CN207068847U

CN207068847U - A kind of Multi-chip parallel type backlight LED

Info

Publication number: CN207068847U
Application number: CN201720864132.8U
Authority: CN
Inventors: 占贤武; 黄德凯
Original assignee: Han Suzhou Frierson Photoelectric Polytron Technologies Inc
Current assignee: Han Suzhou Frierson Photoelectric Polytron Technologies Inc
Priority date: 2017-07-17
Filing date: 2017-07-17
Publication date: 2018-03-02
Anticipated expiration: 2027-07-17

Abstract

It the utility model is related to LED encapsulation technologies field, a kind of more particularly to Multi-chip parallel type backlight LED, a kind of Multi-chip parallel type backlight LED, including substrate, also include first electrode terminal, insulating base, second electrode terminal and at least two LED chips, the first electrode terminal is disposed adjacent on substrate with second electrode terminal, filled up and separated by the substrate between the first electrode terminal and second electrode terminal, connection is contradicted between adjacent two LED chip and forms a LED module, LED chip on the LED module is connected in parallel between first electrode terminal and second electrode terminal, the insulating base is on the surface of the first electrode terminal and the second electrode terminal.Utility model is a kind of production cost is low, production capacity is high, can improve the Multi-chip parallel type backlight LED of LED lumen value.

Description

A kind of Multi-chip parallel type backlight LED

Technical field

It the utility model is related to LED encapsulation technologies field, more particularly to a kind of Multi-chip parallel type backlight LED.

Background technology

The concrete structure of conventional known LED has generally comprised LED support and LED chip, in order that what LED was sent Light is brighter, and lumen value is higher, generally a large scale LED chip is used in the manufacture production of LED, by the large scale LED chip is fixedly arranged on metallic support, and make the large scale LED chip conducting be connected to metallic support positive conductive terminal and Between cathode conductive terminal, large scale LED chip is expensive, improves the manufacture production cost of product, and use big work( Its speed of production is slow during rate chip manufacturing LED, expends more man-hour so that and the production capacity of LED is relatively low, while to light Injection impacts, so as to cause the luminous flux of LED effectively to play.

Utility model content

In view of the foregoing, the utility model be provided to solve the deficiencies in the prior art a kind of production cost it is low, Production capacity is high, can improve the Multi-chip parallel type backlight LED of LED lumen value.

To reach above-mentioned purpose, technical scheme is used by the utility model solves its technical problem：

A kind of Multi-chip parallel type backlight LED, including substrate, in addition to first electrode terminal, insulating base, second electrode end Son and at least two LED chips, the first electrode terminal are disposed adjacent with second electrode terminal on substrate, and described first Filled up and separated by the substrate between electrode terminal and second electrode terminal, connection is contradicted between adjacent two LED chip and forms one LED module, the LED chip on the LED module are connected in parallel between first electrode terminal and second electrode terminal, it is described absolutely Edge seat is on the surface of the first electrode terminal and the second electrode terminal.

Preferably, the first electrode terminal and second electrode terminal have one end to extend out to outside insulating base.

Preferably, the second electrode terminal has primer close to the end set of first electrode terminal, and the LED module leads to Primer is crossed to be bonded on second electrode terminal.

Preferably, the second electrode terminal accounts for area >=60% of insulating base bottom.

Preferably, it is square structure on the insulating base, which is provided with a groove, the concave surface of the groove is provided with reflective Layer.

Preferably, it is provided with fluorescent coating in the groove.

Preferably, adopt and be connected serially between the LED chip on the LED module.

Preferably, connected between the LED chip using gold thread, a diameter of 10 μm -50 μm of gold thread.

It can be seen from the above technical scheme that the utility model is in parallel by using at least two small size LED chips Connection instead of one of tradition large scale LED chip so that the effectively save chip under conditions of guarantee LED lights and become clear Cost, reduce the manufacture production cost of product；Speed of production ratio when LED is manufactured using small size LED chip uses big The speed of production of size LED chips is fast, can effectively improve the production efficiency of product, the consuming reduced work hours, fundamentally carry The production capacity of high LED.It is connected in parallel by using at least two small size LED chips so that LED chip occupies the sky of LED support Between effectively reduce, make the injection of light more smooth, really effectively cause LED lumen be worth to raising so that The luminous of LED more becomes clear.

Brief description of the drawings

Fig. 1 is a kind of Multi-chip parallel type backlight LED structure schematic diagram of the utility model.

Description of reference numerals：1- substrates, 2- first electrode terminals, 3- second electrode terminals, 4- insulating bases, 41- reflector layers, 5- primers, 6-LED modules, 61-LED chips, 7- fluorescent coatings.

Embodiment

With reference to specific embodiment, content of the present utility model is described in further detail：

Refering to Fig. 1, a kind of Multi-chip parallel type backlight LED, including substrate 1, also settable neck on the substrate 1, base When plate 1 is fixed on the device for need backlight, neck plays consolidation effect.

Also include first electrode terminal 2, insulating base 4, the LED chip 61 of second electrode terminal 3 and at least two, described the One electrode terminal 2 is disposed adjacent with second electrode terminal 3 on substrate 1, the first electrode terminal 2 and second electrode terminal 3 Between filled up and separate by the substrate 1, connection is contradicted between adjacent two LED chip 61 and forms a LED module 6, the LED module 6 be that at least two LED chips 61 form a monoblock LED chip structure, and the LED chip 61 on the LED module 6 is connected in parallel in Between first electrode terminal 2 and second electrode terminal 3, the insulating base 4 is embedded in the first electrode terminal 2 and second electricity On the surface of extreme son 3.

More preferably scheme is to include 3 LED chips 61 to the utility model, wherein, contradicted between adjacent two LED chip 61 Connection, 3 LED chips 61 form a LED module 6, and the LED chip 61 is connected in parallel in the electricity of first electrode terminal 2 and second Between extreme son 3.

The LED chip 61 is small-size chips, and the small-size chips are square structure, its size≤24mil, preferably , the small size LED chip is the arbitrary dimension in 8mil, 9mil, 12mil or 14mil.

It is connected in parallel by using at least two small size LED chips and instead of one of tradition large scale LED chip, is made The effectively save chip cost under conditions of guarantee LED lights and become clear is obtained, reduces the manufacture production cost of product, also, Speed of production when LED is manufactured using small size LED chip is faster than using the speed of production of large scale LED chip, can have Effect improves the production efficiency of product, the production capacity of the consuming reduced work hours, fundamentally raising LED.

The first electrode terminal 2 and second electrode terminal 3 have one end to extend out to outside insulating base 4, with external power source Scolding tin connects.

The second electrode terminal 3 has primer 5 close to the end set of first electrode terminal 2, and the LED module 6 passes through Primer 5 is bonded on second electrode terminal 3.

The second electrode terminal 3 accounts for area >=60% of the bottom of insulating base 4.

It is square structure on the insulating base 4, which is provided with a groove, the concave surface of the groove is provided with reflector layer 41, The reflector layer 41 is high reflecting rate coating.

After the completion of the paster of LED chip 61, fluorescent coating 7, the basis of fluorescent coating 7 are filled in the bowl-shape groove of insulating base 4 Need to be matched, the photoreactivation that fluorescent coating 7 is sent with LED chip 61, be emitted the light of the color of needs.

Adopt and be connected serially between LED chip 61 on the LED module 6, using gold between the LED chip 61 Line connects, a diameter of 10 μm -50 μm of gold thread.The preferable scheme of the present embodiment be the gold thread it is a diameter of 14 μm, 18 μm, 20 μm with And 24 μm of any one gold thread diameters.

For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique Personage can understand content of the present utility model and be carried out, the scope of protection of the utility model can not be limited with this, All equivalent change or modifications made according to the utility model Spirit Essence, should all cover in the scope of protection of the utility model It is interior.

Claims

1. a kind of Multi-chip parallel type backlight LED, including substrate, it is characterised in that：Also include first electrode terminal, insulating base, Second electrode terminal and at least two LED chips, the first electrode terminal are disposed adjacent in substrate with second electrode terminal On, filled up and separated by the substrate between the first electrode terminal and second electrode terminal, contradicted between adjacent two LED chip Connect and form a LED module, the LED chip on the LED module is connected in parallel in first electrode terminal and second electrode terminal Between, the insulating base is on the surface of the first electrode terminal and the second electrode terminal.

2. Multi-chip parallel type backlight LED according to claim 1, it is characterised in that the first electrode terminal and Two electrode terminals have one end to extend out to outside insulating base.

3. Multi-chip parallel type backlight LED according to claim 1, it is characterised in that the second electrode terminal is close The end set of first electrode terminal has primer, and the LED module is bonded on second electrode terminal by primer.

4. Multi-chip parallel type backlight LED according to claim 1, it is characterised in that the second electrode terminal accounts for absolutely Area >=60% of edge seat bottom.

5. Multi-chip parallel type backlight LED according to claim 1, it is characterised in that be square knot on the insulating base Structure, which is provided with a groove, and the concave surface of the groove is provided with reflector layer.

6. Multi-chip parallel type backlight LED according to claim 5, it is characterised in that be provided with fluorescence in the groove Glued membrane.

7. Multi-chip parallel type backlight LED according to claim 1, it is characterised in that the LED core on the LED module Adopt and be connected serially between piece.

8. Multi-chip parallel type backlight LED according to claim 7, it is characterised in that using gold between the LED chip Line connects, a diameter of 10 μm -50 μm of gold thread.