CN207094525U - A kind of lamp heat-radiating device - Google Patents
A kind of lamp heat-radiating device Download PDFInfo
- Publication number
- CN207094525U CN207094525U CN201720668910.6U CN201720668910U CN207094525U CN 207094525 U CN207094525 U CN 207094525U CN 201720668910 U CN201720668910 U CN 201720668910U CN 207094525 U CN207094525 U CN 207094525U
- Authority
- CN
- China
- Prior art keywords
- heat
- metal level
- mounting hole
- layer
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to technical field of heat dissipation, more particularly, to a kind of lamp heat-radiating device suitable for LED.A kind of lamp heat-radiating device, suitable for LED, it is characterised in that including：Metal level, in the non-luminescent side of the LED, the metal level is sheet for the metal level configuration；Packed layer, the packed layer are configured in the lower section of the metal level, and the packed layer shape is identical with the metal level shape, and the packed layer is the metal indium sheet with first thickness；Heat dissipating layer, below the packed layer, the heat dissipating layer is a metal heat sink for the heat dissipating layer configuration.The beneficial effect of the technical program is：Radiating rate is fast, and radiating efficiency is high, and overall thermal conductivity is good, and thermal resistance is low, so as to effectively distribute LED liberated heat, and then extends the service life of LED.
Description
Technical field
The utility model belongs to technical field of heat dissipation, more particularly, to a kind of lamp heat-radiating device suitable for LED.
Background technology
LED automobile lamp is mainly characterized by economize on electricity, colour purity, long lifespan, however, LED also has the shortcomings that light decay, and
The temperature of life-span and LED chip has a direct relation to light decay in other words, and the temperature lower life-span of LED chip is longer.Extend the LED longevity
The key of life is the temperature for reducing LED chip, it is necessary to try timely to distribute heat caused by LED chip, this will
Design a heat abstractor of good performance.The radiating efficiency of heat abstractor and the pyroconductivity of radiator material, radiating equipment
The relating to parameters such as effective area of dissipation of thermal capacitance and radiator of material and heat eliminating medium.
At present, LED heat radiation substrate and radiator are bonded together using heat-conducting silicone grease more, assembled by screw 5, heat conduction
Silicone grease thermal conductivity factor is 2~3W/ (mK) so that heat abstractor has larger thermal resistance, it is impossible to effectively reduces LED temperature.
In order to solve the problem present on, people are seeking a kind of preferable technical solution always.
Utility model content
Based on the above-mentioned problems in the prior art, the utility model be intended for a radiating efficiency it is high, so as to having
Effect extends a kind of light fixture radiating transposition of the service life of LED lamp for vehicles, including：
Metal level, in the non-luminescent side of the LED, the metal level is sheet for the metal level configuration；
Packed layer, the packed layer configuration is in the lower section of the metal level, the packed layer shape and the metal level shape
Shape is identical, and the packed layer is the metal indium sheet with first thickness；
Heat dissipating layer, below the packed layer, the heat dissipating layer is a metal heat sink for the heat dissipating layer configuration.
Specifically, in the utility model, the LED is welded on the metal level by eutectic Welding.
Specifically, in the utility model, the lamp heat-radiating device also includes at least one screw；
The metal level also includes at least one first mounting hole site；
The packed layer also includes at least one second mounting hole site；
The heat dissipating layer also includes at least one 3rd mounting hole site；
First mounting hole site and second mounting hole site correspond, and second mounting hole site with it is described
3rd mounting hole site corresponds；
Each screw is each passed through corresponding first mounting hole site, second mounting hole site and the described 3rd
Mounting hole site, the metal level, the packed layer and the heat dissipating layer are interfixed.
Specifically, in the utility model, the span of the first thickness is [0.08,0.2]；
The value unit of the first thickness is millimeter.
Specifically, in the utility model, the heat dissipating layer is a fin-inserted radiator.
Specifically, in the utility model, the screw is metallic screw.
Specifically, in the utility model, the heat dissipating layer is a blade inserting Aluminium Radiator.
The beneficial effect of the technical program is：Radiating rate is fast, and radiating efficiency is high, and overall thermal conductivity is good, and thermal resistance is low, so as to
LED liberated heat can be effectively distributed, and then extends the service life of LED.
Brief description of the drawings
Fig. 1 is the structural representation of lamp heat-radiating device in the utility model preferred embodiment.
Embodiment
The accompanying drawing that lower section will be combined in the utility model embodiment, is carried out to the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the premise of creative work
Lower obtained every other embodiment, belong to the scope of the utility model protection.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the utility model can
To be mutually combined.
Below with the drawings and specific embodiments, the utility model is described in further detail, but not as of the present utility model
Limit.
Based on the above-mentioned problems in the prior art, it is high, automobile-used so as to effectively extend now to provide a radiating efficiency
A kind of light fixture radiating transposition of the service life of LED 1, including：
Metal level 2, metal level 2 are configured in the non-luminescent side of LED 1, and metal level 2 is sheet；
Packed layer 3, packed layer 3 are configured in the lower section of metal level 2, and the shape of packed layer 3 is identical with the shape of metal level 2, filling
Layer 3 is the metal indium sheet with first thickness；
Heat dissipating layer 4, heat dissipating layer 4 are configured below packed layer 3, and heat dissipating layer 4 is a metal heat sink.
Specifically, in the above-mentioned preferred embodiment of the utility model, in order to ensure that good thermal conductivity is needed metal
One layer of packed layer 3 is added between layer 2 and heat dissipating layer 4 to enable the heat of metal level 2 to pass to as early as possible to heat dissipating layer 4.
Specifically, in the above-mentioned preferred embodiment of the utility model, metal level 2 is an aluminum base layer or other metal materials
Matter layer, heat dissipating layer 4 are a conventional radiator, a kind of packed layer 3 are also added between metal level 2 and heat dissipating layer 4, by LED works
As when the temperature that comes out conducted from metal level 2 to heat dissipating layer 4.
Specifically, in the above-mentioned preferred embodiment of the utility model, because heat dissipating layer 4 is indium sheet, the fusing point of indium metal
For 156.61 degrees Celsius, for this, its fusing point can be melted compared with other metal phases than low for this in the baking oven of routine.Gold simultaneously
The thermal conductivity factor for belonging to indium is 82W/ (mK), and original is higher than the thermal conductivity factor of silica gel, for this using indium metal as the utility model
Packed layer Heat Conduction Material.
Specifically, in the above-mentioned preferred embodiment of the utility model, 4 specific fusion process of packed layer 3 and heat dissipating layer
For by carrying out the baking between 30 minutes to 60 minutes by a definite date between 150 DEG C to 180 DEG C of oven temperature, so that metal
Packed layer 3 is full of between layer 2 and heat dissipating layer 4 preferably to be radiated.
To sum up, in technical solutions of the utility model, there is provided a kind of lamp heat-radiating device, the device pass through in metal substrate
Heat-conducting layer material is changed to sheet metal indium sheet between heat dissipating layer 4, solves when heat dissipating layer 4 in the prior art is silica gel radiating and leads
The problem of thermal effect is bad, realize the high effect of the fast heat transfer efficiency of high heat conduction speed；LED can be effectively reduced at work
Temperature.
Preferably, in the utility model preferred embodiment, LED 1 is welded on metal level 2 by eutectic Welding.
In preferable bright preferred embodiment, lamp heat-radiating device also includes at least one screw 5；
Metal level 2 also includes at least one first mounting hole site；
Packed layer 3 also includes at least one second mounting hole site；
Heat dissipating layer 4 also includes at least one 3rd mounting hole site；
First mounting hole site and the second mounting hole site correspond, and the second mounting hole site and the 3rd mounting hole site are one by one
It is corresponding；
Each screw 5 is each passed through corresponding first mounting hole site, the second mounting hole site and the 3rd mounting hole site, by gold
Category layer 2, packed layer 3 and heat dissipating layer 4 interfix.
Specifically, in the above-mentioned preferred embodiment of the utility model, in order to further fix heat dissipating layer 4, packed layer 3
Connection between metal level 2, both are fixed by screw 5 for this.
Preferably, in the utility model preferred embodiment, first thickness between span be [0.08,0.2]；The
The value unit of one thickness is millimeter.
Preferably, in the utility model preferred embodiment, heat dissipating layer 4 is a fin-inserted radiator.
Preferably, in the utility model preferred embodiment, screw 5 is metallic screw.
Preferably, in the utility model preferred embodiment, heat dissipating layer 4 is a blade inserting Aluminium Radiator.
Specifically, in the above-mentioned preferred embodiment of the utility model, heat dissipating layer 4 can also be copper radiator.
The utility model preferred embodiment is these are only, not thereby limits embodiment of the present utility model and protection
Scope, to those skilled in the art, it should can appreciate that all with the utility model specification and diagramatic content institute
Scheme obtained by the equivalent substitution made and obvious change, should be included in the scope of protection of the utility model
It is interior.
Claims (7)
- A kind of 1. lamp heat-radiating device, suitable for LED, it is characterised in that including：Metal level, in the non-luminescent side of the LED, the metal level is sheet for the metal level configuration；Packed layer, the packed layer configuration is in the lower section of the metal level, the packed layer shape and the metal level shape phase Together, the packed layer is the metal indium sheet with first thickness；Heat dissipating layer, below the packed layer, the heat dissipating layer is a metal heat sink for the heat dissipating layer configuration.
- 2. lamp heat-radiating device according to claim 1, it is characterised in that the LED is welded by eutectic Welding Onto the metal level.
- 3. lamp heat-radiating device according to claim 1, it is characterised in that the lamp heat-radiating device also includes at least one Individual screw；The metal level also includes at least one first mounting hole site；The packed layer also includes at least one second mounting hole site；The heat dissipating layer also includes at least one 3rd mounting hole site；First mounting hole site and second mounting hole site correspond, and second mounting hole site and the described 3rd Mounting hole site corresponds；Each screw is each passed through corresponding first mounting hole site, second mounting hole site and the 3rd installation Hole position, the metal level, the packed layer and the heat dissipating layer are interfixed.
- 4. lamp heat-radiating device according to claim 1, it is characterised in that the span of the first thickness is [0.08,0.2]；The value unit of the first thickness is millimeter.
- 5. lamp heat-radiating device according to claim 1, it is characterised in that the heat dissipating layer is a fin-inserted radiator.
- 6. lamp heat-radiating device according to claim 3, it is characterised in that the screw is metallic screw.
- 7. lamp heat-radiating device according to claim 5, it is characterised in that the heat dissipating layer radiates for a blade inserting aluminum Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720668910.6U CN207094525U (en) | 2017-06-09 | 2017-06-09 | A kind of lamp heat-radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720668910.6U CN207094525U (en) | 2017-06-09 | 2017-06-09 | A kind of lamp heat-radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207094525U true CN207094525U (en) | 2018-03-13 |
Family
ID=61552143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720668910.6U Active CN207094525U (en) | 2017-06-09 | 2017-06-09 | A kind of lamp heat-radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207094525U (en) |
-
2017
- 2017-06-09 CN CN201720668910.6U patent/CN207094525U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101408298B (en) | Upright post type LED heat radiator | |
| CN105650566A (en) | LED headlamp with heat dissipation structure | |
| CN108461461A (en) | A kind of porous conductive material filled-type heat-pipe radiator | |
| CN201318656Y (en) | LED tunnel lamp | |
| CN100594323C (en) | High power semiconductor lighting lamp | |
| CN102563575A (en) | Isolation type heat dissipation device of LED (light-emitting diode) lamp | |
| CN207094525U (en) | A kind of lamp heat-radiating device | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN101761903A (en) | Cooling structure for LED lamp | |
| CN207486469U (en) | Heat dissipation LED lamp bead | |
| CN205746098U (en) | A kind of LED lamp utilizing cover surface to dispel the heat | |
| CN201983233U (en) | Heat dissipation and heat insulation device of LED (light-emitting diode) lamp | |
| CN103388770A (en) | Integrated light source radiating module of LED lamp and manufacturing method thereof | |
| CN201003736Y (en) | Semi-conductor LED road lamp heat dissipation structure | |
| CN101566329B (en) | Method for applying ultravacuum heat sink to modular high-power LED street lamp | |
| CN203349028U (en) | Integral light source heat-dissipating module of LED (Light Emitting Diode) lamp | |
| CN204516803U (en) | Great power LED low thermal resistance radiator structure | |
| CN204084289U (en) | A kind of heat dissipation device of LED lamp | |
| CN207880785U (en) | LED worklight wiring board | |
| CN203489020U (en) | Cylindrical radiator, LED lamp bead heat dissipation device composed of cylindrical radiator, and LED lamp | |
| CN207716350U (en) | A kind of automotive LED headlamp | |
| CN202598449U (en) | A phase-change sunflower-shaped radiator for heat dissipation of a large-power LED | |
| CN201487652U (en) | LED lamp | |
| CN207990473U (en) | A kind of LED street lamp | |
| CN201751711U (en) | Heat-radiating structure for LED (light-emitting diode) lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yang Xiaofeng Inventor after: You Yan Inventor after: Gu Haijun Inventor after: Cao Gaofeng Inventor before: Yang Xiaofeng Inventor before: You Yan Inventor before: Gu Haijun Inventor before: Cao Gaofeng |
|
| CB03 | Change of inventor or designer information |