CN207082553U - Inverted light-emitting diode (LED) support and encapsulating structure - Google Patents
Inverted light-emitting diode (LED) support and encapsulating structure Download PDFInfo
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- CN207082553U CN207082553U CN201721065865.1U CN201721065865U CN207082553U CN 207082553 U CN207082553 U CN 207082553U CN 201721065865 U CN201721065865 U CN 201721065865U CN 207082553 U CN207082553 U CN 207082553U
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Abstract
The utility model provides a kind of inverted light-emitting diode (LED) support and encapsulating structure, the inverted light-emitting diode (LED) support includes matrix and conductive structure, conductive structure is on matrix, conductive structure includes spaced first conductive part and the second conductive part, the middle part of first conductive part and the second conductive part above matrix extends to the edge of matrix, and offers the perforate that arranged along the first conductive part and the second conductive part, middle part above matrix extends to the edge of matrix in the first conductive part and the second conductive part respectively.In this inverted light-emitting diode (LED) support, due to offering perforate in the first conductive part and the second conductive part, heat can come out along perforate, substantially increase the radiating effect of inverted light-emitting diode (LED) support；Meanwhile first the outer wall of conductive part and the second conductive part can be combined closely with matrix, ensure the firmness that conductive structure is combined with matrix.The encapsulating structure includes above-mentioned inverted light-emitting diode (LED) support, chip and encapsulated layer.
Description
Technical field
LED technology field is the utility model is related to, more particularly to a kind of inverted light-emitting diode (LED) support and encapsulating structure.
Background technology
LED (Light Emitting Diode), light emitting diode, it is that a kind of can convert electrical energy into consolidating for visible ray
The semiconductor devices of state.LED can be finally applied in daily life, it is necessary to be packaged to LED.For different LED cores
Chip architecture, there is different modes, and flip LED encapsulates especially specific encapsulation scheme.The encapsulation of flip LED at present, including encapsulation
The structures such as material, wire, substrate, while also need to a variety of packaging process, such as silk-screen printing etc..In the process of flip LED encapsulation
In, wherein a mode is to need the copper sheet coated with solder or conducting resinl by being screen printed onto substrate, then flip LED chips
Electrode is electrically connected on copper sheet.
The electrode of the chip of flip LED electrically connects in bottom with the electrode of the metallic support of support, is more unfavorable for heat
Distribute, and then cause the failure of LED encapsulation structure.
Utility model content
The purpose of this utility model is to provide a kind of good inverted light-emitting diode (LED) support and encapsulating structure of radiating effect.
The utility model provides a kind of inverted light-emitting diode (LED) support, including matrix and conductive structure, the conductive structure
In described matrix, the conductive structure includes spaced first conductive part and the second conductive part, and described first is conductive
The middle part of portion and second conductive part above described matrix extends to the edge of described matrix, and first conductive part
With offered respectively in second conductive part it is along first conductive part and second conductive part arrangement, from described matrix
The perforate of the edge of described matrix is extended in the middle part of top.
In this inverted light-emitting diode (LED) support, due to offering perforate in the first conductive part and the second conductive part, heat can
Come out along perforate, substantially increase the radiating effect of inverted light-emitting diode (LED) support；Meanwhile first conductive part and second
The outer wall of conductive part can combine closely with matrix, ensure the firmness that conductive structure is combined with matrix.
In a wherein embodiment, the perforate is along arrangement of curves.
In a wherein embodiment, the good protective layer of heat conductivility is laid with the inwall of the perforate.
In a wherein embodiment, the end of first conductive part and second conductive part is also associated with pin, described
Pin is extended outside described matrix.
In a wherein embodiment, perforate can be opened up in the pin.
In a wherein embodiment, it is provided with the top of described matrix between first conductive part and second conductive part
Projection.
The utility model also provides a kind of encapsulating structure, including above-mentioned inverted light-emitting diode (LED) support, chip and encapsulated layer,
Chip is on conductive structure, and chip includes two electrodes electrically connected respectively with the first conductive part and the second conductive part, envelope
Layer is filled above conductive structure and chip, and chip package is got up.
Brief description of the drawings
Fig. 1 is the structural representation of the encapsulating structure of the embodiment of the utility model one；
Fig. 2 is the structural representation of the encapsulating structure of another embodiment of the utility model；
Fig. 3 is the structural representation of the encapsulating structure of the another embodiment of the utility model.
Embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is used to illustrate the utility model, but is not limited to the scope of the utility model.
As shown in figure 1, the inverted light-emitting diode (LED) support that an embodiment provides includes matrix 12 and conductive structure 14, it is conductive
Structure 14 is on matrix 12.Conductive structure 14 includes the spaced conductive part 144 of first conductive part 142 and second, and first
Middle part of the conductive part 144 of conductive part 142 and second above matrix 12 extends to the edge of matrix 12, and the first conductive part
142 and second offer respectively in conductive part 144 it is along the first conductive part 142 and the second conductive part 144 arrangement, from matrix 12
The middle part of side extends to the perforate 146 of the edge of matrix 12.
Due to offering perforate 146 in the first conductive part 142 and the second conductive part 144, heat can distribute along perforate 146
Out, the radiating effect of inverted light-emitting diode (LED) support is substantially increased.
In the present embodiment, perforate 146 is arranged along a straight line.It is appreciated that perforate 146 also can be along arrangement of curves, arrangement of curves
The length of perforate 146 it is longer, the progress for heat transfer of being more convenient for, can further improve radiating effect；Meanwhile first conductive part 142
It can be combined closely with the outer wall of the second conductive part 144 with matrix 12, ensure the firmness that conductive structure 14 is combined with matrix 12.
In the present embodiment, the good protective layer of heat conductivility is laid with the inwall of perforate 146.So, external moisture etc.
Conductive structure 14 will not be corroded, avoids steam etc. from influenceing the electric conductivity of conductive structure 14.
The utility model also provides a kind of encapsulating structure, including above-mentioned inverted light-emitting diode (LED) support, chip (16) and envelope
Fill layer 18, chip (16) on the conductive structure 14, and chip (16) include respectively with the first conductive part 142 and the second conductive part
Two electrodes 162 of 144 electrical connections, encapsulated layer 18 encapsulate above conductive structure 14 and chip (16), and by chip (16)
Get up.
As shown in Fig. 2 upside-down mounting shown in the structure and Fig. 1 of the inverted light-emitting diode (LED) support of another embodiment of the utility model
The structure of LED support is similar, and difference is, the first conductive part 142 of the inverted light-emitting diode (LED) support of the present embodiment
Pin 148 is also associated with the end of the second conductive part 144, pin 148 is extended outside matrix 12, has bigger radiating surface
Product, more conducively radiates, it may have the more large access area being connected with pcb board, contact are good.Perforate can be opened up in pin 148,
Also it can not open up perforate, in the present embodiment, perforate be opened up in pin 148, is more conducively radiated.
As shown in figure 3, upside-down mounting shown in the structure and Fig. 1 of the inverted light-emitting diode (LED) support of the another embodiment of the utility model
The structure of LED support is similar, and difference is, the top of matrix 12 of the inverted light-emitting diode (LED) support of the present embodiment is set
There is the projection 122 between the first conductive part 142 and the second conductive part 144.So, avoid the first conductive part 142 and
When two conductive parts 144 are welded on electrode 162, the solder of flowing turns on the first conductive part 142 and the second conductive part 144.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
For art personnel, on the premise of the utility model technical principle is not departed from, some improvement and replacement can also be made, these change
Enter and replace and also should be regarded as the scope of protection of the utility model.
Claims (7)
- A kind of 1. inverted light-emitting diode (LED) support, it is characterised in that including matrix (12) and conductive structure (14), the conductive knot For structure (14) in described matrix (12), the conductive structure (14) includes spaced first conductive part (142) and second Conductive part (144), the middle part of first conductive part (142) and second conductive part (144) above described matrix (12) The edge of described matrix (12) is extended to, and is opened respectively in first conductive part (142) and second conductive part (144) Provided with middle part being arranged along first conductive part (142) and second conductive part (144), above described matrix (12) Extend to the perforate (146) of the edge of described matrix (12).
- 2. inverted light-emitting diode (LED) support as claimed in claim 1, it is characterised in that the perforate (146) is along arrangement of curves.
- 3. inverted light-emitting diode (LED) support as claimed in claim 1, it is characterised in that cloth on the inwall of the perforate (146) Provided with the good protective layer of heat conductivility.
- 4. inverted light-emitting diode (LED) support as claimed in claim 1, it is characterised in that first conductive part (142) and institute The end for stating the second conductive part (144) is also associated with pin (148), and it is outside that the pin (148) extends described matrix (12).
- 5. inverted light-emitting diode (LED) support as claimed in claim 4, it is characterised in that can be opened up in the pin (148) Perforate.
- 6. inverted light-emitting diode (LED) support as claimed in claim 1, it is characterised in that be provided with and be located at the top of described matrix (12) Projection (122) between first conductive part (142) and second conductive part (144).
- 7. a kind of encapsulating structure, it is characterised in that including inverted light-emitting diode (LED) branch as claimed in any one of claims 1 to 6 Frame, chip (16) and encapsulated layer (18), chip (16) is on conductive structure (14), and chip (16) includes leading with first respectively Electric portion (142) and two electrodes (162) of the second conductive part (144) electrical connection, encapsulated layer (18) located at conductive structure (14) and Above chip (16), and chip (16) is encapsulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721065865.1U CN207082553U (en) | 2017-08-22 | 2017-08-22 | Inverted light-emitting diode (LED) support and encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721065865.1U CN207082553U (en) | 2017-08-22 | 2017-08-22 | Inverted light-emitting diode (LED) support and encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207082553U true CN207082553U (en) | 2018-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721065865.1U Active CN207082553U (en) | 2017-08-22 | 2017-08-22 | Inverted light-emitting diode (LED) support and encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207082553U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110594712A (en) * | 2019-08-29 | 2019-12-20 | 深圳市芯联电股份有限公司 | LED packaging substrate and LED packaging structure |
-
2017
- 2017-08-22 CN CN201721065865.1U patent/CN207082553U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110594712A (en) * | 2019-08-29 | 2019-12-20 | 深圳市芯联电股份有限公司 | LED packaging substrate and LED packaging structure |
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Legal Events
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220107 Address after: 518105 101, building 4, building 4, No. 2, Chuangye 6 road, Jiangbian third industrial zone, Jiangbian community, Songgang street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Chonghui semiconductor (Shenzhen) Co.,Ltd. Address before: 518105 No.15, Jiangbian Industrial Center Avenue, Jiangbian community, Songgang street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XINLIAN ELECTRICITY CO.,LTD. |