CN207083270U - A kind of hard soft golden blending surface multilayer printed circuit board of gold - Google Patents
A kind of hard soft golden blending surface multilayer printed circuit board of gold Download PDFInfo
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- CN207083270U CN207083270U CN201720356214.1U CN201720356214U CN207083270U CN 207083270 U CN207083270 U CN 207083270U CN 201720356214 U CN201720356214 U CN 201720356214U CN 207083270 U CN207083270 U CN 207083270U
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Abstract
It the utility model is related to a kind of hard soft golden blending surface multilayer printed circuit board of gold, including core plate, dielectric layer, layers of copper and Gold plated Layer, core plate is by substrate and is formed at the copper foil of the substrate upper and lower surface, copper foil is outer covered with dielectric layer, scattered plating forms multiple layers of copper outside dielectric layer, and Gold plated Layer includes plating soft gold layer and plating hard gold layer, and hard golden, soft golden two kinds of regions are realized on the same surface of the wiring board, so that it has good solderability and wearability, increase the service life.
Description
Technical field
It the utility model is related to a kind of wiring board, and in particular to a kind of hard soft golden blending surface multilayer printed circuit board of gold.
Background technology
With the popularization of the consumer electronics such as mobile phone, ensure the reliability of equipment, corrosion resistance and wearability become more next
More important, the heavy nickel gold process of print circuit board surface processing method of past main flow is substituted, nowadays, using only single
Surface treatment method can not meet both to need the reliability for ensureing solder connection in same printed circuit board, need to ensure again
Dual requirementses as the reliability of electrical contact disk.
Utility model content
Technical problem to be solved in the utility model is the shortcomings that overcoming prior art, there is provided a kind of hard soft gold of gold is mixed
Surface multi-layer printed substrate is closed, hard golden, soft golden two kinds of regions are realized on the same surface of the wiring board so that it can with good
Weldering property and wearability, increase the service life.
In order to solve the above technical problems, the utility model provides a kind of hard soft golden blending surface multilayered printed circuit of gold
Plate, including core plate, dielectric layer, layers of copper and Gold plated Layer, core plate is by substrate and is formed at the copper foil of the substrate upper and lower surface, copper foil
Outside covered with described dielectric layer, outside dielectric layer scattered plating form multiple described layers of copper, Gold plated Layer include plating soft gold layer and
Hard gold layer is plated, wherein：
Several via holes are set on core plate, and the region that core plate surface is used for welding electronic part is provided with pad, on pad
Plating forms soft gold layer, and the region that core plate surface is used for electrical contact is provided with golden finger, is electroplated on golden finger and form hard gold layer.
The technical scheme that the utility model further limits is：
Further, in the foregoing hard soft golden blending surface multilayer printed circuit board of gold, the thickness of layers of copper is not less than 20um.
In the foregoing hard soft golden blending surface multilayer printed circuit board of gold, the material of hard gold layer is the plating alloy containing cobalt.
In the foregoing hard soft golden blending surface multilayer printed circuit board of gold, the material of soft gold layer is plating proof gold.
In the foregoing hard soft golden blending surface multilayer printed circuit board of gold, the thickness of hard gold layer is not less than 1.27um, described soft
The thickness of layer gold is 0.035um-0.076um.
The beneficial effects of the utility model are：
Realize hard golden, soft golden two kinds of regions in the same surface of wiring board of the present utility model so that it has well solderable
Property and wearability, increase the service life.
The utility model is because copper foil can not meet the needs of product than relatively thin, therefore copper electroplating layer is to meet on the dielectric layer
Need.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment；
In figure：1- substrates, 2- copper foils, 3- dielectric layers, 4- layers of copper, 5- soft gold layer, 6- hard gold layer, 7- via holes.
Embodiment
Embodiment 1
A kind of hard soft golden blending surface multilayer printed circuit board of gold that the present embodiment provides, structure is as shown in figure 1, including core
Plate, dielectric layer 3, layers of copper 4 and Gold plated Layer, core plate is by substrate 1 and is formed at the copper foil 2 of the upper and lower surface of substrate 1, outside copper foil 2
Covered with described dielectric layer 3, scattered electroplate forms multiple described layers of copper 4 outside dielectric layer 3, and Gold plated Layer includes the He of soft gold layer 5
Hard gold layer 6, wherein：
Several via holes 7 are set on core plate, and the region that core plate surface is used for welding electronic part is provided with pad, on pad
Plating forms soft gold layer 5, and the region that core plate surface is used for electrical contact is provided with golden finger, electroplated on golden finger described in being formed
Hard gold layer 6.
In the present embodiment, the thickness of layers of copper is not less than 20um, and the material of hard gold layer is the plating alloy containing cobalt, described
The material of soft gold layer is plating proof gold, and the thickness of hard gold layer is not less than 1.27um, and the thickness of the soft gold layer is 0.035um-
0.076um。
The specific of the soft golden blending surface multilayer printed circuit board of hard gold in the present embodiment is prepared as on the copper face of substrate
Carry out first time overlay film, perform exposure for the first time, development, wherein make will the region of electroplating mild alloy do not expose, remaining region exposes
Light, and NaCO3 or K2CO3 solution developments are used after exposition, it would be desirable to the region exposure of electroplating mild alloy, then electroplate soft
Gold goes membrane removal, second of overlay film, exposure, development is carried out on copper face, wherein making that hard gold will be electroplated to form soft golden region
Region does not expose, remaining regional exposure, and uses NaCO3 or K2CO3 solution developments after exposition, it would be desirable to the hard gold of plating
Region exposes, and then the hard gold of plating goes membrane removal, perform alkali etching, wherein with soft golden region and hard gold to form hard golden region
Region is as resist layer.
In addition to the implementation, the utility model can also have other embodiment.It is all to use equivalent substitution or equivalent change
The technical scheme to be formed is changed, all falls within the protection domain of the requires of the utility model.
Claims (4)
- A kind of 1. hard soft golden blending surface multilayer printed circuit board of gold, it is characterised in that：Including core plate, dielectric layer (3), layers of copper (4) and Gold plated Layer, the core plate by substrate (1) and is formed at the copper foil (2) of substrate (1) upper and lower surface, the copper foil (2) Outside covered with described dielectric layer (3), the dielectric layer (3) disperses plating and forms multiple described layers of copper (4), described plating outside Layer gold includes soft gold layer (5) and hard gold layer (6), wherein：Several via holes (7) are set on the core plate, the region that the core plate surface is used for welding electronic part is provided with pad, Plating forms described soft gold layer (5) on the pad, and the region that the core plate surface is used for electrical contact is provided with golden finger, Plating forms described hard gold layer (6) on the golden finger.
- 2. the hard soft golden blending surface multilayer printed circuit board of gold according to claim 1, it is characterised in that：The layers of copper Thickness is not less than 20um.
- 3. the hard soft golden blending surface multilayer printed circuit board of gold according to claim 1, it is characterised in that：The soft gold layer Material for plating proof gold.
- 4. the hard soft golden blending surface multilayer printed circuit board of gold according to claim 1, it is characterised in that：The hard gold layer Thickness be not less than 1.27um, the thickness of the soft gold layer is 0.035um-0.076um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720356214.1U CN207083270U (en) | 2017-04-06 | 2017-04-06 | A kind of hard soft golden blending surface multilayer printed circuit board of gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720356214.1U CN207083270U (en) | 2017-04-06 | 2017-04-06 | A kind of hard soft golden blending surface multilayer printed circuit board of gold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207083270U true CN207083270U (en) | 2018-03-09 |
Family
ID=61436105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720356214.1U Active CN207083270U (en) | 2017-04-06 | 2017-04-06 | A kind of hard soft golden blending surface multilayer printed circuit board of gold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207083270U (en) |
-
2017
- 2017-04-06 CN CN201720356214.1U patent/CN207083270U/en active Active
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