
Preparing the adhesive heat-conducting resin: mixing 25 parts of epoxy resin, 45 parts of acrylic resin and 10 parts of urea-formaldehyde resin, stirring at room temperature to fully mix the epoxy resin, the acrylic resin and the urea-formaldehyde resin, sequentially adding 2 parts of silicon dioxide, 5 parts of magnesium oxide, 8 parts of aluminum nitride, 2 parts of sodium dodecyl benzene sulfonate, 2 parts of sodium methylene dinaphthalene sulfonate and 1 part of polyoxyethylene fatty acid into the mixture, stirring at high speed at room temperature to uniformly disperse the mixture, and standing for defoaming for later use.
Coating: coating the bonding heat-conducting resin on the surface of an aluminum foil with the thickness of 140um through a roller coating machine, drying and curing the bonding heat-conducting resin to form a bonding heat-conducting resin layer with the thickness of 5um, coating a layer of water-soluble lubricating resin on the surface of the bonding heat-conducting resin layer through the roller coating machine, drying and curing the water-soluble lubricating resin layer to form a water-soluble lubricating resin layer with the thickness of 35um, and thus obtaining the aluminum-based cover plate for PCB drilling. In the coating process, two groups of coating, drying and curing equipment can be connected in series, so that the working efficiency is improved.
In the invention, the hard board drilling test is carried out on the examples 1, 2 and 3 and the existing film-coated aluminum-based cover plate in the market, and the test structure is as follows:
| kind of cover plate | Hole site accuracy | Roughness of hole wall | Winding of wire | 5000 hole drilling needle condition |
| Ordinary coated aluminum base cover plate | 2.1 | 22um | Severe winding | Broken needle |
| EXAMPLE 1 cover plate | 4.2 | 9um | Without winding wire | Non-broken needle |
| EXAMPLE 2 cover plate | 3.9 | 15um | Without winding wire | Non-broken needle |
| EXAMPLE 3 cover plate | 4.7 | 13um | Without winding wire | Non-broken needle |
According to the data in the table, it is obvious that the aluminum-based cover plate for PCB drilling, prepared by the invention, has the advantages of high hole site precision, low hole wall roughness, no wire winding and no broken needle under the condition of 5000 drilling, and various detection indexes are superior to those of the conventional ordinary film-coated aluminum-based cover plate.
In summary, the aluminum-based cover plate for PCB drilling and the preparation method thereof are designed, the structure is reasonably matched, the water-soluble lubricating resin layer is used as the outermost layer, the aluminum foil is used as a supporting material, the bonding heat-conducting resin layer is arranged between the water-soluble lubricating resin layer and the aluminum foil, the aluminum-based cover plate for PCB drilling with gradually-changed hardness is prepared, the technical problems that the surface resin layer of the existing coated aluminum-based cover plate for PCB drilling is poor in adhesion with the aluminum foil and a drill needle is not easy to clean in a drilling process are solved, and meanwhile, the prepared aluminum-based cover plate for PCB drilling has the gradually-changed hardness, plays a role in guiding the drilling of the drill needle, and reduces the needle breakage rate.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a PCB is aluminium base apron for drilling which characterized in that includes from supreme aluminium foil, the heat conduction resin layer that bonds and the water-soluble lubricating resin layer that stacks gradually the setting down.
2. The aluminum-based cover plate for drilling of PCB of claim 1, wherein the binding heat-conducting resin comprises 70-90 parts of binding resin, 10-20 parts of heat-conducting compound and 5-10 parts of surfactant by weight.
3. The aluminum-based cover plate for PCB drilling as recited in claim 2, wherein the bonding resin is one or more of epoxy resin, acrylic resin or urea resin.
4. The aluminum-based cover plate for PCB drilling according to claim 2, wherein the heat conductive compound is one or more of silicon dioxide, zinc oxide, magnesium hydroxide, aluminum oxide and aluminum nitride.
5. The aluminum-based cover plate for drilling of PCB according to claim 1, wherein the water-soluble lubricating resin comprises 25-30 parts of lubricating resin, 30-40 parts of binding resin, 1-3 parts of surfactant and 1-2 parts of defoaming agent by weight.
6. The aluminum-based cover plate for drilling of PCB of claim 5, wherein said lubricating resin is one or more of polyacrylamide, sodium polyacrylate, polyethylene glycol, polyvinyl alcohol, polymethacrylic acid, polyvinyl pyrrolidone, sodium alginate, sodium carboxymethyl cellulose and carboxyethyl cellulose.
7. The aluminum-based cover plate for drilling of PCB of claim 1, wherein the thickness of said bonding heat-conducting resin layer is 5-10 um.
8. The aluminum-based cover sheet for drilling of PCB according to claim 1, wherein the thickness of the water-soluble lubricating resin layer is 30-40 um.
9. The aluminum-based cover plate for drilling of PCB of claim 1, wherein the aluminum foil has a thickness of 80-140 um.
10. A preparation method of an aluminum-based cover plate for PCB drilling is characterized by comprising the following steps:
preparing a bonding heat-conducting resin layer on the surface of the aluminum foil;
and preparing a water-soluble lubricating resin layer on the surface of the bonding heat-conducting resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910876403.5A CN110774353A (en) | 2019-09-17 | 2019-09-17 | Aluminum-based cover plate for PCB drilling and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910876403.5A CN110774353A (en) | 2019-09-17 | 2019-09-17 | Aluminum-based cover plate for PCB drilling and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110774353A true CN110774353A (en) | 2020-02-11 |
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| CN201910876403.5A Pending CN110774353A (en) | 2019-09-17 | 2019-09-17 | Aluminum-based cover plate for PCB drilling and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112662314A (en) * | 2020-12-10 | 2021-04-16 | 深圳市柳鑫实业股份有限公司 | Environment-friendly PCB drilling cover plate and preparation method thereof |
| CN112888162A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN116075059A (en) * | 2023-02-27 | 2023-05-05 | 健鼎（湖北）电子有限公司 | Coated aluminum sheet for PCB drilling and preparation method thereof |
| CN117467319A (en) * | 2023-12-05 | 2024-01-30 | 扬宣电子(清远)有限公司 | High-heat-conductivity PCB (printed circuit board) laminated aluminum substrate and preparation method thereof |
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| CN112662314A (en) * | 2020-12-10 | 2021-04-16 | 深圳市柳鑫实业股份有限公司 | Environment-friendly PCB drilling cover plate and preparation method thereof |
| CN112888162A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN112888162B (en) * | 2021-01-12 | 2024-02-06 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN116075059A (en) * | 2023-02-27 | 2023-05-05 | 健鼎（湖北）电子有限公司 | Coated aluminum sheet for PCB drilling and preparation method thereof |
| CN117467319A (en) * | 2023-12-05 | 2024-01-30 | 扬宣电子(清远)有限公司 | High-heat-conductivity PCB (printed circuit board) laminated aluminum substrate and preparation method thereof |
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Application publication date: 20200211 |